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MC9S12E128 MC9S12E64 MC9S12E32
Data Sheet
HCS12 Microcontrollers
MC9S12E128V1 Rev. 1.07 10/2005
freescale.com
MC9S12E128 Data Sheet
covers MC9S12E64 & MC9S12E32
MC9S12E128V1 Rev. 1.07 10/2005
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information available, refer to: http://freescale.com/ The following revision history table summarizes changes contained in this document.
Revision History
Date October 10, 2005 Revision Level 01.07 New Data Sheet Description
FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. This product incorporates SuperFlash(R) technology licensed from SST. (c) Freescale Semiconductor, Inc., 2005. All rights reserved. MC9S12E128 Data Sheet, Rev. 1.07 4 Freescale Semiconductor
Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 Chapter 7 Chapter 8 Chapter 9 Chapter 10 Chapter 11 Chapter 12 Chapter 13 Chapter 14 Chapter 15 Chapter 16 Chapter 17 Chapter 18 Chapter 19
MC9S12E128 Device Overview (MC9S12E128DGV1) . . . . . . . 21 128 Kbyte Flash Module (FTS128K1V1) . . . . . . . . . . . . . . . . . . 85 Port Integration Module (PIM9E128V1). . . . . . . . . . . . . . . . . . 119 Clocks and Reset Generator (CRGV4) . . . . . . . . . . . . . . . . . . 165 Oscillator (OSCV2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 Analog-to-Digital Converter (ATD10B16CV2) . . . . . . . . . . . . 205 Digital-to-Analog Converter (DAC8B1CV1) . . . . . . . . . . . . . . 237 Serial Communication Interface (SCIV3) . . . . . . . . . . . . . . . . 245 Serial Peripheral Interface (SPIV3) . . . . . . . . . . . . . . . . . . . . . 277 Inter-Integrated Circuit (IICV2) . . . . . . . . . . . . . . . . . . . . . . . . 299 Pulse Width Modulator w/ Fault Protection (PMF15B6CV2). 323 Pulse-Width Modulator (PWM8B6CV1). . . . . . . . . . . . . . . . . . 381 Timer Module (TIM16B4CV1) . . . . . . . . . . . . . . . . . . . . . . . . . . 415 Dual Output Voltage Regulator (VREG3V3V2). . . . . . . . . . . . 439 Background Debug Module (BDMV4). . . . . . . . . . . . . . . . . . . 447 Debug Module (DBGV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473 Interrupt (INTV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 505 Multiplexed External Bus Interface (MEBIV3) . . . . . . . . . . . . 513 Module Mapping Control (MMCV4) . . . . . . . . . . . . . . . . . . . . . 543
Appendix A Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563 Appendix B Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 599 Appendix C Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 602
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 5
MC9S12E128 Data Sheet, Rev. 1.07 6 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 1.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 1.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 1.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 1.2.1 Detailed Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 1.2.2 Part ID Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 1.3.1 Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 1.3.2 Signal Properties Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 1.4.1 EXTAL, XTAL -- Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 1.4.2 RESET -- External Reset Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 1.4.3 TEST -- Test Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 1.4.4 XFC -- PLL Loop Filter Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 1.4.5 BKGD / TAGHI / MODC -- Background Debug, Tag High & Mode Pin . . . . . . . . . . . 64 1.4.6 PA[7:0] / ADDR[15:8] / DATA[15:8] -- Port A I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . 64 1.4.7 PB[7:0] / ADDR[7:0] / DATA[7:0] -- Port B I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . 64 1.4.8 PE7 / NOACC / XCLKS -- Port E I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 1.4.9 PE6 / MODB / IPIPE1 -- Port E I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 1.4.10 PE5 / MODA / IPIPE0 -- Port E I/O Pin 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 1.4.11 PE4 / ECLK-- Port E I/O Pin 4 / E-Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 1.4.12 PE3 / LSTRB / TAGLO -- Port E I/O Pin 3 / Low-Byte Strobe (LSTRB) . . . . . . . . . . . 66 1.4.13 PE2 / R/W -- Port E I/O Pin 2 / Read/Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 1.4.14 PE1 / IRQ -- Port E input Pin 1 / Maskable Interrupt Pin . . . . . . . . . . . . . . . . . . . . . . . 66 1.4.15 PE0 / XIRQ -- Port E input Pin 0 / Non Maskable Interrupt Pin . . . . . . . . . . . . . . . . . . 67 1.4.16 PK7 / ECS / ROMCTL -- Port K I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 1.4.17 PK6 / XCS -- Port K I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 1.4.18 PK[5:0] / XADDR[19:14] -- Port K I/O Pins [5:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 1.4.19 PAD[15:0] / AN[15:0] / KWAD[15:0] -- Port AD I/O Pins [15:0] . . . . . . . . . . . . . . . . 67 1.4.20 PM7 / SCL -- Port M I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 1.4.21 PM6 / SDA -- Port M I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 1.4.22 PM5 / TXD2 -- Port M I/O Pin 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 1.4.23 PM4 / RXD2 -- Port M I/O Pin 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 1.4.24 PM3 -- Port M I/O Pin 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 1.4.25 PM1 / DAO1 -- Port M I/O Pin 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 1.4.26 PM0 / DAO2 -- Port M I/O Pin 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 1.4.27 PP[5:0] / PW0[5:0] -- Port P I/O Pins [5:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
1.2
1.3
1.4
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 7
1.4.28 PQ[6:4] / IS[2:0] -- Port Q I/O Pins [6:4] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 1.4.29 PQ[3:0] / FAULT[3:0] -- Port Q I/O Pins [3:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 1.4.30 PS7 / SS -- Port S I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 1.4.31 PS6 / SCK -- Port S I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 1.4.32 PS5 / MOSI -- Port S I/O Pin 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 1.4.33 PS4 / MISO -- Port S I/O Pin 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 1.4.34 PS3 / TXD1 -- Port S I/O Pin 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 1.4.35 PS2 / RXD1 -- Port S I/O Pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 1.4.36 PS1 / TXD0 -- Port S I/O Pin 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 1.4.37 PS0 / RXD0 -- Port S I/O Pin 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 1.4.38 PT[7:4] / IOC1[7:4]-- Port T I/O Pins [7:4] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 1.4.39 PT[3:0] / IOC0[7:4]-- Port T I/O Pins [3:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 1.4.40 PU[7:6] -- Port U I/O Pins [7:6] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 1.4.41 PU[5:4] / PW1[5:4] -- Port U I/O Pins [5:4] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 1.4.42 PU[3:0] / IOC2[7:4]/PW1[3:0] -- Port U I/O Pins [3:0] . . . . . . . . . . . . . . . . . . . . . . . . 71 1.4.43 VDDX,VSSX -- Power & Ground Pins for I/O Drivers . . . . . . . . . . . . . . . . . . . . . . . . . 72 1.4.44 VDDR, VSSR -- Power Supply Pins for I/O Drivers & for Internal Voltage Regulator 72 1.4.45 VDD1, VDD2, VSS1, VSS2 -- Power Supply Pins for Internal Logic . . . . . . . . . . . . . 72 1.4.46 VDDA, VSSA -- Power Supply Pins for ATD and VREG . . . . . . . . . . . . . . . . . . . . . . 72 1.4.47 VRH, VRL -- ATD Reference Voltage Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 1.4.48 VDDPLL, VSSPLL -- Power Supply Pins for PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 1.5 System Clock Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 1.6 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 1.6.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 1.6.2 Chip Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 1.7 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 1.7.1 Securing the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 1.7.2 Operation of the Secured Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 1.7.3 Unsecuring the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 1.8 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 1.8.1 Stop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 1.8.2 Pseudo Stop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 1.8.3 Wait . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 1.8.4 Run . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 1.9 Resets and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 1.9.1 Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 1.9.2 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 1.10 Recommended Printed Circuit Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
MC9S12E128 Data Sheet, Rev. 1.07 8 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 2.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 2.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 2.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 2.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 2.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 2.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 2.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 2.4.2 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 2.4.3 Flash Module Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 2.4.4 Flash Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 2.4.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
2.2 2.3
2.4
Chapter 3 Port Integration Module (PIM9E128V1)
3.1 lntroduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 3.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 3.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 3.3.1 Port AD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 3.3.2 Port M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 3.3.3 Port P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 3.3.4 Port Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 3.3.5 Port S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 3.3.6 Port T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 3.3.7 Port U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 3.4.1 I/O Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 3.4.2 Input Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 3.4.3 Data Direction Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 3.4.4 Reduced Drive Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 3.4.5 Pull Device Enable Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 3.4.6 Polarity Select Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 3.4.7 Pin Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 3.5.1 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 3.6.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
3.2 3.3
3.4
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3.6.2 Interrupt Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 3.6.3 Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
Chapter 4 Clocks and Reset Generator (CRGV4)
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 4.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 4.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 4.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 4.2.1 VDDPLL, VSSPLL -- PLL Operating Voltage, PLL Ground . . . . . . . . . . . . . . . . . . . . . . 167 4.2.2 XFC -- PLL Loop Filter Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 4.2.3 RESET -- Reset Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 4.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 4.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 4.4.1 Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 4.4.2 System Clocks Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183 4.4.3 Clock Monitor (CM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184 4.4.4 Clock Quality Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184 4.4.5 Computer Operating Properly Watchdog (COP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 4.4.6 Real-Time Interrupt (RTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 4.4.7 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 4.4.8 Low-Power Operation in Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 4.4.9 Low-Power Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 4.4.10 Low-Power Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 4.5.1 Clock Monitor Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 4.5.2 Computer Operating Properly Watchdog (COP) Reset . . . . . . . . . . . . . . . . . . . . . . . . . 198 4.5.3 Power-On Reset, Low Voltage Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 4.6.1 Real-Time Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 4.6.2 PLL Lock Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 4.6.3 Self-Clock Mode Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
4.2
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4.4
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Chapter 5 Oscillator (OSCV2)
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 5.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 5.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 5.2.1 VDDPLL and VSSPLL -- PLL Operating Voltage, PLL Ground . . . . . . . . . . . . . . . . . . . 202 5.2.2 EXTAL and XTAL -- Clock/Crystal Source Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 5.2.3 XCLKS -- Colpitts/Pierce Oscillator Selection Signal . . . . . . . . . . . . . . . . . . . . . . . . . 203 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 5.4.1 Amplitude Limitation Control (ALC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 5.4.2 Clock Monitor (CM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
5.2
5.3 5.4
5.5
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 6.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 6.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 6.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 6.2.1 AN15/ETRIG -- Analog Input Channel 15 / External trigger Pin . . . . . . . . . . . . . . . . 207 6.2.2 ANx (x = 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) -- Analog Input Channel x Pins . . 207 6.2.3 VRH, VRL -- High Reference Voltage Pin, Low Reference Voltage Pin . . . . . . . . . . . . 207 6.2.4 VDDA, VSSA -- Analog Circuitry Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . 207 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 6.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 6.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 6.4.1 Analog Sub-block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 6.4.2 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231 6.4.3 Operation in Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
6.2
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6.4
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Chapter 7 Digital-to-Analog Converter (DAC8B1CV1)
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 7.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 7.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 7.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238 7.2.1 DAO -- DAC Channel Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 7.2.2 VDDA -- DAC Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 7.2.3 VSSA -- DAC Ground Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 7.2.4 VREF -- DAC Reference Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 7.2.5 VRL -- DAC Reference Ground Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 7.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 7.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243 7.4.1 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 7.5.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
7.2
7.3
7.4 7.5
Chapter 8 Serial Communication Interface (SCIV3)
8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 8.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 8.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 8.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246 8.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 8.2.1 TXD -- SCI Transmit Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 8.2.2 RXD -- SCI Receive Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 8.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 8.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258 8.4.1 Infrared Interface Submodule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259 8.4.2 Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259 8.4.3 Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261 8.4.4 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262 8.4.5 Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 8.4.6 Single-Wire Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 8.4.7 Loop Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 8.5.1 Description of Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 8.5.2 Recovery from Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275
8.2
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Chapter 9 Serial Peripheral Interface (SPIV3)
9.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277 9.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277 9.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277 9.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 9.2.1 MOSI -- Master Out/Slave In Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 9.2.2 MISO -- Master In/Slave Out Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 9.2.3 SS -- Slave Select Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 9.2.4 SCK -- Serial Clock Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 9.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 9.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287 9.4.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 9.4.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 9.4.3 Transmission Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290 9.4.4 SPI Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293 9.4.5 Special Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294 9.4.6 Error Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 295 9.4.7 Operation in Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296 9.4.8 Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296 9.4.9 Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 9.6.1 MODF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 9.6.2 SPIF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 9.6.3 SPTEF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297
9.2
9.3
9.4
9.5 9.6
Chapter 10 Inter-Integrated Circuit (IICV2)
10.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299 10.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299 10.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 10.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 10.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 10.2.1 IIC_SCL -- Serial Clock Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 10.2.2 IIC_SDA -- Serial Data Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 10.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 10.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 10.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302 10.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313 10.4.1 I-Bus Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313
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10.4.2 Operation in Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316 10.4.3 Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316 10.4.4 Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316 10.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317 10.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317 10.7 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317 10.7.1 IIC Programming Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323 11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323 11.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 11.1.3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 11.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326 11.2.1 PWM0-PWM5 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326 11.2.2 FAULT0-FAULT3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326 11.2.3 IS0-IS2 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326 11.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327 11.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327 11.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330 11.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 357 11.4.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 357 11.4.2 Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 357 11.4.3 PWM Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 357 11.4.4 Independent or Complementary Channel Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . 361 11.4.5 Deadtime Generators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 362 11.4.6 Software Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 370 11.4.7 PWM Generator Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373 11.4.8 Fault Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 11.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 379 11.6 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 379 11.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 380
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381 12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381 12.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381 12.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382 12.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382 12.2.1 PWM5 -- Pulse Width Modulator Channel 5 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382 12.2.2 PWM4 -- Pulse Width Modulator Channel 4 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382 12.2.3 PWM3 -- Pulse Width Modulator Channel 3 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382
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12.3
12.4
12.5 12.6
12.2.4 PWM2 -- Pulse Width Modulator Channel 2 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383 12.2.5 PWM1 -- Pulse Width Modulator Channel 1 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383 12.2.6 PWM0 -- Pulse Width Modulator Channel 0 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383 12.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383 12.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403 12.4.1 PWM Clock Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403 12.4.2 PWM Channel Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 413 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 413
Chapter 13 Timer Module (TIM16B4CV1)
13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415 13.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415 13.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415 13.1.3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 416 13.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 418 13.2.1 IOC7 -- Input Capture and Output Compare Channel 7 Pin . . . . . . . . . . . . . . . . . . . . 418 13.2.2 IOC6 -- Input Capture and Output Compare Channel 6 Pin . . . . . . . . . . . . . . . . . . . . 418 13.2.3 IOC5 -- Input Capture and Output Compare Channel 5 Pin . . . . . . . . . . . . . . . . . . . . 418 13.2.4 IOC4 -- Input Capture and Output Compare Channel 4 Pin . . . . . . . . . . . . . . . . . . . . 418 13.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 419 13.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 419 13.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 420 13.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 435 13.4.1 Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436 13.4.2 Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436 13.4.3 Output Compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436 13.4.4 Pulse Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436 13.4.5 Event Counter Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 437 13.4.6 Gated Time Accumulation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 437 13.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 437 13.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438 13.6.1 Channel [7:4] Interrupt (C[7:4]F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438 13.6.2 Pulse Accumulator Input Interrupt (PAOVI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438 13.6.3 Pulse Accumulator Overflow Interrupt (PAOVF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438 13.6.4 Timer Overflow Interrupt (TOF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438
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Chapter 14 Dual Output Voltage Regulator (VREG3V3V2)
14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 439 14.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 439 14.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 439 14.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 440 14.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 441 14.2.1 VDDR -- Regulator Power Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 441 14.2.2 VDDA, VSSA -- Regulator Reference Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 441 14.2.3 VDD, VSS -- Regulator Output1 (Core Logic) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442 14.2.4 VDDPLL, VSSPLL -- Regulator Output2 (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442 14.2.5 VREGEN -- Optional Regulator Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442 14.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442 14.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442 14.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 443 14.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 443 14.4.1 REG -- Regulator Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 443 14.4.2 Full-Performance Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 444 14.4.3 Reduced-Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 444 14.4.4 LVD -- Low-Voltage Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 444 14.4.5 POR -- Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 444 14.4.6 LVR -- Low-Voltage Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 444 14.4.7 CTRL -- Regulator Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 444 14.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 445 14.5.1 Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 445 14.5.2 Low-Voltage Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 445 14.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 445 14.6.1 LVI -- Low-Voltage Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 445
Chapter 15 Background Debug Module (BDMV4)
15.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 447 15.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 447 15.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 448 15.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 448 15.2.1 BKGD -- Background Interface Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 449 15.2.2 TAGHI -- High Byte Instruction Tagging Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 449 15.2.3 TAGLO -- Low Byte Instruction Tagging Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 449 15.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 15.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 15.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 451 15.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 456 15.4.1 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 456 15.4.2 Enabling and Activating BDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 456
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15.4.3 BDM Hardware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 457 15.4.4 Standard BDM Firmware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 458 15.4.5 BDM Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 459 15.4.6 BDM Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461 15.4.7 Serial Interface Hardware Handshake Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464 15.4.8 Hardware Handshake Abort Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 466 15.4.9 SYNC -- Request Timed Reference Pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 15.4.10Instruction Tracing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 15.4.11Instruction Tagging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 15.4.12Serial Communication Time-Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 15.4.13Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471 15.4.14Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471
Chapter 16 Debug Module (DBGV1)
16.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473 16.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473 16.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475 16.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475 16.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 477 16.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 478 16.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 478 16.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 478 16.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 493 16.4.1 DBG Operating in BKP Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 493 16.4.2 DBG Operating in DBG Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 495 16.4.3 Breakpoints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502 16.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503 16.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503
Chapter 17 Interrupt (INTV1)
17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 505 17.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 506 17.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 506 17.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507 17.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507 17.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507 17.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507 17.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 509 17.4.1 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 509 17.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510 17.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510 17.6.1 Interrupt Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510
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17.6.2 Highest Priority I-Bit Maskable Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510 17.6.3 Interrupt Priority Decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510 17.7 Exception Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 511
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 18.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 18.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 515 18.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 516 18.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 518 18.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 518 18.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 519 18.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536 18.4.1 Detecting Access Type from External Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536 18.4.2 Stretched Bus Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536 18.4.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 537 18.4.4 Internal Visibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541 18.4.5 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 542
Chapter 19 Module Mapping Control (MMCV4)
19.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 543 19.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544 19.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544 19.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544 19.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544 19.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544 19.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 546 19.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 555 19.4.1 Bus Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 555 19.4.2 Address Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 556 19.4.3 Memory Expansion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 557
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Appendix A Electrical Characteristics
A.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563 A.1.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563 A.1.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563 A.1.3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564 A.1.4 Current Injection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564 A.1.5 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 565 A.1.6 ESD Protection and Latch-up Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 566 A.1.7 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567 A.1.8 Power Dissipation and Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567 A.1.9 I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 569 A.1.10 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 570 A.2 Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 572 A.2.1 Chip Power-up and LVI/LVR Graphical Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . 573 A.2.2 Output Loads. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 573 A.3 Startup, Oscillator and PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 574 A.3.1 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 574 A.3.2 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 576 A.3.3 Phase Locked Loop. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 577 A.4 Flash NVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 581 A.4.1 NVM Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 581 A.4.2 NVM Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 583 A.5 SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 585 A.5.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 585 A.5.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 587 A.6 ATD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 589 A.6.1 ATD Operating Characteristics -- 5V Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 589 A.6.2 ATD Operating Characteristics -- 3.3V Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 590 A.6.3 Factors Influencing Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 590 A.6.4 ATD Accuracy -- 5V Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 592 A.6.5 ATD Accuracy -- 3.3V Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 592 A.7 DAC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595 A.7.1 DAC Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595 A.8 External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595
Appendix B Package Information
B.1 64-Pin QFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 599 B.2 80-Pin QFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600 B.3 112-Pin LQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601
Appendix C Ordering Information
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 19
MC9S12E128 Data Sheet, Rev. 1.07 20 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.1 Introduction
The MC9S12E128 is a 112/80/64 pin low cost general purpose MCU comprised of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), up to 128K bytes of Flash EEPROM, up to 8K bytes of RAM, three asynchronous serial communications interface modules (SCI), a serial peripheral interface (SPI), an Inter-IC Bus (IIC), three 4-channel 16-bit timer modules (TIM), a 6-channel 15-bit Pulse Modulator with Fault protection module (PMF), a 6-channel 8-bit Pulse Width Modulator (PWM), a 16-channel 10-bit analog-to-digital converter (ADC), and two 1-channel 8-bit digital-to-analog converters (DAC). The MC9S12E128 has full 16-bit data paths throughout. The inclusion of a PLL circuit allows power consumption and performance to be adjusted to suit operational requirements. In addition to the I/O ports available on each module, 16 dedicated I/O port bits are available with Wake-Up capability from STOP or WAIT mode. Furthermore, an on chip bandgap based voltage regulator (VREG) generates the internal digital supply voltage of 2.5V (VDD) from a 3.135V to 5.5V external supply range.
1.1.1
*
Features
16-bit HCS12 CORE -- HCS12 CPU - i. Upward compatible with M68HC11 instruction set - ii. Interrupt stacking and programmer's model identical to M68HC11 - iii. Instruction queue - iv. Enhanced indexed addressing -- Module Mapping Control (MMC) -- Interrupt control (INT) -- Background Debug Module (BDM) -- Debugger (DBG12) including breakpoints and change-of-flow trace buffer -- Multiplexed External Bus Interface (MEBI) Wake-Up interrupt inputs -- Up to 16 port bits available for wake up interrupt function with digital filtering Memory Options -- 32K, 64K or 128K Byte Flash EEPROM -- 2K, 4K or 8K Byte RAM
* *
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 21
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
* *
*
*
*
*
*
Two 1-channel Digital-to-Analog Converters (DAC) -- 8-bit resolution Analog-to-Digital Converter (ADC) -- 16-channel module with 10-bit resolution -- External conversion trigger capability Three 4-channel Timers (TIM) -- Programmable input capture or output compare channels -- Simple PWM mode -- Counter modulo reset -- External event counting -- Gated time accumulation 6 PWM channels (PWM) -- Programmable period and duty cycle -- 8-bit 6-channel or 16-bit 3-channel -- Separate control for each pulse width and duty cycle -- Center-aligned or left-aligned outputs -- Programmable clock select logic with a wide range of frequencies -- Fast emergency shutdown input 6-channel Pulse width Modulator with Fault protection (PMF) -- Three independent 15-bit counters with synchronous mode -- Complementary channel operation -- Edge and center aligned PWM signals -- Programmable dead time insertion -- Integral reload rates from 1 to 16 -- Four fault protection shut down input pins -- Three current sense input pins Serial interfaces -- Three asynchronous serial communication interfaces (SCI) -- Synchronous serial peripheral interface (SPI) -- Inter-IC Bus (IIC) Clock and Reset Generator (CRG) -- Windowed COP watchdog -- Real Time interrupt -- Clock Monitor -- Pierce or low current Colpitts oscillator -- Phase-locked loop clock frequency multiplier -- Self Clock mode in absence of external clock -- Low power 0.5 to 16Mhz crystal oscillator reference clock
MC9S12E128 Data Sheet, Rev. 1.07 22 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
* *
*
*
Operating frequency -- 50MHz equivalent to 25MHz Bus Speed Internal 2.5V Regulator -- Input voltage range from 3.135V to 5.5V -- Low power mode capability -- Includes low voltage reset (LVR) circuitry -- Includes low voltage interrupt (LVI) circuitry 112-Pin LQFP or 80-Pin QFP or 64-Pin QFN package -- Up to 90 I/O lines with 5V input and drive capability (112 pin package) -- Up to two dedicated 5V input only lines (IRQ and XIRQ) -- Sixteen 3.3V/5V A/D converter inputs Development Support. -- Single-wire background debugTM mode -- On-chip hardware breakpoints -- Enhanced debug features
1.1.2
Modes of Operation
User modes (Expanded modes are only available in the 112-pin package version) * Normal modes -- Normal Single-Chip Mode -- Normal Expanded Wide Mode -- Normal Expanded Narrow Mode -- Emulation Expanded Wide Mode -- Emulation Expanded Narrow Mode * Special Operating Modes -- Special Single-Chip Mode with active Background Debug Mode -- Special Test Mode (Freescale use only) -- Special Peripheral Mode (Freescale use only) * Low power modes -- Stop Mode -- Pseudo Stop Mode -- Wait Mode
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 23
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.1.3
Block Diagram
32K / 64K / 128K Byte Flash EEPROM 2k / 4K / 8K Byte RAM VDDR VSSR BKGD Voltage Regulator MODC/TAGHI Single-wire Background Debug Module Clock and CRG Reset Generation PMF PW00 PW01 PW02 PW03 PW04 PW05 FAULT0 FAULT1 FAULT2 FAULT3 IS0 IS1 IS2 SCI0 SCI1 System Integration Module (SIM) SPI RXD0 TXD0 RXD1 TXD1 MISO MOSI SCK SS IOC04 IOC05 IOC06 IOC07 IOC14 IOC15 IOC16 IOC17 MUX DDRU PTU PP0 PP1 PP2 PP3 PP4 PP5 PQ0 PQ1 PQ2 PQ3 PQ4 PQ5 PQ6 PS0 PS1 PS2 PS3 PS4 PS5 PS6 PS7 PT0 PT1 PT2 PT3 PT4 PT5 PT6 PT7 PU0 PU1 PU2 PU3 PU4 PU5 PU6 PU7 DDRP DDRQ DDRS DDRT
XFC EXTAL XTAL RESET PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 PK0 PK1 PK2 PK3 PK4 PK5 PK6 PK7 TEST
Periodic Interrupt COP Watchdog Clock Monitor Debugger(DBG12) Breakpoints
XIRQ IRQ R/W LSTRB/TAGLO ECLK MODA/IPIPE0 MODB/IPIPE1 NOACC/XCLKS XADDR14 XADDR15 XADDR16 XADDR17 XADDR18 XADDR19 XCS ECS
DDRE
PTE
TIM0
DDRK
PTK
TIM1 PW10 PW11 PW12 PW13 PW14 PW15 IOC24 IOC25 IOC26 IOC27 AN0 AN1 AN2 AN3 ADC AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 AN12 AN13 AN14 AN15 DAC0
PWM Multiplexed Address/Data Bus
DDRA PTA PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0
DDRB PTB PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 TIM2
Multiplexed Wide Bus Multiplexed Narrow Bus
Voltage Regulator 3.3V/5V VDDR VSSR PLL 2.5V VDDPLL VSSPLL
ADC/DAC 3.3V/5V Voltage Reference VRH VRL I/O Driver 3.3V/5V VDDA VSSA VDDX VSSX
KWAD0 KWAD1 KWAD2 KWAD3 KWAD4 KWAD5 KWAD6 KWAD7 KWAD8 KWAD9 KWAD10 KWAD11 KWAD12 KWAD13 KWAD14 KWAD15 DAO0
PTT
PTS
PTQ
CPU12
PTP
PAD0 PAD1 PAD2 PAD3 PAD4 PAD5 PAD6 PAD7 PAD8 PAD9 PAD10 PAD11 PAD12 PAD13 PAD14 PAD15 PM0 PM1
ADDR15 ADDR14 ADDR13 ADDR12 ADDR11 ADDR10 ADDR9 ADDR8 DATA15 DATA14 DATA13 DATA12 DATA11 DATA10 DATA9 DATA8
ADDR7 ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0
DDRAD DDRM
DATA7 DATA6 DATA5 DATA4 DATA3 DATA2 DATA1 DATA0
DATA7 DATA6 DATA5 DATA4 DATA3 DATA2 DATA1 DATA0
SCI2 IIC
Signals shown in Bold are not available on the 80 Pin Package
RXD2 TXD2 SDA SCL
Figure 1-1. MC9S12E128 Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 24 Freescale Semiconductor
PTM
Internal Logic 2.5V VDD1,2 VSS1,2
DAC1
DAO1
PAD
PM3 PM4 PM5 PM6 PM7
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.2
Device Memory Map
Table 1-1 shows the device register map of the MC9S12E128 after reset. Figure 1-2, Figure 1-3 and Figure 1-4 illustrate the device memory map with Flash and RAM.
Table 1-1. Device Register Map Overview
Address 0x0000-0x0017 0x0018 0x0019 0x001A-0x001B 0x001C-0x001F 0x0020-0x002F 0x0030-0x0033 0x0034-0x003F 0x0040-0x006F 0x0070-0x007F 0x0080-0x00AF 0x00B0-0x00C7 0x00D0-0x00D7 0x00E0-0x00E7 0x00E8-0x00EF 0x00F0-0x00F3 0x00F4-0x00F7 0x00F8-0x00FF 0x0100- 0x010F 0x0110-0x013F 0x0140-0x016F 0x0170-0x017F 0x0180-0x01AF 0x01B0-0x01DF 0x01E0-0x01FF 0x0200-0x023F 0x0240-0x027F 0x0280-0x03FF Module CORE (Ports A, B, E, Modes, Inits, Test) Reserved Voltage Regulator (VREG) Device ID register (PARTID) CORE (MEMSIZ, IRQ, HPRIO) CORE (DBG) CORE (PPAGE, Port K) Clock and Reset Generator (PLL, RTI, COP) Standard Timer 16-bit 4 channels (TIM0) Reserved Analog to Digital Converter 10-bit 16 channels (ATD) Reserved Serial Communications Interface 1 (SCI1) Inter IC Bus Serial Communications Interface 2 (SCI2) Digital to Analog Converter 8-bit 1-channel (DAC0) Digital to Analog Converter 8-bit 1-channel (DAC1) Reserved Flash Control Register Reserved Standard Timer 16-bit 4 channels (TIM1) Reserved Standard Timer 16-bit 4 channels (TIM2) Reserved Pulse Width Modulator 8-bit 6 channels (PWM) Pulse Width Modulator with Fault 15-bit 6 channels (PMF) Port Integration Module (PIM) Reserved Size 24 1 1 2 4 16 4 12 48 16 48 24 8 8 8 8 8 4 4 8 16 48 48 16 48 48 32 64 64 384
0x00C8-0x00CF Serial Communications Interface 0 (SCI0) 0x00D8-0x00DF Serial Peripheral Interface (SPI)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 25
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
$0000 $0000 $0400 $2000 $2000 $4000 $3FFF $4000 $03FF
1K Register Space Mappable to any 2K Boundary
8K Bytes RAM Mappable to any 8K Boundary 0.5K, 1K, 2K or 4K Protected Sector
$7FFF $8000 $8000 EXT $BFFF $C000 $C000
16K Fixed Flash EEPROM
16K Page Window eight * 16K Flash EEPROM Pages
16K Fixed Flash EEPROM 2K, 4K, 8K or 16K Protected Boot Sector BDM (If Active)
$FFFF $FF00 $FF00 $FFFF VECTORS NORMAL SINGLE CHIP VECTORS EXPANDED VECTORS SPECIAL SINGLE CHIP $FFFF
The figure shows a useful map, which is not the map out of reset. After reset the map is: $0000-$03FF: Register Space $0000-$1FFF: 8K RAM (only 7K RAM visible $0400-$1FFF)
Figure 1-2. MC9S12E128 User Configurable Memory Map
MC9S12E128 Data Sheet, Rev. 1.07 26 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
$0000 $0000 $0400 $3000 $3000 $4000 $3FFF $4000 $03FF
1K Register Space Mappable to any 2K Boundary
4K Bytes RAM Mappable to any 4K Boundary 0.5K, 1K, 2K or 4K Protected Sector
$7FFF $8000 $8000 EXT $BFFF $C000 $C000
16K Fixed Flash EEPROM
16K Page Window four * 16K Flash EEPROM Pages
16K Fixed Flash EEPROM 2K, 4K, 8K or 16K Protected Boot Sector BDM (If Active)
$FFFF $FF00 $FF00 $FFFF VECTORS NORMAL SINGLE CHIP VECTORS EXPANDED VECTORS SPECIAL SINGLE CHIP $FFFF
The figure shows a useful map, which is not the map out of reset. After reset the map is: $0000-$03FF: Register Space $0000-$0FFF: 4K RAM (only 3K RAM visible $0400-$0FFF)
Figure 1-3. MC9S12E64 User Configurable Memory Map
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 27
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
$0000 $0000 $0400 $3000 $3700 $4000 $3FFF $4000 $03FF
1K Register Space Mappable to any 2K Boundary
2K Bytes RAM Mappable to any 2K Boundary 0.5K, 1K, 2K or 4K Protected Sector
$7FFF $8000 $8000 EXT $BFFF $C000 $C000
16K Fixed Flash EEPROM
16K Page Window two * 16K Flash EEPROM Pages
16K Fixed Flash EEPROM 2K, 4K, 8K or 16K Protected Boot Sector BDM (If Active)
$FFFF $FF00 $FF00 $FFFF VECTORS NORMAL SINGLE CHIP VECTORS EXPANDED VECTORS SPECIAL SINGLE CHIP $FFFF
The figure shows a useful map, which is not the map out of reset. After reset the map is: $0000-$03FF: Register Space $0000-$07FF: 2K RAM (only 1K RAM visible $0400-$07FF)
Figure 1-4. MC9S12E32 User Configurable Memory Map
MC9S12E128 Data Sheet, Rev. 1.07 28 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.2.1
Detailed Register Map
0x0000 - 0x000F MEBI Map 1 of 3 (HCS12 Multiplexed External Bus Interface)
Address 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 0x000A 0x000B 0x000C 0x000D 0x000E 0x000F Name PORTA PORTB DDRA DDRB Reserved Reserved Reserved Reserved PORTE DDRE PEAR MODE PUCR RDRIV EBICTL Reserved R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 0 Bit 7 Bit 7 NOACCE MODC PUPKE RDPK 0 6 6 0 5 5 PIPOE MODA 0 0 0 4 4 NECLK 0 3 3 LSTRE IVIS 0 0 0 2 Bit 2 RDWE 0 0 0 0 Bit 1 0 0 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 0 Bit 6 6 6 6 6 0 Bit 5 5 5 5 5 0 Bit 4 4 4 4 4 0 Bit 3 3 3 3 3 0 Bit 2 2 2 2 2 0 Bit 1 1 1 1 1 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 0
MODB 0 0 0
EMK PUPBE RDPB 0
EME PUPAE RDPA ESTR 0
PUPEE RDPE 0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 29
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0010 - 0x0014 MMC Map 1 of 4 (HCS12 Module Mapping Control)
Address 0x0010 0x0011 0x0012 0x0013 0x0014 Name INITRM INITRG INITEE MISC MTST0 R W R W R W R W R W Bit 7 6 5 4 EE15 0 Bit 7 RAM15 0 Bit 6 RAM14 REG14 EE14 0 Bit 5 RAM13 REG13 EE13 0 Bit 4 RAM12 REG12 EE12 0 Bit 3 RAM11 REG11 EE11 EXSTR1 3 Bit 2 0 0 0 Bit 1 0 0 0 Bit 0 RAMHAL 0
EEON ROMON Bit 0
EXSTR0 2
ROMHM 1
0x0015 - 0x0016 INT Map 1 of 2 (HCS12 Interrupt)
Address 0x0015 0x0016 Name ITCR ITEST R W R W INTE INTC INTA Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 WRINT INT8 Bit 3 ADR3 INT6 Bit 2 ADR2 INT4 Bit 1 ADR1 INT2 Bit 0 ADR0 INT0
0x0017 - 0x0017MMC Map 2 of 4 (HCS12 Module Mapping Control)
Address 0x0017 Name MTST1 R W Bit 7 Bit 7 Bit 6 6 Bit 5 5 Bit 4 4 Bit 3 3 Bit 2 2 Bit 1 1 Bit 0 Bit 0
0x0018 - 0x0018
Address 0x0018 Name Reserved
Miscellaneous Peripherals (Device User Guide)
Bit 7 R W 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x0019 - 0x0019
Address 0x0019 Name VREGCTRL
VREG3V3 (Voltage Regulator)
Bit 7 R W 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 LVDS Bit 1 LVIE Bit 0 LVIF
MC9S12E128 Data Sheet, Rev. 1.07 30 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x001A - 0x001B Miscellaneous Peripherals (Device User Guide)
Address 0x001A 0x001B Name PARTIDH PARTIDL R W R W ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 Bit 7 ID15 Bit 6 ID14 Bit 5 ID13 Bit 4 ID12 Bit 3 ID11 Bit 2 ID10 Bit 1 ID9 Bit 0 ID8
0x001C - 0x001D MMC Map 3 of 4 (HCS12 Module Mapping Control, Device User Guide)
Address 0x001C 0x001D Name MEMSIZ0 MEMSIZ1 R W R rom_sw1 W rom_sw0 0 0 0 0 pag_sw1 pag_sw0 Bit 7 reg_sw0 Bit 6 0 Bit 5 eep_sw1 Bit 4 eep_sw0 Bit 3 0 Bit 2 ram_sw2 Bit 1 ram_sw1 Bit 0 ram_sw0
0x001E - 0x001E MEBI Map 2 of 3 (HCS12 Multiplexed External Bus Interface)
Address 0x001E Name INTCR R W Bit 7 IRQE Bit 6 IRQEN Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x001F - 0x001F INT Map 2 of 2 (HCS12 Interrupt)
Address 0x001F Name HPRIO R W Bit 7 PSEL7 Bit 6 PSEL6 Bit 5 PSEL5 Bit 4 PSEL4 Bit 3 PSEL3 Bit 2 PSEL2 Bit 1 PSEL1 Bit 0 0
0x0020 - 0x002F DBG (Including BKP) Map 1 of 1 (HCS12 Debug)
Address 0x0020 0x0021 0x0022 0x0023 0x0024 0x0025 Name DBGC1 -- DBGSC -- DBGTBH -- DBGTBL -- DBGCNT -- DBGCCX -- R W R W R W R W R W R W PAGSEL EXTCMP TBF 0 CNT Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 7 DBGEN AF Bit 6 ARM BF Bit 5 TRGSEL CF Bit 4 BEGIN 0 Bit 3 DBGBRK Bit 2 0 Bit 1 Bit 0
CAPMOD TRG Bit 9 Bit 8
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 31
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0020 - 0x002F DBG (Including BKP) Map 1 of 1 (HCS12 Debug) (continued)
Address 0x0026 0x0027 0x0028 0x0029 0x002A 0x002B 0x002C 0x002D 0x002E 0x002F Name DBGCCH -- DBGCCL -- DBGC2 BKPCT0 DBGC3 BKPCT1 DBGCAX BKP0X DBGCAH BKP0H DBGCAL BKP0L DBGCBX BKP1X DBGCBH BKP1H DBGCBL BKP1L R W R W R W R W R W R W R W R W R W R W Bit 7 Bit 15 Bit 7 BKABEN BKAMBH Bit 6 14 6 FULL BKAMBL Bit 5 13 5 BDM BKBMBH Bit 4 12 4 TAGAB BKBMBL Bit 3 11 3 BKCEN RWAEN Bit 2 10 2 TAGC RWA Bit 1 9 1 RWCEN RWBEN Bit 0 Bit 8 Bit 0 RWC RWB
PAGSEL Bit 15 Bit 7 PAGSEL Bit 15 Bit 7 14 6 13 5 12 4 11 3 14 6 13 5 12 4 11 3
EXTCMP 10 2 EXTCMP 10 2 9 1 Bit 8 Bit 0 9 1 Bit 8 Bit 0
0x0030 - 0x0031 MMC Map 4 of 4 (HCS12 Module Mapping Control)
Address 0x0030 0x0031 Name PPAGE Reserved R W R W 0 0 Bit 7 0 Bit 6 0 Bit 5 PIX5 0 Bit 4 PIX4 0 Bit 3 PIX3 0 Bit 2 PIX2 0 Bit 1 PIX1 0 Bit 0 PIX0 0
0x0032 - 0x0033 MEBI Map 3 of 3 (HCS12 Multiplexed External Bus Interface)
Address 0x0032 0x0033 Name PORTK DDRK R W R W Bit 7 ECS Bit 7 Bit 6 XCS 6 Bit 5 XAB19 5 Bit 4 XAB18 4 Bit 3 XAB17 3 Bit 2 XAB16 2 Bit 1 XAB15 1 Bit 0 XAB14 Bit 0
MC9S12E128 Data Sheet, Rev. 1.07 32 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0034 - 0x003F CRG (Clock and Reset Generator)
Address 0x0034 0x0035 0x0036 0x0037 0x0038 0x0039 0x003A 0x003B 0x003C 0x003D 0x003E 0x003F Name SYNR REFDV CTFLG TEST ONLY CRGFLG CRGINT CLKSEL PLLCTL RTICTL COPCTL FORBYP TEST ONLY CTCTL TEST ONLY ARMCOP R W R W R W R W R W R W R W R W R W R W R W R W 0 Bit 7 0 6 0 5 0 4 0 3 0 2 0 1 0 Bit 0 WCOP RTIBYP TCTL7 RTIF RTIE PLLSEL CME 0 PROF 0 0 0 LOCKIF LOCKIE ROAWAI ACQ RTR4 0 LOCK 0 TRACK 0 SCMIF SCMIE RTIWAI PCE RTR1 CR1 FCM TCTL1 SCM 0 TOUT7 TOUT6 TOUT5 TOUT4 0 0 Bit 7 0 Bit 6 0 Bit 5 SYN5 0 Bit 4 SYN4 0 Bit 3 SYN3 REFDV3 TOUT3 Bit 2 SYN2 REFDV2 TOUT2 Bit 1 SYN1 REFDV1 TOUT1 Bit 0 SYN0 REFDV0 TOUT0
PSTP PLLON RTR6 RSBCK COPBYP TCTL6
SYSWAI AUTO RTR5 0 0 TCTL5
PLLWAI 0
CWAI PRE RTR2 CR2 0 TCTL2
COPWAI SCME RTR0 CR0 0 TCTL0
RTR3 0 0 TCLT3
PLLBYP TCTL4
0x0040 - 0x006F TIM0 (Timer 16 Bit 4 Channels) (Sheet 1 of 4)
Address 0x0040 0x0041 0x0042 0x0043 0x0044 0x0045 Name TIOS CFORC OC7M OC7D TCNT (hi) TCNT (lo) R W R W R W R W R W R W MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 33 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 IOS7 0 FOC7 OC7M7 OC7D7 Bit 15 Bit 6 IOS6 0 FOC6 OC7M6 OC7D6 14 Bit 5 IOS5 0 FOC5 OC7M5 OC7D5 13 Bit 4 IOS4 0 FOC4 OC7M4 OC7D4 12 0 0 11 0 0 10 0 0 9 0 0 Bit 8 Bit 3 0 0 Bit 2 0 0 Bit 1 0 0 Bit 0 0 0
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0040 - 0x006F TIM0 (Timer 16 Bit 4 Channels) (Sheet 2 of 4)
Address 0x0046 0x0047 0x0048 0x0049 0x004A 0x004B 0x004C 0x004D 0x004E 0x004F 0x0050 0x0051 0x0052 0x0053 0x0054 0x0055 0x0056 0x0057 0x0058 Name TSCR1 TTOV TCTL1 Reserved TCTL3 Reserved TIE TSCR2 TFLG1 TFLG2 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved TC4 (hi) R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 15 14 13 12 11 10 9 Bit 8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C7I TOI C7F TOF 0 C6I 0 C5I 0 C4I 0 0 0 0 0 EDG7B 0 EDG7A 0 EDG6B 0 EDG6A 0 EDG5B 0 EDG5A 0 EDG4B 0 EDG4A 0 Bit 7 TEN TOV7 OM7 0 Bit 6 TSWAI TOV6 OL7 0 Bit 5 TSFRZ TOV5 OM6 0 Bit 4 TFFCA TOV4 OL6 0 Bit 3 0 0 Bit 2 0 0 Bit 1 0 0 Bit 0 0 0
OM5 0
OL5 0
OM4 0
OL4 0
TCRE 0 0 0
PR2 0 0 0
PR1 0 0 0
PR0 0 0 0
C6F 0 0
C5F 0 0
C4F 0 0
MC9S12E128 Data Sheet, Rev. 1.07 34 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0040 - 0x006F TIM0 (Timer 16 Bit 4 Channels) (Sheet 3 of 4)
Address 0x0059 0x005A 0x005B 0x005C 0x005D 0x005E 0x005F 0x0060 0x0061 0x0062 0x0063 0x0064 0x0065 0x0066 0x0067 0x0068 0x0069 0x006A 0x006B Name TC4 (lo) TC5 (hi) TC5 (lo) TC6 (hi) TC6 (lo) TC7 (hi) TC7 (lo) PACTL PAFLG PACNT (hi) PACNT (lo) Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 15 Bit 7 0 14 6 0 13 5 0 12 4 0 11 3 0 10 2 0 0 Bit 7 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 0 Bit 6 6 14 6 14 6 14 6 PAEN 0 Bit 5 5 13 5 13 5 13 5 PAMOD 0 Bit 4 4 12 4 12 4 12 4 PEDGE 0 Bit 3 3 11 3 11 3 11 3 CLK1 0 Bit 2 2 10 2 10 2 10 2 CLK0 0 Bit 1 1 9 1 9 1 9 1 PAOVI PAOVF 9 1 0 Bit 0 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 PAI PAIF Bit 8 Bit 0 0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 35
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0040 - 0x006F TIM0 (Timer 16 Bit 4 Channels) (Sheet 4 of 4)
Address 0x006C 0x006D 0x006E 0x006F Name Reserved Reserved Reserved Reserved R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x0070 - 0x007F Reserved
Address 0x0070- 0x007F Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x0080 - 0x00AF ATD (Analog to Digital Converter 10 Bit 16 Channel) (Sheet 1 of 3)
Address 0x0080 0x0081 0x0082 0x0083 0x0084 0x0085 0x0086 0x0087 0x0088 0x0089 0x008A Name ATDCTL0 ATDCTL1 ATDCTL2 ATDCTL3 ATDCTL4 ATDCTL5 ATDSTAT0 Reserved ATDTEST0 ATDTEST1 ATDSTAT0 R W R W R W R W R W R W R W R W R W R W R W CCF15 CCF14 CCF13 CCF12 CCF11 CCF10 CCF9 0 0 0 0 0 0 0 SC CCF8 0 0 0 0 0 0 0 0 SRES8 DJM SCF 0 ETRIGSEL2 ADPU 0 0 0 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 WRAP31 Bit 2 WRAP21 Bit 1 WRAP11 Bit 0 WRAP01
ETRIGCH32 ETRIGCH22 ETRIGCH12 ETRIGCH02 ETRIGP S1C PRS3 0 0 0 ETRIG FIFO PRS2 CC CC2 0 ASCIE FRZ1 PRS1 CB CC1 0 ASCIF
AFFC S8C SMP1 DSGN 0 0
AWAI S4C SMP0 SCAN ETORF 0
ETRIGLE S2C PRS4 MULT FIFOR 0
FRZ0 PRS0 CA CC0 0
MC9S12E128 Data Sheet, Rev. 1.07 36 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0080 - 0x00AF ATD (Analog to Digital Converter 10 Bit 16 Channel) (Sheet 2 of 3)
Address 0x008B 0x008C 0x008D 0x008E 0x008F 0x0090 0x0091 0x0092 0x0093 0x0094 0x0095 0x0096 0x0097 0x0098 0x0099 0x009A 0x009B 0x009C 0x009D Name ATDSTAT1 ATDDIEN0 ATDDIEN1 PORTAD0 PORTAD1 ATDDR0H ATDDR0L ATDDR1H ATDDR1L ATDDR2H ATDDR2L ATDDR3H ATDDR3L ATDDR4H ATDDR4L ATDDR5H ATDDR5L ATDDR6H ATDDR6L R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit7 Bit6 0 0 0 0 0 0 Bit15 14 13 12 11 10 9 Bit8 Bit7 Bit6 0 0 0 0 0 0 Bit15 14 13 12 11 10 9 Bit8 Bit7 Bit6 0 0 0 0 0 0 Bit15 14 13 12 11 10 9 Bit8 Bit7 Bit6 0 0 0 0 0 0 Bit15 14 13 12 11 10 9 Bit8 Bit7 Bit6 0 0 0 0 0 0 Bit15 14 13 12 11 10 9 Bit8 Bit7 Bit6 0 0 0 0 0 0 Bit15 14 13 12 11 10 9 Bit8 Bit7 Bit6 0 0 0 0 0 0 Bit15 14 13 12 11 10 9 Bit8 PTAD7 PTAD6 PTAD5 PTAD4 PTAD3 PTAD2 PTAD1 PTAD0 IEN15 IEN7 PTAD15 IEN14 IEN6 PTAD14 IEN13 IEN5 PTAD13 IEN12 IEN4 PTAD12 IEN11 IEN3 PTAD11 IEN10 IEN2 PTAD10 IEN9 IEN1 PTAD9 IEN8 IEN0 PTAD8 Bit 7 CCF7 Bit 6 CCF6 Bit 5 CCF5 Bit 4 CCF4 Bit 3 CCF3 Bit 2 CCF2 Bit 1 CCF1 Bit 0 CCF0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 37
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0080 - 0x00AF ATD (Analog to Digital Converter 10 Bit 16 Channel) (Sheet 3 of 3)
Address 0x009E 0x009F 0x00A0 0x00A1 0x00A2 0x00A3 0x00A4 0x00A5 0x00A6 0x00A7 0x00A8 0x00A9 0x00AA 0x00AB 0x00AC 0x00AD 0x00AE 0x00AF
1 2
Name ATDDR7H ATDDR7L ATDDR8H ATDDR8L ATDDR9H ATDDR9L ATDDR10H ATDDR10L ATDDR11H ATDDR11L ATDDR12H ATDDR12L ATDDR13H ATDDR13L ATDDR14H ATDDR14L ATDDR15H ATDDR15L R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W
Bit 7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7
Bit 6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6
Bit 5 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0
Bit 4 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0
Bit 3 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0
Bit 2 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0
Bit 1 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0
Bit 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0
WRAP0-3 bits are available in version V04 of ATD10B16C ETRIGSEL and ETRIGCH0-3 bits are available in version V04 of ATD10B16C
MC9S12E128 Data Sheet, Rev. 1.07 38 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x00B0 - 0x00C7 Reserved
Address 0x00B0- 0x00C7 Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x00C8 - 0x00CF SCI0 (Asynchronous Serial Interface)
Address 0x00C8 0x00C9 0x00CA 0x00CB 0x00CC 0x00CD 0x00CE 0x00CF
1
Name SCIBDH SCIBDL SCICR1 SCICR2 SCISR1 SCISR2 SCIDRH SCIDRL R W R W R W R W R W R W R W R W
Bit 7 IREN SBR7 LOOPS TIE TDRE 0 R8 R7 T7
Bit 6 TNP1 SBR6 SCISWAI TCIE TC 0
Bit 5 TNP0 SBR5 RSRC RIE RDRF 0 0 R5 T5
Bit 4 SBR12 SBR4 M ILIE IDLE
Bit 3 SBR11 SBR3 WAKE TE OR
Bit 2 SBR10 SBR2 ILT RE NF
Bit 1 SBR9 SBR1 PE RWU FE
Bit 0 SBR8 SBR0 PT SBK PF RAF 0 R0 T0
TXPOL1 0 R4 T4
RXPOL1 0 R3 T3
BRK13 0 R2 T2
TXDIR 0 R1 T1
T8 R6 T6
TXPOL and RXPOL bits are available in version V04 of SCI
0x00D0 - 0x00D7 SCI1 (Asynchronous Serial Interface)
Address 0x00D0 0x00D1 0x00D2 0x00D3 0x00D4 Name SCIBDH SCIBDL SCICR1 SCICR2 SCISR1 R W R W R W R W R W Bit 7 IREN SBR7 LOOPS TIE TDRE Bit 6 TNP1 SBR6 SCISWAI TCIE TC Bit 5 TNP0 SBR5 RSRC RIE RDRF Bit 4 SBR12 SBR4 M ILIE IDLE Bit 3 SBR11 SBR3 WAKE TE OR Bit 2 SBR10 SBR2 ILT RE NF Bit 1 SBR9 SBR1 PE RWU FE Bit 0 SBR8 SBR0 PT SBK PF
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 39
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x00D0 - 0x00D7 SCI1 (Asynchronous Serial Interface) (continued)
Address 0x00D5 0x00D6 0x00D7
1
Name SCISR2 SCIDRH SCIDRL R W R W R W
Bit 7 0 R8 R7 T7
Bit 6 0
Bit 5 0 0 R5 T5
Bit 4 TXPOL1 0 R4 T4
Bit 3 RXPOL1 0 R3 T3
Bit 2 BRK13 0 R2 T2
Bit 1 TXDIR 0 R1 T1
Bit 0 RAF 0 R0 T0
T8 R6 T6
TXPOL and RXPOL are available in version V04 of SCI
0x00D8 - 0x00DF SPI (Serial Peripheral Interface)
Address 0x00D8 0x00D9 0x00DA 0x00DB 0x00DC 0x00DD 0x00DE 0x00DF Name SPICR1 SPICR2 SPIBR SPISR Reserved SPIDR Reserved Reserved R W R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 Bit7 0 6 0 5 0 4 0 3 0 2 0 1 0 Bit0 0 0 0 0 0 0 0 0 0 SPIF 0 SPPR2 0 SPPR1 SPTEF Bit 7 SPIE 0 Bit 6 SPE 0 Bit 5 SPTIE 0 Bit 4 MSTR MODFEN SPPR0 MODF Bit 3 CPOL BIDIROE 0 0 Bit 2 CPHA 0 Bit 1 SSOE SPISWAI SPR1 0 Bit 0 LSBFE SPC0 SPR0 0
SPR2 0
0x00E0 - 0x00E7 IIC (Inter-IC Bus)
Address 0x00E0 0x00E1 0x00E2 0x00E3 Name IBAD IBFD IBCR IBSR R W R W R W R W Bit 7 ADR7 IBC7 IBEN TCF Bit 6 ADR6 IBC6 IBIE IAAS Bit 5 ADR5 IBC5 MS/SL IBB Bit 4 ADR4 IBC4 Tx/Rx IBAL Bit 3 ADR3 IBC3 TXAK 0 Bit 2 ADR2 IBC2 0 RSTA SRW IBIF Bit 1 ADR1 IBC1 0 Bit 0 0
IBC0 IBSWAI RXAK
MC9S12E128 Data Sheet, Rev. 1.07 40 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x00E0 - 0x00E7 IIC (Inter-IC Bus) (continued)
Address 0x00E4 0x00E5 0x00E6 0x00E7 Name IBDR Reserved Reserved Reserved R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 D7 0 Bit 6 D6 0 Bit 5 D5 0 Bit 4 D4 0 Bit 3 D3 0 Bit 2 D2 0 Bit 1 D1 0 Bit 0 D0 0
0x00E8 - 0x00EF SCI2 (Asynchronous Serial Interface)
Address 0x00E8 0x00E9 0x00EA 0x00EB 0x00EC 0x00ED 0x00EE 0x00EF
1
Name SCIBDH SCIBDL SCICR1 SCICR2 SCISR1 SCISR2 SCIDRH SCIDRL R W R W R W R W R W R W R W R W
Bit 7 IREN SBR7 LOOPS TIE TDRE 0 R8 R7 T7
Bit 6 TNP1 SBR6 SCISWAI TCIE TC 0
Bit 5 TNP0 SBR5 RSRC RIE RDRF 0 0 R5 T5
Bit 4 SBR12 SBR4 M ILIE IDLE
Bit 3 SBR11 SBR3 WAKE TE OR
Bit 2 SBR10 SBR2 ILT RE NF
Bit 1 SBR9 SBR1 PE RWU FE
Bit 0 SBR8 SBR0 PT SBK PF RAF 0 R0 T0
TXPOL1 0 R4 T4
RXPOL1 0 R3 T3
BRK13 0 R2 T2
TXDIR 0 R1 T1
T8 R6 T6
TXPOL and RXPOL are available in version V04 of SCI
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 41
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x00F0 - 0x00F3 DAC0 (Digital-to-Analog Converter)
Address 0x00F0 0x00F1 0x00F2 0x00F3 Name DACC0 DACC1 DACD DACD R W R W R W R W BIT7 BIT7 BIT6 BIT6 BIT5 BIT5 BIT4 BIT4 BIT3 BIT3 BIT2 BIT2 BIT1 BIT1 BIT0 BIT0 Bit 7 DACE 0 Bit 6 DACTE 0 Bit 5 0 0 Bit 4 0 0 Bit 3 DJM 0 Bit 2 DSGN 0 Bit 1 DACWAI 0 Bit 0 DACOE 0
0x00F4 - 0x00F7 DAC1 (Digital-to-Analog Converter)
Address 0x00F4 0x00F5 0x00F6 0x00F7 Name DACC0 DACC1 DACD DACD R W R W R W R W BIT7 BIT7 BIT6 BIT6 BIT5 BIT5 BIT4 BIT4 BIT3 BIT3 BIT2 BIT2 BIT1 BIT1 BIT0 BIT0 Bit 7 DACE 0 Bit 6 DACTE 0 Bit 5 0 0 Bit 4 0 0 Bit 3 DJM 0 Bit 2 DSGN 0 Bit 1 DACWAI 0 Bit 0 DACOE 0
0x00F8 - 0x00FF Reserved
Address 0x00F8- 0x00FF Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x0100 - 0x010F Flash Control Register
Address 0x0100 0x0101 0x0102 0x0103 0x0104 Name FCLKDIV FSEC Reserved for Factory Test FCNFG FPROT R W R W R W R W R W CBEIE FPOPEN CCIE NV6 KEYACC FPHDIS 0 0 0 0 0 0 0 0 0 0 0 0 0 KEYEN1 Bit 7 FDIVLD Bit 6 PRDIV8 NV6 Bit 5 FDIV5 NV5 Bit 4 FDIV4 NV4 Bit 3 FDIV3 NV3 Bit 2 FDIV2 NV2 Bit 1 FDIV1 SEC1 Bit 0 FDIV0 SEC0
FPHS1
FPHS0
FPLDIS
FPLS1
FPLS0
MC9S12E128 Data Sheet, Rev. 1.07 42 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0100 - 0x010F Flash Control Register (continued)
Address 0x0105 0x0106 0x0107 0x0108 0x0109 0x010A 0x010B 0x010C 0x010D 0x010E 0x010F Name FSTAT FCMD Reserved for Factory Test Reserved for Factory Test Reserved for Factory Test Reserved for Factory Test Reserved for Factory Test Reserved Reserved Reserved Reserved R W R W R W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 CBEIF 0 Bit 6 CCIF Bit 5 PVIOL CMDB5 0 Bit 4 ACCERR 0 0 Bit 3 0 0 0 Bit 2 BLANK CMDB2 0 Bit 1 0 0 0 Bit 0 0
CMDB6 0
CMDB0 0
0x0110 - 0x013F Reserved
Address 0x0110- 0x013F Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x0140 - 0x016F TIM1 (Timer 16 Bit 4 Channels) (Sheet 1 of 4)
Address 0x0140 0x0141 0x0142 0x0143 Name TIOS CFORC OC7M OC7D R W R W R W R W Bit 7 IOS7 0 FOC7 OC7M7 OC7D7 Bit 6 IOS6 0 FOC6 OC7M6 OC7D6 Bit 5 IOS5 0 FOC5 OC7M5 OC7D5 Bit 4 IOS4 0 FOC4 OC7M4 OC7D4 0 0 0 0 0 0 0 0 Bit 3 0 0 Bit 2 0 0 Bit 1 0 0 Bit 0 0 0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 43
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0140 - 0x016F TIM1 (Timer 16 Bit 4 Channels) (Sheet 2 of 4)
Address 0x0144 0x0145 0x0146 0x0147 0x0148 0x0149 0x014A 0x014B 0x014C 0x014D 0x014E 0x014F 0x0150 0x0151 0x0152 0x0153 0x0154 0x0155 0x0156 Name TCNT (hi) TCNT (lo) TSCR1 TTOV TCTL1 Reserved TCTL3 Reserved TIE TSCR2 TFLG1 TFLG2 Reserved Reserved Reserved Reserved Reserved Reserved Reserved R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C7I TOI C7F TOF 0 C6I 0 C5I 0 C4I 0 0 0 0 0 EDG7B 0 EDG7A 0 EDG6B 0 EDG6A 0 EDG5B 0 EDG5A 0 EDG4B 0 EDG4A 0 TEN TOV7 OM7 0 TSWAI TOV6 OL7 0 TSFRZ TOV5 OM6 0 TFFCA TOV4 OL6 0 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 Bit 15 Bit 6 14 Bit 5 13 Bit 4 12 Bit 3 11 Bit 2 10 Bit 1 9 Bit 0 Bit 8
OM5 0
OL5 0
OM4 0
OL4 0
TCRE 0 0 0
PR2 0 0 0
PR1 0 0 0
PR0 0 0 0
C6F 0 0
C5F 0 0
C4F 0 0
MC9S12E128 Data Sheet, Rev. 1.07 44 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0140 - 0x016F TIM1 (Timer 16 Bit 4 Channels) (Sheet 3 of 4)
Address 0x0157 0x0158 0x0159 0x015A 0x015B 0x015C 0x015D 0x015E 0x015F 0x0160 0x0161 0x0162 0x0163 0x0164 0x0165 0x0166 0x0167 0x0168 0x0169 Name Reserved TC4 (hi) TC4 (lo) TC5 (hi) TC5 (lo) TC6 (hi) TC6 (lo) TC7 (hi) TC7 (lo) PACTL PAFLG PACNT (hi) PACNT (lo) Reserved Reserved Reserved Reserved Reserved Reserved R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 15 Bit 7 0 14 6 0 13 5 0 12 4 0 11 3 0 10 2 0 0 Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 0 14 6 14 6 14 6 14 6 PAEN 0 13 5 13 5 13 5 13 5 PAMOD 0 12 4 12 4 12 4 12 4 PEDGE 0 11 3 11 3 11 3 11 3 CLK1 0 10 2 10 2 10 2 10 2 CLK0 0 9 1 9 1 9 1 9 1 PAOVI PAOVF 9 1 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 PAI PAIF Bit 8 Bit 0 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 45
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0140 - 0x016F TIM1 (Timer 16 Bit 4 Channels) (Sheet 4 of 4)
Address 0x016A 0x016B 0x016C 0x016D 0x016E 0x016F Name Reserved Reserved Reserved Reserved Reserved Reserved R W R W R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x0170 - 0x017F Reserved
Address 0x0110- 0x013F Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x0180 - 0x01AF TIM2 (Timer 16 Bit 4 Channels) (Sheet 1 of 3)
Address 0x0180 0x0181 0x0182 0x0183 0x0184 0x0185 0x0186 0x0187 0x0188 Name TIOS CFORC OC7M OC7D TCNT (hi) TCNT (lo) TSCR1 TTOV TCTL1 R W R W R W R W R W R W R W R W R W TEN TOV7 OM7 TSWAI TOV6 OL7 TSFRZ TOV5 OM6 TFFCA TOV4 OL6 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 IOS7 0 FOC7 OC7M7 OC7D7 Bit 15 Bit 6 IOS6 0 FOC6 OC7M6 OC7D6 14 Bit 5 IOS5 0 FOC5 OC7M5 OC7D5 13 Bit 4 IOS4 0 FOC4 OC7M4 OC7D4 12 0 0 11 0 0 10 0 0 9 0 0 Bit 8 Bit 3 0 0 Bit 2 0 0 Bit 1 0 0 Bit 0 0 0
OM5
OL5
OM4
OL4
MC9S12E128 Data Sheet, Rev. 1.07 46 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0180 - 0x01AF TIM2 (Timer 16 Bit 4 Channels) (Sheet 2 of 3)
Address 0x0189 0x018A 0x018B 0x018C 0x018D 0x018E 0x018F 0x0190 0x0191 0x0192 0x0193 0x0194 0x0195 0x0196 0x0197 0x0198 0x0199 0x015A 0x019B 0x019C Name Reserved TCTL3 Reserved TIE TSCR2 TFLG1 TFLG2 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved TC4 (hi) TC4 (lo) TC5 (hi) TC5 (lo) TC6 (hi) R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 14 6 14 6 14 13 5 13 5 13 12 4 12 4 12 11 3 11 3 11 10 2 10 2 10 9 1 9 1 9 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C7I TOI C7F TOF 0 C6I 0 C5I 0 C4I 0 0 0 0 0 EDG7B 0 EDG7A 0 EDG6B 0 EDG6A 0 EDG5B 0 EDG5A 0 EDG4B 0 EDG4A 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
TCRE 0 0 0
PR2 0 0 0
PR1 0 0 0
PR0 0 0 0
C6F 0 0
C5F 0 0
C4F 0 0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 47
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0180 - 0x01AF TIM2 (Timer 16 Bit 4 Channels) (Sheet 3 of 3)
Address 0x019D 0x019E 0x019F 0x01A0 0x01A1 0x01A2 0x01A3 0x01A4 0x01A5 0x01A6 0x01A7 0x01A8 0x01A9 0x01AA 0x01AB 0x01AC 0x01AD 0x01AE 0x01AF Name TC6 (lo) TC7 (hi) TC7 (lo) PACTL PAFLG PACNT (hi) PACNT (lo) Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 15 Bit 7 0 14 6 0 13 5 0 12 4 0 11 3 0 10 2 0 0 Bit 7 Bit 7 Bit 15 Bit 7 0 Bit 6 6 14 6 PAEN 0 Bit 5 5 13 5 PAMOD 0 Bit 4 4 12 4 PEDGE 0 Bit 3 3 11 3 CLK1 0 Bit 2 2 10 2 CLK0 0 Bit 1 1 9 1 PAOVI PAOVF 9 1 0 Bit 0 Bit 0 Bit 8 Bit 0 PAI PAIF Bit 8 Bit 0 0
MC9S12E128 Data Sheet, Rev. 1.07 48 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x01B0 - 0x01DF Reserved
Address 0x01B0- 0x01DF Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x01E0 - 0x01FF PWM (Pulse Width Modulator)
Address 0x01E0 0x01E1 0x01E2 0x01E3 0x01E4 0x01E5 0x01E6 0x01E7 0x01E8 0x01E9 0x01EA 0x01EB 0x01EC 0x01ED 0x01EE 0x01EF Name PWME PWMPOL PWMCLK PWMPRCLK PWMCAE PWMCTL PWMTST Test Only PWMPRSC PWMSCLA PWMSCLB PWMSCNTA PWMSCNTB PWMCNT0 PWMCNT1 PWMCNT2 PWMCNT3 R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 6 0 6 0 6 0 6 0 5 0 5 0 5 0 5 0 4 0 4 0 4 0 4 0 3 0 3 0 3 0 3 0 2 0 2 0 2 0 2 0 1 0 1 0 1 0 1 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 0 0 0 0 0 0 0 0 Bit 7 Bit 7 0 6 6 0 5 5 0 4 4 0 3 3 0 2 2 0 1 1 0 Bit 0 Bit 0 0 0 0 0 0 0 0 0 0 0 0 CON45 0 0 0 PCKB2 0 0 0 0 0 Bit 7 0 Bit 6 0 Bit 5 PWME5 PPOL5 PCLK5 PCKB1 CAE5 CON23 0 Bit 4 PWME4 PPOL4 PCLK4 PCKB0 CAE4 CON01 0 Bit 3 PWME3 PPOL3 PCLK3 0 Bit 2 PWME2 PPOL2 PCLK2 PCKA2 CAE2 PFRZ 0 Bit 1 PWME1 PPOL1 PCLK1 PCKA1 CAE1 0 0 Bit 0 PWME0 PPOL0 PCLK0 PCKA0 CAE0 0 0
CAE3 PSWAI 0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 49
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x01E0 - 0x01FF PWM (Pulse Width Modulator) (continued)
Address 0x01F0 0x01F1 0x01F2 0x01F3 0x01F4 0x01F5 0x01F6 0x01F7 0x01F8 0x01F9 0x01FA 0x01FB 0x01FC 0x01FD 0x01FE 0x01FF Name PWMCNT4 PWMCNT5 PWMPER0 PWMPER1 PWMPER2 PWMPER3 PWMPER4 PWMPER5 PWMDTY0 PWMDTY1 PWMDTY2 PWMDTY3 PWMDTY4 PWMDTY5 PWMSDN Reserved R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 Bit 7 0 Bit 7 0 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 PWMIF 0 Bit 6 6 0 6 0 6 6 6 6 6 6 6 6 6 6 6 6 PWMIE 0 Bit 5 5 0 5 0 5 5 5 5 5 5 5 5 5 5 5 5 0
PWMRSTRT
Bit 4 4 0 4 0 4 4 4 4 4 4 4 4 4 4 4 4 PWMLVL 0
Bit 3 3 0 3 0 3 3 3 3 3 3 3 3 3 3 3 3 0 0
Bit 2 2 0 2 0 2 2 2 2 2 2 2 2 2 2 2 2 PWM5IN 0
Bit 1 1 0 1 0 1 1 1 1 1 1 1 1 1 1 1 1 PWM5INL 0
Bit 0 Bit 0 0 Bit 0 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 PWM5ENA 0
0
MC9S12E128 Data Sheet, Rev. 1.07 50 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0200 - 0x023F PMF (Pulse width Modulator with Fault protection) (Sheet 1 of 4)
Address 0x0200 0x0201 0x0202 0x0203 0x0204 0x0205 0x0206 0x0207 0x0208 0x0209 0x020A 0x020B 0x020C 0x020D 0x020E 0x020F 0x0210 0x0211 0x0212 Name PMFCFG0 PMFCFG1 PMFCFG2 PMFCFG3 PMFFCTL R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 15 Bit 7 Bit 15 14 6 14 13 5 13 0 0 ISENS 12 4 12 0 IPOLC 10 2 10 IPOLB 9 1 9 IPOLA Bit 8 Bit 0 Bit 8 0 0 0 0 0 0 OUTCTL5 OUTCTL4 OUTCTL3 OUTCTL2 OUTCTL1 OUTCTL0 OUT5 DT5 OUT4 DT4 OUT3 DT3 OUT2 DT2 OUT1 DT1 OUT0 DT0 0 PMFWAI FMODE3 0 PMFFRZ FIE3 FPINE3 FFLAG3 QSMP3 DMP13 DMP33 DMP53 0 DMP12 DMP32 DMP52 0 Bit 7 WP ENHA 0 Bit 6 MTG 0 0 Bit 5 EDGEC BOTNEGC MSK5 0 Bit 4 EDGEB TOPNEGC MSK4 Bit 3 EDGEA BOTNEGB MSK3 Bit 2 INDEPC TOPNEGB MSK2 SWAPC FIE1 FPINE1 FFLAG1 QSMP1 DMP03 DMP23 DMP43 0 DMP02 DMP22 DMP42 0 Bit 1 INDEPB BOTNEGA MSK1 SWAPB FMODE0 0 0 Bit 0 INDEPA TOPNEGA MSK0 SWAPA FIE0 FPINE0 FFLAG0 QSMP0 DMP01 DMP21 DMP41 0 DMP00 DMP20 DMP40 0
VLMODE FIE2 FPINE2 FFLAG2 QSMP2 FMODE1 0 0
FMODE2 0 0
PMFFPIN
PMFFSTA PMFQSMP PMFDMPA PMFDMPB PMFDMPC Reserved PMFOUTC PMFOUTB PMFDTMS PMFCCTL PMFVAL0 PMFVAL0 PMFVAL1
DMP11 DMP31 DMP51 0
DMP10 DMP30 DMP50 0
11 3 11
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 51
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0200 - 0x023F PMF (Pulse width Modulator with Fault protection) (Sheet 2 of 4)
Address 0x0213 0x0214 0x0215 0x0216 0x0217 0x0218 0x0219 0x021A 0x021B 0x021C 0x021D 0x021E 0x021F 0x0220 0x0221 0x0222 0x0223 0x0224 0x0225 Name PMFVAL1 PMFVAL2 PMFVAL2 PMFVAL3 PMFVAL3 PMFVAL4 PMFVAL4 PMFVAL5 PMFVAL5 Reserved Reserved Reserved Reserved PMFENCA PMFFQCA PMFCNTA PMFCNTA PMFMODA PMFMODA R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 Bit 7 0 0 PWMENA 0 0 0 0 0 LDOKA PRSCA 10 2 10 2 9 1 9 1 PWMRIEA PWMRFA Bit 8 Bit 0 Bit 8 Bit 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 0 Bit 6 6 14 6 14 6 14 6 14 6 0 Bit 5 5 13 5 13 5 13 5 13 5 0 Bit 4 4 12 4 12 4 12 4 12 4 0 Bit 3 3 11 3 11 3 11 3 11 3 0 Bit 2 2 10 2 10 2 10 2 10 2 0 Bit 1 1 9 1 9 1 9 1 9 1 0 Bit 0 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 0
LDFQA Bit 14 6 Bit 14 6 13 5 13 5 12 4 12 4
HALFA 11 3 11 3
MC9S12E128 Data Sheet, Rev. 1.07 52 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0200 - 0x023F PMF (Pulse width Modulator with Fault protection) (Sheet 3 of 4)
Address 0x0226 0x0227 0x0228 0x0229 0x022A 0x022B 0x022C 0x022D 0x022E 0x022F 0x0230 0x0231 0x0232 0x0233 0x0234 0x0235 0x0236 0x0237 0x0238 Name PMFDTMA PMFDTMA PMFENCB PMFFQCB PMFCNTB PMFCNTB PMFMODB PMFMODB PMFDTMB PMFDTMB PMFENCC PMFFQCC PMFCNTC PMFCNTC PMFMODC PMFMODC PMFDTMC PMFDTMC Reserved R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 0 6 0 5 0 4 0 Bit 7 0 Bit 7 0 0 Bit 7 PWMENC 6 0 5 0 4 0 Bit 7 0 Bit 7 0 0 Bit 7 PWMENB 6 0 5 0 4 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 Bit 11 3 0 Bit 2 10 2 0 Bit 1 9 1 LDOKB PRSCB 10 2 10 2 10 2 0 9 1 9 1 9 1 LDOKC PRSCC 10 2 10 2 10 2 0 9 1 9 1 9 1 0 Bit 0 Bit 8 Bit 0 PWMRIEB PWMRFB Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 PWMRIEC PWMRFC Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 0
LDFQB Bit 14 6 Bit 14 6 0 13 5 13 5 0 12 4 12 4 0
HALFB 11 3 11 3 Bit 11 3 0
LDFQC Bit 14 6 Bit 14 6 0 13 5 13 5 0 12 4 12 4 0
HALFC 11 3 11 3 Bit 11 3 0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 53
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0200 - 0x023F PMF (Pulse width Modulator with Fault protection) (Sheet 4 of 4)
Address 0x0239 0x023A 0x023B 0x023C 0x023D 0x023E 0x023F Name Reserved Reserved Reserved Reserved Reserved Reserved Reserved R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
0x0240 - 0x027F PIM (Port Interface Module) (Sheet 1 of 4)
Address 0x0240 0x0241 0x0242 0x0243 0x0244 0x0245 0x0246 0x0247 0x0248 0x0249 Name PTT PTIT DDRT RDRT PERT PPST Reserved Reserved PTS PTIS R W R W R W R W R W R W R W R W R W R W PTS7 PTIS7 PTS6 PTIS6 PTS5 PTIS5 PTS4 PTIS4 PTS3 PTIS3 PTS2 PTIS2 PTS1 PTIS1 PTS0 PTIS0 0 0 0 0 0 0 0 0 DDRT7 RDRT7 PERT7 PPST7 0 DDRT7 RDRT6 PERT6 PPST6 0 DDRT5 RDRT5 PERT5 PPST5 0 DDRT4 RDRT4 PERT4 PPST4 0 DDRT3 RDRT3 PERT3 PPST3 0 DDRT2 RDRT2 PERT2 PPST2 0 DDRT1 RDRT1 PERT1 PPST1 0 DDRT0 RDRT0 PERT0 PPST0 0 Bit 7 PTT7 PTIT7 Bit 6 PTT6 PTIT6 Bit 5 PTT5 PTIT5 Bit 4 PTT4 PTIT4 Bit 3 PTT3 PTIT3 Bit 2 PTT2 PTIT2 Bit 1 PTT1 PTIT1 Bit 0 PTT0 PTIT0
MC9S12E128 Data Sheet, Rev. 1.07 54 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0240 - 0x027F PIM (Port Interface Module) (Sheet 2 of 4)
Address 0x024A 0x024B 0x024C 0x024D 0x024E 0x024F 0x0250 0x0251 0x0252 0x0253 0x0254 0x0255 0x0256 0x0257 0x0258 0x0259 0x025A 0x025B 0x025C Name DDRS RDRS PERS PPSS WOMS Reserved PTM PTIM DDRM RDRM PERM PPSM WOMM Reserved PTP PTIP DDRP RDRP PERP R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 DDRP5 RDRP5 PERP5 DDRP4 RDRP4 PERP4 DDRP3 RDRP3 PERP3 DDRP2 RDRP2 PERP2 DDRP1 RDRP1 PERP1 DDRP0 RDRP0 PERP0 0 0 0 0 PTP5 PTIP5 PTP4 PTIP4 PTP3 PTIP3 PTP2 PTIP2 PTP1 PTIP1 PTP0 PTIP0 DDRM7 RDRM7 PERM7 PPSM7 WOMM7 0 DDRM6 RDRM6 PERM6 PPSM6 WOMM6 0 DDRM5 RDRM5 PERM5 PPSM5 WOMM5 0 DDRM4 RDRM4 PERM4 PPSM4 WOMM4 0 DDRM3 RDRM3 PERM3 PPSM3 0 0 0 0 0 0 0 0 DDRM1 RDRM1 PERM1 PPSM1 0 0 DDRM0 RDRM0 PERM0 PPSM0 0 0 PTM7 PTIM7 PTM6 PTIM6 PTM5 PTIM5 PTM4 PTIM4 PTM3 PTIM3 0 0 PTM1 PTIM1 PTM0 PTIM0 Bit 7 DDRS7 RDRS7 PERS7 PPSS7 WOMS7 0 Bit 6 DDRS6 RDRS6 PERS6 PPSS6 WOMS6 0 Bit 5 DDRS5 RDRS5 PERS5 PPSS5 WOMS5 0 Bit 4 DDRS4 RDRS4 PERS4 PPSS4 WOMS4 0 Bit 3 DDRS3 RDRS3 PERS3 PPSS3 WOMS3 0 Bit 2 DDRS2 RDRS2 PERS2 PPSS2 WOMS2 0 Bit 1 DDRS1 RDRS1 PERS1 PPSS1 WOMS1 0 Bit 0 DDRS0 RDRS0 PERS0 PPSS0 WOMS0 0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 55
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0240 - 0x027F PIM (Port Interface Module) (Sheet 3 of 4)
Address 0x025D 0x025E 0x025F 0x0260 0x0261 0x0262 0x0263 0x0264 0x0265 0x0266 0x0267 0x0268 0x0269 0x026A 0x026B 0x026C 0x026D 0x026E 0x026F Name PPSP Reserved Reserved PTQ PTIQ DDRQ RDRQ PERQ PPSQ Reserved Reserved PTU PTIU DDRU RDRU PERU PPSU MODRR Reserved R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W 0 0 0 0 DDRU7 RDRU7 PERU7 PPSU7 0 DDRU6 RDRU6 PERU6 PPSU6 0 DDRU5 RDRU5 PERU5 PPSU5 0 DDRU4 RDRU4 PERU4 PPSU4 0 DDRU3 RDRU3 PERU3 PPSU3 DDRU2 RDRU2 PERU2 PPSU2 DDRU1 RDRU1 PERU1 PPSU1 DDRU0 RDRU0 PERU0 PPSU0 PTU7 PTIU7 PTU6 PTIU6 PTU5 PTIU5 PTU4 PTIU4 PTU3 PTIU3 PTU2 PTIU2 PTU1 PTIU1 PTU0 PTIU0 0 0 0 0 0 0 0 0 0 0 0 0 0 DDRQ6 RDRQ6 PERQ6 PPSQ6 0 DDRQ5 RDRQ5 PERQ5 PPSQ5 0 DDRQ4 RDRQ4 PERQ4 PPSQ4 0 DDRQ3 RDRQ3 PERQ3 PPSQ3 0 DDRQ2 RDRQ2 PERQ2 PPSQ2 0 DDRQ1 RDRQ1 PERQ1 PPSQ1 0 DDRQ0 RDRQ0 PERQ0 PPSQ0 0 0 0 PTQ6 PTIQ6 PTQ5 PTIQ5 PTQ4 PTIQ4 PTQ3 PTIQ3 PTQ2 PTIQ2 PTQ1 PTIQ1 PTQ0 PTIQ0 0 0 0 0 0 0 0 0 0 0 Bit 7 0 Bit 6 0 Bit 5 PPSP5 0 Bit 4 PPSP4 0 Bit 3 PPSP3 0 Bit 2 PPSP2 0 Bit 1 PPSP1 0 Bit 0 PPSP0 0
MODRR3 MODRR2 MODRR1 MODRR0 0 0 0 0
MC9S12E128 Data Sheet, Rev. 1.07 56 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
0x0240 - 0x027F PIM (Port Interface Module) (Sheet 4 of 4)
Address 0x0270 0x0271 0x0272 0x0273 0x0274 0x0275 0x0276 0x0277 0x0278 0x0279 0x027A 0x027B 0x027C 0x027D 0x027E 0x027F Name PTAD(H) PTAD(L) PTIAD(H) PTIAD(L) DDRAD(H) DDRAD(L) RDRAD(H) RDRAD(L) PERAD(H) PERAD(L) PPSAD(H) PPSAD(L) PIEAD(H) PIEAD(L) PIFAD(H) PIFAD(L) R W R W W R W R W R W R W R W R W R W R W R W R W R W R W R W DDRAD15 DDRAD7 RDRAD15 RDRAD7 DDRAD14 DDRAD6 RDRAD14 RDRAD6 DDRAD13 DDRAD5 RDRAD13 RDRAD5 DDRAD12 DDRAD4 RDRAD12 RDRAD4 DDRAD11 DDRAD3 RDRAD11 RDRAD3 DDRAD10 DDRAD2 RDRAD10 RDRAD2 DDRAD9 DDRAD1 RDRAD9 RDRAD1 PERAD9 PERAD1 PPSAD9 PPSAD1 PIEAD9 PIEAD1 PIFAD9 PIFAD1 DDRAD8 DDRAD0 RDRAD8 RDRAD0 PERAD8 PERAD0 PPSAD8 PPSAD0 PIEAD8 PIEAD0 PIFAD8 PIFAD0 PTIAD7 PTIAD6 PTIAD5 PTIAD4 PTIAD3 PTIAD2 PTIAD1 PTIAD0 Bit 7 PTAD15 PTAD7 Bit 6 PTAD14 PTAD6 PTIAD14 Bit 5 PTAD13 PTAD5 PTIAD13 Bit 4 PTAD12 PTAD4 PTIAD12 Bit 3 PTAD11 PTAD3 PTIAD11 Bit 2 PTAD10 PTAD2 PTIAD10 Bit 1 PTAD9 PTAD1 PTIAD9 Bit 0 PTAD8 PTAD0 PTIAD8
R PTIAD15
PERAD15 PERAD14 PERAD13 PERAD12 PERAD11 PERAD10 PERAD7 PERAD6 PERAD5 PERAD4 PERAD3 PERAD2
PPSAD15 PPSAD14 PPSAD13 PPSAD12 PPSAD11 PPSAD10 PPSAD7 PIEAD15 PIEAD7 PIFAD15 PIFAD7 PPSAD6 PIEAD14 PIEAD6 PIFAD14 PIFAD6 PPSAD5 PIEAD13 PIEAD5 PIFAD13 PIFAD5 PPSAD4 PIEAD12 PIEAD4 PIFAD12 PIFAD4 PPSAD3 PIEAD11 PIEAD3 PIFAD11 PIFAD3 PPSAD2 PIEAD10 PIEAD2 PIFAD10 PIFAD2
0x0280 - 0x03FF Reserved Space
Address 0x0280- 0x2FF Name Reserved R W 0 0 0 0 0 0 0 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0
R 0x0300- Unimplemented 0x03FF W
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 57
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.2.2
Part ID Assignments
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses 0x001A and 0x001B after reset. The read-only value is a unique part ID for each revision of the chip. Table 1-2 shows the assigned part ID numbers.
Table 1-2. Assigned Part ID Numbers
Device MC9S12E128
1
Mask Set Number 2L15P
Part ID1 0x5102
The coding is as follows: Bit 15-12: Major family identifier Bit 11-8: Minor family identifier Bit 7-4: Major mask set revision number including FAB transfers Bit 3-0: Minor -- non full -- mask set revision
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses 0x001C and 0x001D after reset). Table 1-3 shows the read-only values of these registers. Refer to HCS12 Module Mapping Control (MMC) block description chapter for further details.
Table 1-3. Memory Size Registers
Device MC9S12E128 MC9S12E128 Register name MEMSIZ0 MEMSIZ1 Value 0x03 0x80
MC9S12E128 Data Sheet, Rev. 1.07 58 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.3
1.3.1
Signal Description
Device Pinout
PP0/PW00 PP1/PW01 PP2/PW02 PP3/PW03 PP4/PW04 PP5/PW05 PK7/ECS/ROMCTL PK6/XCS PK5/XADDR19 PK4/XADDR18 VDD1 VSS1 PK3/XADDR17 PK2/XADDR16 PK1/XADDR15 PK0/XADDR14 PM1/DA1 PM0/DA0 PAD15/AN15/KWAD15 PAD14/AN14/KWAD14 PAD13/AN13/KWAD13 PAD12/AN12/KWAD12 PAD11/AN11/KWAD11 PAD10/AN10/KWAD10 PAD09/AN09/KWAD09 PAD08/AN08/KWAD08 VSSA VRL
Signals shown in Bold are not available on the 80-pin package
Freescale Semiconductor
IOC15/PT5 IOC16/PT6 IOC17/PT7 PW10/IOC24/PU0 PW11/IOC25/PU1 PW14/PU4 PW15/PU5 XCLKS/NOACC/PE7 MODB/IPIPE1/PE6 MODA/IPIPE0/PE5 ECLK/PE4 VSSR VDDR RESET VDDPLL XFC VSSPLL EXTAL XTAL TEST PU6 PU7 PW12/IOC26/PU2 PW13/IOC27PU3 LSTRB/TAGLO/PE3 R/W/PE2 IRQ/PE1 XIRQ/PE0
29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
PM3 RXD2/PM4 TXD2/PM5 SDA/PM6 SCL/PM7 FAULT0/PQ0 FAULT1/PQ1 FAULT2/PQ2 FAULT3/PQ3 ADDR0/DATA0/PB0 ADDR1/DATA1/PB1 ADDR2/DATA2/PB2 ADDR3/DATA3/PB3 VDDX VSSX ADDR4/DATA4/PB4 ADDR5/DATA5/PB5 ADDR6/DATA6/PB6 ADDR7/DATA7/PB7 IS0/PQ4 IS1/PQ5 IS2/PQ6 MODC/TAGHI/BKGD IOC04/PT0 IOC05/PT1 IOC06/PT2 IOC07/PT3 IOC14/PT4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85
MC9S12E128 112LQFP
84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57
VRH VDDA PAD07/AN07/KWAD07 PAD06/AN06/KWAD06 PAD05/AN05/KWAD05 PAD04/AN04/KWAD04 PAD03/AN03/KWAD03 PAD02/AN02/KWAD02 PAD01/AN01/KWAD01 PAD00/AN00/KWAD00 PA7/ADDR15/DATA15 PA6/ADDR14/DATA14 PA5/ADDR13/DATA13 PA4/ADDR12/DATA12 VSS2 VDD2 PA3/ADDR11/DATA11 PA2/ADDR10/DATA10 PA1/ADDR9/DATA9 PA0/ADDR8/DATA8 PS7/SS PS6/SCK PS5/MOSI PS4/MISO PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0
Figure 1-5. Pin Assignments for 112-LQFP
MC9S12E128 Data Sheet, Rev. 1.07 59
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
PM3 RXD2/PM4 TXD2/PM5 SDA/PM6 SCL/PM7 FAULT0/PQ0 FAULT1/PQ1 FAULT2/PQ2 FAULT3/PQ3 VDDX VSSX IS0/PQ4 IS1/PQ5 IS2/PQ6 MODC/TAGHI/BKGD IOC04/PT0 IOC05/PT1 IOC06/PT2 IOC07/PT3 IOC14/PT4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
PP0/PW00 PP1/PW01 PP2/PW02 PP3/PW03 PP4/PW04 PP5/PW05 VDD1 VSS1 PM1/DA1 PM0/DA0 PAD15/AN15/KWAD15 PAD14/AN14/KWAD14 PAD13/AN13/KWAD13 PAD12/AN12/KWAD12 PAD11/AN11/KWAD11 PAD10/AN10/KWAD10 PAD09/AN09/KWAD09 PAD08/AN08/KWAD08 VSSA VRL
MC9S12E128 80 QFP
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
VRH VDDA PAD07/AN07/KWAD07 PAD06/AN06/KWAD06 PAD05/AN05/KWAD05 PAD04/AN04/KWAD04 PAD03/AN03/KWAD03 PAD02/AN02/KWAD02 PAD01/AN01/KWAD01 PAD00/AN00/KWAD00 VSS2 VDD2 PS7/SS PS6/SCK PS5/MOSI PS4/MISO PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0
Signals shown in Bold are not available on the 64-pin package
60
IOC15/PT5 IOC16/PT6 IOC17/PT7 PW10/IOC24/PU0 PW11/IOC25/PU1 XCLKS/NOACC/PE7 ECLK/PE4 VSSR VDDR RESET VDDPLL XFC VSSPLL EXTAL XTAL TEST PW12/IOC26/PU2 PW13/IOC27/PU3 IRQ/PE1 XIRQ/PE0
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Figure 1-6. Pin Assignments for 80-QFP
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
PP0/PW00 PP1/PW01 PP2/PW02 PP3/PW03 PP4/PW04 PP5/PW05 VDD1 VSS1 PM1/DA1 PM0/DA0 PAD15/AN15/KWAD15 PAD13/AN13/KWAD13 PAD12/AN12/KWAD12 PAD08/AN08/KWAD08 VSSA VRL 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
PM4 PM5 SDA/PM6 SCL/PM7 FAULT0/PQ0 FAULT1/PQ1 FAULT2/PQ2 FAULT3/PQ3 VDDX VSSX MODC/BKGD IOC04/PT0 IOC05/PT1 IOC06/PT2 IOC07/PT3 IOC14/PT4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
MC9S12E128 64 QFN
VRH VDDA PAD06/AN06/KWAD06 PAD04/AN04/KWAD04 PAD02/AN02/KWAD02 PAD00/AN00/KWAD00 VSS2 VDD2 PS7/SS PS6/SCK PS5/MOSI PS4/MISO PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0
Freescale Semiconductor
IOC15/PT5 IOC16/PT6 IOC17/PT7 XCLKS/PE7 ECLK/PE4 VSSR VDDR RESET VDDPLL XFC VSSPLL EXTAL XTAL TEST IRQ/PE1 XIRQ/PE0
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Figure 1-7. Pin Assignments for 64-QFN
MC9S12E128 Data Sheet, Rev. 1.07 61
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.3.2
Signal Properties Summary
Table 1-4. Signal Properties
Pin Name Function 1 EXTAL XTAL XFC RESET BKGD TEST PAD[15,13, 12,8,6,4,2,0] PAD[14,11, 10,9,7,5,3,1] PA[7:0] PB[7:0] PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 PK[7] PK[6] PK[5:0] PM7 PM6 PM5 PM4 PM3 PM1
Pin Name Function 2 -- -- -- -- MODC VPP AN[15,13, 12,8,6,4,2,0] AN[14,11, 10,9,7,5,3,1] ADDR[15:8]/ DATA[15:8] ADDR[7:0]/ DATA[7:0] NOACC IPIPE1 IPIPE0 ECLK LSTRB R/W IRQ XIRQ ECS XCS XADDR[19:14] SCL SDA TXD2 RXD2 -- DAO1
Pin Name Function 3 -- -- -- -- TAGHI -- KWAD[15,13, 12,8,6,4,2,0] KWAD[14,11, 10,9,7,5,3,1] -- -- XCLKS MODB MODA -- TAGLO -- -- -- ROMCTL -- -- -- -- -- -- -- --
Power Domain VDDPLL VDDPLL VDDPLL VDDX VDDX NA VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX
Internal Pull Resistor Description CTRL NA NA NA None Up NA PERAD/ PPSAD PERAD/ PPSAD PUCR PUCR Input Reset State NA NA NA None Up NA Disabled Disabled Disabled Disabled Input PLL loop filter pin External reset pin Background debug, mode pin, tag signal high Test pin only Port AD I/O Pins, ATD inputs, keypad Wake-up Port AD I/O Pins, ATD inputs, keypad Wake-up Port A I/O pin, multiplexed address/data Port B I/O pin, multiplexed address/data Port E I/O pin, access, clock select Port E I/O pin, pipe status, mode selection Port E I/O pin, pipe status, mode selection Port E I/O pin, bus clock output Port E I/O pin, low strobe, tag signal low Port E I/O pin, R/W in expanded modes Port E input, external interrupt pin Port E input, non-maskable interrupt pin Port K I/O Pin, Emulation Chip Select Port K I/O Pin, External Chip Select Port K I/O Pins, Extended Addresses Port M I/O Pin, IIC SCL signal Port M I/O Pin, IIC SDA signal Port M I/O Pin, SCI2 transmit signal Port M I/O Pin, SCI2 receive signal Port M I/O Pin Port M I/O Pin, DAC1 output Oscillator pins
While RESET is low: Down While RESET is low: Down PUCR PUCR PUCR PUCR PUCR PUCR PUCR PUCR PERM/ PPSM PERM/ PPSM PERM/ PPSM PERM/ PPSM PERM/ PPSM PERM/ PPSM Mode Dep1 Mode Dep1
Mode Dep1 Up Up Up Up Up Up Up Up Up Disabled Disabled
MC9S12E128 Data Sheet, Rev. 1.07 62 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
Table 1-4. Signal Properties
Pin Name Function 1 PM0 PP[5:0] PQ[6:4] PQ[3:0] PS7 PS6 PS5 PS4 PS3 PS2 PS1 PS0 PT[7:4] PT[3:0] PU[7:6] PU[5:4] PU[3:0]
1
Pin Name Function 2 DAO0 PW0[5:0] IS[6:4] FAULT[3:0] SS SCK MOSI MISO TXD1 RXD1 TXD0 RXD0 IOC1[7:4] IOC0[7:4] -- PW1[5:4] IOC2[7:4]
Pin Name Function 3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- PW1[3:0]
Power Domain VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX
Internal Pull Resistor Description CTRL PERM/ PPSM PERP/ PPSP PERQ/ PPSQ PERQ/ PPSQ PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERT/ PPST PERT/ PPST PERU/ PPSU PERU/ PPSU PERU/ PPSU Reset State Disabled Disabled Disabled Disabled Up Up Up Up Up Up Up Up Disabled Disabled Disabled Disabled Disabled Port M I/O Pin, DAC0 output Port P I/O Pins, PWM output Port Q I/O Pins, IS[6:4] input Port Q I/O Pins, Fault[3:0] input Port S I/O Pin, SPI SS signal Port S I/O Pin, SPI SCK signal Port S I/O Pin, SPI MOSI signal Port S I/O Pin, SPI MISO signal Port S I/O Pin, SCI1 transmit signal Port S I/O Pin, SCI1 receive signal Port S I/O Pin, SCI0 transmit signal Port S I/O Pin, SCI0 receive signal Port T I/O Pins, timer (TIM1) Port T I/O Pins, timer (TIM0) Port U I/O Pins Port U I/O Pins, PWM outputs Port U I/O Pins, timer (TIM2), PWM outputs
The Port E output buffer enable signal control at reset is determined by the PEAR register and is mode dependent. For example, in special test mode RDWE = LSTRE = 1 which enables the PE[3:2] output buffers and disables the pull-ups. Refer to the S12 MEBI block description chapter for PEAR register details.
NOTE Signals shown in bold are not available in the 112-pin package. Signals shown in italic are not available in the 80-pin package. If the port pins are not bonded out in the chosen package the user should initialize the registers to be inputs with enabled pull resistance to avoid excess current consumption. This applies to the following pins: (80QFP): Port A[7:0], Port B[7:0], Port E[6,5,3,2], Port K[7:0], Port U[7:4] (64QFN): Port U[3:0], Port Q[6:4], Port M[3], Port AD[14,11,10,9,7,5,3,1]
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 63
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.4
1.4.1
Detailed Signal Descriptions
EXTAL, XTAL -- Oscillator Pins
EXTAL and XTAL are the external clock and crystal driver pins. On reset all the device clocks are derived from the EXTAL input frequency. XTAL is the crystal output.
1.4.2
RESET -- External Reset Pin
RESET is an active low bidirectional control signal that acts as an input to initialize the MCU to a known start-up state. It also acts as an open-drain output to indicate that an internal failure has been detected in either the clock monitor or COP watchdog circuit. External circuitry connected to the RESET pin should not include a large capacitance that would interfere with the ability of this signal to rise to a valid logic one within 32 ECLK cycles after the low drive is released. Upon detection of any reset, an internal circuit drives the RESET pin low and a clocked reset sequence controls when the MCU can begin normal processing.
1.4.3
TEST -- Test Pin
The TEST pin is reserved for test and must be tied to VSS in all applications.
1.4.4
XFC -- PLL Loop Filter Pin
Dedicated pin used to create the PLL loop filter. See the CRG block description chapter for more detailed information.
1.4.5
BKGD / TAGHI / MODC -- Background Debug, Tag High & Mode Pin
The BKGD / TAGHI / MODC pin is used as a pseudo-open-drain pin for the background debug communication. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODC bit at the rising edge of RESET. In MCU expanded modes of operation, when instruction tagging is on, an input low on this pin during the falling edge of E-clock tags the high half of the instruction word being read into the instruction queue. This pin always has an internal pull up.
1.4.6
PA[7:0] / ADDR[15:8] / DATA[15:8] -- Port A I/O Pins
PA[7:0] are general purpose input or output pins. In MCU expanded modes of operation, these pins are used for the multiplexed external address and data bus. PA[7:0] pins are not available in the 80 pin package version.
1.4.7
PB[7:0] / ADDR[7:0] / DATA[7:0] -- Port B I/O Pins
PB[7:0] are general purpose input or output pins. In MCU expanded modes of operation, these pins are used for the multiplexed external address and data bus. PB[7:0] pins are not available in the 80 pin package version.
MC9S12E128 Data Sheet, Rev. 1.07 64 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.4.8
PE7 / NOACC / XCLKS -- Port E I/O Pin 7
PE7 is a general purpose input or output pin. During MCU expanded modes of operation, the NOACC signal, when enabled, is used to indicate that the current bus cycle is an unused or "free cycle". This signal will assert when the CPU is not using the bus. The XCLKS is an input signal which controls whether a crystal in combination with the internal Colpitts (low power) oscillator is used or whether Pierce oscillator/external clock circuitry is used. The state of this pin is latched at the rising edge of RESET. If the input is a logic low the EXTAL pin is configured for an external clock drive or a Pierce Oscillator. If the input is a logic high a Colpitts oscillator circuit is configured on EXTAL and XTAL. Since this pin is an input with a pull-up device during reset, if the pin is left floating, the default configuration is a Colpitts oscillator circuit on EXTAL and XTAL.
EXTAL CDC1 MCU C1 Crystal or ceramic resonator
XTAL C2 VSSPLL 1. Due to the nature of a translated ground Colpitts oscillator a DC voltage bias is applied to the crystal. Please contact the crystal manufacturer for crystal DC
Figure 1-8. Colpitts Oscillator Connections (PE7 = 1)
EXTAL C1 MCU RS1 XTAL C2 VSSPLL 1. Rs can be zero (shorted) when use with higher frequency crystals. Refer to manufacturer's data. RB Crystal or ceramic resonator
Figure 1-9. Pierce Oscillator Connections (PE7 = 0)
1.4.9
PE6 / MODB / IPIPE1 -- Port E I/O Pin 6
PE6 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODB bit at the rising edge of RESET. This pin is shared with the instruction queue tracking signal IPIPE1. This pin is an input with a pull-down device which is only active when RESET is low. PE6 is not available in the 80 pin package version.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 65
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.4.10
PE5 / MODA / IPIPE0 -- Port E I/O Pin 5
PE5 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODA bit at the rising edge of RESET. This pin is shared with the instruction queue tracking signal IPIPE0. This pin is an input with a pull-down device which is only active when RESET is low. PE5 is not available in the 80-pin package version.
1.4.11
PE4 / ECLK-- Port E I/O Pin 4 / E-Clock Output
PE4 is a general purpose input or output pin. In Normal Single Chip mode PE4 is configured with an active pull-up while in reset and immediately out of reset. The pullup can be turned off by clearing PUPEE in the PUCR register. In all modes except Normal Single Chip Mode, the PE4 pin is initially configured as the output connection for the internal bus clock (ECLK). ECLK is used as a timing reference and to demultiplex the address and data in expanded modes. The ECLK frequency is equal to 1/2 the crystal frequency out of reset. The ECLK output function depends upon the settings of the NECLK bit in the PEAR register, the IVIS bit in the MODE register and the ESTR bit in the EBICTL register. All clocks, including the ECLK, are halted when the MCU is in STOP mode. It is possible to configure the MCU to interface to slow external memory. ECLK can be stretched for such accesses. The PE4 pin is initially configured as ECLK output with stretch in all expanded modes. Reference the MISC register (EXSTR[1:0] bits) for more information. In normal expanded narrow mode, the ECLK is available for use in external select decode logic or as a constant speed clock for use in the external application system.
1.4.12
PE3 / LSTRB / TAGLO -- Port E I/O Pin 3 / Low-Byte Strobe (LSTRB)
PE3 can be used as a general-purpose I/O in all modes and is an input with an active pull-up out of reset. The pullup can be turned off by clearing PUPEE in the PUCR register. PE3 can also be configured as a Low-Byte Strobe (LSTRB). The LSTRB signal is used in write operations, so external low byte writes will not be possible until this function is enabled. LSTRB can be enabled by setting the LSTRE bit in the PEAR register. In Expanded Wide and Emulation Narrow modes, and when BDM tagging is enabled, the LSTRB function is multiplexed with the TAGLO function. When enabled a logic zero on the TAGLO pin at the falling edge of ECLK will tag the low byte of an instruction word being read into the instruction queue. PE3 is not available in the 80 pin package version.
1.4.13
PE2 / R/W -- Port E I/O Pin 2 / Read/Write
PE2 can be used as a general-purpose I/O in all modes and is configured an input with an active pull-up out of reset. The pullup can be turned off by clearing PUPEE in the PUCR register. If the read/write function is required it should be enabled by setting the RDWE bit in the PEAR register. External writes will not be possible until the read/write function is enabled. The PE2 pin is not available in the 80 pin package version.
1.4.14
PE1 / IRQ -- Port E input Pin 1 / Maskable Interrupt Pin
PE1 is always an input and can always be read. The PE1 pin is also the IRQ input used for requesting an asynchronous interrupt to the MCU. During reset, the I bit in the condition code register (CCR) is set and any IRQ interrupt is masked until software enables it by clearing the I bit. The IRQ is software
MC9S12E128 Data Sheet, Rev. 1.07 66 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
programmable to either falling edge-sensitive triggering or level-sensitive triggering based on the setting of the IRQE bit in the IRQCR register. The IRQ is always enabled and configured to level-sensitive triggering out of reset. It can be disabled by clearing IRQEN bit in the IRQCR register. There is an active pull-up on this pin while in reset and immediately out of reset. The pullup can be turned off by clearing PUPEE in the PUCR register.
1.4.15
PE0 / XIRQ -- Port E input Pin 0 / Non Maskable Interrupt Pin
PE0 is always an input and can always be read. The PE0 pin is also the XIRQ input for requesting a nonmaskable asynchronous interrupt to the MCU. During reset, the X bit in the condition code register (CCR) is set and any XIRQ interrupt is masked until MCU software enables it by clearing the X bit. Because the XIRQ input is level sensitive triggered, it can be connected to a multiple-source wired-OR network. There is an active pull-up on this pin while in reset and immediately out of reset. The pullup can be turned off by clearing PUPEE in the PUCR register.
1.4.16
PK7 / ECS / ROMCTL -- Port K I/O Pin 7
PK7 is a general purpose input or output pin. During MCU expanded modes of operation, when the EMK bit in the MODE register is set to 1, this pin is used as the emulation chip select output (ECS). In expanded modes the PK7 pin can be used to determine the reset state of the ROMON bit in the MISC register. At the rising edge of RESET, the state of the PK7 pin is latched to the ROMON bit. There is an active pull-up on this pin while in reset and immediately out of reset. The pullup can be turned off by clearing PUPKE in the PUCR register. Refer to the HCS12 MEBI block description chapter for further details. PK7 is not available in the 80 pin package version.
1.4.17
PK6 / XCS -- Port K I/O Pin 6
PK6 is a general purpose input or output pin. During MCU expanded modes of operation, when the EMK bit in the MODE register is set to 1, this pin is used as an external chip select signal for most external accesses that are not selected by ECS. There is an active pull-up on this pin while in reset and immediately out of reset. The pullup can be turned off by clearing PUPKE in the PUCR register. Refer to the HCS12 MEBI block description chapter for further details. PK6 is not available in the 80 pin package version.
1.4.18
PK[5:0] / XADDR[19:14] -- Port K I/O Pins [5:0]
PK[5:0] are general purpose input or output pins. In MCU expanded modes of operation, when the EMK bit in the MODE register is set to 1, PK[5:0] provide the expanded address XADDR[19:14] for the external bus. There are active pull-ups on PK[5:0] pins while in reset and immediately out of reset. The pullup can be turned off by clearing PUPKE in the PUCR register. Refer to the HCS12 MEBI block description chapter for further details. PK[5:0] are not available in the 80 pin package version.
1.4.19
PAD[15:0] / AN[15:0] / KWAD[15:0] -- Port AD I/O Pins [15:0]
PAD[15:0] are the analog inputs for the analog to digital converter (ADC). They can also be configured as general purpose digital input or output pin. When enabled as digital inputs or outputs, the PAD[15:0] can
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 67
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
also be configured as Keypad Wake-up pins (KWU) and generate interrupts causing the MCU to exit STOP or WAIT mode. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the ATD_10B16C block description chapter for information about pin configurations.
1.4.20
PM7 / SCL -- Port M I/O Pin 7
PM7 is a general purpose input or output pin. When the IIC module is enabled it becomes the serial clock line (SCL) for the IIC module (IIC). While in reset and immediately out of reset the PM7 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the IIC block description chapter for information about pin configurations.
1.4.21
PM6 / SDA -- Port M I/O Pin 6
PM6 is a general purpose input or output pin. When the IIC module is enabled it becomes the Serial Data Line (SDL) for the IIC module (IIC). While in reset and immediately out of reset the PM6 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the IIC block description chapter for information about pin configurations.
1.4.22
PM5 / TXD2 -- Port M I/O Pin 5
PM5 is a general purpose input or output. When the Serial Communications Interface 2 (SCI2) transmitter is enabled the PM5 pin is configured as the transmit pin TXD2 of SCI2. While in reset and immediately out of reset the PM5 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SCI block description chapter for information about pin configurations.
1.4.23
PM4 / RXD2 -- Port M I/O Pin 4
PM4 is a general purpose input or output. When the Serial Communications Interface 2 (SCI2) receiver is enabled the PM4 pin is configured as the receive pin RXD2 of SCI2. While in reset and immediately out of reset the PM4 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SCI block description chapter for information about pin configurations.
1.4.24
PM3 -- Port M I/O Pin 3
PM3 is a general purpose input or output pin. While in reset and immediately out of reset the PM3 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter for information about pin configurations.
1.4.25
PM1 / DAO1 -- Port M I/O Pin 1
PM1 is a general purpose input or output pin. When the Digital to Analog module 1 (DAC1) is enabled the PM1 pin is configured as the analog output DA01 of DAC1. While in reset and immediately out of reset the PM1 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM)
MC9S12E128 Data Sheet, Rev. 1.07 68 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
PIM_9E128 block description chapter and the DAC_8B1C block description chapter for information about pin configurations.
1.4.26
PM0 / DAO2 -- Port M I/O Pin 0
PM0 is a general purpose input or output pin. When the Digital to Analog module 2 (DAC2) is enabled the PM0 pin is configured as the analog output DA02 of DAC2. While in reset and immediately out of reset the PM0 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the DAC_8B1C block description chapter for information about pin configurations.
1.4.27
PP[5:0] / PW0[5:0] -- Port P I/O Pins [5:0]
PP[5:0] are general purpose input or output pins. When the Pulse width Modulator with Fault protection (PMF) is enabled the PP[5:0] output pins, as a whole or as pairs, can be configured as PW0[5:0] outputs. While in reset and immediately out of reset the PP[5:0] pins are configured as a high impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the PMF_15B6C block description chapter for information about pin configurations.
1.4.28
PQ[6:4] / IS[2:0] -- Port Q I/O Pins [6:4]
PQ[6:4] are general purpose input or output pins. When enabled in the Pulse width Modulator with Fault protection module (PMF), the PQ[6:4] pins become the current status input pins, IS[2:0], for top/bottom pulse width correction. While in reset and immediately out of reset PP[5:0] pins are configured as a high impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the PMF_15B6C block description chapter for information about pin configurations.
1.4.29
PQ[3:0] / FAULT[3:0] -- Port Q I/O Pins [3:0]
PQ[3:0] are general purpose input or output pins. When enabled in the Pulse width Modulator with Fault protection module (PMF), the PQ[3:0] pins become the Fault protection inputs pins, FAULT[3:0], of the PMF. While in reset and immediately out of reset the PQ[3:0] pins are configured as a high impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the PMF_15B6C block description chapter for information about pin configurations.
1.4.30
PS7 / SS -- Port S I/O Pin 7
PS7 is a general purpose input or output. When the Serial Peripheral Interface (SPI) is enabled PS7 becomes the slave select pin SS. While in reset and immediately out of reset the PS7 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SPI block description chapter for information about pin configurations.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 69
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.4.31
PS6 / SCK -- Port S I/O Pin 6
PS6 is a general purpose input or output pin. When the Serial Peripheral Interface (SPI) is enabled PS6 becomes the serial clock pin, SCK. While in reset and immediately out of reset the PS6 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SPI block description chapter for information about pin configurations.
1.4.32
PS5 / MOSI -- Port S I/O Pin 5
PS5 is a general purpose input or output pin. When the Serial Peripheral Interface (SPI) is enabled PS5 is the master output (during master mode) or slave input (during slave mode) pin. While in reset and immediately out of reset the PS5 pin is configured as a high impedance input pin Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SPI block description chapter for information about pin configurations.
1.4.33
PS4 / MISO -- Port S I/O Pin 4
PS4 is a general purpose input or output pin. When the Serial Peripheral Interface (SPI) is enabled PS4 is the master input (during master mode) or slave output (during slave mode) pin. While in reset and immediately out of reset the PS4 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SPI block description chapter for information about pin configurations.
1.4.34
PS3 / TXD1 -- Port S I/O Pin 3
PS3 is a general purpose input or output. When the Serial Communications Interface 1 (SCI1) transmitter is enabled the PS3 pin is configured as the transmit pin, TXD1, of SCI1. While in reset and immediately out of reset the PS3 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SCI block description chapter for information about pin configurations.
1.4.35
PS2 / RXD1 -- Port S I/O Pin 2
PS2 is a general purpose input or output. When the Serial Communications Interface 1 (SCI1) receiver is enabled the PS2 pin is configured as the receive pin RXD1 of SCI1. While in reset and immediately out of reset the PS2 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SCI block description chapter for information about pin configurations.
1.4.36
PS1 / TXD0 -- Port S I/O Pin 1
PS1 is a general purpose input or output. When the Serial Communications Interface 0 (SCI0) transmitter is enabled the PS1 pin is configured as the transmit pin, TXD0, of SCI0. While in reset and immediately out of reset the PS1 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SCI block description chapter for information about pin configurations.
MC9S12E128 Data Sheet, Rev. 1.07 70 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.4.37
PS0 / RXD0 -- Port S I/O Pin 0
PS0 is a general purpose input or output. When the Serial Communications Interface 0 (SCI0) receiver is enabled the PS0 pin is configured as the receive pin RXD0 of SCI0. While in reset and immediately out of reset the PS0 pin is configured as a high impedance input pin. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the SCI block description chapter for information about pin configurations.
1.4.38
PT[7:4] / IOC1[7:4]-- Port T I/O Pins [7:4]
PT[7:4] are general purpose input or output pins. When the Timer system 1 (TIM1) is enabled they can also be configured as the TIM1 input capture or output compare pins IOC1[7-4]. While in reset and immediately out of reset the PT[7:4] pins are configured as a high impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the TIM_16B4C block description chapter for information about pin configurations.
1.4.39
PT[3:0] / IOC0[7:4]-- Port T I/O Pins [3:0]
PT[3:0] are general purpose input or output pins. When the Timer system 0 (TIM0) is enabled they can also be configured as the TIM0 input capture or output compare pins IOC0[7-4]. While in reset and immediately out of reset the PT[3:0] pins are configured as a high impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the TIM_16B4C block description chapter for information about pin configurations.
1.4.40
PU[7:6] -- Port U I/O Pins [7:6]
PU[7:6] are general purpose input or output pins. While in reset and immediately out of reset the PU[7:6] pins are configured as a high impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 for information about pin configurations. PU[7:6] are not available in the 80 pin package version.
1.4.41
PU[5:4] / PW1[5:4] -- Port U I/O Pins [5:4]
PU[5:4] are general purpose input or output pins. When the Pulse Width Modulator (PWM) is enabled the PU[5:4] output pins, individually or as a pair, can be configured as PW1[5:4] outputs. While in reset and immediately out of reset the PU[5:4] pins are configured as a high impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter and the PWM_8B6C block description chapter for information about pin configurations. PU[5:4] are not available in the 80 pin package version.
1.4.42
PU[3:0] / IOC2[7:4]/PW1[3:0] -- Port U I/O Pins [3:0]
PU[3:0] are general purpose input or output pins. When the Timer system 2 (TIM2) is enabled they can also be configured as the TIM2 input capture or output compare pins IOC2[7-4]. When the Pulse Width Modulator (PWM) is enabled the PU[3:0] output pins, individually or as a pair, can be configured as PW1[3:0] outputs. The MODRR register in the Port Integration Module determines if the TIM2 or PWM function is selected. While in reset and immediately out of reset the PU[3:0] pins are configured as a high
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 71
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
impedance input pins. Consult the Port Integration Module (PIM) PIM_9E128 block description chapter, TIM_16B4C block description chapter, and the PWM_8B6C block description chapter for information about pin configurations.
1.4.43
VDDX,VSSX -- Power & Ground Pins for I/O Drivers
External power and ground for I/O drivers. Bypass requirements depend on how heavily the MCU pins are loaded.
1.4.44
VDDR, VSSR -- Power Supply Pins for I/O Drivers & for Internal Voltage Regulator
External power and ground for I/O drivers and input to the internal voltage regulator. Bypass requirements depend on how heavily the MCU pins are loaded.
1.4.45
VDD1, VDD2, VSS1, VSS2 -- Power Supply Pins for Internal Logic
Power is supplied to the MCU through VDD and VSS. This 2.5V supply is derived from the internal voltage regulator. There is no static load on those pins allowed. The internal voltage regulator is turned off, if VDDR is tied to ground.
1.4.46
VDDA, VSSA -- Power Supply Pins for ATD and VREG
VDDA, VSSA are the power supply and ground input pins for the voltage regulator and the analog to digital converter.
1.4.47
VRH, VRL -- ATD Reference Voltage Input Pins
VRH and VRL are the reference voltage input pins for the analog to digital converter.
1.4.48
VDDPLL, VSSPLL -- Power Supply Pins for PLL
Provides operating voltage and ground for the Oscillator and the Phased-Locked Loop. This allows the supply voltage to the Oscillator and PLL to be bypassed independently. This 2.5V voltage is generated by the internal voltage regulator.
MC9S12E128 Data Sheet, Rev. 1.07 72 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
Table 1-5. MC9S12E128 Power and Ground Connection Summary
Mnemonic VDD1, VDD2 VSS1, VSS2 VDDR VSSR VDDX VSSX VDDA VSSA VRH VRL VDDPLL VSSPLL Nominal Voltage 2.5 V 0V 3.3/5.0 V 0V 3.3/5.0 V 0V 3.3/5.0 V 0V 3.3/5.0 V 0V 2.5 V 0V Operating voltage and ground for the analog-to-digital converter, the reference for the internal voltage regulator and the digital-to-analog converters, allows the supply voltage to the A/D to be bypassed independently. Reference voltage high for the ATD converter, and DAC. Reference voltage low for the ATD converter. Provides operating voltage and ground for the Phased-Locked Loop. This allows the supply voltage to the PLL to be bypassed independently. Internal power and ground generated by internal regulator. Description Internal power and ground generated by internal regulator. These also allow an external source to supply the core VDD/VSS voltages and bypass the internal voltage regulator. External power and ground, supply to internal voltage regulator. To disable voltage regulator attach VDDR to VSSR. External power and ground, supply to pin drivers.
NOTE All VSS pins must be connected together in the application. Because fast signal transitions place high, short-duration current demands on the power supply, use bypass capacitors with high-frequency characteristics and place them as close to the MCU as possible. Bypass requirements depend on MCU pin load.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 73
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.5
System Clock Description
The Clock and Reset Generator provides the internal clock signals for the core and all peripheral modules. Figure 1-10 shows the clock connections from the CRG to all modules. Consult the CRG block description chapter for details on clock generation.
HCS12 CORE BDM Core Clock MEBI INT CPU MMC DBG
Flash RAM ATD DAC EXTAL IIC PIM OSC Bus Clock Oscillator Clock XTAL PMF PWM SCI0, SCI1, SCI2 SPI TIM0, TIM1, TIM2 VREG
CRG
Figure 1-10. Clock Connections
Table 1-6. Clock Selection Based on PE7
PE7 = XCLKS 1 0 Description Colpitts Oscillator selected Pierce Oscillator/external clock selected
MC9S12E128 Data Sheet, Rev. 1.07 74 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.6
1.6.1
Modes of Operation
Overview
Eight possible modes determine the operating configuration of the MC9S12E128. Each mode has an associated default memory map and external bus configuration controlled by a further pin. Three low power modes exist for the device.
1.6.2
Chip Configuration Summary
The operating mode out of reset is determined by the states of the MODC, MODB, and MODA pins during reset. The MODC, MODB, and MODA bits in the MODE register show the current operating mode and provide limited mode switching during operation. The states of the MODC, MODB, and MODA pins are latched into these bits on the rising edge of the reset signal. The ROMCTL signal allows the setting of the ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the memory map. ROMON = 1 mean the Flash is visible in the memory map. The state of the ROMCTL pin is latched into the ROMON bit in the MISC register on the rising edge of the reset signal.
Table 1-7. Mode Selection
BKGD = MODC 0 PE6 = MODB 0 PE5 = MODA 0 PK7 = ROMCTL X ROMON Bit 1 Mode Description Special Single Chip, BDM allowed and ACTIVE. BDM is allowed in all other modes but a serial command is required to make BDM active. Emulation Expanded Narrow, BDM allowed Special Test (Expanded Wide), BDM allowed Emulation Expanded Wide, BDM allowed Normal Single Chip, BDM allowed Normal Expanded Narrow, BDM allowed Peripheral; BDM allowed but bus operations would cause bus conflicts (must not be used) Normal Expanded Wide, BDM allowed
0 0 0 1 1 1 1
0 1 1 0 0 1 1
1 0 1 0 1 0 1
0 1 X 0 1 X 0 1 X 0 1
1 0 0 1 0 1 0 1 1 0 1
For further explanation on the modes refer to the HCS12 MEBI block description chapter.
Table 1-8. Clock Selection Based on PE7 PE7 = XCLKS
1 0 Description Colpitts Oscillator selected Pierce Oscillator/external clock selected
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 75
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.7
Security
The device will make available a security feature preventing the unauthorized read and write of the memory contents. This feature allows: * Protection of the contents of FLASH, * Operation in single-chip mode, * Operation from external memory with internal FLASH disabled. The user must be reminded that part of the security must lie with the user's code. An extreme example would be user's code that dumps the contents of the internal program. This code would defeat the purpose of security. At the same time the user may also wish to put a back door in the user's program. An example of this is the user downloads a key through the SCI which allows access to a programming routine that updates parameters.
1.7.1
Securing the Microcontroller
Once the user has programmed the FLASH, the part can be secured by programming the security bits located in the FLASH module. These non-volatile bits will keep the part secured through resetting the part and through powering down the part. The security byte resides in a portion of the Flash array. Check the Flash block description chapter for more details on the security configuration.
1.7.2
1.7.2.1
Operation of the Secured Microcontroller
Normal Single Chip Mode
This will be the most common usage of the secured part. Everything will appear the same as if the part was not secured with the exception of BDM operation. The BDM operation will be blocked.
1.7.2.2
Executing from External Memory
The user may wish to execute from external space with a secured microcontroller. This is accomplished by resetting directly into expanded mode. The internal FLASH will be disabled. BDM operations will be blocked.
1.7.3
Unsecuring the Microcontroller
In order to unsecure the microcontroller, the internal FLASH must be erased. This can be done through an external program in expanded mode. Once the user has erased the FLASH, the part can be reset into special single chip mode. This invokes a program that verifies the erasure of the internal FLASH. Once this program completes, the user can erase and program the FLASH security bits to the unsecured state. This is generally done through the BDM, but the user could also change to expanded mode (by writing the mode bits through the BDM) and jumping to
MC9S12E128 Data Sheet, Rev. 1.07 76 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
an external program (again through BDM commands). Note that if the part goes through a reset before the security bits are reprogrammed to the unsecure state, the part will be secured again.
1.8
Low Power Modes
The microcontroller features three main low power modes. Consult the respective block description chapter for information on the module behavior in Stop, Pseudo Stop, and Wait Mode. An important source of information about the clock system is the Clock and Reset Generator (CRG) block description chapter.
1.8.1
Stop
Executing the CPU STOP instruction stops all clocks and the oscillator thus putting the chip in fully static mode. Wake up from this mode can be done via reset or external interrupts.
1.8.2
Pseudo Stop
This mode is entered by executing the CPU STOP instruction. In this mode the oscillator is still running and the Real Time Interrupt (RTI) or Watchdog (COP) sub module can stay active. Other peripherals are turned off. This mode consumes more current than the full STOP mode, but the wake up time from this mode is significantly shorter.
1.8.3
Wait
This mode is entered by executing the CPU WAI instruction. In this mode the CPU will not execute instructions. The internal CPU signals (address and data bus) will be fully static. All peripherals stay active. For further power consumption the peripherals can individually turn off their local clocks.
1.8.4
Run
Although this is not a low power mode, unused peripheral modules should not be enabled in order to save power.
1.9
Resets and Interrupts
Consult the Exception Processing section of the CPU12 Reference Manual for information on resets and interrupts. System resets can be generated through external control of the RESET pin, through the clock and reset generator module CRG or through the low voltage reset (LVR) generator of the voltage regulator module. Refer to the CRG and VREG block description chapters for detailed information on reset generation.
1.9.1
Vectors
Table 1-9 lists interrupt sources and vectors in default order of priority.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 77
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
Table 1-9. Interrupt Vector Locations
Vector Address 0xFFFE, 0xFFFF Interrupt Source External Reset, Power On Reset or Low Voltage Reset (see CRG Flags Register to determine reset source) Clock Monitor fail reset COP failure reset Unimplemented instruction trap SWI XIRQ IRQ Real Time Interrupt Standard Timer 0 channel 4 Standard Timer 0 channel 5 Standard Timer 0 channel 6 Standard Timer 0 channel 7 Standard Timer overflow Pulse accumulator overflow Pulse accumulator input edge SPI SCI0 SCI1 SCI2 ATD Port AD (KWU) CRG PLL lock CRG Self Clock Mode IIC Bus FLASH Standard Timer 1 channel 4 Standard Timer 1 channel 5 Standard Timer 1 channel 6 Standard Timer 1 channel 7 Standard Timer 1 overflow CCR Mask None Local Enable None HPRIO Value to Elevate -
0xFFFC, 0xFFFD 0xFFFA, 0xFFFB 0xFFF8, 0xFFF9 0xFFF6, 0xFFF7 0xFFF4, 0xFFF5 0xFFF2, 0xFFF3 0xFFF0, 0xFFF1 0xFFE8 to 0xFFEF 0xFFE6, 0xFFE7 0xFFE4, 0xFFE5 0xFFE2, 0xFFE3 0xFFE0, 0xFFE1 0xFFDE, 0xFFDF 0xFFDC, 0xFFDD 0xFFDA, 0xFFDB 0xFFD8, 0xFFD9 0xFFD6, 0xFFD7 0xFFD4, 0xFFD5 0xFFD2, 0xFFD3 0xFFD0, 0xFFD1 0xFFCE, 0xFFCF 0xFFC8 to 0xFFCD 0xFFC6, 0xFFC7 0xFFC4, 0xFFC5 0xFFC2, 0xFFC3 0xFFC0, 0xFFC1 0xFFBA to 0xFFBF 0xFFB8, 0xFFB9 0xFFB6, 0xFFB7 0xFFB4, 0xFFB5 0xFFB2, 0xFFB3 0xFFB0, 0xFFB1 0xFFAE, 0xFFAF
None None None None X-Bit I-Bit I-Bit Reserved I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit Reserved I-Bit I-Bit Reserved I-Bit Reserved I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit
COPCTL (CME, FCME) COP rate select None None None INTCR (IRQEN) CRGINT (RTIE) TIE (C4I) TIE (C5I) TIE (C6I) TIE (C7I) TSCR2 (TOI) PACTL(PAOVI) PACTL (PAI) SPICR1 (SPIE, SPTIE) SCICR2 (TIE, TCIE, RIE, ILIE) SCICR2 (TIE, TCIE, RIE, ILIE) SCICR2 (TIE, TCIE, RIE, ILIE) ATDCTL2 (ASCIE) PTADIF (PTADIE) PLLCR (LOCKIE) PLLCR (SCMIE) IBCR (IBIE) FCNFG (CCIE, CBEIE) TIE (C4I) TIE (C5I) TIE (C6I) TIE (C7I) TSCR2 (TOI)
- - - - - 0xF2 0xF0 0xE6 0xE4 0xE2 0xE0 0xDE 0xDC 0xDA 0xD8 0xD6 0xD4 0xD2 0xD0 0xCE 0xC6 0xC4 0xC0 0xB8 0xB6 0xB4 0xB2 0xB0 0xAE
MC9S12E128 Data Sheet, Rev. 1.07 78 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
Table 1-9. Interrupt Vector Locations (continued)
Vector Address 0xFFAC, 0xFFAD 0xFFAA, 0xFFAB 0xFFA8, 0xFFA9 0xFFA6, 0xFFA7 0xFFA4, 0xFFA5 0xFFA2, 0xFFA3 0xFFA0, 0xFFA1 0xFF9E, 0xFF9F 0xFF9C, 0xFF9D 0xFF9A, 0xFF9B 0xFF98, 0xFF99 0xFF96, 0xFF97 0xFF94, 0xFF95 0xFF92, 0xFF93 0xFF90, 0xFF91 0xFF8E, 0xFF8F 0xFF8C, 0xFF8D 0xFF8A, 0xFF8B 0xFF88, 0xFF89 0xFF80 to 0xFF87 Standard Timer 2 channel 4 Standard Timer 2 channel 5 Standard Timer 2 channel 6 Standard Timer 2 channel 7 Standard Timer overflow Standard Timer 2 Pulse accumulator overflow Standard Timer 2 Pulse accumulator input edge PMF Generator A Reload PMF Generator B Reload PMF Generator C Reload PMF Fault 0 PMF Fault 1 PMF Fault 2 PMF Fault 3 VREG LVI PWM Emergency Shutdown Interrupt Source Standard Timer 1 Pulse accumulator overflow Standard Timer 1 Pulse accumulator input edge CCR Mask I-Bit I-Bit Reserved I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit I-Bit Reserved TIE (C4I) TIE (C5I) TIE (C6I) TIE (C7I) TSCR2 (TOI) PACTL (PAOVI) PACTL (PAI) PMFENCA (PWMRIEA) PMFENCB (PWMRIEB) PMFENCC (PWMRIEC) PMFFCTL (FIE0) PMFFCTL (FIE1) PMFFCTL (FIE2) PMFFCTL (FIE3) CTRL0 (LVIE) PWMSDN(PWMIE) 0xA6 0xA4 0xA2 0xA0 0x9E 0x9C 0x9A 0x98 0x96 0x94 0x92 0x90 0x8E 0x8C 0x8A 0x88 Local Enable PACTL (PAOVI) PACTL (PAI) HPRIO Value to Elevate 0xAC 0xAA
1.9.2
Resets
Resets are a subset of the interrupts featured in Table 1-9. The different sources capable of generating a system reset are summarized in Table 1-10.
1.9.2.1
Reset Summary Table
Table 1-10. Reset Summary
Reset Power-on Reset External Reset Low Voltage Reset Clock Monitor Reset COP Watchdog Reset Priority 1 1 1 2 3 Source CRG Module RESET pin VREG Module CRG Module CRG Module Vector 0xFFFE, 0xFFFF 0xFFFE, 0xFFFF 0xFFFE, 0xFFFF 0xFFFC, 0xFFFD 0xFFFA, 0xFFFB
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 79
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.9.2.2
Effects of Reset
When a reset occurs, MCU registers and control bits are changed to known start-up states. Refer to the respective module block description chapters for register reset states. Refer to the HCS12 MEBI block description chapter for mode dependent pin configuration of port A, B and E out of reset. Refer to the PIM block description chapter for reset configurations of all peripheral module ports. Refer to Table 1-1 for locations of the memories depending on the operating mode after reset. The RAM array is not automatically initialized out of reset.
MC9S12E128 Data Sheet, Rev. 1.07 80 Freescale Semiconductor
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
1.10
Recommended Printed Circuit Board Layout
The Printed Circuit Board (PCB) must be carefully laid out to ensure proper operation of the voltage regulator as well as the MCU itself. The following rules must be observed: * Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the corresponding pins (C1-C6). * Central point of the ground star should be the VSSR pin. * Use low ohmic low inductance connections between VSS1, VSS2 and VSSR. * VSSPLL must be directly connected to VSSR. * Keep traces of VSSPLL, EXTAL and XTAL as short as possible and occupied board area for C7, C8, C11 and Q1 as small as possible. * Do not place other signals or supplies underneath area occupied by C7, C8, C10 and Q1 and the connection area to the MCU. * Central power input should be fed in at the VDDA/VSSA pins.
Table 1-11. Recommended Decoupling Capacitor Choice
Component C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 R1 Q1 Purpose VDD1 filter cap VDD2 filter cap (80 QFP only) VDDA filter cap VDDR filter cap VDDPLL filter cap VDDX filter cap OSC load cap OSC load cap PLL loop filter cap PLL loop filter cap DC cutoff cap PLL loop filter res Quartz See PLL specification chapter Type Ceramic X7R Ceramic X7R Ceramic X7R X7R/tantalum Ceramic X7R X7R/tantalum Value 100-220nF 100-220nF 100nF >=100nF 100nF >=100nF
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 81
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
NOTE: Oscillator in Colpitts mode.
VDD1
C1 VSS1
VSSA
C3
VDDA
VDDX C6 VSSX
VSS2 C2 VDD2
VSSR C4 VDDR C5 C9 R1 C10 C8 Q1 VSSPLL VDDPLL C7
Figure 1-11. Recommended PCB Layout (112-LQFP)
MC9S12E128 Data Sheet, Rev. 1.07 82 Freescale Semiconductor
C11
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
NOTE: Oscillator in Colpitts mode.
VSSA VDD1 C1 VSS1 C3
VDDA
VDDX C6 VSSX
VSS2 C2
VDD2
VSSR C4 C5 VDDR C8 Q1 VSSPLL R1 VDDPLL C7 C11
Figure 1-12. Recommended PCB Layout (80-QFP)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 83
C9
C10
Chapter 1 MC9S12E128 Device Overview (MC9S12E128DGV1)
NOTE: Oscillator in Colpitts mode.
VSSA VDD1 C1 VSS1 C3
VDDA
VSS2 C2 VDDX VDD2 C6 VSSX
VSSR C4 C5 VDDR C8 Q1 VSSPLL R1 VDDPLL C7 C11
Figure 1-13. Recommended PCB Layout (64-QFN)
MC9S12E128 Data Sheet, Rev. 1.07 84 Freescale Semiconductor
C9
C10
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.1 Introduction
The FTS128K1 module implements a 128 Kbyte Flash (nonvolatile) memory. The Flash memory contains one array of 128 Kbytes organized as 1024 rows of 128 bytes with an erase sector size of eight rows (1024 bytes). The Flash array may be read as either bytes, aligned words, or misaligned words. Read access time is one bus cycle for byte and aligned word, and two bus cycles for misaligned words. The Flash array is ideal for program and data storage for single-supply applications allowing for field reprogramming without requiring external voltage sources for program or erase. Program and erase functions are controlled by a command driven interface. The Flash module supports both mass erase and sector erase. An erased bit reads 1 and a programmed bit reads 0. The high voltage required to program and erase is generated internally. It is not possible to read from a Flash array while it is being erased or programmed. CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed.
2.1.1
Glossary
Command Write Sequence -- A three-step MCU instruction sequence to program, erase, or erase verify the Flash array memory.
2.1.2
* * * * * * * *
Features
128 Kbytes of Flash memory comprised of one 128 Kbyte array divided into 128 sectors of 1024 bytes Automated program and erase algorithm Interrupts on Flash command completion and command buffer empty Fast sector erase and word program operation 2-stage command pipeline for faster multi-word program times Flexible protection scheme to prevent accidental program or erase Single power supply for Flash program and erase operations Security feature to prevent unauthorized access to the Flash array memory
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 85
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.1.3
Modes of Operation
See Section 2.4.2, "Operating Modes" for a description of the Flash module operating modes. For program and erase operations, refer to Section 2.4.1, "Flash Command Operations".
2.1.4
Block Diagram
Figure 2-1 shows a block diagram of the FTS128K1 module.
FTS128K1
Flash Interface
Command Pipeline
Command Complete Interrupt Command Buffer Empty Interrupt
Flash Array
cmd2 addr2 data2 cmd1 addr1 data1
64K * 16 Bits
sector 0 sector 1
Registers
Protection sector 127 Security
Oscillator Clock
Clock Divider FCLK
Figure 2-1. FTS128K1 Block Diagram
2.2
External Signal Description
The FTS128K1 module contains no signals that connect off-chip.
MC9S12E128 Data Sheet, Rev. 1.07 86 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.3
Memory Map and Registers
This section describes the FTS128K1 memory map and registers.
2.3.1
Module Memory Map
The FTS128K1 memory map is shown in Figure 2-2. The HCS12 architecture places the Flash array addresses between 0x4000 and 0xFFFF, which corresponds to three 16 Kbyte pages. The content of the HCS12 Core PPAGE register is used to map the logical middle page ranging from address 0x8000 to 0xBFFF to any physical 16K byte page in the Flash array memory.1 The FPROT register (see Section 2.3.2.5) can be set to globally protect the entire Flash array. Three separate areas, one starting from the Flash array starting address (called lower) towards higher addresses, one growing downward from the Flash array end address (called higher), and the remaining addresses, can be activated for protection. The Flash array addresses covered by these protectable regions are shown in Figure 2-2. The higher address area is mainly targeted to hold the boot loader code since it covers the vector space. The lower address area can be used for EEPROM emulation in an MCU without an EEPROM module since it can be left unprotected while the remaining addresses are protected from program or erase. Default protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the Flash configuration field described in Table 2-1.
Table 2-1. Flash Configuration Field
Flash Address 0xFF00-0xFF07 0xFF08-0xFF0C 0xFF0D 0xFF0E 0xFF0F Size (bytes) 8 5 1 1 1 Description Backdoor Key to unlock security Reserved Flash Protection byte Refer to Section 2.3.2.5, "Flash Protection Register (FPROT)" Reserved Flash Security/Options byte Refer to Section 2.3.2.2, "Flash Security Register (FSEC)"
1. By placing 0x3E/0x3F in the HCS12 Core PPAGE register, the bottom/top fixed 16 Kbyte pages can be seen twice in the MCU memory map.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 87
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
MODULE BASE + 0x0000 MODULE BASE + 0x000F FLASH_START = 0x4000 0x4400 0x4800 0x5000 Flash Protected Low Sectors 1, 2, 4, 8 Kbytes Flash Registers 16 bytes
0x6000
0x3E
Flash Array
0x8000
16K PAGED MEMORY
0x38
0x39
0x3A
0x3B 0x3C
0x3D
003E
0x3F
0xC000
0xE000
0x3F
Flash Protected High Sectors 2, 4, 8, 16 Kbytes
0xF000 0xF800 FLASH_END = 0xFFFF
0xFF00-0xFF0F (Flash Configuration Field)
Note: 0x38-0x3F correspond to the PPAGE register content
Figure 2-2. Flash Memory Map
MC9S12E128 Data Sheet, Rev. 1.07 88 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
Table 2-2. Flash Array Memory Map Summary
MCU Address Range 0x0000-0x3FFF2 0x4000-0x7FFF PPAGE Unpaged (0x3D) Unpaged (0x3E) Protectable Low Range N.A. 0x4000-0x43FF 0x4000-0x47FF 0x4000-0x4FFF 0x4000-0x5FFF 0x8000-0xBFFF 0x38 0x39 0x3A 0x3B 0x3C 0x3D 0x3E N.A. N.A. N.A. N.A. N.A. N.A. 0x8000-0x83FF 0x8000-0x87FF 0x8000-0x8FFF 0x8000-0x9FFF 0x3F N.A. 0xB800-0xBFFF 0xB000-0xBFFF 0xA000-0xBFFF 0x8000-0xBFFF 0xC000-0xFFFF Unpaged (0x3F) N.A. 0xF800-0xFFFF 0xF000-0xFFFF 0xE000-0xFFFF 0xC000-0xFFFF
1 2
Protectable High Range N.A. N.A.
Array Relative Address1 0x14000-0x17FFF 0x18000-0x1BFFF
N.A. N.A. N.A. N.A. N.A. N.A. N.A.
0x00000-0x03FFF 0x04000-0x07FFF 0x08000-0x0BFFF 0x0C000-0x0FFFF 0x10000-0x13FFF 0x14000-0x17FFF 0x18000-0x1BFFF
0x1C000-0x1FFFF
0x1C000-0x1FFFF
Inside Flash block. If allowed by MCU.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 89
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.3.2
Register Descriptions
The Flash module contains a set of 16 control and status registers located between module base + 0x0000 and 0x000F. A summary of the Flash module registers is given in Figure 2-3. Detailed descriptions of each register bit are provided.
Register Name 0x0000 FCLKDIV 0x0001 FSEC 0x0002 RESERVED11 0x0003 FCNFG 0x0004 FPROT 0x0005 FSTAT 0x0006 FCMD 0x0007 RESERVED21 0x0008 FADDRHI1 0x0009 FADDRLO1 0x000A FDATAHI1 0x000B FDATALO1 0x000C RESERVED31 0x000D RESERVED41 0x000E RESERVED51 0x000F RESERVED61 R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 FDIVLD KEYEN1 0 6 PRDIV8 KEYEN0 0 5 FDIV5 NV5 0 4 FDIV4 NV4 0 0 3 FDIV3 NV3 0 0 2 FDIV2 NV2 0 0 1 FDIV1 SEC1 0 0 Bit 0 FDIV0 SEC0 0 0
CBEIE FPOPEN CBEIF 0 0
CCIE NV6 CCIF
KEYACC FPHDIS PVIOL CMDB5 0
FPHS1 ACCERR 0 0
FPHS0 0 0 0
FPLDIS BLANK
FPLS1 FAIL 0 0
FPLS0 DONE
CMDB6 0
CMDB2 0
CMDB0 0
FABHI FABLO FDHI FDLO 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
= Unimplemented or Reserved
Figure 2-3. Flash Register Summary
1
Intended for factory test purposes only.
MC9S12E128 Data Sheet, Rev. 1.07 90 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.3.2.1
Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
Module Base + 0x0000
7 6 5 4 3 2 1 0
R W Reset
FDIVLD PRDIV8 0 0 FDIV5 0 FDIV4 0 FDIV3 0 FDIV2 0 FDIV1 0 FDIV0 0
= Unimplemented or Reserved
Figure 2-4. Flash Clock Divider Register (FCLKDIV)
All bits in the FCLKDIV register are readable, bits 6-0 are write once and bit 7 is not writable.
Table 2-3. FCLKDIV Field Descriptions
Field 7 FDIVLD 6 PRDIV8 5-0 FDIV[5:0] Description Clock Divider Loaded 0 FCLKDIV register has not been written 1 FCLKDIV register has been written to since the last reset Enable Prescalar by 8 0 The oscillator clock is directly fed into the Flash clock divider 1 The oscillator clock is divided by 8 before feeding into the Flash clock divider Clock Divider Bits -- The combination of PRDIV8 and FDIV[5:0] must divide the oscillator clock down to a frequency of 150 kHz - 200 kHz. The maximum divide ratio is 512. Refer to Section 2.4.1.1, "Writing the FCLKDIV Register" for more information.
2.3.2.2
Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
Module Base + 0x0001
7 6 5 4 3 2 1 0
R W Reset
KEYEN1
KEYEN0
NV5
NV4
NV3
NV2
SEC1
SEC0
F
F
F
F
F
F
F
F
= Unimplemented or Reserved
Figure 2-5. Flash Security Register (FSEC)
All bits in the FSEC register are readable but not writable. The FSEC register is loaded from the Flash configuration field at 0xFF0F during the reset sequence, indicated by F in Figure 2-5.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 91
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
Table 2-4. FSEC Field Descriptions
Field Description
7-6 Backdoor Key Security Enable Bits -- The KEYEN[1:0] bits define the enabling of the backdoor key access KEYEN[1:0] to the Flash module as shown in Table 2-5. 5-2 NV[5:2] 1-0 SEC[1:0] Nonvolatile Flag Bits -- The NV[5:2] bits are available to the user as nonvolatile flags. Flash Security Bits -- The SEC[1:0] bits define the security state of the MCU as shown in Table 2-6. If the Flash module is unsecured using backdoor key access, the SEC[1:0] bits are forced to 1:0.
Table 2-5. Flash KEYEN States
KEYEN[1:0] 00 01
1
Status of Backdoor Key Access DISABLED DISABLED ENABLED DISABLED
10 11
1
Preferred KEYEN state to disable Backdoor Key Access.
Table 2-6. Flash Security States
SEC[1:0] 00 01
1
Status of Security Secured Secured Unsecured Secured
10 11
1
Preferred SEC state to set MCU to secured state.
The security function in the Flash module is described in Section 2.4.3, "Flash Module Security".
2.3.2.3
RESERVED1
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0002
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-6. RESERVED1
All bits read 0 and are not writable.
MC9S12E128 Data Sheet, Rev. 1.07 92 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.3.2.4
Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash interrupts and gates the security backdoor key writes.
Module Base + 0x0003
7 6 5 4 3 2 1 0
R CBEIE W Reset 0 0 0 CCIE KEYACC
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-7. Flash Configuration Register (FCNFG)
CBEIE, CCIE, and KEYACC are readable and writable while remaining bits read 0 and are not writable. KEYACC is only writable if the KEYEN bit in the FSEC register is set to the enabled state (see Section 2.3.2.2).
Table 2-7. FCNFG Field Descriptions
Field 7 CBEIE Description Command Buffer Empty Interrupt Enable -- The CBEIE bit enables the interrupts in case of an empty command buffer in the Flash module. 0 Command Buffer Empty interrupts disabled 1 An interrupt will be requested whenever the CBEIF flag is set (see Section 2.3.2.6) Command Complete Interrupt Enable -- The CCIE bit enables the interrupts in case of all commands being completed in the Flash module. 0 Command Complete interrupts disabled 1 An interrupt will be requested whenever the CCIF flag is set (see Section 2.3.2.6) Enable Security Key Writing. 0 Flash writes are interpreted as the start of a command write sequence 1 Writes to the Flash array are interpreted as a backdoor key while reads of the Flash array return invalid data
6 CCIE
5 KEYACC
2.3.2.5
Flash Protection Register (FPROT)
The FPROT register defines which Flash sectors are protected against program or erase.
Module Base + 0x0004
7 6 5 4 3 2 1 0
R FPOPEN W Reset F F F F F F F F NV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
Figure 2-8. Flash Protection Register (FPROT)
The FPROT register is readable in normal and special modes. FPOPEN can only be written from a 1 to a 0. FPLS[1:0] can be written anytime until FPLDIS is cleared. FPHS[1:0] can be written anytime until
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 93
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
FPHDIS is cleared. The FPROT register is loaded from Flash address 0xFF0D during the reset sequence, indicated by F in Figure 2-8. To change the Flash protection that will be loaded on reset, the upper sector of the Flash array must be unprotected, then the Flash protection byte located at Flash address 0xFF0D must be written to. A protected Flash sector is disabled by FPHDIS and FPLDIS while the size of the protected sector is defined by FPHS[1:0] and FPLS[1:0] in the FPROT register. Trying to alter any of the protected areas will result in a protect violation error and the PVIOL flag will be set in the FSTAT register (see Section 2.3.2.6). A mass erase of the whole Flash array is only possible when protection is fully disabled by setting the FPOPEN, FPLDIS, and FPHDIS bits. An attempt to mass erase a Flash array while protection is enabled will set the PVIOL flag in the FSTAT register.
Table 2-8. FPROT Field Descriptions
Field 7 FPOPEN Description Protection Function for Program or Erase -- It is possible using the FPOPEN bit to either select address ranges to be protected using FPHDIS, FPLDIS, FPHS[1:0] and FPLS[1:0] or to select the same ranges to be unprotected. When FPOPEN is set, FPxDIS enables the ranges to be protected, whereby clearing FPxDIS enables protection for the range specified by the corresponding FPxS[1:0] bits. When FPOPEN is cleared, FPxDIS defines unprotected ranges as specified by the corresponding FPxS[1:0] bits. In this case, setting FPxDIS enables protection. Thus the effective polarity of the FPxDIS bits is swapped by the FPOPEN bit as shown in Table 2-9. This function allows the main part of the Flash array to be protected while a small range can remain unprotected for EEPROM emulation. 0 The FPHDIS and FPLDIS bits define Flash address ranges to be unprotected 1 The FPHDIS and FPLDIS bits define Flash address ranges to be protected Nonvolatile Flag Bit -- The NV6 bit should remain in the erased state for future enhancements. Flash Protection Higher Address Range Disable -- The FPHDIS bit determines whether there is a protected/unprotected area in the higher space of the Flash address map. 0 Protection/unprotection enabled 1 Protection/unprotection disabled Flash Protection Higher Address Size -- The FPHS[1:0] bits determine the size of the protected/unprotected sector as shown in Table 2-10. The FPHS[1:0] bits can only be written to while the FPHDIS bit is set. Flash Protection Lower Address Range Disable -- The FPLDIS bit determines whether there is a protected/unprotected sector in the lower space of the Flash address map. 0 Protection/unprotection enabled 1 Protection/unprotection disabled Flash Protection Lower Address Size -- The FPLS[1:0] bits determine the size of the protected/unprotected sector as shown in Table 2-11. The FPLS[1:0] bits can only be written to while the FPLDIS bit is set.
6 NV6 5 FPHDIS
4-3 FPHS[1:0] 2 FPLDIS
1-0 FPLS[1:0]
MC9S12E128 Data Sheet, Rev. 1.07 94 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
Table 2-9. Flash Protection Function
FPOPEN 1 1 1 1 0 0 0 0
1
FPHDIS 1 1 0 0 1 0 1 0
FPHS[1] x x x x x x x x
FPHS[0] x x x x x x x x
FPLDIS 1 0 1 0 1 1 0 0
FPLS[1] x x x x x x x x
FPLS[0] x x x x x x x x
Function1 No protection Protect low range Protect high range Protect high and low ranges Full Flash array protected Unprotected high range Unprotected low range Unprotected high and low ranges
For range sizes refer to Table 2-10 and Table 2-11 or .
Table 2-10. Flash Protection Higher Address Range
FPHS[1:0] 00 01 10 11 Address Range 0xF800-0xFFFF 0xF000-0xFFFF 0xE000-0xFFFF 0xC000-0xFFFF Range Size 2 Kbytes 4 Kbytes 8 Kbytes 16 Kbytes
Table 2-11. Flash Protection Lower Address Range
FPLS[1:0] 00 01 10 11 Address Range 0x4000-0x43FF 0x4000-0x47FF 0x4000-0x4FFF 0x4000-0x5FFF Range Size 1 Kbyte 2 Kbytes 4 Kbytes 8 Kbytes
Figure 2-9 illustrates all possible protection scenarios. Although the protection scheme is loaded from the Flash array after reset, it is allowed to change in normal modes. This protection scheme can be used by applications requiring re-programming in single chip mode while providing as much protection as possible if no re-programming is required.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 95
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
FPHDIS = 1 FPLDIS = 1 Scenario 7
FPHDIS = 1 FPLDIS = 0 6
FPHDIS = 0 FPLDIS = 1 5
FPHDIS = 0 FPLDIS = 0 4 FPLS[1:0] 7 Freescale Semiconductor FPHS[1:0] FPLS[1:0] FPHS[1:0]
0xFFFF
Scenario
FPOPEN = 1
3
2
1
0
0xFFFF Protected Flash
FPOPEN = 0
Figure 2-9. Flash Protection Scenarios
2.3.2.5.1
Flash Protection Restrictions
The general guideline is that protection can only be added, not removed. All valid transitions between Flash protection scenarios are specified in Table 2-12. Any attempt to write an invalid scenario to the FPROT register will be ignored and the FPROT register will remain unchanged. The contents of the FPROT register reflect the active protection scenario.
Table 2-12. Flash Protection Scenario Transitions
From Protection Scenario 0 1 2 3 4 5 X To Protection Scenario1 0 X 1 X X X 2 X 3 X X X X X X X X X 4 5 6
MC9S12E128 Data Sheet, Rev. 1.07 96
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
Table 2-12. Flash Protection Scenario Transitions
From Protection Scenario 6 7
1
To Protection Scenario1 0 1 X X X X 2 3 X X 4 X X X 5 6 X X X 7
Allowed transitions marked with X.
2.3.2.6
Flash Status Register (FSTAT)
The FSTAT register defines the status of the Flash command controller and the results of command execution.
Module Base + 0x0005
7 6 5 4 3 2 1 0
R CBEIF W Reset 1
CCIF PVIOL 1 0 ACCERR 0
0
BLANK FAIL
DONE
0
0
0
1
= Unimplemented or Reserved
Figure 2-10. Flash Status Register (FSTAT)
In normal modes, bits CBEIF, PVIOL, and ACCERR are readable and writable, bits CCIF and BLANK are readable and not writable, remaining bits, including FAIL and DONE, read 0 and are not writable. In special modes, FAIL is readable and writable while DONE is readable but not writable. FAIL must be clear in special modes when starting a command write sequence.
Table 2-13. FSTAT Field Descriptions
Field 7 CBEIF Description Command Buffer Empty Interrupt Flag -- The CBEIF flag indicates that the address, data and command buffers are empty so that a new command write sequence can be started. The CBEIF flag is cleared by writing a 1 to CBEIF. Writing a 0 to the CBEIF flag has no effect on CBEIF. Writing a 0 to CBEIF after writing an aligned word to the Flash address space but before CBEIF is cleared will abort a command write sequence and cause the ACCERR flag in the FSTAT register to be set. Writing a 0 to CBEIF outside of a command write sequence will not set the ACCERR flag. The CBEIF flag is used together with the CBEIE bit in the FCNFG register to generate an interrupt request (see Figure 2-26). 0 Buffers are full 1 Buffers are ready to accept a new command Command Complete Interrupt Flag -- The CCIF flag indicates that there are no more commands pending. The CCIF flag is cleared when CBEIF is clear and sets automatically upon completion of all active and pending commands. The CCIF flag does not set when an active commands completes and a pending command is fetched from the command buffer. Writing to the CCIF flag has no effect. The CCIF flag is used together with the CCIE bit in the FCNFG register to generate an interrupt request (see Figure 2-26). 0 Command in progress 1 All commands are completed
6 CCIF
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 97
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
Table 2-13. FSTAT Field Descriptions
Field 5 PVIOL Description Protection Violation -- The PVIOL flag indicates an attempt was made to program or erase an address in a protected Flash array memory area. The PVIOL flag is cleared by writing a 1 to PVIOL. Writing a 0 to the PVIOL flag has no effect on PVIOL. While PVIOL is set, it is not possible to launch another command. 0 No protection violation detected 1 Protection violation has occurred Access Error -- The ACCERR flag indicates an illegal access to the Flash array caused by either a violation of the command write sequence, issuing an illegal command (illegal combination of the CMDBx bits in the FCMD register) or the execution of a CPU STOP instruction while a command is executing (CCIF=0). The ACCERR flag is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR flag has no effect on ACCERR. While ACCERR is set, it is not possible to launch another command. 0 No access error detected 1 Access error has occurred Flash Array Has Been Verified as Erased -- The BLANK flag indicates that an erase verify command has checked the Flash array and found it to be erased. The BLANK flag is cleared by hardware when CBEIF is cleared as part of a new valid command write sequence. Writing to the BLANK flag has no effect on BLANK. 0 If an erase verify command has been requested, and the CCIF flag is set, then a 0 in BLANK indicates the array is not erased 1 Flash array verifies as erased Flag Indicating a Failed Flash Operation -- In special modes, the FAIL flag will set if the erase verify operation fails (Flash array verified as not erased). Writing a 0 to the FAIL flag has no effect on FAIL. The FAIL flag is cleared by writing a 1 to FAIL. While FAIL is set, it is not possible to launch another command. 0 Flash operation completed without error 1 Flash operation failed Flag Indicating a Failed Operation is not Active -- In special modes, the DONE flag will clear if a program, erase, or erase verify operation is active. 0 Flash operation is active 1 Flash operation is not active
4 ACCERR
2 BLANK
1 FAIL
0 DONE
2.3.2.7
Flash Command Register (FCMD)
The FCMD register defines the Flash commands.
Module Base + 0x0006
7 6 5 4 3 2 1 0
R W Reset
0 CMDB6 0 0 CMDB5 0
0
0 CMDB2
0 CMDB0 0 0
0
0
0
= Unimplemented or Reserved
Figure 2-11. Flash Command Register (FCMD)
Bits CMDB6, CMDB5, CMDB2, and CMDB0 are readable and writable during a command write sequence while bits 7, 4, 3, and 1 read 0 and are not writable.
MC9S12E128 Data Sheet, Rev. 1.07 98 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
Table 2-14. FCMD Field Descriptions
Field 6, 5, 2, 0 CMDB[6:5] CMDB[2] CMDB[0] Description Valid Flash commands are shown in Table 2-15. An attempt to execute any command other than those listed in Table 2-15 will set the ACCERR bit in the FSTAT register (see Section 2.3.2.6).
Table 2-15. Valid Flash Command List
CMDB 0x05 0x20 0x40 0x41 NVM Command Erase verify Word program Sector erase Mass erase
2.3.2.8
RESERVED2
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0007
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-12. RESERVED2
All bits read 0 and are not writable.
2.3.2.9
\
Flash Address Register (FADDR)
FADDRHI and FADDRLO are the Flash address registers.
Module Base + 0x0008
7 6 5 4 3 2 1 0
R FABHI W Reset 0 0 0 0 0 0 0 0
Figure 2-13. Flash Address High Register (FADDRHI)
\ \
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 99
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
Module Base + 0x0009
7 6 5 4 3 2 1 0
R FABLO W Reset 0 0 0 0 0 0 0 0
Figure 2-14. Flash Address Low Register (FADDRLO)
In normal modes, all FABHI and FABLO bits read 0 and are not writable. In special modes, the FABHI and FABLO bits are readable and writable. For sector erase, the MCU address bits [9:0] are ignored. For mass erase, any address within the Flash array is valid to start the command.
2.3.2.10
Flash Data Register (FDATA)
FDATAHI and FDATALO are the Flash data registers.
Module Base + 0x000A
7 6 5 4 3 2 1 0
R FDHI W Reset 0 0 0 0 0 0 0 0
Figure 2-15. Flash Data High Register (FDATAHI)
Module Base + 0x000B
7 6 5 4 3 2 1 0
R FDLO W Reset 0 0 0 0 0 0 0 0
Figure 2-16. Flash Data Low Register (FDATALO)
In normal modes, all FDATAHI and FDATALO bits read 0 and are not writable. In special modes, all FDATAHI and FDATALO bits are readable and writable when writing to an address within the Flash address range.
2.3.2.11
RESERVED3
This register is reserved for factory testing and is not accessible to the user.
MC9S12E128 Data Sheet, Rev. 1.07 100 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
Module Base + 0x000C
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-17. RESERVED3
All bits read 0 and are not writable.
2.3.2.12
RESERVED4
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000D
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-18. RESERVED4
All bits read 0 and are not writable.
2.3.2.13
RESERVED5
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000E
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-19. RESERVED5
All bits read 0 and are not writable.
2.3.2.14
RESERVED6
This register is reserved for factory testing and is not accessible to the user.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 101
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
Module Base + 0x000F
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-20. RESERVED6
All bits read 0 and are not writable.
2.4
2.4.1
Functional Description
Flash Command Operations
Write operations are used for the program, erase, and erase verify algorithms described in this section. The program and erase algorithms are controlled by a state machine whose timebase FCLK is derived from the oscillator clock via a programmable divider. The FCMD register as well as the associated FADDR and FDATA registers operate as a buffer and a register (2-stage FIFO) so that a new command along with the necessary data and address can be stored to the buffer while the previous command is still in progress. This pipelined operation allows a time optimization when programming more than one word on a specific row, as the high voltage generation can be kept active in between two programming commands. The pipelined operation also allows a simplification of command launching. Buffer empty as well as command completion are signalled by flags in the FSTAT register with corresponding interrupts generated, if enabled. The next sections describe: * How to write the FCLKDIV register * Command write sequence used to program, erase or erase verify the Flash array * Valid Flash commands * Errors resulting from illegal Flash operations
2.4.1.1
Writing the FCLKDIV Register
Prior to issuing any Flash command after a reset, it is first necessary to write the FCLKDIV register to divide the oscillator clock down to within the 150-kHz to 200-kHz range. Since the program and erase timings are also a function of the bus clock, the FCLKDIV determination must take this information into account. If we define: * FCLK as the clock of the Flash timing control block * Tbus as the period of the bus clock * INT(x) as taking the integer part of x (e.g., INT(4.323) = 4),
MC9S12E128 Data Sheet, Rev. 1.07 102 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
then FCLKDIV register bits PRDIV8 and FDIV[5:0] are to be set as described in Figure 2-21. For example, if the oscillator clock frequency is 950 kHz and the bus clock is 10 MHz, FCLKDIV bits FDIV[5:0] should be set to 4 (000100) and bit PRDIV8 set to 0. The resulting FCLK is then 190 kHz. As a result, the Flash algorithm timings are increased over optimum target by:
( 200 - 190 ) 200 x 100 = 5%
Command execution time will increase proportionally with the period of FCLK. CAUTION Because of the impact of clock synchronization on the accuracy of the functional timings, programming or erasing the Flash array cannot be performed if the bus clock runs at less than 1 MHz. Programming or erasing the Flash array with an input clock < 150 kHz should be avoided. Setting FCLKDIV to a value such that FCLK < 150 kHz can destroy the Flash array due to overstress. Setting FCLKDIV to a value such that (1/FCLK + Tbus) < 5s can result in incomplete programming or erasure of the Flash array cells. If the FCLKDIV register is written, the bit FDIVLD is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written to, the Flash command loaded during a command write sequence will not execute and the ACCERR flag in the FSTAT register will set.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 103
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
START
Tbus < 1s? yes PRDIV8=0 (reset)
no ALL COMMANDS IMPOSSIBLE
oscillator_clock 12.8MHz? yes
no
PRDIV8=1 PRDCLK=oscillator_clock/8
PRDCLK=oscillator_clock
PRDCLK[MHz]*(5+Tbus[s]) an integer? yes
no
FDIV[5:0]=INT(PRDCLK[MHz]*(5+Tbus[s]))
FDIV[5:0]=PRDCLK[MHz]*(5+Tbus[s])-1
TRY TO DECREASE Tbus
FCLK=(PRDCLK)/(1+FDIV[5:0])
1/FCLK[MHz] + Tbus[s] > 5 AND FCLK > 0.15MHz ? no
yes END
yes
FDIV[5:0] > 4?
no ALL COMMANDS IMPOSSIBLE
Figure 2-21. PRDIV8 and FDIV Bits Determination Procedure
MC9S12E128 Data Sheet, Rev. 1.07 104 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.4.1.2
Command Write Sequence
The Flash command controller is used to supervise the command write sequence to execute program, erase, and erase verify algorithms. Before starting a command write sequence, the ACCERR and PVIOL flags in the FSTAT register must be clear and the CBEIF flag should be tested to determine the state of the address, data, and command buffers. If the CBEIF flag is set, indicating the buffers are empty, a new command write sequence can be started. If the CBEIF flag is clear, indicating the buffers are not available, a new command write sequence will overwrite the contents of the address, data, and command buffers. A command write sequence consists of three steps which must be strictly adhered to with writes to the Flash module not permitted between the steps. However, Flash register and array reads are allowed during a command write sequence. The basic command write sequence is as follows: 1. Write to a valid address in the Flash array memory. 2. Write a valid command to the FCMD register. 3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the command. The address written in step 1 will be stored in the FADDR registers and the data will be stored in the FDATA registers. When the CBEIF flag is cleared in step 3, the CCIF flag is cleared by the Flash command controller indicating that the command was successfully launched. For all command write sequences, the CBEIF flag will set after the CCIF flag is cleared indicating that the address, data, and command buffers are ready for a new command write sequence to begin. A buffered command will wait for the active operation to be completed before being launched. Once a command is launched, the completion of the command operation is indicated by the setting of the CCIF flag in the FSTAT register. The CCIF flag will set upon completion of all active and buffered commands.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 105
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.4.1.3
Valid Flash Commands
Table 2-16 summarizes the valid Flash commands along with the effects of the commands on the Flash array.
Table 2-16. Valid Flash Commands
FCMD 0x05 0x20 0x40 0x41 Meaning Erase Verify Program Sector Erase Mass Erase Function on Flash Array Verify all bytes in the Flash array are erased. If the Flash array is erased, the BLANK bit will set in the FSTAT register upon command completion. Program a word (2 bytes) in the Flash array. Erase all 1024 bytes in a sector of the Flash array. Erase all bytes in the Flash array. A mass erase of the full Flash array is only possible when FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register are set prior to launching the command.
CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed.
MC9S12E128 Data Sheet, Rev. 1.07 106 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.4.1.3.1
Erase Verify Command
The erase verify operation will verify that a Flash array is erased. An example flow to execute the erase verify operation is shown in Figure 2-22. The erase verify command write sequence is as follows: 1. Write to a Flash array address to start the command write sequence for the erase verify command. The address and data written will be ignored. 2. Write the erase verify command, 0x05, to the FCMD register. 3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the erase verify command. After launching the erase verify command, the CCIF flag in the FSTAT register will set after the operation has completed unless a new command write sequence has been buffered. Upon completion of the erase verify operation, the BLANK flag in the FSTAT register will be set if all addresses in the Flash array are verified to be erased. If any address in the Flash array is not erased, the erase verify operation will terminate and the BLANK flag in the FSTAT register will remain clear.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 107
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
START
Read: FCLKDIV register
Clock Register Written Check
FDIVLD Set? yes
no
NOTE: FCLKDIV needs to be set once after each reset.
Write: FCLKDIV register
Read: FSTAT register Address, Data, Command Buffer Empty Check
CBEIF Set? yes
no
Access Error and Protection Violation Check
ACCERR/ PVIOL Set? no
yes
Write: FSTAT register Clear ACCERR/PVIOL 0x30
1.
Write: Flash Array Address and Dummy Data Write: FCMD register Erase Verify Command 0x05 Write: FSTAT register Clear CBEIF 0x80 Read: FSTAT register
2.
3.
Bit Polling for Command Completion Check
CCIF Set?
no
yes
Erase Verify Status BLANK Set? no
yes
EXIT Flash Array Erased EXIT Flash Array Not Erased
Figure 2-22. Example Erase Verify Command Flow
MC9S12E128 Data Sheet, Rev. 1.07 108 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.4.1.3.2
Program Command
The program operation will program a previously erased word in the Flash array using an embedded algorithm. An example flow to execute the program operation is shown in Figure 2-23. The program command write sequence is as follows: 1. Write to a Flash array address to start the command write sequence for the program command. The data written will be programmed to the Flash array address written. 2. Write the program command, 0x20, to the FCMD register. 3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the program command. If a word to be programmed is in a protected area of the Flash array, the PVIOL flag in the FSTAT register will set and the program command will not launch. Once the program command has successfully launched, the CCIF flag in the FSTAT register will set after the program operation has completed unless a new command write sequence has been buffered. By executing a new program command write sequence on sequential words after the CBEIF flag in the FSTAT register has been set, up to 55% faster programming time per word can be effectively achieved than by waiting for the CCIF flag to set after each program operation.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 109
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
START
Read: FCLKDIV register
Clock Register Written Check
FDIVLD Set? yes
no
NOTE: FCLKDIV needs to be set once after each reset.
Write: FCLKDIV register
Read: FSTAT register Address, Data, Command Buffer Empty Check
CBEIF Set? yes
no
Access Error and Protection Violation Check
ACCERR/ PVIOL Set? no Write: Flash Address and program Data
yes
Write: FSTAT register Clear ACCERR/PVIOL 0x30
1.
2.
Write: FCMD register Program Command 0x20 Write: FSTAT register Clear CBEIF 0x80 Read: FSTAT register
3.
Bit Polling for Buffer Empty Check
CBEIF Set?
no
yes
Sequential Programming Decision Next Word? no Read: FSTAT register yes
Bit Polling for Command Completion Check
CCIF Set?
no
yes
EXIT
Figure 2-23. Example Program Command Flow
MC9S12E128 Data Sheet, Rev. 1.07 110 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.4.1.3.3
Sector Erase Command
The sector erase operation will erase all addresses in a 1024 byte sector of the Flash array using an embedded algorithm. An example flow to execute the sector erase operation is shown in Figure 2-24. The sector erase command write sequence is as follows: 1. Write to a Flash array address to start the command write sequence for the sector erase command. The Flash address written determines the sector to be erased while MCU address bits [9:0] and the data written are ignored. 2. Write the sector erase command, 0x40, to the FCMD register. 3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the sector erase command. If a Flash sector to be erased is in a protected area of the Flash array, the PVIOL flag in the FSTAT register will set and the sector erase command will not launch. Once the sector erase command has successfully launched, the CCIF flag in the FSTAT register will set after the sector erase operation has completed unless a new command write sequence has been buffered.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 111
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
START
Read: FCLKDIV register
Clock Register Written Check
FDIVLD Set? yes
no
NOTE: FCLKDIV needs to be set once after each reset.
Write: FCLKDIV register
Read: FSTAT register Address, Data, Command Buffer Empty Check
CBEIF Set? yes
no
Access Error and Protection Violation Check
ACCERR/ PVIOL Set? no
yes
Write: FSTAT register Clear ACCERR/PVIOL 0x30
1.
Write: Flash Sector Address and Dummy Data Write: FCMD register Sector Erase Command 0x40 Write: FSTAT register Clear CBEIF 0x80 Read: FSTAT register
2.
3.
Bit Polling for Command Completion Check
CCIF Set?
no
yes
EXIT
Figure 2-24. Example Sector Erase Command Flow
MC9S12E128 Data Sheet, Rev. 1.07 112 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.4.1.3.4
Mass Erase Command
The mass erase operation will erase all addresses in a Flash array using an embedded algorithm. An example flow to execute the mass erase operation is shown in Figure 2-25. The mass erase command write sequence is as follows: 1. Write to a Flash array address to start the command write sequence for the mass erase command. The address and data written will be ignored. 2. Write the mass erase command, 0x41, to the FCMD register. 3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the mass erase command. If a Flash array to be erased contains any protected area, the PVIOL flag in the FSTAT register will set and the mass erase command will not launch. Once the mass erase command has successfully launched, the CCIF flag in the FSTAT register will set after the mass erase operation has completed unless a new command write sequence has been buffered.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 113
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
START
Read: FCLKDIV register
Clock Register Written Check
FDIVLD Set? yes
no
NOTE: FCLKDIV needs to be set once after each reset.
Write: FCLKDIV register
Read: FSTAT register Address, Data, Command Buffer Empty Check
CBEIF Set? yes
no
Access Error and Protection Violation Check
ACCERR/ PVIOL Set? no
yes
Write: FSTAT register Clear ACCERR/PVIOL 0x30
1.
Write: Flash Block Address and Dummy Data Write: FCMD register Mass Erase Command 0x41 Write: FSTAT register Clear CBEIF 0x80 Read: FSTAT register
2.
3.
Bit Polling for Command Completion Check
CCIF Set?
no
yes
EXIT
Figure 2-25. Example Mass Erase Command Flow
MC9S12E128 Data Sheet, Rev. 1.07 114 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.4.1.4
2.4.1.4.1
Illegal Flash Operations
Access Error
The ACCERR flag in the FSTAT register will be set during the command write sequence if any of the following illegal Flash operations are performed causing the command write sequence to immediately abort: 1. Writing to the Flash address space before initializing the FCLKDIV register 2. Writing a misaligned word or a byte to the valid Flash address space 3. Writing to the Flash address space while CBEIF is not set 4. Writing a second word to the Flash address space before executing a program or erase command on the previously written word 5. Writing to any Flash register other than FCMD after writing a word to the Flash address space 6. Writing a second command to the FCMD register before executing the previously written command 7. Writing an invalid command to the FCMD register 8. Writing to any Flash register other than FSTAT (to clear CBEIF) after writing to the FCMD register 9. The part enters stop mode and a program or erase command is in progress. The command is aborted and any pending command is killed 10. When security is enabled, a command other than mass erase originating from a non-secure memory or from the background debug mode is written to the FCMD register 11. A 0 is written to the CBEIF bit in the FSTAT register to abort a command write sequence. The ACCERR flag will not be set if any Flash register is read during the command write sequence. If the Flash array is read during execution of an algorithm (CCIF=0), the Flash module will return invalid data and the ACCERR flag will not be set. If an ACCERR flag is set in the FSTAT register, the Flash command controller is locked. It is not possible to launch another command until the ACCERR flag is cleared. 2.4.1.4.2 Protection Violation
The PVIOL flag in the FSTAT register will be set during the command write sequence after the word write to the Flash address space if any of the following illegal Flash operations are performed, causing the command write sequence to immediately abort: 1. Writing a Flash address to program in a protected area of the Flash array (see Section 2.3.2.5). 2. Writing a Flash address to erase in a protected area of the Flash array. 3. Writing the mass erase command to the FCMD register while any protection is enabled. If the PVIOL flag is set, the Flash command controller is locked. It is not possible to launch another command until the PVIOL flag is cleared.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 115
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.4.2
2.4.2.1
Operating Modes
Wait Mode
If the MCU enters wait mode while a Flash command is active (CCIF = 0), that command and any buffered command will be completed. The Flash module can recover the MCU from wait mode if the interrupts are enabled (see Section 2.4.5).
2.4.2.2
Stop Mode
If the MCU enters stop mode while a Flash command is active (CCIF = 0), that command will be aborted and the data being programmed or erased is lost. The high voltage circuitry to the Flash array will be switched off when entering stop mode. CCIF and ACCERR flags will be set. Upon exit from stop mode, the CBEIF flag will be set and any buffered command will not be executed. The ACCERR flag must be cleared before returning to normal operation. NOTE As active Flash commands are immediately aborted when the MCU enters stop mode, it is strongly recommended that the user does not use the STOP instruction during program and erase execution.
2.4.2.3
Background Debug Mode
In background debug mode (BDM), the FPROT register is writable. If the MCU is unsecured, then all Flash commands listed in Table 2-16 can be executed. If the MCU is secured and is in special single chip mode, the only possible command to execute is mass erase.
2.4.3
Flash Module Security
The Flash module provides the necessary security information to the MCU. After each reset, the Flash module determines the security state of the MCU as defined in Section 2.3.2.2, "Flash Security Register (FSEC)". The contents of the Flash security/options byte at address 0xFF0F in the Flash configuration field must be changed directly by programming address 0xFF0F when the device is unsecured and the higher address sector is unprotected. If the Flash security/options byte is left in the secure state, any reset will cause the MCU to return to the secure operating mode.
2.4.3.1
Unsecuring the MCU using Backdoor Key Access
The MCU may only be unsecured by using the backdoor key access feature which requires knowledge of the contents of the backdoor key (four 16-bit words programmed at addresses 0xFF00-0xFF07). If KEYEN[1:0] = 1:0 and the KEYACC bit is set, a write to a backdoor key address in the Flash array triggers a comparison between the written data and the backdoor key data stored in the Flash array. If all four words of data are written to the correct addresses in the correct order and the data matches the backdoor key stored in the Flash array, the MCU will be unsecured. The data must be written to the backdoor key
MC9S12E128 Data Sheet, Rev. 1.07 116 Freescale Semiconductor
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
addresses sequentially staring with 0xFF00-0xFF01 and ending with 0xFF06-0xFF07. The values 0x0000 and 0xFFFF are not permitted as keys. When the KEYACC bit is set, reads of the Flash array will return invalid data. The user code stored in the Flash array must have a method of receiving the backdoor key from an external stimulus. This external stimulus would typically be through one of the on-chip serial ports. If KEYEN[1:0] = 1:0 in the FSEC register, the MCU can be unsecured by the backdoor key access sequence described below: 1. Set the KEYACC bit in the FCNFG register 2. Write the correct four 16-bit words to Flash addresses 0xFF00-0xFF07 sequentially starting with 0xFF00 3. Clear the KEYACC bit in the FCNFG register 4. If all four 16-bit words match the backdoor key stored in Flash addresses 0xFF00-0xFF07, the MCU is unsecured and bits SEC[1:0] in the FSEC register are forced to the unsecure state of 1:0 The backdoor key access sequence is monitored by the internal security state machine. An illegal operation during the backdoor key access sequence will cause the security state machine to lock, leaving the MCU in the secured state. A reset of the MCU will cause the security state machine to exit the lock state and allow a new backdoor key access sequence to be attempted. The following illegal operations will lock the security state machine: 1. If any of the four 16-bit words does not match the backdoor key programmed in the Flash array 2. If the four 16-bit words are written in the wrong sequence 3. If more than four 16-bit words are written 4. If any of the four 16-bit words written are 0x0000 or 0xFFFF 5. If the KEYACC bit does not remain set while the four 16-bit words are written After the backdoor key access sequence has been correctly matched, the MCU will be unsecured. The Flash security byte can be programmed to the unsecure state, if desired. In the unsecure state, the user has full control of the contents of the four word backdoor key by programming bytes 0xFF00-0xFF07 of the Flash configuration field. The security as defined in the Flash security/options byte at address 0xFF0F is not changed by using the backdoor key access sequence to unsecure. The backdoor key stored in addresses 0xFF00-0xFF07 is unaffected by the backdoor key access sequence. After the next reset sequence, the security state of the Flash module is determined by the Flash security/options byte at address 0xFF0F. The backdoor key access sequence has no effect on the program and erase protection defined in the FPROT register. It is not possible to unsecure the MCU in special single chip mode by executing the backdoor key access sequence in background debug mode.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 117
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
2.4.4
Flash Reset Sequence
On each reset, the Flash module executes a reset sequence to hold CPU activity while loading the following registers from the Flash array memory according to Table 2-1: * FPROT -- Flash Protection Register (see Section 2.3.2.5) * FSEC -- Flash Security Register (see Section 2.3.2.2)
2.4.4.1
Reset While Flash Command Active
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/array being erased is not guaranteed.
2.4.5
Interrupts
The Flash module can generate an interrupt when all Flash commands have completed execution or the Flash address, data, and command buffers are empty.
Table 2-17. Flash Interrupt Sources
Interrupt Source Flash Address, Data, and Command Buffers are empty All Flash commands have completed execution Interrupt Flag CBEIF (FSTAT register) CCIF (FSTAT register) Local Enable CBEIE CCIE Global (CCR) Mask I Bit I Bit
NOTE Vector addresses and their relative interrupt priority are determined at the MCU level.
2.4.5.1
Description of Interrupt Operation
Figure 2-26 shows the logic used for generating interrupts. The Flash module uses the CBEIF and CCIF flags in combination with the enable bits CBIE and CCIE to discriminate for the generation of interrupts.
CBEIF CBEIE
FLASH INTERRUPT REQUEST
CCIF CCIE
Figure 2-26. Flash Interrupt Implementation
For a detailed description of these register bits, refer to Section 2.3.2.4, "Flash Configuration Register (FCNFG)" and Section 2.3.2.6, "Flash Status Register (FSTAT)".
MC9S12E128 Data Sheet, Rev. 1.07 118 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.1 lntroduction
The port integration module establishes the interface between the peripheral modules and the I/O pins for for ports AD, M, P, Q, S, T and U. This section covers: * Port A, B, E, and K and the BKGD pin * Port AD associated with ATD module (channels 15 through 0) and keyboard wake-up interrupts * Port M connected to 2 DAC, 1 IIC and 1 SCI (SCI2) modules * Port P and port Q connected to PMF module * Port S connected to 2 SCI (SCI0 and SCI1) and 1 SPI modules * Port T connected to 2 TIM (TIM0 and TIM1) modules * Port U connected to 1 TIM (TIM2) and 1 PWM modules Each I/O pin can be configured by several registers: input/output selection, drive strength reduction, enable and select of pull resistors, wired-or mode selection, interrupt enable, and/or status flags. NOTE Refer to the MEBI block description chapter for details on p orts A, B, E and K, and the BKGD pin.
3.1.1
Features
A standard port has the following minimum features: * Input/output selection * 5-V output drive with two selectable drive strength (or slew rates) * 5-V digital and analog input * Input with selectable pull-up or pull-down device Optional features: * Open drain for wired-OR connections * Interrupt input with glitch filtering
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 119
Chapter 3 Port Integration Module (PIM9E128V1)
3.1.2
Block Diagram
Figure 3-1 is a block diagram of the PIM9E128V1.
Port Integration Module
PAD0 PAD1 PAD2 PAD3 PAD4 PAD5 PAD6 PAD7 PAD8 PAD9 PAD10 PAD11 PAD12 PAD13 PAD14 PAD15
KWAD0 KWAD1 KWAD2 KWAD3 KWAD4 KWAD5 KWAD6 KWAD7 KWAD8 KWAD9 KWAD10 KWAD11 KWAD12 KWAD13 KWAD14 KWAD15 AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7hhhkhkjsdhfshdfhskdf ADC AN8 TIM2 AN9 AN10 AN11 AN12 AN13 AN14 AN15
IOC24 IOC25 IOC26 IOC27 IOC04 IOC05 IOC06 IOC07 IOC14 IOC15 IOC16 IOC17 PW00 PW01 PW02 PW03 PW04 PW05 RXD
Port U
PWM
PW10 PW11 PW12 PW13 PW14 PW15
MUX
PU0 PU1 PU2 PU3 PU4 PU5 PU6 PU7 PT0 PT1 PT2 PT3 PT4 PT5 PT6 PT7 PP0 PP1 PP2 PP3 PP4 PP5 PS0 PS1 PS2 PS3 PS4 PS5 PS6 PS7 BKGD PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 PK0 PK1 PK2 PK3 PK4 PK5 PK6 PK7
Interrupt Logic
TIM0/TIM1
PQ6 PQ5 PQ4 PQ3 PQ2 PQ1 PQ0 PM7 PM6 PM5 PM4 PM3 PM1 PM0 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7
IS2 IS1 IS0 FAULT3 FAULT2 FAULT1 FAULT0
PMF
CAN0 routing
SCI2
SCI1
DAO1 DAC1 DAO0 DAC0 ADDR0/DATA0 ADDR1/DATA1 ADDR2/DATA2 ADDR3/DATA3 ADDR4/DATA4 ADDR5/DATA5 ADDR6/DATA6 ADDR7/DATA7 ADDR8/DATA8 ADDR9/DATA9 ADDR10/DATA10 ADDR11/DATA11 ADDR12/DATA12 ADDR13/DATA13 ADDR14/DATA14 ADDR15/DATA15
BKGD/MODC/TAGHI XIRQ IRQ R/W LSTRB/TAGLO ECLK IPIPE0/MODA IPIPE1/MODB NOACC/XCLKS
CORE
XADDR14 XADDR15 XADDR16 XADDR17 XADRR18 XADDR19 XCS ECS/ROMONE
Figure 3-1. PIM9E128V1 Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 120 Freescale Semiconductor
Port K
Port E
Port S
SCL SDA TXD2 RXD2
IIC
SCI0 TXD
RXD TXD SDI/MISO SDO/MOSI SCK SPI SS
Port P
Port T
Port AD Port Q Port M Port B Port A
Chapter 3 Port Integration Module (PIM9E128V1)
3.2
External Signal Description
This section lists and describes the signals that connect off chip. Table 3-1 shows all the pins and their functions that are controlled by the PIM9E128V1. The order in which the pin functions are listed represents the functions priority (top - highest priority, bottom - lowest priority).
Table 3-1. Detailed Signal Descriptions (Sheet 1 of 6)
Port -- Pin Name Pin Function Description Refer to the MEBI block description chapter Refer to the BDM block description chapter Refer to the MEBI block description chapter Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Pin Function after Reset Refer to the MEBI block description chapter Refer to the MEBI block description chapter
Port A
BKGD MODC BKGD TAGHI PA7 ADDR15/DATA15 GPIO ADDR14/DATA14 GPIO ADDR13/DATA13 GPIO ADDR12/DATA12 GPIO ADDR11/DATA11 GPIO ADDR10/DATA10 GPIO ADDR9/DATA9 GPIO ADDR8/DATA8 GPIO ADDR7/DATA7 GPIO ADDR6/DATA6 GPIO ADDR5/DATA5 GPIO ADDR4/DATA4 GPIO ADDR3/DATA3 GPIO ADDR2/DATA2 GPIO ADDR1/DATA1 GPIO ADDR0/DATA0 GPIO
PA6 PA5 PA4 PA3 PA2 PA1 PA0 Port B PB7
Refer to the MEBI block description chapter
PB6 PB5 PB4 PB3 PB2 PB1 PB0
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 121
Chapter 3 Port Integration Module (PIM9E128V1)
Table 3-1. Detailed Signal Descriptions (Sheet 2 of 6)
Port Port E Pin Name PE7 Pin Function XCLKS NOACC GPIO IPIPE1/MODB GPIO IPIPE0/MODA GPIO ECLK GPIO LSTRB/TAGLO GPIO R/W GPIO IRQ GPIO XIRQ GPIO ECS/ROMONE GPIO XCS GPIO XADDR19 GPIO XADDR18 GPIO XADDR17 GPIO XADDR16 GPIO XADDR15 GPIO XADDR14 GPIO Description Refer to OSC block description chapter Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Refer to the MEBI block description chapter General-purpose I/O Pin Function after Reset Refer to the MEBI block description chapter
PE6 PE5 PE4 PE3 PE2 PE1 PE0 Port K PK7
Refer to the MEBI block description chapter
PK6 PK5 PK4 PK3 PK2 PK1 PK0
MC9S12E128 Data Sheet, Rev. 1.07 122 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
Table 3-1. Detailed Signal Descriptions (Sheet 3 of 6)
Port Pin Name Pin Function Description Analog-to-digital converter input channel 15 Keyboard wake-up interrupt 15 General-purpose I/O Analog-to-digital converter input channel 14 Keyboard wake-up interrupt 14 General-purpose I/O Analog-to-digital converter input channel 13 Keyboard wake-up interrupt 13 General-purpose I/O Analog-to-digital converter input channel 12 Keyboard wake-up interrupt 12 General-purpose I/O Analog-to-digital converter input channel 11 Keyboard wake-up interrupt 11 General-purpose I/O Analog-to-digital converter input channel 10 Keyboard wake-up interrupt 10 General-purpose I/O Analog-to-digital converter input channel 9 Keyboard wake-up interrupt 9 General-purpose I/O Analog-to-digital converter input channel 8 Keyboard wake-up interrupt 8 General-purpose I/O Analog-to-digital converter input channel 7 Keyboard wake-up interrupt 7 General-purpose I/O Analog-to-digital converter input channel 6 Keyboard wake-up interrupt 6 General-purpose I/O Analog-to-digital converter input channel 5 Keyboard wake-up interrupt 5 General-purpose I/O Analog-to-digital converter input channel 4 Keyboard wake-up interrupt 4 General-purpose I/O Analog-to-digital converter input channel 3 Keyboard wake-up interrupt 3 General-purpose I/O Analog-to-digital converter input channel 2 Keyboard wake-up interrupt 2 General-purpose I/O Analog-to-digital converter input channel 1 Keyboard wake-up interrupt 1 General-purpose I/O Analog-to-digital converter input channel 0 Keyboard wake-up interrupt 0 General-purpose I/O Pin Function after Reset GPIO
Port AD PAD15 AN15 KWAD15 GPIO PAD14 AN14 KWAD14 GPIO PAD13 AN13 KWAD13 GPIO PAD12 AN12 KWAD12 GPIO PAD11 AN11 KWAD11 GPIO PAD10 AN10 KWAD10 GPIO PAD9 AN9 KWAD9 GPIO PAD8 AN8 KWAD8 GPIO PAD7 AN7 KWAD7 GPIO PAD6 AN6 KWAD6 GPIO PAD5 AN5 KWAD5 GPIO PAD4 AN4 KWAD4 GPIO PAD3 AN3 KWAD3 GPIO PAD2 AN2 KWAD2 GPIO PAD1 AN1 KWAD1 GPIO PAD0 AN0 KWAD0 GPIO
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 123
Chapter 3 Port Integration Module (PIM9E128V1)
Table 3-1. Detailed Signal Descriptions (Sheet 4 of 6)
Port Port M Pin Name PM7 PM6 PM5 PM4 PM3 PM1 PM0 Port P PP5 PP4 PP3 PP2 PP1 PP0 Port Q PQ6 PQ5 PQ4 PQ3 PQ2 PQ1 PQ0 Pin Function SCL GPIO SDA GPIO TXD2 GPIO RXD2 GPIO GPIO DAO1 GPIO DAO0 GPIO PWM5 GPIO PWM4 GPIO PWM3 GPIO PWM2 GPIO PWM1 GPIO PWM0 GPIO IS2 GPIO IS1 GPIO IS0 GPIO FAULT3 GPIO FAULT2 GPIO FAULT11 GPIO FAULT0 GPIO Description Inter-integrated circuit serial clock line General-purpose I/O Inter-integrated circuit serial data line General-purpose I/O Serial communication interface 2 transmit pin General-purpose I/O Serial communication interface 2 receive pin General-purpose I/O General-purpose I/O Digital to analog convertor 1 output General-purpose I/O Digital to analog convertor 0 output General-purpose I/O Pulse-width modulator 0 channel 5 General-purpose I/O Pulse-width modulator 0 channel 4 General-purpose I/O Pulse-width modulator 0 channel 3 General-purpose I/O Pulse-width modulator 0 channel 2 General-purpose I/O Pulse-width modulator 0 channel 1 General-purpose I/O Pulse-width modulator 0 channel 0 General-purpose I/O PMF current status pin 2 General-purpose I/O PMF current status pin 1 General-purpose I/O PMF current status pin 0 General-purpose I/O PMF fault pin3 General-purpose I/O PMF fault pin 2 General-purpose I/O PMF fault pin 1 General-purpose I/O PMF fault pin 0 General-purpose I/O Pin Function after Reset GPIO
GPIO
GPIO
MC9S12E128 Data Sheet, Rev. 1.07 124 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
Table 3-1. Detailed Signal Descriptions (Sheet 5 of 6)
Port Port S Pin Name PS7 SS GPIO SCK GPIO MOSI GPIO MISO GPIO TXD0 GPIO RXD0 GPIO TXD0 GPIO RXD0 GPIO IOC7 GPIO IOC6 GPIO IOC5 GPIO IOC4 GPIO IOC3 GPIO IOC2 GPIO IOC1 GPIO IOC0 GPIO Pin Function Description Serial peripheral interface slave select input/output in master mode, input in slave mode General-purpose I/O Serial peripheral interface serial clock pin General-purpose I/O Serial peripheral interface master out/slave in pin General-purpose I/O Serial peripheral interface master in/slave out pin General-purpose I/O Serial communication interface 1 transmit pin General-purpose I/O Serial communication interface 1 receive pin General-purpose I/O Serial communication interface 0 transmit pin General-purpose I/O Serial communication interface 0 receive pin General-purpose I/O Timer 1 channel 7 General-purpose I/O Timer 1 channel 6 General-purpose I/O Timer 1 channel 5 General-purpose I/O Timer 1 channel 4 General-purpose I/O Timer 0 channel 7 General-purpose I/O Timer 0 channel 6 General-purpose I/O Timer 0 channel 5 General-purpose I/O Timer 0 channel 4 General-purpose I/O Pin Function after Reset GPIO
PS6 PS5 PS4 PS3 PS2 PS1 PS0 Port T PT7 PT6 PT5 PT4 PT3 PT2 PT1 PT0
GPIO
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 125
Chapter 3 Port Integration Module (PIM9E128V1)
Table 3-1. Detailed Signal Descriptions (Sheet 6 of 6)
Port Port U Pin Name PU7 PU6 PU5 PU4 PU3 Pin Function GPIO GPIO PW15 GPIO PW14 GPIO IOC3 PW13 GPIO IOC2 PW12 GPIO IOC1 PW11 GPIO IOC0 PW11 GPIO Description General-purpose I/O General-purpose I/O Pulse-width modulator 1 channel 5 General-purpose I/O Pulse-width modulator 1 channel 4 General-purpose I/O Timer 2 channel 7 Pulse-width modulator 1 channel 3 General-purpose I/O Timer 2 channel 6 Pulse-width modulator 1 channel 2 General-purpose I/O Timer 2 channel 5 Pulse-width modulator 1 channel 1 General-purpose I/O Timer 2 channel 4 Pulse-width modulator 1 channel 0 General-purpose I/O Pin Function after Reset GPIO
PU2
PU1
PU0
MC9S12E128 Data Sheet, Rev. 1.07 126 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3
Memory Map and Register Definition
This section provides a detailed description of all registers. Table 3-2 is a standard memory map of port integration module.
Table 3-2. PIM9HZ256 Memory Map
Address Offset 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 - 0x0007 0x0008 0x0009 0x000A 0x000B 0x000C 0x000D 0x000E 0x000F 0x0010 0x0011 0x0012 0x0013 0x0014 0x0015 0x0016 0x0017 0x0018 0x0019 0x001A 0x001B 0x001C 0x001D 0x001E - 0x001F Port T I/O Register (PTT) Port T Input Register (PTIT) Port T Data Direction Register (DDRT) Port T Reduced Drive Register (RDRT) Port T Pull Device Enable Register (PERT) Port T Polarity Select Register (PPST) Reserved Port S I/O Register (PTS) Port S Input Register (PTIS) Port S Data Direction Register (DDRS) Port S Reduced Drive Register (RDRS) Port S Pull Device Enable Register (PERS) Port S Polarity Select Register (PPSS) Port S Wired-OR Mode Register (WOMS) Reserved Port M I/O Register (PTM) Port M Input Register (PTIM) Port M Data Direction Register (DDRM) Port M Reduced Drive Register (RDRM) Port M Pull Device Enable Register (PERM) Port M Polarity Select Register (PPSM) Port M Wired-OR Mode Register (WOMM) Reserved Port P I/O Register (PTP) Port P Input Register (PTIP) Port P Data Direction Register (DDRP) Port P Reduced Drive Register (RDRP) Port P Pull Device Enable Register (PERP) Port P Polarity Select Register (PPSP) Reserved Use Access R/W R R/W R/W R/W R/W -- R/W R R/W R/W R/W R/W R/W -- R/W R R/W R/W R/W R/W R/W -- R/W R R/W R/W R/W R/W --
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 127
Chapter 3 Port Integration Module (PIM9E128V1)
Table 3-2. PIM9HZ256 Memory Map (continued)
Address Offset 0x0020 0x0021 0x0022 0x0023 0x0024 0x0025 0x0026 - 0x0027 0x0028 0x0029 0x002A 0x002B 0x002C 0x002D 0x002E 0x002F 0x0030 0x0031 0x0032 0x0033 0x0034 0x0035 0x0036 0x0037 0x0038 0x0039 0x003A 0x003B 0x003D 0x003D 0x003E 0x003F Port AD Interrupt Flag Register (PIFAD) R/W Port AD Interrupt Enable Register (PIEAD) R/W Port AD Polarity Select Register (PPSAD) R/W Port AD Pull Device Enable Register (PERAD) R/W Port AD Reduced Drive Register (RDRAD) R/W Port AD Data Direction Register (DDRAD) R/W Port AD Input Register (PTIAD) R Port Q I/O Register (PTQ) Port Q Input Register (PTIQ) Port Q Data Direction Register (DDRQ) Port Q Reduced Drive Register (RDRQ) Port Q Pull Device Enable Register (PERQ) Port Q Polarity Select Register (PPSQ) Reserved Port U I/O Register (PTU) Port U Input Register (PTIU) Port U Data Direction Register (DDRU) Port U Reduced Drive Register (RDRU) Port U Pull Device Enable Register (PERU) Port U Polarity Select Register (PPSU) Port U Module Routing Register (MODRR) Reserved Port AD I/O Register (PTAD) Use Access R/W R R/W R/W R/W R/W -- R/W R R/W R/W R/W R/W R/W -- R/W
3.3.1
Port AD
Port AD is associated with the analog-to-digital converter (ATD) and keyboard wake-up (KWU) interrupts. Each pin is assigned to these modules according to the following priority: ATD > KWU > general-purpose I/O. For the pins of port AD to be used as inputs, the corresponding bits of the ATDDIEN0 and ATDDIEN1 registers in the ATD module must be set to 1 (digital input buffer is enabled). The ATDDIEN0 and ATDDIEN1 registers do not affect the port AD pins when they are configured as outputs.
MC9S12E128 Data Sheet, Rev. 1.07 128 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
Refer to the ATD block description chapter for information on the ATDDIEN0 and ATDDIEN1 registers. During reset, port AD pins are configured as high-impedance analog inputs (digital input buffer is disabled).
3.3.1.1
Port AD I/O Register (PTAD)
7 6 5 4 3 2 1 0
R PTAD15 W KWU: ATD: Reset KWAD15 AN15 0
7
PTAD14 KWAD14 AN14 0
6
PTAD13 KWAD13 AN13 0
5
PTAD12 KWA12 AN12 0
4
PTAD11 KWAD11 AN11 0
3
PTAD10 KWAD10 AN10 0
2
PTAD9 KWAD9 AN9 0
1
PTAD8 KWAD8 AN8 0
0
R PTAD7 W KWU: ATD: Reset KWAD7 AN7 0 KWAD6 AN6 0 KWAD5 AN5 0 KWAD4 AN4 0 KWAD3 AN3 0 KWAD2 AN2 0 KWAD1 AN1 0 KWAD0 AN0 0 PTAD6 PTAD5 PTAD4 PTAD3 PTAD2 PTAD1 PTAD0
Figure 3-2. Port AD I/O Register (PTAD)
Read: Anytime. Write: Anytime. If the data direction bit of the associated I/O pin (DDRADx) is set to 1 (output), a write to the corresponding I/O Register bit sets the value to be driven to the Port AD pin. If the data direction bit of the associated I/O pin (DDRADx) is set to 0 (input), a write to the corresponding I/O Register bit takes place but has no effect on the Port AD pin. If the associated data direction bit (DDRADx) is set to 1 (output), a read returns the value of the I/O register bit. If the associated data direction bit (DDRADx) is set to 0 (input) and the associated ATDDIEN0(1) bit is set to 0 (digital input buffer is disabled), the associated I/O register bit (PTADx) reads "1". If the associated data direction bit (DDRADx) is set to 0 (input) and the associated ATDDIEN0(1) bit is set to 1 (digital input buffer is enabled), a read returns the value of the pin.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 129
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.1.2
Port AD Input Register (PTIAD)
7 6 5 4 3 2 1 0
R W Reset
PTIAD15
PTIAD14
PTIAD13
PTIAD12
PTIAD11
PTIAD10
PTIAD9
PTIAD8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
1
0
R W Reset
PTIAD7
PTIAD6
PTIAD5
PTIAD4
PTIAD3
PTIAD2
PTIAD1
PTIAD0
1
1
1
1
1
1
1
1
= Reserved or Unimplemented
Figure 3-3. Port AD Input Register (PTIAD)
Read: Anytime. Write: Never; writes to these registers have no effect. If the ATDDIEN0(1) bit of the associated I/O pin is set to 0 (digital input buffer is disabled), a read returns a 1. If the ATDDIEN0(1) bit of the associated I/O pin is set to 1 (digital input buffer is enabled), a read returns the status of the associated pin.
MC9S12E128 Data Sheet, Rev. 1.07 130 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.1.3
Port AD Data Direction Register (DDRAD)
7 6 5 4 3 2 1 0
R DDRAD15 W Reset 0
7
DDRAD14 0
6
DDRAD13 0
5
DDRAD12 0
4
DDRAD11 0
3
DDRAD10 0
2
DDRAD9 0
1
DDRAD8 0
0
R DDRAD7 W Reset 0 0 0 0 0 0 0 0 DDRAD6 DDRAD5 DDRAD4 DDRAD3 DDRAD2 DDRAD1 DDRAD0
Figure 3-4. Port AD Data Direction Register (DDRAD)
Read: Anytime. Write: Anytime. This register configures port pins PAD[15:0] as either input or output. If a data direction bit is 0 (pin configured as input), then a read value on PTADx depends on the associated ATDDIEN0(1) bit. If the associated ATDDIEN0(1) bit is set to 1 (digital input buffer is enabled), a read on PTADx returns the value on port AD pin. If the associated ATDDIEN0(1) bit is set to 0 (digital input buffer is disabled), a read on PTADx returns a 1.
Table 3-3. DDRAD Field Descriptions
Field 15:0 Data Direction Port AD DDRAD[15:0] 0 Associated pin is configured as input. 1 Associated pin is configured as output. Description
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 131
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.1.4
Port AD Reduced Drive Register (RDRAD)
7 6 5 4 3 2 1 0
R RDRAD15 W Reset 0
7
RDRAD14 0
6
RDRAD13 0
5
RDRAD12 0
4
RDRAD11 0
3
RDRAD10 0
2
RDRAD9 0
1
RDRAD8 0
0
R RDRAD7 W Reset 0 0 0 0 0 0 0 0 RDRAD6 RDRAD5 RDRAD4 RDRAD3 RDRAD2 RDRAD1 RDRAD0
Figure 3-5. Port AD Reduced Drive Register (RDRAD)
Read: Anytime. Write: Anytime. This register configures the drive strength of configured output pins as either full or reduced. If a pin is configured as input, the corresponding Reduced Drive Register bit has no effect.
Table 3-4. RDRAD Field Descriptions
Field Description
15:0 Reduced Drive Port AD RDRAD[15:0] 0 Full drive strength at output. 1 Associated pin drives at about 1/3 of the full drive strength.
MC9S12E128 Data Sheet, Rev. 1.07 132 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.1.5
Port AD Pull Device Enable Register (PERAD)
7 6 5 4 3 2 1 0
R PERAD15 W Reset 0
7
PERAD14 0
6
PERAD13 0
5
PERAD12 0
4
PERAD11 0
3
PERAD10 0
2
PERAD9 0
1
PERAD8 0
0
R PERAD7 W Reset 0 0 0 0 0 0 0 0 PERAD6 PERAD5 PERAD4 PERAD3 PERAD2 PERAD1 PERAD0
Figure 3-6. Port AD Pull Device Enable Register (PERAD)
Read: Anytime. Write: Anytime. This register configures whether a pull-up or a pull-down device is activated on configured input pins. If a pin is configured as output, the corresponding Pull Device Enable Register bit has no effect.
Table 3-5. PERAD Field Descriptions
Field 15:0 Pull Device Enable Port AD PERAD[15:0 0 Pull-up or pull-down device is disabled. ] 1 Pull-up or pull-down device is enabled. Description
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 133
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.1.6
Port AD Polarity Select Register (PPSAD)
7 6 5 4 3 2 1 0
R PPSAD15 W Reset 0
7
PPSAD14 0
6
PPSAD13 0
5
PPSAD12 0
4
PPSAD11 0
3
PPSAD10 0
2
PPSAD9 0
1
PPSAD8 0
0
R PPSAD7 W Reset 0 0 0 0 0 0 0 0 PPSAD6 PPSAD5 PPSAD4 PPSAD3 PPSAD2 PPSAD1 PPSAD0
Figure 3-7. Port AD Polarity Select Register (PPSAD)
Read: Anytime. Write: Anytime. The Port AD Polarity Select Register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting a pull-up or pull-down device if enabled (PERADx = 1). The Port AD Polarity Select Register is effective only when the corresponding Data Direction Register bit is set to 0 (input). In pull-down mode (PPSADx = 1), a rising edge on a port AD pin sets the corresponding PIFADx bit. In pull-up mode (PPSADx = 0), a falling edge on a port AD pin sets the corresponding PIFADx bit.
Table 3-6. PPSAD Field Descriptions
Field Description
15:0 Polarity Select Port AD PPSAD[15:0] 0 A pull-up device is connected to the associated port AD pin, and detects falling edge for interrupt generation. 1 A pull-down device is connected to the associated port AD pin, and detects rising edge for interrupt generation.
MC9S12E128 Data Sheet, Rev. 1.07 134 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.1.7
Port AD Interrupt Enable Register (PIEAD)
7 6 5 4 3 2 1 0
R PIEAD15 W Reset 0
7
PIEAD14 0
6
PIEAD13 0
5
PIEAD12 0
4
PIEAD11 0
3
PIEAD10 0
2
PIEAD9 0
1
PIEAD8 0
0
R PIEAD7 W Reset 0 0 0 0 0 0 0 0 PIEAD6 PIEAD5 PIEAD4 PIEAD3 PIEAD2 PIEAD1 PIEAD0
Figure 3-8. Port AD Interrupt Enable Register (PIEAD)
Read: Anytime. Write: Anytime. This register disables or enables on a per pin basis the edge sensitive external interrupt associated with port AD.
Table 3-7. PIEAD Field Descriptions
Field 15:0 Interrupt Enable Port AD PIEAD[15:0] 0 Interrupt is disabled (interrupt flag masked). 1 Interrupt is enabled. Description
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 135
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.1.8
Port AD Interrupt Flag Register (PIFAD)
7 6 5 4 3 2 1 0
R PIFAD15 W Reset 0
7
PIFAD14 0
6
PIFAD13 0
5
PIFAD12 0
4
PIFAD11 0
3
PIFAD10 0
2
PIFAD9 0
1
PIFAD8 0
0
R PIFAD7 W Reset 0 0 0 0 0 0 0 0 PIFAD6 PIFAD5 PIFAD4 PIFAD3 PIFAD2 PIFAD1 PIFAD0
Figure 3-9. Port AD Interrupt Flag Register (PIFAD)
Read: Anytime. Write: Anytime. Each flag is set by an active edge on the associated input pin. The active edge could be rising or falling based on the state of the corresponding PPSADx bit. To clear each flag, write "1" to the corresponding PIFADx bit. Writing a "0" has no effect. NOTE If the ATDDIEN0(1) bit of the associated pin is set to 0 (digital input buffer is disabled), active edges can not be detected.
Table 3-8. PIFAD Field Descriptions
Field Description
15:0 Interrupt Flags Port AD PIFAD[15:0] 0 No active edge pending. Writing a "0" has no effect. 1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set). Writing a "1" clears the associated flag.
MC9S12E128 Data Sheet, Rev. 1.07 136 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.2
Port M
Port M is associated with the serial communication interface (SCI2) , Inter-IC bus (IIC) and the digital to analog converter (DAC0 and DAC1) modules. Each pin is assigned to these modules according to the following priority: IIC/SCI2/DAC1/DAC0 > general-purpose I/O. When the IIC bus is enabled, the PM[7:6] pins become SCL and SDA respectively. Refer to the IIC block description chapter for information on enabling and disabling the IIC bus. When the SCI2 receiver and transmitter are enabled, the PM[5:4] become RXD2 and TXD2 respectively. Refer to the SCI block description chapter for information on enabling and disabling the SCI receiver and transmitter. When the DAC1 and DAC0 outputs are enabled, the PM[1:0] become DAO1 and DAO0 respectively. Refer to the DAC block description chapter for information on enabling and disabling the DAC output. During reset, PM[3] and PM[1:0] pins are configured as high-impedance inputs and PM[7:4] pins are configured as pull-up inputs.
3.3.2.1
Port M I/O Register (PTM)
7 6 5 4 3 2 1 0
R PTM7 W IIC: SCI2: DAC1/DAC0: Reset 0 0 0 0 0 PTM6 PTM5 PTM4 PTM3
0 PTM1 PTM0
SCL
SDA TXD2 RXD2 DAO1
0 0
DAO0
0
= Reserved or Unimplemented
Figure 3-10. Port M I/O Register (PTM)
Read: Anytime. Write: Anytime. If the associated data direction bit (DDRMx) is set to 1 (output), a read returns the value of the I/O register bit. If the associated data direction bit (DDRMx) is set to 0 (input), a read returns the value of the pin.
3.3.2.2
Port M Input Register (PTIM)
7 6 5 4 3 2 1 0
R W Reset
PTIM7
PTIM6
PTIM5
PTIM4
PTIM3
0
PTIM1
PTIM0
u
u
u
u
u
0
u
u
= Reserved or Unimplemented
u = Unaffected by reset
Figure 3-11. Port M Input Register (PTIM)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 137
Chapter 3 Port Integration Module (PIM9E128V1)
Read: Anytime. Write: Never, writes to this register have no effect. This register always reads back the status of the associated pins.
3.3.2.3
Port M Data Direction Register (DDRM)
7 6 5 4 3 2 1 0
R DDRM7 W Reset 0 0 0 0 0 DDRM6 DDRM5 DDRM4 DDRM3
0 DDRM1 0 0 DDRM0 0
= Reserved or Unimplemented
Figure 3-12. Port M Data Direction Register (DDRM)
Read: Anytime. Write: Anytime. This register configures port pins PM[7:3] and PM[1:0] as either input or output. If the IIC is enabled, the IIC controls the SCL and SDA I/O direction, and the corresponding DDRM[7:6] bits have no effect on their I/O direction. Refer to the IIC block description chapter for details. If the SCI2 transmitter is enabled, the I/O direction of the transmit pin TXD2 is controlled by SCI2, and the DDRM5 bit has no effect. If the SCI2 receiver is enabled, the I/O direction of the receive pin RXD2 is controlled by SCI2, and the DDRM4 bit has no effect. Refer to the SCI block description chapter for further details. If the DAC1 or DAC0 channel is enabled, the associated pin DAO1 or DAO0 is forced to be output, and the associated DDRM1 or DDRM0 bit has no effect. The DDRM bits do not change to reflect the pin I/O direction when not being used as GPIO. The DDRM[7:3]; DDRM[1:0] bits revert to controlling the I/O direction of the pins when the associated IIC, SCI, or DAC1/0 function are disabled.
Table 3-9. DDRM Field Descriptions
Field 7:3, 1:0 DDRM[7:3, 1:0] Data Direction Port M 0 Associated pin is configured as input. 1 Associated pin is configured as output. Description
MC9S12E128 Data Sheet, Rev. 1.07 138 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.2.4
Port M Reduced Drive Register (RDRM)
7 6 5 4 3 2 1 0
R RDRM7 W Reset 0 0 0 0 0 RDRM6 RDRM5 RDRM4 RDRM3
0 RDRM1 0 0 RDRM0 0
= Reserved or Unimplemented
Figure 3-13. Port M Reduced Drive Register (RDRM)
Read: Anytime. Write: Anytime. This register configures the drive strength of configured output pins as either full or reduced. If a pin is configured as input, the corresponding Reduced Drive Register bit has no effect.
Table 3-10. RDRM Field Descriptions
Field 7:3, 1:0 RDRM[7:3, 1:0] Description Reduced Drive Port M 0 Full drive strength at output 1 Associated pin drives at about 1/3 of the full drive strength.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 139
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.2.5
Port M Pull Device Enable Register (PERM)
7 6 5 4 3 2 1 0
R PERM7 W Reset 0 0 0 0 0 PERM6 PERM5 PERM4 PERM3
0 PERM1 0 0 PERM0 0
= Reserved or Unimplemented
Figure 3-14. Port M Pull Device Enable Register (PERM)
Read: Anytime. Write: Anytime. This register configures whether a pull-up or a pull-down device is activated on configured input or wired-or output pins. If a pin is configured as push-pull output, the corresponding Pull Device Enable Register bit has no effect.
Table 3-11. PERM Field Descriptions
Field 7:3, 1:0 PERM[7:3, 1:0] Pull Device Enable Port M 0 Pull-up or pull-down device is disabled. 1 Pull-up or pull-down device is enabled. Description
3.3.2.6
Port M Polarity Select Register (PPSM)
7 6 5 4 3 2 1 0
R PPSM7 W Reset 0 0 0 0 0 PPSM6 PPSM5 PPSM4 PPSM3
0 PPSM1 0 0 PPSM0 0
= Reserved or Unimplemented
Figure 3-15. Port M Polarity Select Register (PPSM)
Read: Anytime. Write: Anytime. The Port M Polarity Select Register selects whether a pull-down or a pull-up device is connected to the pin. The Port M Polarity Select Register is effective only when the corresponding Data Direction Register bit is set to 0 (input) and the corresponding Pull Device Enable Register bit is set to 1.
Table 3-12. PPSM Field Descriptions
Field 7:3, 1:0 PPSM[7:3, 1:0] Description Pull Select Port M 0 A pull-up device is connected to the associated port M pin. 1 A pull-down device is connected to the associated port M pin.
MC9S12E128 Data Sheet, Rev. 1.07 140 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.2.7
Port M Wired-OR Mode Register (WOMM)
7 6 5 4 3 2 1 0
R WOMM7 W Reset 0 0 0 0 WOMM6 WOMM5 WOMM4
0
0
0
0
0
0
0
0
= Reserved or Unimplemented
Figure 3-16. Port M Wired-OR Mode Register (WOMM)
Read: Anytime. Write: Anytime. This register selects whether a port M output is configured as push-pull or wired-or. When a Wired-OR Mode Register bit is set to 1, the corresponding output pin is driven active low only (open drain) and a high level is not driven. A Wired-OR Mode Register bit has no effect if the corresponding pin is configured as an input. These bits apply also to the SCI2 outputs and allow a multipoint connection of several serial modules. If the IIC is enabled, the associated pins are always set to wired-or mode, and the state of the WOMM[7:6] bits have no effect. The WOMM[7:6] bits will not change to reflect their wired-or mode configuration when the IIC is enabled.
Table 3-13. WOMM Field Descriptions
Field 7:4 Wired-OR Mode Port M WOMM[7:4] 0 Output buffers operate as push-pull outputs. 1 Output buffers operate as open-drain outputs. Description
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 141
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.3
Port P
Port P is associated with the Pulse Width Modulator (PMF) modules. Each pin is assigned according to the following priority: PMF > general-purpose I/O. When a PMF channel is enabled, the corresponding pin becomes a PWM output. Refer to the PMF block description chapter for information on enabling and disabling the PWM channels. During reset, port P pins are configured as high-impedance inputs.
3.3.3.1
Port P I/O Register (PTP)
7 6 5 4 3 2 1 0
R W PMF: Reset
0
0 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0
PW05
0 0 0
PW04
0
PW03
0
PW02
0
PW01
0
PW00
0
= Reserved or Unimplemented
Figure 3-17. Port P I/O Register (PTP)
Read: Anytime. Write: Anytime. If the associated data direction bit (DDRPx) is set to 1 (output), a read returns the value of the I/O register bit. If the associated data direction bit (DDRPx) is set to 0 (input), a read returns the value of the pin. The PMF function takes precedence over the general-purpose I/O function if the associated PWM channel is enabled. The PWM channels 5-0 are outputs if the respective channels are enabled.
3.3.3.2
Port P Input Register (PTIP)
7 6 5 4 3 2 1 0
R W Reset
0
0
PTIP5
PTIP4
PTIP3
PTIP2
PTIP1
PTIP0
0
0
u
u
u
u
u
u
= Reserved or Unimplemented
u = Unaffected by reset
Figure 3-18. Port P Input Register (PTIP)
Read: Anytime. Write: Never, writes to this register have no effect. This register always reads back the status of the associated pins.
MC9S12E128 Data Sheet, Rev. 1.07 142 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.3.3
Port P Data Direction Register (DDRP)
7 6 5 4 3 2 1 0
R W Reset
0
0 DDRP5 DDRP4 0 DDRP3 0 DDRP2 0 DDRP1 0 DDRP0 0
0
0
0
= Reserved or Unimplemented
Figure 3-19. Port P Data Direction Register (DDRP)
Read: Anytime. Write: Anytime. This register configures port pins PP[5:0] as either input or output. If a PMF channel is enabled, the corresponding pin is forced to be an output and the associated Data Direction Register bit has no effect. If a PMF channel is disabled, the corresponding Data Direction Register bit reverts to control the I/O direction of the associated pin.
Table 3-14. DDRP Field Descriptions
Field 5:0 DDRP[5:0] Data Direction Port P 0 Associated pin is configured as input. 1 Associated pin is configured as output. Description
3.3.3.4
Port P Reduced Drive Register (RDRP)
7 6 5 4 3 2 1 0
R W Reset
0
0 RDRP5 RDRP4 0 RDRP3 0 RDRP2 0 RDRP1 0 RDRP0 0
0
0
0
= Reserved or Unimplemented
Figure 3-20. Port P Reduced Drive Register (RDRP)
Read:Anytime. Write:Anytime. This register configures the drive strength of configured output pins as either full or reduced. If a pin is configured as input, the corresponding Reduced Drive Register bit has no effect.
Table 3-15. RDRP Field Descriptions
Field 5:0 RDRP[5:0] Description Reduced Drive Port P 0 Full drive strength at output. 1 Associated pin drives at about 1/3 of the full drive strength.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 143
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.3.5
Port P Pull Device Enable Register (PERP)
7 6 5 4 3 2 1 0
R W Reset
0
0 PERP5 PERP4 0 PERP3 0 PERP2 0 PERP1 0 PERP0 0
0
0
0
= Reserved or Unimplemented
Figure 3-21. Port P Pull Device Enable Register (PERP)
Read: Anytime. Write: Anytime. This register configures whether a pull-up or a pull-down device is activated on configured input pins. If a pin is configured as output, the corresponding Pull Device Enable Register bit has no effect.
Table 3-16. PERP Field Descriptions
Field 5:0 PERP[5:0] Pull Device Enable Port P 0 Pull-up or pull-down device is disabled. 1 Pull-up or pull-down device is enabled. Description
3.3.3.6
Port P Polarity Select Register (PPSP)
7 6 5 4 3 2 1 0
R W Reset
0
0 PPSP5 PPSP4 0 PPSP3 0 PPSP2 0 PPSP1 0 PPSP0 0
0
0
0
= Reserved or Unimplemented
Figure 3-22. Port P Polarity Select Register (PPSP)
Read: Anytime. Write: Anytime. The Port P Polarity Select Register selects whether a pull-down or a pull-up device is connected to the pin. The Port P Polarity Select Register is effective only when the corresponding Data Direction Register bit is set to 0 (input) and the corresponding Pull Device Enable Register bit is set to 1.
Table 3-17. PPSP Field Descriptions
Field 5:0 PPSP[5:0] Description Polarity Select Port P 0 A pull-up device is connected to the associated port P pin. 1 A pull-down device is connected to the associated port P pin.
MC9S12E128 Data Sheet, Rev. 1.07 144 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.4
Port Q
Port Q is associated with the Pulse Width Modulator (PMF) modules. Each pin is assigned according to the following priority: PMF > general-purpose I/O. When a current status or fault function is enabled, the corresponding pin becomes an input. PQ[3:0] are connected to FAULT[3:0] inputs and PQ[6:4] are connected to IS[2:0] inputs of the PMF module. Refer to the PMF block description chapter for information on enabling and disabling these PMF functions. During reset, port Q pins are configured as high-impedance inputs.
3.3.4.1
Port Q I/O Register (PTQ)
7 6 5 4 3 2 1 0
R W PMF: Reset
0 PTQ5 PTQ5 PTQ4 PTQ3 PTQ2 PTQ1 PTQ0
IS2
0 0
IS1
0
IS0
0
FAULT3
0
FAULT2
0
FAULT1
0
FAULT0
0
= Reserved or Unimplemented
Figure 3-23. Port Q I/O Register (PTQ)
Read: Anytime. Write: Anytime. If the associated data direction bit (DDRQx) is set to 1 (output), a read returns the value of the I/O register bit. If the associated data direction bit (DDRQx) is set to 0 (input), a read returns the value of the pin.
3.3.4.2
Port Q Input Register (PTIQ)
7 6 5 4 3 2 1 0
R W Reset
0
PTIQ6
PTIQ5
PTIQ4
PTIQ3
PTIQ2
PTIQ1
PTIQ0
0
u
u
u
u
u
u
u
= Reserved or Unimplemented
u = Unaffected by reset
Figure 3-24. Port Q Input Register (PTIQ)
Read: Anytime. Write: Never, writes to this register have no effect. This register always reads back the status of the associated pins.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 145
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.4.3
Port Q Data Direction Register (DDRQ)
7 6 5 4 3 2 1 0
R W Reset
0 DDRQ6 0 0 DDRQ5 0 DDRQ4 0 DDRQ3 0 DDRQ2 0 DDRQ1 0 DDRQ0 0
= Reserved or Unimplemented
Figure 3-25. Port Q Data Direction Register (DDRQ)
Read: Anytime. Write: Anytime. This register configures port pins PQ[6:0] as either input or output. If a PMF function is enabled, the corresponding pin is forced to be an input and the associated Data Direction Register bit has no effect. If a PMF channel is disabled, the corresponding Data Direction Register bit reverts to control the I/O direction of the associated pin.
Table 3-18. DDRQ Field Descriptions
Field 6:0 DDRQ[6:0] Data Direction Port Q 0 Associated pin is configured as input. 1 Associated pin is configured as output. Description
3.3.4.4
Port Q Reduced Drive Register (RDRQ)
7 6 5 4 3 2 1 0
R W Reset
0 RDRQ6 0 0 RDRQ5 0 RDRQ4 0 RDRQ3 0 RDRQ2 0 RDRQ1 0 RDRQ0 0
= Reserved or Unimplemented
Figure 3-26. Port Q Reduced Drive Register (RDRQ)
Read:Anytime. Write:Anytime. This register configures the drive strength of configured output pins as either full or reduced. If a pin is configured as input, the corresponding Reduced Drive Register bit has no effect.
Table 3-19. RDRQ Field Descriptions
Field 6:0 RDRQ[6:0] Description Reduced Drive Port Q 0 Full drive strength at output. 1 Associated pin drives at about 1/3 of the full drive strength.
MC9S12E128 Data Sheet, Rev. 1.07 146 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.4.5
Port Q Pull Device Enable Register (PERQ)
7 6 5 4 3 2 1 0
R W Reset
0 PERQ6 0 0 PERQ5 0 PERQ4 0 PERQ3 0 PERQ2 0 PERQ1 0 PERQ0 0
= Reserved or Unimplemented
Figure 3-27. Port Q Pull Device Enable Register (PERQ)
Read: Anytime. Write: Anytime. This register configures whether a pull-up or a pull-down device is activated on configured input pins. If a pin is configured as output, the corresponding Pull Device Enable Register bit has no effect.
Table 3-20. PERP Field Descriptions
Field 6:0 PERQ[6:0] Pull Device Enable Port P 0 Pull-up or pull-down device is disabled. 1 Pull-up or pull-down device is enabled. Description
3.3.4.6
Port Q Polarity Select Register (PPSQ)
7 6 5 4 3 2 1 0
R W Reset
0 PPSQ6 0 0 PPSQ5 0 PPSQ4 0 PPSQ3 0 PPSQ2 0 PPSQ1 0 PPSQ0 0
= Reserved or Unimplemented
Figure 3-28. Port Q Polarity Select Register (PPSQ)
Read: Anytime. Write: Anytime. The Port Q Polarity Select Register selects whether a pull-down or a pull-up device is connected to the pin. The Port Q Polarity Select Register is effective only when the corresponding Data Direction Register bit is set to 0 (input) and the corresponding Pull Device Enable Register bit is set to 1.
Table 3-21. PPSP Field Descriptions
Field 6:0 PPSQ[6:0] Description Polarity Select Port Q 0 A pull-up device is connected to the associated port Q pin. 1 A pull-down device is connected to the associated port Q pin.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 147
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.5
Port S
Port S is associated with the serial peripheral interface (SPI) and serial communication interfaces (SCI0 and SCI1). Each pin is assigned to these modules according to the following priority: SPI/SCI1/SCI0 > general-purpose I/O. When the SPI is enabled, the PS[7:4] pins become SS, SCK, MOSI, and MISO respectively. Refer to the SPI block description chapter for information on enabling and disabling the SPI. When the SCI1 receiver and transmitter are enabled, the PS[3:2] pins become TXD1 and RXD1 respectively. When the SCI0 receiver and transmitter are enabled, the PS[1:0] pins become TXD0 and RXD0 respectively. Refer to the SCI block description chapter for information on enabling and disabling the SCI receiver and transmitter. During reset, port S pins are configured as high-impedance inputs.
3.3.5.1
Port S I/O Register (PTS)
7 6 5 4 3 2 1 0
R PTS7 W SPI: SCI1/SCI0 : Reset 0 0 0 0 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0
SS
SCK
MOSI
MISO TXD1
0
RXD1
0
TXD0
0
RXD0
0
Figure 3-29. Port S I/O Register (PTS)
Read: Anytime. Write: Anytime. If the associated data direction bit (DDRSx) is set to 1 (output), a read returns the value of the I/O register bit. If the associated data direction bit (DDRSx) is set to 0 (input), a read returns the value of the pin.
3.3.5.2
Port S Input Register (PTIS)
7 6 5 4 3 2 1 0
R W Reset
PTIS7
PTIS6
PTIS5
PTIS4
PTIS3
PTIS2
PTIS1
PTIS0
u
u
u
u
u
u
u
u
= Reserved or Unimplemented
u = Unaffected by reset
Figure 3-30. Port S Input Register (PTIS)
Read: Anytime. Write: Never, writes to this register have no effect. This register always reads back the status of the associated pins.
MC9S12E128 Data Sheet, Rev. 1.07 148 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.5.3
Port S Data Direction Register (DDRS)
7 6 5 4 3 2 1 0
R DDRS7 W Reset 0 0 0 0 0 0 0 0 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0
Figure 3-31. Port S Data Direction Register (DDRS)
Read: Anytime. Write: Anytime. This register configures port pins PS[7:4] and PS[2:0] as either input or output. When the SPI is enabled, the PS[7:4] pins become the SPI bidirectional pins. The associated Data Direction Register bits have no effect. When the SCI1 transmitter is enabled, the PS[3] pin becomes the TXD1 output pin and the associated Data Direction Register bit has no effect. When the SCI1 receiver is enabled, the PS[2] pin becomes the RXD1 input pin and the associated Data Direction Register bit has no effect. When the SCI0 transmitter is enabled, the PS[1] pin becomes the TXD0 output pin and the associated Data Direction Register bit has no effect. When the SCI0 receiver is enabled, the PS[0] pin becomes the RXD0 input pin and the associated Data Direction Register bit has no effect. If the SPI, SCI1 and SCI0 functions are disabled, the corresponding Data Direction Register bit reverts to control the I/O direction of the associated pin.
Table 3-22. DDRS Field Descriptions
Field 7:0 DDRS[7:0] Data Direction Port S 0 Associated pin is configured as input. 1 Associated pin is configured as output. Description
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 149
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.5.4
Port S Reduced Drive Register (RDRS)
7 6 5 4 3 2 1 0
R RDRS7 W Reset 0 0 0 0 0 0 0 0 RDRS6 RDRS5 RDRS4 RDRS3 RDRS2 RDRS1 RDRS0
Figure 3-32. Port S Reduced Drive Register (RDRS)
Read: Anytime. Write: Anytime. This register configures the drive strength of configured output pins as either full or reduced. If a pin is configured as input, the corresponding Reduced Drive Register bit has no effect.
Table 3-23. RDRS Field Descriptions
Field 7:0 RDRS[7:0] Description Reduced Drive Port S 0 Full drive strength at output. 1 Associated pin drives at about 1/3 of the full drive strength.
3.3.5.5
Port S Pull Device Enable Register (PERS)
7 6 5 4 3 2 1 0
R PERS7 W Reset 1 1 1 1 1 1 1 1 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0
= Reserved or Unimplemented
Figure 3-33. Port S Pull Device Enable Register (PERS)
Read: Anytime. Write: Anytime. This register configures whether a pull-up or a pull-down device is activated on configured input or wired-or (open drain) output pins. If a pin is configured as push-pull output, the corresponding Pull Device Enable Register bit has no effect.
Table 3-24. PERS Field Descriptions
Field 7:0 PERS[7:0] Pull Device Enable Port S 0 Pull-up or pull-down device is disabled. 1 Pull-up or pull-down device is enabled. Description
MC9S12E128 Data Sheet, Rev. 1.07 150 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.5.6
Port S Polarity Select Register (PPSS)
7 6 5 4 3 2 1 0
R PPSS7 W Reset 0 0 0 0 0 0 0 0 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0
Figure 3-34. Port S Polarity Select Register (PPSS)
Read: Anytime. Write: Anytime. The Port S Polarity Select Register selects whether a pull-down or a pull-up device is connected to the pin. The Port S Polarity Select Register is effective only when the corresponding Data Direction Register bit is set to 0 (input) and the corresponding Pull Device Enable Register bit is set to 1.
Table 3-25. PPSS Field Descriptions
Field 7:0 PPSS[7:0] Description Pull Select Port S 0 A pull-up device is connected to the associated port S pin. 1 A pull-down device is connected to the associated port S pin.
3.3.5.7
Port S Wired-OR Mode Register (WOMS)
7 6 5 4 3 2 1 0
R WOMS7 W Reset 0 0 0 0 0 0 0 0 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0
Figure 3-35. Port S Wired-OR Mode Register (WOMS)
Read: Anytime. Write: Anytime. This register selects whether a port S output is configured as push-pull or wired-or. When a Wired-OR Mode Register bit is set to 1, the corresponding output pin is driven active low only (open drain) and a high level is not driven. A Wired-OR Mode Register bit has no effect if the corresponding pin is configured as an input.
Table 3-26. WOMS Field Descriptions
Field 7:0 Wired-OR Mode Port S WOMS[7:0] 0 Output buffers operate as push-pull outputs. 1 Output buffers operate as open-drain outputs. Description
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 151
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.6
Port T
Port T is associated with two 4-channel timers (TIM0 and TIM1). Each pin is assigned to these modules according to the following priority: TIM1/TIM0 > general-purpose I/O. If the timer TIM0 is enabled, the channels configured for output compare are available on port T pins PT[3:0]. If the timer TIM1 is enabled, the channels configured for output compare are available on port T pins PT[7:4]. Refer to the TIM block description chapter for information on enabling and disabling the TIM module. During reset, port T pins are configured as high-impedance inputs.
3.3.6.1
Port T I/O Register (PTT)
7 6 5 4 3 2 1 0
R PTT7 W TIM: Reset PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0
OC17
0
OC16
0
OC15
0
OC14
0
OC07
0
OC06
0
OC05
0
OC04
0
Figure 3-36. Port T I/O Register (PTT)
Read: Anytime. Write: Anytime. If the associated data direction bit (DDRTx) is set to 1 (output), a read returns the value of the I/O register bit. If the associated data direction bit (DDRTx) is set to 0 (input), a read returns the value of the pin.
3.3.6.2
Port T Input Register (PTIT)
7 6 5 4 3 2 1 0
R W Reset
PTIT7
PTIT6
PTIT5
PTIT4
PTIT3
PTIT2
PTIT1
PTIT0
u
u
u
u
u
u
u
u
= Reserved or Unimplemented
u = Unaffected by reset
Figure 3-37. Port T Input Register (PTIT)
Read: Anytime. Write: Never, writes to this register have no effect. This register always reads back the status of the associated pins.
MC9S12E128 Data Sheet, Rev. 1.07 152 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.6.3
Port T Data Direction Register (DDRT)
7 6 5 4 3 2 1 0
R DDRT7 W Reset 0 0 0 0 0 0 0 0 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0
Figure 3-38. Port T Data Direction Register (DDRT)
Read: Anytime. Write: Anytime. This register configures port pins PT[7:0] as either input or output. If the TIM0(1) module is enabled, each port pin configured for output compare is forced to be an output and the associated Data Direction Register bit has no effect. If the associated timer output compare is disabled, the corresponding DDRTx bit reverts to control the I/O direction of the associated pin. If the TIM0(1) module is enabled, each port pin configured as an input capture has the corresponding DDRTx bit controlling the I/O direction of the associated pin.
Table 3-27. DDRT Field Descriptions
Field 7:0 DDRT[7:0] Data Direction Port T 0 Associated pin is configured as input. 1 Associated pin is configured as output. Description
3.3.6.4
Port T Reduced Drive Register (RDRT)
7 6 5 4 3 2 1 0
R RDRT7 W Reset 0 0 0 0 0 0 0 0 RDRT6 RDRT5 RDRT4 RDRT3 RDRT2 RDRT1 RDRT0
Figure 3-39. Port T Reduced Drive Register (RDRT)
Read: Anytime. Write: Anytime. This register configures the drive strength of configured output pins as either full or reduced. If a pin is configured as input, the corresponding Reduced Drive Register bit has no effect.
Table 3-28. RDRT Field Descriptions
Field 7:0 RDRT[7:0] Description Reduced Drive Port T 0 Full drive strength at output. 1 Associated pin drives at about 1/3 of the full drive strength.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 153
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.6.5
Port T Pull Device Enable Register (PERT)
7 6 5 4 3 2 1 0
R PERT7 W Reset 0 0 0 0 0 0 0 0 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0
Figure 3-40. Port T Pull Device Enable Register (PERT)
Read: Anytime. Write: Anytime. This register configures whether a pull-up or a pull-down device is activated on configured input pins. If a pin is configured as output, the corresponding Pull Device Enable Register bit has no effect.
Table 3-29. PERT Field Descriptions
Field 7:0 PERT[7:0] Pull Device Enable Port T 0 Pull-up or pull-down device is disabled. 1 Pull-up or pull-down device is enabled. Description
3.3.6.6
Port T Polarity Select Register (PPST)
7 6 5 4 3 2 1 0
R PPST7 W Reset 0 0 0 0 0 0 0 0 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0
Figure 3-41. Port T Polarity Select Register (PPST)
Read: Anytime. Write: Anytime. The Port T Polarity Select Register selects whether a pull-down or a pull-up device is connected to the pin. The Port T Polarity Select Register is effective only when the corresponding Data Direction Register bit is set to 0 (input) and the corresponding Pull Device Enable Register bit is set to 1.
Table 3-30. PPST Field Descriptions
Field 7:0 PPST[7:0] Description Pull Select Port T 0 A pull-up device is connected to the associated port T pin. 1 A pull-down device is connected to the associated port T pin.
MC9S12E128 Data Sheet, Rev. 1.07 154 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.7
Port U
Port U is associated with one 4-channel timer (TIM2) and the pulse width modulator (PWM) module. Each pin is assigned to these modules according to the following priority: TIM2/PWM > general-purpose I/O. If the timer TIM2 is enabled, the channels configured for output compare are available on port U pins PU[3:0]. Refer to the TIM block description chapter for information on enabling and disabling the TIM module. When a PWM channel is enabled, the corresponding pin becomes a PWM output. Refer to the PWM block description chapter for information on enabling and disabling the PWM channels. If both PWM and TIM2 are enabled simultaneously, the pin functionality is determined by the configuration of the MODRR bits During reset, port U pins are configured as high-impedance inputs.
3.3.7.1
Port U I/O Register (PTU)
7 6 5 4 3 2 1 0
R PTU7 W PWM: TIM2: Reset 0 0 0 0 PTU6 PTU5 PTU4 PTU3 PTU2 PTU1 PTU0
PW15
PW14
PW13 OC27
0
PW12 OC26
0
PW11 OC25
0
PW10 OC24
0
Figure 3-42. Port U I/O Register (PTU)
Read: Anytime. Write: Anytime. If the associated data direction bit (DDRUx) is set to 1 (output), a read returns the value of the I/O register bit. If the associated data direction bit (DDRUx) is set to 0 (input), a read returns the value of the pin.
3.3.7.2
Port U Input Register (PTIU)
7 6 5 4 3 2 1 0
R W Reset
PTIU7
PTIU6
PTIU5
PTIU4
PTIU3
PTIU2
PTIU1
PTIU0
u
u
u
u
u
u
u
u
= Reserved or Unimplemented
u = Unaffected by reset
Figure 3-43. Port U Input Register (PTIU)
Read: Anytime. Write: Never, writes to this register have no effect. This register always reads back the status of the associated pins.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 155
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.7.3
Port U Data Direction Register (DDRU)
7 6 5 4 3 2 1 0
R DDRU7 W Reset 0 0 0 0 0 0 0 0 DDRU6 DDRU5 DDRU4 DDRU3 DDRU2 DDRU1 DDRU0
Figure 3-44. Port U Data Direction Register (DDRU)
Read: Anytime. Write: Anytime. This register configures port pins PU[7:0] as either input or output. If a pulse width modulator channel is enabled, the associated pin is forced to be an output and the associated Data Direction Register bit has no effect. If the associated pulse width modulator channel is disabled, the corresponding DDRUx bit reverts to control the I/O direction of the associated pin. If the TIM2 module is enabled, each port pin configured for output compare is forced to be an output and the associated Data Direction Register bit has no effect. If the associated timer output compare is disabled, the corresponding DDRUx bit reverts to control the I/O direction of the associated pin. If the TIM2 module is enabled, each port pin configured as an input capture has the corresponding DDRUx bit controlling the I/O direction of the associated pin. When both a timer function and a PWM function are enabled on the same pin, the MODRR register determines which function has control of the pin
Table 3-31. DDRT Field Descriptions
Field 7:0 DDRU[7:0] Data Direction Port U 0 Associated pin is configured as input. 1 Associated pin is configured as output. Description
MC9S12E128 Data Sheet, Rev. 1.07 156 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.7.4
Port U Reduced Drive Register (RDRU)
7 6 5 4 3 2 1 0
R RDRU7 W Reset 0 0 0 0 0 0 0 0 RDRU6 RDRU5 RDRU4 RDRU3 RDRU2 RDRU1 RDRU0
Figure 3-45. Port U Reduced Drive Register (RDRU)
Read: Anytime. Write: Anytime. This register configures the drive strength of configured output pins as either full or reduced. If a pin is configured as input, the corresponding Reduced Drive Register bit has no effect.
Table 3-32. RDRT Field Descriptions
Field 7:0 RDRU[7:0] Description Reduced Drive Port U 0 Full drive strength at output. 1 Associated pin drives at about 1/3 of the full drive strength.
3.3.7.5
Port U Pull Device Enable Register (PERU)
7 6 5 4 3 2 1 0
R PERU7 W Reset 0 0 0 0 0 0 0 0 PERU6 PERU5 PERU4 PERU3 PERU2 PERU1 PERU0
Figure 3-46. Port T Pull Device Enable Register (PERT)
Read: Anytime. Write: Anytime. This register configures whether a pull-up or a pull-down device is activated on configured input pins. If a pin is configured as output, the corresponding Pull Device Enable Register bit has no effect.
Table 3-33. PERT Field Descriptions
Field 7:0 PERU[7:0] Pull Device Enable Port U 0 Pull-up or pull-down device is disabled. 1 Pull-up or pull-down device is enabled. Description
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 157
Chapter 3 Port Integration Module (PIM9E128V1)
3.3.7.6
Port U Polarity Select Register (PPSU)
7 6 5 4 3 2 1 0
R PPSU7 W Reset 0 0 0 0 0 0 0 0 PPSU6 PPSU5 PPSU4 PPSU3 PPSU2 PPSU1 PPSU0
Figure 3-47. Port U Polarity Select Register (PPSU)
Read: Anytime. Write: Anytime. The Port U Polarity Select Register selects whether a pull-down or a pull-up device is connected to the pin. The Port U Polarity Select Register is effective only when the corresponding Data Direction Register bit is set to 0 (input) and the corresponding Pull Device Enable Register bit is set to 1.
Table 3-34. PPST Field Descriptions
Field 7:0 PPSU[7:0] Description Pull Select Port U 0 A pull-up device is connected to the associated port T pin. 1 A pull-down device is connected to the associated port T pin.
3.3.7.7
Port U Module Routing Register (MODRR)
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0 MODRR3 MODRR2 0 MODRR1 0 MODRR0 0
0
0
0
0
0
Figure 3-48. Port U Module Routing Register (MODRR)
Read: Anytime. Write: Anytime. This register selects the module connected to port U.
Table 3-35. MODRR Field Descriptions
Field Description
3:0 Pull Select Port U MODRR[3:0] 0 If enabled, TIM2 channel is connected to the associated port U pin. 1 If enabled, PWM channel is connected to the associated port U pin.
MC9S12E128 Data Sheet, Rev. 1.07 158 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.4
Functional Description
Each pin associated with ports AD, M, P, Q, S, T and U can act as general-purpose I/O. In addition the pin can act as an output from a peripheral module or an input to a peripheral module. A set of configuration registers is common to all ports. All registers can be written at any time, however a specific configuration might not become active. Example: Selecting a pull-up resistor. This resistor does not become active while the port is used as a push-pull output.
3.4.1
I/O Register
The I/O Register holds the value driven out to the pin if the port is used as a general-purpose I/O. Writing to the I/O Register only has an effect on the pin if the port is used as general-purpose output. When reading the I/O Register, the value of each pin is returned if the corresponding Data Direction Register bit is set to 0 (pin configured as input). If the data direction register bits is set to 1, the content of the I/O Register bit is returned. This is independent of any other configuration (Figure 3-49). Due to internal synchronization circuits, it can take up to 2 bus cycles until the correct value is read on the I/O Register when changing the data direction register.
3.4.2
Input Register
The Input Register is a read-only register and generally returns the value of the pin (Figure 3-49). It can be used to detect overload or short circuit conditions. Due to internal synchronization circuits, it can take up to 2 bus cycles until the correct value is read on the Input Register when changing the Data Direction Register.
3.4.3
Data Direction Register
The Data Direction Register defines whether the pin is used as an input or an output. A Data Direction Register bit set to 0 configures the pin as an input. A Data Direction Register bit set to 0 configures the pin as an output. If a peripheral module controls the pin the contents of the data direction register is ignored (Figure 3-49).
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 159
Chapter 3 Port Integration Module (PIM9E128V1)
PTIx
0 1
PTx
0 1
PAD
DDRx Digital Module
data out output enable
0 1
module enable
Figure 3-49. Illustration of I/O Pin Functionality
Figure 3-50 shows the state of digital inputs and outputs when an analog module drives the port. When the analog module is enabled all associated digital output ports are disabled and all associated digital input ports read "1". 1
Digital Input
1 0
Module Enable
Analog Module
Digital Output Analog Output
0 1
PAD
PIM Boundary
Figure 3-50. Digital Ports and Analog Module
3.4.4
Reduced Drive Register
If the port is used as an output the Reduced Drive Register allows the configuration of the drive strength.
3.4.5
Pull Device Enable Register
The Pull Device Enable Register turns on a pull-up or pull-down device. The pull device becomes active only if the pin is used as an input or as a wired-or output.
MC9S12E128 Data Sheet, Rev. 1.07 160 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.4.6
Polarity Select Register
The Polarity Select Register selects either a pull-up or pull-down device if enabled. The pull device becomes active only if the pin is used as an input or as a wired-or output.
3.4.7
Pin Configuration Summary
The following table summarizes the effect of various configuration in the Data Direction (DDR), Input/Output (I/O), reduced drive (RDR), Pull Enable (PE), Pull Select (PS) and Interrupt Enable (IE) register bits. The PS configuration bit is used for two purposes: 1. Configure the sensitive interrupt edge (rising or falling), if interrupt is enabled. 2. Select either a pull-up or pull-down device if PE is set to "1".
Table 3-36. Pin Configuration Summary
DDR 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1
1 2
IO X X X X X X X 0 1 0 1 0 1 0 1
RDR X X X X X X X 0 0 1 1 0 0 1 1
PE 0 1 1 0 0 1 1 X X X X X X X X
PS X 0 1 0 1 0 1 X X X X 0 1 0 1
IE1 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1
Function2 Input Input Input Input Input Input Input Output to 0, Full Drive Output to 1, Full Drive Output to 0, Reduced Drive Output to 1, Reduced Drive Output to 0, Full Drive Output to 1, Full Drive Output to 0, Reduced Drive Output to 1, Reduced Drive
Pull Device Disabled Pull Up Pull Down Disabled Disabled Pull Up Pull Down Disabled Disabled Disabled Disabled Disabled Disabled Disabled Disabled
Interrupt Disabled Disabled Disabled Falling Edge Rising Edge Falling Edge Rising Edge Disabled Disabled Disabled Disabled Falling Edge Rising Edge Falling Edge Rising Edge
Applicable only on Port AD. Digital outputs are disabled and digital input logic is forced to "1" when an analog module associated with the port is enabled.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 161
Chapter 3 Port Integration Module (PIM9E128V1)
3.5
Resets
The reset values of all registers are given in the register description in Section 3.3, "Memory Map and Register Definition". All ports start up as general-purpose inputs on reset.
3.5.1
Reset Initialization
All registers including the data registers get set/reset asynchronously. Table 3-37 summarizes the port properties after reset initialization.
P
Table 3-37. Port Reset State Summary
Reset States Port Data Direction Refer to section Bus Control and Input/Output Pull Mode Pull Up Red. Drive Wired-OR Mode Interrupt
A B E K BKGD pin AD M[7:4] M[3,1:0] P Q S T U
Refer to section Bus Control and Input/Output
Input Input Input Input Input Input Input Input
Hi-z Pull Up Hi-z Hi-z Hi-z Pull Up Hi-z Hi-z
Disabled Disabled Disabled Disabled Disabled Disabled Disabled Disabled
N/A Disabled Disabled N/A N/A Disabled N/A N/A
Disabled N/A N/A N/A N/A N/A N/A N/A
MC9S12E128 Data Sheet, Rev. 1.07 162 Freescale Semiconductor
Chapter 3 Port Integration Module (PIM9E128V1)
3.6
3.6.1
Interrupts
General
Port AD generates an edge sensitive interrupt if enabled. It offers sixteen I/O pins with edge triggered interrupt capability in wired-or fashion. The interrupt enable as well as the sensitivity to rising or falling edges can be individually configured on per pin basis. All eight bits/pins share the same interrupt vector. Interrupts can be used with the pins configured as inputs (with the corresponding ATDDIEN1 bit set to 1) or outputs. An interrupt is generated when a bit in the port interrupt flag register and its corresponding port interrupt enable bit are both set. This external interrupt feature is capable to wake up the CPU when it is in stop or wait mode. A digital filter on each pin prevents pulses (Figure 3-52) shorter than a specified time from generating an interrupt. The minimum time varies over process conditions, temperature and voltage (Figure 3-51 and Table 3-38).
Glitch, filtered out, no interrupt flag set
Valid pulse, interrupt flag set
tifmin tifmax Figure 3-51. Interrupt Glitch Filter on Port AD (PPS = 0)
Table 3-38. Pulse Detection Criteria
Mode Pulse STOP Unit Ignored Uncertain Valid
1
STOP1 Unit tpulse <= 3.2 3.2 < tpulse < 10 s s s
tpulse <= 3 3 < tpulse <4
Bus Clock Bus Clock Bus Clock
tpulse >= 4
tpulse >= 10
These values include the spread of the oscillator frequency over temperature, voltage and process.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 163
Chapter 3 Port Integration Module (PIM9E128V1)
tpulse
Figure 3-52. Pulse Illustration
A valid edge on an input is detected if 4 consecutive samples of a passive level are followed by 4 consecutive samples of an active level directly or indirectly The filters are continuously clocked by the bus clock in RUN and WAIT mode. In STOP mode the clock is generated by a single RC oscillator in the port integration module. To maximize current saving the RC oscillator runs only if the following condition is true on any pin: Sample count <= 4 and port interrupt enabled (PIE=1) and port interrupt flag not set (PIF=0).
3.6.2
Interrupt Sources
Table 3-39. Port Integration Module Interrupt Sources
Interrupt Source Port AD Interrupt Flag PIFAD[15:0] Local Enable PIEAD[15:0] Global (CCR) Mask I Bit
NOTE Vector addresses and their relative interrupt priority are determined at the MCU level.
3.6.3
Operation in Stop Mode
All clocks are stopped in STOP mode. The port integration module has asynchronous paths on port AD to generate wake-up interrupts from stop mode. For other sources of external interrupts refer to the respective block description chapters.
MC9S12E128 Data Sheet, Rev. 1.07 164 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
4.1 Introduction
This specification describes the function of the clocks and reset generator (CRGV4).
4.1.1
Features
The main features of this block are: * Phase-locked loop (PLL) frequency multiplier -- Reference divider -- Automatic bandwidth control mode for low-jitter operation -- Automatic frequency lock detector -- CPU interrupt on entry or exit from locked condition -- Self-clock mode in absence of reference clock * System clock generator -- Clock quality check -- Clock switch for either oscillator- or PLL-based system clocks -- User selectable disabling of clocks during wait mode for reduced power consumption * Computer operating properly (COP) watchdog timer with time-out clear window * System reset generation from the following possible sources: -- Power-on reset -- Low voltage reset Refer to the device overview section for availability of this feature. -- COP reset -- Loss of clock reset -- External pin reset * Real-time interrupt (RTI)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 165
Chapter 4 Clocks and Reset Generator (CRGV4)
4.1.2
Modes of Operation
This subsection lists and briefly describes all operating modes supported by the CRG. * Run mode All functional parts of the CRG are running during normal run mode. If RTI or COP functionality is required the individual bits of the associated rate select registers (COPCTL, RTICTL) have to be set to a nonzero value. * Wait mode This mode allows to disable the system and core clocks depending on the configuration of the individual bits in the CLKSEL register. * Stop mode Depending on the setting of the PSTP bit, stop mode can be differentiated between full stop mode (PSTP = 0) and pseudo-stop mode (PSTP = 1). -- Full stop mode The oscillator is disabled and thus all system and core clocks are stopped. The COP and the RTI remain frozen. -- Pseudo-stop mode The oscillator continues to run and most of the system and core clocks are stopped. If the respective enable bits are set the COP and RTI will continue to run, else they remain frozen. * Self-clock mode Self-clock mode will be entered if the clock monitor enable bit (CME) and the self-clock mode enable bit (SCME) are both asserted and the clock monitor in the oscillator block detects a loss of clock. As soon as self-clock mode is entered the CRGV4 starts to perform a clock quality check. Self-clock mode remains active until the clock quality check indicates that the required quality of the incoming clock signal is met (frequency and amplitude). Self-clock mode should be used for safety purposes only. It provides reduced functionality to the MCU in case a loss of clock is causing severe system conditions.
4.1.3
Block Diagram
Figure 4-1 shows a block diagram of the CRGV4.
MC9S12E128 Data Sheet, Rev. 1.07 166 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
Voltage Regulator
Power-on Reset Low Voltage Reset 1
CRG
RESET
COP Timeout
XCLKS EXTAL XTAL
Clock Monitor
CM fail
Reset Generator Clock Quality Checker COP RTI
System Reset
OSCCLK
Oscillator
Bus Clock Core Clock Oscillator Clock
Registers
XFC VDDPLL VSSPLL PLLCLK
PLL
Clock and Reset Control
Real-Time Interrupt PLL Lock Interrupt Self-Clock Mode Interrupt
1
Refer to the device overview section for availability of the low-voltage reset feature.
Figure 4-1. CRG Block Diagram
4.2
External Signal Description
This section lists and describes the signals that connect off chip.
4.2.1
VDDPLL, VSSPLL -- PLL Operating Voltage, PLL Ground
These pins provides operating voltage (VDDPLL) and ground (VSSPLL) for the PLL circuitry. This allows the supply voltage to the PLL to be independently bypassed. Even if PLL usage is not required VDDPLL and VSSPLL must be connected properly.
4.2.2
XFC -- PLL Loop Filter Pin
A passive external loop filter must be placed on the XFC pin. The filter is a second-order, low-pass filter to eliminate the VCO input ripple. The value of the external filter network and the reference frequency determines the speed of the corrections and the stability of the PLL. Refer to the device overview chapter for calculation of PLL loop filter (XFC) components. If PLL usage is not required the XFC pin must be tied to VDDPLL.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 167
Chapter 4 Clocks and Reset Generator (CRGV4)
VDDPLL
CS MCU RS
CP
XFC
Figure 4-2. PLL Loop Filter Connections
4.2.3
RESET -- Reset Pin
RESET is an active low bidirectional reset pin. As an input it initializes the MCU asynchronously to a known start-up state. As an open-drain output it indicates that an system reset (internal to MCU) has been triggered.
4.3
Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the CRGV4.
4.3.1
Module Memory Map
Table 4-1 gives an overview on all CRGV4 registers.
Table 4-1. CRGV4 Memory Map
Address Offset 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 0x000A 0x000B
1 2
Use CRG Synthesizer Register (SYNR) CRG Reference Divider Register (REFDV) CRG Test Flags Register (CTFLG)1 CRG Flags Register (CRGFLG) CRG Interrupt Enable Register (CRGINT) CRG Clock Select Register (CLKSEL) CRG PLL Control Register (PLLCTL) CRG RTI Control Register (RTICTL) CRG COP Control Register (COPCTL) CRG Force and Bypass Test Register CRG Test Control Register (CTCTL)3 (FORBYP)2
Access R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
CRG COP Arm/Timer Reset (ARMCOP)
CTFLG is intended for factory test purposes only. FORBYP is intended for factory test purposes only. 3 CTCTL is intended for factory test purposes only.
MC9S12E128 Data Sheet, Rev. 1.07 168 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
NOTE Register address = base address + address offset, where the base address is defined at the MCU level and the address offset is defined at the module level.
4.3.2
Register Descriptions
This section describes in address order all the CRGV4 registers and their individual bits.
Register Name SYNR R W REFDV R W CTFLG R W CRGFLG R W CRGINT R W CLKSEL R W PLLCTL R W RTICTL R W COPCTL R W FORBYP CTCTL R W R W = Unimplemented or Reserved 0 0 0 0 0 0 0 0 WCOP 0 RTIF PORF 0 LVRF 0 LOCKIF LOCK TRACK SCMIF SCM 0 0 0 0 0 0
Bit 7 0
6 0
5 SYN5 0
4 SYN4 0
3 SYN3
2 SYN2
1 SYN1
Bit 0 SYN0
REFDV3 0
REFDV2 0
REFDV1 0
REFDV0 0
RTIE
LOCKIE
0
0
SCMIE
0
PLLSEL
PSTP
SYSWAI
ROAWAI
PLLWAI 0
CWAI
RTIWAI
COPWAI
CME 0
PLLON
AUTO
ACQ
PRE
PCE
SCME
RTR6
RTR5 0
RTR4 0
RTR3 0
RTR2
RTR1
RTR0
RSBCK 0
CR2 0
CR1 0
CR0 0
0
0
0
Figure 4-3. CRG Register Summary
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 169
Chapter 4 Clocks and Reset Generator (CRGV4)
Register Name ARMCOP R W
Bit 7 0 Bit 7
6 0 Bit 6
5 0 Bit 5
4 0 Bit 4
3 0 Bit 3
2 0 Bit 2
1 0 Bit 1
Bit 0 0 Bit 0
= Unimplemented or Reserved
Figure 4-3. CRG Register Summary (continued)
4.3.2.1
CRG Synthesizer Register (SYNR)
The SYNR register controls the multiplication factor of the PLL. If the PLL is on, the count in the loop divider (SYNR) register effectively multiplies up the PLL clock (PLLCLK) from the reference frequency by 2 x (SYNR+1). PLLCLK will not be below the minimum VCO frequency (fSCM).
( SYNR + 1 ) PLLCLK = 2xOSCCLKx ---------------------------------( REFDV + 1 )
NOTE If PLL is selected (PLLSEL=1), Bus Clock = PLLCLK / 2 Bus Clock must not exceed the maximum operating system frequency.
7 6 5 4 3 2 1 0
R W Reset
0
0 SYN5 SYNR 0 SYN3 0 SYN2 0 SYN1 0 SYN0 0
0
0
0
= Unimplemented or Reserved
Figure 4-4. CRG Synthesizer Register (SYNR)
Read: anytime Write: anytime except if PLLSEL = 1 NOTE Write to this register initializes the lock detector bit and the track detector bit.
MC9S12E128 Data Sheet, Rev. 1.07 170 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
4.3.2.2
CRG Reference Divider Register (REFDV)
The REFDV register provides a finer granularity for the PLL multiplier steps. The count in the reference divider divides OSCCLK frequency by REFDV + 1.
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0 REFDV3 REFDV2 0 REFDV1 0 REFDV0 0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-5. CRG Reference Divider Register (REFDV)
Read: anytime Write: anytime except when PLLSEL = 1 NOTE Write to this register initializes the lock detector bit and the track detector bit.
4.3.2.3
Reserved Register (CTFLG)
This register is reserved for factory testing of the CRGV4 module and is not available in normal modes.
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-6. CRG Reserved Register (CTFLG)
Read: always reads 0x0000 in normal modes Write: unimplemented in normal modes NOTE Writing to this register when in special mode can alter the CRGV4 functionality.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 171
Chapter 4 Clocks and Reset Generator (CRGV4)
4.3.2.4
CRG Flags Register (CRGFLG)
This register provides CRG status bits and flags.
7 6 5 4 3 2 1 0
R RTIF W Reset 0 Note 1 Note 2 0 PORF LVRF LOCKIF
LOCK
TRACK SCMIF
SCM
0
0
0
0
1. PORF is set to 1 when a power-on reset occurs. Unaffected by system reset. 2. LVRF is set to 1 when a low-voltage reset occurs. Unaffected by system reset. = Unimplemented or Reserved
Figure 4-7. CRG Flag Register (CRGFLG)
Read: anytime Write: refer to each bit for individual write conditions
Table 4-2. CRGFLG Field Descriptions
Field 7 RTIF Description Real-Time Interrupt Flag -- RTIF is set to 1 at the end of the RTI period. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (RTIE = 1), RTIF causes an interrupt request. 0 RTI time-out has not yet occurred. 1 RTI time-out has occurred. Power-on Reset Flag -- PORF is set to 1 when a power-on reset occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Power-on reset has not occurred. 1 Power-on reset has occurred. Low-Voltage Reset Flag -- If low voltage reset feature is not available (see the device overview chapter), LVRF always reads 0. LVRF is set to 1 when a low voltage reset occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Low voltage reset has not occurred. 1 Low voltage reset has occurred. PLL Lock Interrupt Flag -- LOCKIF is set to 1 when LOCK status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect.If enabled (LOCKIE = 1), LOCKIF causes an interrupt request. 0 No change in LOCK bit. 1 LOCK bit has changed. Lock Status Bit -- LOCK reflects the current state of PLL lock condition. This bit is cleared in self-clock mode. Writes have no effect. 0 PLL VCO is not within the desired tolerance of the target frequency. 1 PLL VCO is within the desired tolerance of the target frequency. Track Status Bit -- TRACK reflects the current state of PLL track condition. This bit is cleared in self-clock mode. Writes have no effect. 0 Acquisition mode status. 1 Tracking mode status.
6 PORF
5 LVRF
4 LOCKIF
3 LOCK
2 TRACK
MC9S12E128 Data Sheet, Rev. 1.07 172 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
Table 4-2. CRGFLG Field Descriptions (continued)
Field 1 SCMIF Description Self-Clock Mode Interrupt Flag -- SCMIF is set to 1 when SCM status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (SCMIE=1), SCMIF causes an interrupt request. 0 No change in SCM bit. 1 SCM bit has changed. Self-Clock Mode Status Bit -- SCM reflects the current clocking mode. Writes have no effect. 0 MCU is operating normally with OSCCLK available. 1 MCU is operating in self-clock mode with OSCCLK in an unknown state. All clocks are derived from PLLCLK running at its minimum frequency fSCM.
0 SCM
4.3.2.5
CRG Interrupt Enable Register (CRGINT)
This register enables CRG interrupt requests.
7 6 5 4 3 2 1 0
R RTIE W Reset 0
0
0 LOCKIE
0
0 SCMIE
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-8. CRG Interrupt Enable Register (CRGINT)
Read: anytime Write: anytime
Table 4-3. CRGINT Field Descriptions
Field 7 RTIE 4 LOCKIE 1 SCMIE Description Real-Time Interrupt Enable Bit 0 Interrupt requests from RTI are disabled. 1 Interrupt will be requested whenever RTIF is set. Lock Interrupt Enable Bit 0 LOCK interrupt requests are disabled. 1 Interrupt will be requested whenever LOCKIF is set. Self-Clock Mode Interrupt Enable Bit 0 SCM interrupt requests are disabled. 1 Interrupt will be requested whenever SCMIF is set.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 173
Chapter 4 Clocks and Reset Generator (CRGV4)
4.3.2.6
CRG Clock Select Register (CLKSEL)
This register controls CRG clock selection. Refer to Figure 4-17 for details on the effect of each bit.
7 6 5 4 3 2 1 0
R PLLSEL W Reset 0 0 0 0 0 0 0 0 PSTP SYSWAI ROAWAI PLLWAI CWAI RTIWAI COPWAI
Figure 4-9. CRG Clock Select Register (CLKSEL)
Read: anytime Write: refer to each bit for individual write conditions
Table 4-4. CLKSEL Field Descriptions
Field 7 PLLSEL Description PLL Select Bit -- Write anytime. Writing a 1 when LOCK = 0 and AUTO = 1, or TRACK = 0 and AUTO = 0 has no effect. This prevents the selection of an unstable PLLCLK as SYSCLK. PLLSEL bit is cleared when the MCU enters self-clock mode, stop mode or wait mode with PLLWAI bit set. 0 System clocks are derived from OSCCLK (Bus Clock = OSCCLK / 2). 1 System clocks are derived from PLLCLK (Bus Clock = PLLCLK / 2). Pseudo-Stop Bit -- Write: anytime -- This bit controls the functionality of the oscillator during stop mode. 0 Oscillator is disabled in stop mode. 1 Oscillator continues to run in stop mode (pseudo-stop). The oscillator amplitude is reduced. Refer to oscillator block description for availability of a reduced oscillator amplitude. Note: Pseudo-stop allows for faster stop recovery and reduces the mechanical stress and aging of the resonator in case of frequent stop conditions at the expense of a slightly increased power consumption. Note: Lower oscillator amplitude exhibits lower power consumption but could have adverse effects during any electro-magnetic susceptibility (EMS) tests. System Clocks Stop in Wait Mode Bit -- Write: anytime 0 In wait mode, the system clocks continue to run. 1 In wait mode, the system clocks stop. Note: RTI and COP are not affected by SYSWAI bit. Reduced Oscillator Amplitude in Wait Mode Bit -- Write: anytime -- Refer to oscillator block description chapter for availability of a reduced oscillator amplitude. If no such feature exists in the oscillator block then setting this bit to 1 will not have any effect on power consumption. 0 Normal oscillator amplitude in wait mode. 1 Reduced oscillator amplitude in wait mode. Note: Lower oscillator amplitude exhibits lower power consumption but could have adverse effects during any electro-magnetic susceptibility (EMS) tests. PLL Stops in Wait Mode Bit -- Write: anytime -- If PLLWAI is set, the CRGV4 will clear the PLLSEL bit before entering wait mode. The PLLON bit remains set during wait mode but the PLL is powered down. Upon exiting wait mode, the PLLSEL bit has to be set manually if PLL clock is required. While the PLLWAI bit is set the AUTO bit is set to 1 in order to allow the PLL to automatically lock on the selected target frequency after exiting wait mode. 0 PLL keeps running in wait mode. 1 PLL stops in wait mode. Core Stops in Wait Mode Bit -- Write: anytime 0 Core clock keeps running in wait mode. 1 Core clock stops in wait mode.
6 PSTP
5 SYSWAI
4 ROAWAI
3 PLLWAI
2 CWAI
MC9S12E128 Data Sheet, Rev. 1.07 174 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
Table 4-4. CLKSEL Field Descriptions (continued)
Field 1 RTIWAI 0 COPWAI Description RTI Stops in Wait Mode Bit -- Write: anytime 0 RTI keeps running in wait mode. 1 RTI stops and initializes the RTI dividers whenever the part goes into wait mode. COP Stops in Wait Mode Bit -- Normal modes: Write once --Special modes: Write anytime 0 COP keeps running in wait mode. 1 COP stops and initializes the COP dividers whenever the part goes into wait mode.
4.3.2.7
CRG PLL Control Register (PLLCTL)
This register controls the PLL functionality.
7 6 5 4 3 2 1 0
R CME W Reset 1 1 1 1 PLLON AUTO ACQ
0 PRE 0 0 PCE 0 SCME 1
= Unimplemented or Reserved
Figure 4-10. CRG PLL Control Register (PLLCTL)
Read: anytime Write: refer to each bit for individual write conditions
Table 4-5. PLLCTL Field Descriptions
Field 7 CME Description Clock Monitor Enable Bit -- CME enables the clock monitor. Write anytime except when SCM = 1. 0 Clock monitor is disabled. 1 Clock monitor is enabled. Slow or stopped clocks will cause a clock monitor reset sequence or self-clock mode. Note: Operating with CME = 0 will not detect any loss of clock. In case of poor clock quality this could cause unpredictable operation of the MCU. Note: In Stop Mode (PSTP = 0) the clock monitor is disabled independently of the CME bit setting and any loss of clock will not be detected. Phase Lock Loop On Bit -- PLLON turns on the PLL circuitry. In self-clock mode, the PLL is turned on, but the PLLON bit reads the last latched value. Write anytime except when PLLSEL = 1. 0 PLL is turned off. 1 PLL is turned on. If AUTO bit is set, the PLL will lock automatically. Automatic Bandwidth Control Bit -- AUTO selects either the high bandwidth (acquisition) mode or the low bandwidth (tracking) mode depending on how close to the desired frequency the VCO is running. Write anytime except when PLLWAI=1, because PLLWAI sets the AUTO bit to 1. 0 Automatic mode control is disabled and the PLL is under software control, using ACQ bit. 1 Automatic mode control is enabled and ACQ bit has no effect. Acquisition Bit -- Write anytime. If AUTO=1 this bit has no effect. 0 Low bandwidth filter is selected. 1 High bandwidth filter is selected.
6 PLLON
5 AUTO
4 ACQ
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 175
Chapter 4 Clocks and Reset Generator (CRGV4)
Table 4-5. PLLCTL Field Descriptions (continued)
Field 2 PRE Description RTI Enable during Pseudo-Stop Bit -- PRE enables the RTI during pseudo-stop mode. Write anytime. 0 RTI stops running during pseudo-stop mode. 1 RTI continues running during pseudo-stop mode. Note: If the PRE bit is cleared the RTI dividers will go static while pseudo-stop mode is active. The RTI dividers will not initialize like in wait mode with RTIWAI bit set. COP Enable during Pseudo-Stop Bit -- PCE enables the COP during pseudo-stop mode. Write anytime. 0 COP stops running during pseudo-stop mode 1 COP continues running during pseudo-stop mode Note: If the PCE bit is cleared the COP dividers will go static while pseudo-stop mode is active. The COP dividers will not initialize like in wait mode with COPWAI bit set. Self-Clock Mode Enable Bit -- Normal modes: Write once --Special modes: Write anytime -- SCME can not be cleared while operating in self-clock mode (SCM=1). 0 Detection of crystal clock failure causes clock monitor reset (see Section 4.5.1, "Clock Monitor Reset"). 1 Detection of crystal clock failure forces the MCU in self-clock mode (see Section 4.4.7.2, "Self-Clock Mode").
1 PCE
0 SCME
4.3.2.8
CRG RTI Control Register (RTICTL)
This register selects the timeout period for the real-time interrupt.
7 6 5 4 3 2 1 0
R W Reset
0 RTR6 0 0 RTR5 0 RTR4 0 RTR3 0 RTR2 0 RTR1 0 RTR0 0
= Unimplemented or Reserved
Figure 4-11. CRG RTI Control Register (RTICTL)
Read: anytime Write: anytime NOTE A write to this register initializes the RTI counter.
Table 4-6. RTICTL Field Descriptions
Field 6:4 RTR[6:4] 3:0 RTR[3:0] Description Real-Time Interrupt Prescale Rate Select Bits -- These bits select the prescale rate for the RTI. See Table 4-7. Real-Time Interrupt Modulus Counter Select Bits -- These bits select the modulus counter target value to provide additional granularity. Table 4-7 shows all possible divide values selectable by the RTICTL register. The source clock for the RTI is OSCCLK.
MC9S12E128 Data Sheet, Rev. 1.07 176 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
Table 4-7. RTI Frequency Divide Rates
RTR[6:4] = RTR[3:0] 000 (OFF) OFF* OFF* OFF* OFF* OFF* OFF* OFF* OFF* OFF* OFF* OFF* OFF* OFF* OFF* OFF* OFF* 001 (210) 210 2x210 3x210 4x210 5x210 6x210 7x210 8x210 9x210 10x210 11x210 12x210 13x210 14x210 15x210 16x210 010 (211) 211 2x211 3x211 4x211 5x211 6x211 7x211 8x211 9x211 10x211 11x211 12x211 13x211 14x211 15x211 16x211 011 (212) 212 2x212 3x212 4x212 5x212 6x212 7x212 8x212 9x212 10x212 11x212 12x212 13x212 14x212 15x212 16x212 100 (213) 213 2x213 3x213 4x213 5x213 6x213 7x213 8x213 9x213 10x213 11x213 12x213 13x213 14x213 15x213 16x213 101 (214) 214 2x214 3x214 4x214 5x214 6x214 7x214 8x214 9x214 10x214 11x214 12x214 13x214 14x214 15x214 16x214 110 (215) 215 2x215 3x215 4x215 5x215 6x215 7x215 8x215 9x215 10x215 11x215 12x215 13x215 14x215 15x215 16x215 111 (216) 216 2x216 3x216 4x216 5x216 6x216 7x216 8x216 9x216 10x216 11x216 12x216 13x216 14x216 15x216 16x216
0000 (/1) 0001 (/2) 0010 (/3) 0011 (/4) 0100 (/5) 0101 (/6) 0110 (/7) 0111 (/8) 1000 (/9) 1001 (/10) 1010 (/11) 1011 (/12) 1100 (/ 13) 1101 (/14) 1110 (/15) 1111 (/ 16)
* Denotes the default value out of reset.This value should be used to disable the RTI to ensure future backwards compatibility.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 177
Chapter 4 Clocks and Reset Generator (CRGV4)
4.3.2.9
CRG COP Control Register (COPCTL)
This register controls the COP (computer operating properly) watchdog.
7 6 5 4 3 2 1 0
R WCOP W Reset 0 0 RSBCK
0
0
0 CR2 CR1 0 CR0 0
0
0
0
0
= Unimplemented or Reserved
Figure 4-12. CRG COP Control Register (COPCTL)
Read: anytime Write: WCOP, CR2, CR1, CR0: once in user mode, anytime in special mode Write: RSBCK: once
Table 4-8. COPCTL Field Descriptions
Field 7 WCOP Description Window COP Mode Bit -- When set, a write to the ARMCOP register must occur in the last 25% of the selected period. A write during the first 75% of the selected period will reset the part. As long as all writes occur during this window, 0x0055 can be written as often as desired. As soon as 0x00AA is written after the 0x0055, the time-out logic restarts and the user must wait until the next window before writing to ARMCOP. Table 4-9 shows the exact duration of this window for the seven available COP rates. 0 Normal COP operation 1 Window COP operation COP and RTI Stop in Active BDM Mode Bit 0 Allows the COP and RTI to keep running in active BDM mode. 1 Stops the COP and RTI counters whenever the part is in active BDM mode. COP Watchdog Timer Rate Select -- These bits select the COP time-out rate (see Table 4-9). The COP time-out period is OSCCLK period divided by CR[2:0] value. Writing a nonzero value to CR[2:0] enables the COP counter and starts the time-out period. A COP counter time-out causes a system reset. This can be avoided by periodically (before time-out) reinitializing the COP counter via the ARMCOP register.
6 RSBCK 2:0 CR[2:0]
Table 4-9. COP Watchdog Rates1
CR2 0 0 0 0 1 1 1 1
1
CR1 0 0 1 1 0 0 1 1
CR0 0 1 0 1 0 1 0 1
OSCCLK Cycles to Time Out COP disabled 214 216 218 220 222 223 224
OSCCLK cycles are referenced from the previous COP time-out reset (writing 0x0055/0x00AA to the ARMCOP register)
MC9S12E128 Data Sheet, Rev. 1.07 178 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
4.3.2.10
Reserved Register (FORBYP)
NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in special modes can alter the CRG's functionality.
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-13. Reserved Register (FORBYP)
Read: always read 0x0000 except in special modes Write: only in special modes
4.3.2.11
Reserved Register (CTCTL)
NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in special test modes can alter the CRG's functionality.
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-14. Reserved Register (CTCTL)
Read: always read 0x0080 except in special modes Write: only in special modes
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 179
Chapter 4 Clocks and Reset Generator (CRGV4)
4.3.2.12
CRG COP Timer Arm/Reset Register (ARMCOP)
This register is used to restart the COP time-out period.
7 6 5 4 3 2 1 0
R W Reset
0 Bit 7 0
0 Bit 6 0
0 Bit 5 0
0 Bit 4 0
0 Bit 3 0
0 Bit 2 0
0 Bit 1 0
0 Bit 0 0
Figure 4-15. ARMCOP Register Diagram
Read: always reads 0x0000 Write: anytime When the COP is disabled (CR[2:0] = "000") writing to this register has no effect. When the COP is enabled by setting CR[2:0] nonzero, the following applies: Writing any value other than 0x0055 or 0x00AA causes a COP reset. To restart the COP time-out period you must write 0x0055 followed by a write of 0x00AA. Other instructions may be executed between these writes but the sequence (0x0055, 0x00AA) must be completed prior to COP end of time-out period to avoid a COP reset. Sequences of 0x0055 writes or sequences of 0x00AA writes are allowed. When the WCOP bit is set, 0x0055 and 0x00AA writes must be done in the last 25% of the selected time-out period; writing any value in the first 75% of the selected period will cause a COP reset.
4.4
Functional Description
This section gives detailed informations on the internal operation of the design.
4.4.1
Phase Locked Loop (PLL)
The PLL is used to run the MCU from a different time base than the incoming OSCCLK. For increased flexibility, OSCCLK can be divided in a range of 1 to 16 to generate the reference frequency. This offers a finer multiplication granularity. The PLL can multiply this reference clock by a multiple of 2, 4, 6,... 126,128 based on the SYNR register.
[ SYNR + 1 ] PLLCLK = 2 x OSCCLK x ---------------------------------[ REFDV + 1 ]
CAUTION Although it is possible to set the two dividers to command a very high clock frequency, do not exceed the specified bus frequency limit for the MCU. If (PLLSEL = 1), Bus Clock = PLLCLK / 2 The PLL is a frequency generator that operates in either acquisition mode or tracking mode, depending on the difference between the output frequency and the target frequency. The PLL can change between acquisition and tracking modes either automatically or manually.
MC9S12E128 Data Sheet, Rev. 1.07 180 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
The VCO has a minimum operating frequency, which corresponds to the self-clock mode frequency fSCM.
REFERENCE EXTAL REDUCED CONSUMPTION OSCILLATOR XTAL OSCCLK REFDV <3:0> FEEDBACK LOCK DETECTOR LOCK
REFERENCE PROGRAMMABLE DIVIDER
VDDPLL/VSSPLL PDET PHASE DETECTOR UP DOWN CPUMP VCO
CRYSTAL MONITOR
LOOP PROGRAMMABLE DIVIDER SYN <5:0>
VDDPLL LOOP FILTER XFC PIN PLLCLK
supplied by:
VDDPLL/VSSPLL VDD/VSS
Figure 4-16. PLL Functional Diagram
4.4.1.1
PLL Operation
The oscillator output clock signal (OSCCLK) is fed through the reference programmable divider and is divided in a range of 1 to 16 (REFDV+1) to output the reference clock. The VCO output clock, (PLLCLK) is fed back through the programmable loop divider and is divided in a range of 2 to 128 in increments of [2 x (SYNR +1)] to output the feedback clock. See Figure 4-16. The phase detector then compares the feedback clock, with the reference clock. Correction pulses are generated based on the phase difference between the two signals. The loop filter then slightly alters the DC voltage on the external filter capacitor connected to XFC pin, based on the width and direction of the correction pulse. The filter can make fast or slow corrections depending on its mode, as described in the next subsection. The values of the external filter network and the reference frequency determine the speed of the corrections and the stability of the PLL.
4.4.1.2
Acquisition and Tracking Modes
The lock detector compares the frequencies of the feedback clock, and the reference clock. Therefore, the speed of the lock detector is directly proportional to the final reference frequency. The circuit determines the mode of the PLL and the lock condition based on this comparison.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 181
Chapter 4 Clocks and Reset Generator (CRGV4)
The PLL filter can be manually or automatically configured into one of two possible operating modes: * Acquisition mode In acquisition mode, the filter can make large frequency corrections to the VCO. This mode is used at PLL start-up or when the PLL has suffered a severe noise hit and the VCO frequency is far off the desired frequency. When in acquisition mode, the TRACK status bit is cleared in the CRGFLG register. * Tracking mode In tracking mode, the filter makes only small corrections to the frequency of the VCO. PLL jitter is much lower in tracking mode, but the response to noise is also slower. The PLL enters tracking mode when the VCO frequency is nearly correct and the TRACK bit is set in the CRGFLG register. The PLL can change the bandwidth or operational mode of the loop filter manually or automatically. In automatic bandwidth control mode (AUTO = 1), the lock detector automatically switches between acquisition and tracking modes. Automatic bandwidth control mode also is used to determine when the PLL clock (PLLCLK) is safe to use as the source for the system and core clocks. If PLL LOCK interrupt requests are enabled, the software can wait for an interrupt request and then check the LOCK bit. If CPU interrupts are disabled, software can poll the LOCK bit continuously (during PLL start-up, usually) or at periodic intervals. In either case, only when the LOCK bit is set, is the PLLCLK clock safe to use as the source for the system and core clocks. If the PLL is selected as the source for the system and core clocks and the LOCK bit is clear, the PLL has suffered a severe noise hit and the software must take appropriate action, depending on the application. The following conditions apply when the PLL is in automatic bandwidth control mode (AUTO = 1): * The TRACK bit is a read-only indicator of the mode of the filter. * The TRACK bit is set when the VCO frequency is within a certain tolerance, trk, and is clear when the VCO frequency is out of a certain tolerance, unt. * The LOCK bit is a read-only indicator of the locked state of the PLL. * The LOCK bit is set when the VCO frequency is within a certain tolerance, Lock, and is cleared when the VCO frequency is out of a certain tolerance, unl. * CPU interrupts can occur if enabled (LOCKIE = 1) when the lock condition changes, toggling the LOCK bit. The PLL can also operate in manual mode (AUTO = 0). Manual mode is used by systems that do not require an indicator of the lock condition for proper operation. Such systems typically operate well below the maximum system frequency (fsys) and require fast start-up. The following conditions apply when in manual mode: * ACQ is a writable control bit that controls the mode of the filter. Before turning on the PLL in manual mode, the ACQ bit should be asserted to configure the filter in acquisition mode. * After turning on the PLL by setting the PLLON bit software must wait a given time (tacq) before entering tracking mode (ACQ = 0). * After entering tracking mode software must wait a given time (tal) before selecting the PLLCLK as the source for system and core clocks (PLLSEL = 1).
MC9S12E128 Data Sheet, Rev. 1.07 182 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
4.4.2
System Clocks Generator
PLLSEL or SCM WAIT(CWAI,SYSWAI), STOP PHASE LOCK LOOP PLLCLK
1 0
SYSCLK Core Clock WAIT(SYSWAI), STOP SCM WAIT(RTIWAI), STOP(PSTP,PRE), RTI enable /2 CLOCK PHASE GENERATOR Bus Clock
EXTAL OSCILLATOR OSCCLK
1
RTI
0
XTAL
WAIT(COPWAI), STOP(PSTP,PCE), COP enable Clock Monitor WAIT(SYSWAI), STOP Oscillator Clock COP
STOP(PSTP) Gating Condition = Clock Gate Oscillator Clock (running during Pseudo-Stop Mode
Figure 4-17. System Clocks Generator
The clock generator creates the clocks used in the MCU (see Figure 4-17). The gating condition placed on top of the individual clock gates indicates the dependencies of different modes (stop, wait) and the setting of the respective configuration bits. The peripheral modules use the bus clock. Some peripheral modules also use the oscillator clock. The memory blocks use the bus clock. If the MCU enters self-clock mode (see Section 4.4.7.2, "Self-Clock Mode"), oscillator clock source is switched to PLLCLK running at its minimum frequency fSCM. The bus clock is used to generate the clock visible at the ECLK pin. The core clock signal is the clock for the CPU. The core clock is twice the bus clock as shown in Figure 4-18. But note that a CPU cycle corresponds to one bus clock. PLL clock mode is selected with PLLSEL bit in the CLKSEL register. When selected, the PLL output clock drives SYSCLK for the main system including the CPU and peripherals. The PLL cannot be turned off by clearing the PLLON bit, if the PLL clock is selected. When PLLSEL is changed, it takes a maximum
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 183
Chapter 4 Clocks and Reset Generator (CRGV4)
of 4 OSCCLK plus 4 PLLCLK cycles to make the transition. During the transition, all clocks freeze and CPU activity ceases.
CORE CLOCK:
BUS CLOCK / ECLK
Figure 4-18. Core Clock and Bus Clock Relationship
4.4.3
Clock Monitor (CM)
If no OSCCLK edges are detected within a certain time, the clock monitor within the oscillator block generates a clock monitor fail event. The CRGV4 then asserts self-clock mode or generates a system reset depending on the state of SCME bit. If the clock monitor is disabled or the presence of clocks is detected no failure is indicated by the oscillator block.The clock monitor function is enabled/disabled by the CME control bit.
4.4.4
Clock Quality Checker
The clock monitor performs a coarse check on the incoming clock signal. The clock quality checker provides a more accurate check in addition to the clock monitor. A clock quality check is triggered by any of the following events: * Power-on reset (POR) * Low voltage reset (LVR) * Wake-up from full stop mode (exit full stop) * Clock monitor fail indication (CM fail) A time window of 50000 VCO clock cycles1 is called check window. A number greater equal than 4096 rising OSCCLK edges within a check window is called osc ok. Note that osc ok immediately terminates the current check window. See Figure 4-19 as an example.
1. VCO clock cycles are generated by the PLL when running at minimum frequency fSCM. MC9S12E128 Data Sheet, Rev. 1.07 184 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
check window 1 2 3 49999 50000
VCO clock OSCCLK
12345
4096 4095 osc ok
Figure 4-19. Check Window Example
The sequence for clock quality check is shown in Figure 4-20.
CM fail Clock OK POR LVR exit full stop Clock Monitor Reset Enter SCM num=0 yes no SCM active? num=50
check window
num=num+1 yes yes no SCME=1 ? no
osc ok ? yes SCM active? no
no
num<50 ?
yes
Switch to OSCCLK
Exit SCM
Figure 4-20. Sequence for Clock Quality Check
NOTE Remember that in parallel to additional actions caused by self-clock mode or clock monitor reset1 handling the clock quality checker continues to check the OSCCLK signal.
1. A Clock Monitor Reset will always set the SCME bit to logical'1'
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 185
Chapter 4 Clocks and Reset Generator (CRGV4)
NOTE The clock quality checker enables the PLL and the voltage regulator (VREG) anytime a clock check has to be performed. An ongoing clock quality check could also cause a running PLL (fSCM) and an active VREG during pseudo-stop mode or wait mode
4.4.5
Computer Operating Properly Watchdog (COP)
WAIT(COPWAI), STOP(PSTP,PCE), COP enable OSCCLK CR[2:0] 0:0:0 CR[2:0] 0:0:1
/ 16384 /4
/4 /4 /4 /2 /2 Figure 4-21. Clock Chain for COP
0:1:0
0:1:1
1:0:0
1:0:1
1:1:0
gating condition
= Clock Gate
1:1:1
COP TIMEOUT
The COP (free running watchdog timer) enables the user to check that a program is running and sequencing properly. The COP is disabled out of reset. When the COP is being used, software is responsible for keeping the COP from timing out. If the COP times out it is an indication that the software is no longer being executed in the intended sequence; thus a system reset is initiated (see Section 4.5.2, "Computer Operating Properly Watchdog (COP) Reset)." The COP runs with a gated OSCCLK (see Section Figure 4-21., "Clock Chain for COP"). Three control bits in the COPCTL register allow selection of seven COP time-out periods. When COP is enabled, the program must write 0x0055 and 0x00AA (in this order) to the ARMCOP register during the selected time-out period. As soon as this is done, the COP time-out period is restarted. If the program fails to do this and the COP times out, the part will reset. Also, if any value other than 0x0055 or 0x00AA is written, the part is immediately reset. Windowed COP operation is enabled by setting WCOP in the COPCTL register. In this mode, writes to the ARMCOP register to clear the COP timer must occur in the last 25% of the selected time-out period. A premature write will immediately reset the part. If PCE bit is set, the COP will continue to run in pseudo-stop mode.
MC9S12E128 Data Sheet, Rev. 1.07 186 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
4.4.6
Real-Time Interrupt (RTI)
The RTI can be used to generate a hardware interrupt at a fixed periodic rate. If enabled (by setting RTIE=1), this interrupt will occur at the rate selected by the RTICTL register. The RTI runs with a gated OSCCLK (see Section Figure 4-22., "Clock Chain for RTI"). At the end of the RTI time-out period the RTIF flag is set to 1 and a new RTI time-out period starts immediately. A write to the RTICTL register restarts the RTI time-out period. If the PRE bit is set, the RTI will continue to run in pseudo-stop mode.
.
WAIT(RTIWAI), STOP(PSTP,PRE), RTI enable OSCCLK
/ 1024
RTR[6:4] 0:0:0
0:0:1
/2 /2 /2 /2 /2
gating condition
= Clock Gate
0:1:0
0:1:1
1:0:0
1:0:1
1:1:0
/2
1:1:1 4-BIT MODULUS COUNTER (RTR[3:0])
RTI TIMEOUT
Figure 4-22. Clock Chain for RTI
4.4.7
4.4.7.1
Modes of Operation
Normal Mode
The CRGV4 block behaves as described within this specification in all normal modes.
4.4.7.2
Self-Clock Mode
The VCO has a minimum operating frequency, fSCM. If the external clock frequency is not available due to a failure or due to long crystal start-up time, the bus clock and the core clock are derived from the VCO
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 187
Chapter 4 Clocks and Reset Generator (CRGV4)
running at minimum operating frequency; this mode of operation is called self-clock mode. This requires CME = 1 and SCME = 1. If the MCU was clocked by the PLL clock prior to entering self-clock mode, the PLLSEL bit will be cleared. If the external clock signal has stabilized again, the CRG will automatically select OSCCLK to be the system clock and return to normal mode. See Section 4.4.4, "Clock Quality Checker" for more information on entering and leaving self-clock mode. NOTE In order to detect a potential clock loss, the CME bit should be always enabled (CME=1). If CME bit is disabled and the MCU is configured to run on PLL clock (PLLCLK), a loss of external clock (OSCCLK) will not be detected and will cause the system clock to drift towards the VCO's minimum frequency fSCM. As soon as the external clock is available again the system clock ramps up to its PLL target frequency. If the MCU is running on external clock any loss of clock will cause the system to go static.
4.4.8
Low-Power Operation in Run Mode
The RTI can be stopped by setting the associated rate select bits to 0. The COP can be stopped by setting the associated rate select bits to 0.
4.4.9
Low-Power Operation in Wait Mode
The WAI instruction puts the MCU in a low power consumption stand-by mode depending on setting of the individual bits in the CLKSEL register. All individual wait mode configuration bits can be superposed. This provides enhanced granularity in reducing the level of power consumption during wait mode. Table 4-10 lists the individual configuration bits and the parts of the MCU that are affected in wait mode.
Table 4-10. MCU Configuration During Wait Mode
PLLWAI PLL Core System RTI COP Oscillator
1
CWAI -- stopped -- -- -- --
SYSWAI -- stopped stopped -- -- --
RTIWAI -- -- -- stopped -- --
COPWAI -- -- -- -- stopped --
ROAWAI -- -- -- -- -- reduced1
stopped -- -- -- -- --
Refer to oscillator block description for availability of a reduced oscillator amplitude.
After executing the WAI instruction the core requests the CRG to switch MCU into wait mode. The CRG then checks whether the PLLWAI, CWAI and SYSWAI bits are asserted (see Figure 4-23). Depending on the configuration the CRG switches the system and core clocks to OSCCLK by clearing the PLLSEL bit, disables the PLL, disables the core clocks and finally disables the remaining system clocks. As soon as all clocks are switched off wait mode is active.
MC9S12E128 Data Sheet, Rev. 1.07 188 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
Core req's Wait Mode.
PLLWAI=1 ?
no
yes
Clear PLLSEL, Disable PLL CWAI or SYSWAI=1 ?
no
yes
Disable
core clocks
SYSWAI=1 ?
no no
Enter Wait Mode Wait Mode left due to external reset
Exit Wait w. ext.RESET
yes
Disable system clocks CME=1 ?
no
INT ?
yes
CM fail ?
yes no
yes
Exit Wait w. CMRESET
no
SCME=1 ?
yes no
Exit Wait Mode
SCMIE=1 ? Generate SCM Interrupt (Wakeup from Wait)
yes
Exit Wait Mode SCM=1 ?
no
yes
Enter SCM
Enter SCM
Continue w. normal OP
Figure 4-23. Wait Mode Entry/Exit Sequence
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 189
Chapter 4 Clocks and Reset Generator (CRGV4)
There are five different scenarios for the CRG to restart the MCU from wait mode: * External reset * Clock monitor reset * COP reset * Self-clock mode interrupt * Real-time interrupt (RTI) If the MCU gets an external reset during wait mode active, the CRG asynchronously restores all configuration bits in the register space to its default settings and starts the reset generator. After completing the reset sequence processing begins by fetching the normal reset vector. Wait mode is exited and the MCU is in run mode again. If the clock monitor is enabled (CME=1) the MCU is able to leave wait mode when loss of oscillator/external clock is detected by a clock monitor fail. If the SCME bit is not asserted the CRG generates a clock monitor fail reset (CMRESET). The CRG's behavior for CMRESET is the same compared to external reset, but another reset vector is fetched after completion of the reset sequence. If the SCME bit is asserted the CRG generates a SCM interrupt if enabled (SCMIE=1). After generating the interrupt the CRG enters self-clock mode and starts the clock quality checker (see Section 4.4.4, "Clock Quality Checker"). Then the MCU continues with normal operation.If the SCM interrupt is blocked by SCMIE = 0, the SCMIF flag will be asserted and clock quality checks will be performed but the MCU will not wake-up from wait mode. If any other interrupt source (e.g. RTI) triggers exit from wait mode the MCU immediately continues with normal operation. If the PLL has been powered-down during wait mode the PLLSEL bit is cleared and the MCU runs on OSCCLK after leaving wait mode. The software must manually set the PLLSEL bit again, in order to switch system and core clocks to the PLLCLK. If wait mode is entered from self-clock mode, the CRG will continue to check the clock quality until clock check is successful. The PLL and voltage regulator (VREG) will remain enabled. Table 4-11 summarizes the outcome of a clock loss while in wait mode.
MC9S12E128 Data Sheet, Rev. 1.07 190 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
Table 4-11. Outcome of Clock Loss in Wait Mode
CME 0 1 1 SCME X 0 1 SCMIE X X 0 Clock failure --> No action, clock loss not detected. Clock failure --> CRG performs Clock Monitor Reset immediately Clock failure --> Scenario 1: OSCCLK recovers prior to exiting Wait Mode. - MCU remains in Wait Mode, - VREG enabled, - PLL enabled, - SCM activated, - Start Clock Quality Check, - Set SCMIF interrupt flag. Some time later OSCCLK recovers. - CM no longer indicates a failure, - 4096 OSCCLK cycles later Clock Quality Check indicates clock o.k., - SCM deactivated, - PLL disabled depending on PLLWAI, - VREG remains enabled (never gets disabled in Wait Mode). - MCU remains in Wait Mode. Some time later either a wakeup interrupt occurs (no SCM interrupt) - Exit Wait Mode using OSCCLK as system clock (SYSCLK), - Continue normal operation. or an External Reset is applied. - Exit Wait Mode using OSCCLK as system clock, - Start reset sequence. Scenario 2: OSCCLK does not recover prior to exiting Wait Mode. - MCU remains in Wait Mode, - VREG enabled, - PLL enabled, - SCM activated, - Start Clock Quality Check, - Set SCMIF interrupt flag, - Keep performing Clock Quality Checks (could continue infinitely) while in Wait Mode. Some time later either a wakeup interrupt occurs (no SCM interrupt) - Exit Wait Mode in SCM using PLL clock (fSCM) as system clock, - Continue to perform additional Clock Quality Checks until OSCCLK is o.k. again. or an External RESET is applied. - Exit Wait Mode in SCM using PLL clock (fSCM) as system clock, - Start reset sequence, - Continue to perform additional Clock Quality Checks until OSCCLK is o.k.again. CRG Actions
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 191
Chapter 4 Clocks and Reset Generator (CRGV4)
Table 4-11. Outcome of Clock Loss in Wait Mode (continued)
CME 1 SCME 1 SCMIE 1 Clock failure --> - VREG enabled, - PLL enabled, - SCM activated, - Start Clock Quality Check, - SCMIF set. SCMIF generates Self-Clock Mode wakeup interrupt. - Exit Wait Mode in SCM using PLL clock (fSCM) as system clock, - Continue to perform a additional Clock Quality Checks until OSCCLK is o.k. again. CRG Actions
4.4.10
Low-Power Operation in Stop Mode
All clocks are stopped in STOP mode, dependent of the setting of the PCE, PRE and PSTP bit. The oscillator is disabled in STOP mode unless the PSTP bit is set. All counters and dividers remain frozen but do not initialize. If the PRE or PCE bits are set, the RTI or COP continues to run in pseudo-stop mode. In addition to disabling system and core clocks the CRG requests other functional units of the MCU (e.g. voltage-regulator) to enter their individual power-saving modes (if available). This is the main difference between pseudo-stop mode and wait mode. After executing the STOP instruction the core requests the CRG to switch the MCU into stop mode. If the PLLSEL bit remains set when entering stop mode, the CRG will switch the system and core clocks to OSCCLK by clearing the PLLSEL bit. Then the CRG disables the PLL, disables the core clock and finally disables the remaining system clocks. As soon as all clocks are switched off, stop mode is active. If pseudo-stop mode (PSTP = 1) is entered from self-clock mode the CRG will continue to check the clock quality until clock check is successful. The PLL and the voltage regulator (VREG) will remain enabled. If full stop mode (PSTP = 0) is entered from self-clock mode an ongoing clock quality check will be stopped. A complete timeout window check will be started when stop mode is exited again. Wake-up from stop mode also depends on the setting of the PSTP bit.
MC9S12E128 Data Sheet, Rev. 1.07 192 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4) Core req's Stop Mode. Clear PLLSEL, Disable PLL
Exit Stop w. ext.RESET
Wait Mode left due to external
Enter Stop Mode
no
INT ?
no
PSTP=1 ?
yes
CME=1 ?
no
INT ?
no
yes
yes
CM fail ?
yes no
no
Clock OK ?
Exit Stop w. CMRESET
no
SCME=1 ?
yes yes
Exit Stop w. CMRESET
yes
no
SCME=1 ?
yes
SCMIE=1 ? Generate SCM Interrupt (Wakeup from Stop)
no
Exit Stop Mode
yes
Exit Stop Mode SCM=1 ?
Exit Stop Mode
Exit Stop Mode
no
yes
Enter SCM
Enter SCM
Enter SCM
Continue w. normal OP
Figure 4-24. Stop Mode Entry/Exit Sequence
4.4.10.1
Wake-Up from Pseudo-Stop (PSTP=1)
Wake-up from pseudo-stop is the same as wake-up from wait mode. There are also three different scenarios for the CRG to restart the MCU from pseudo-stop mode: * * * External reset Clock monitor fail Wake-up interrupt
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 193
Chapter 4 Clocks and Reset Generator (CRGV4)
If the MCU gets an external reset during pseudo-stop mode active, the CRG asynchronously restores all configuration bits in the register space to its default settings and starts the reset generator. After completing the reset sequence processing begins by fetching the normal reset vector. Pseudo-stop mode is exited and the MCU is in run mode again. If the clock monitor is enabled (CME = 1) the MCU is able to leave pseudo-stop mode when loss of oscillator/external clock is detected by a clock monitor fail. If the SCME bit is not asserted the CRG generates a clock monitor fail reset (CMRESET). The CRG's behavior for CMRESET is the same compared to external reset, but another reset vector is fetched after completion of the reset sequence. If the SCME bit is asserted the CRG generates a SCM interrupt if enabled (SCMIE=1). After generating the interrupt the CRG enters self-clock mode and starts the clock quality checker (see Section 4.4.4, "Clock Quality Checker"). Then the MCU continues with normal operation. If the SCM interrupt is blocked by SCMIE = 0, the SCMIF flag will be asserted but the CRG will not wake-up from pseudo-stop mode. If any other interrupt source (e.g. RTI) triggers exit from pseudo-stop mode the MCU immediately continues with normal operation. Because the PLL has been powered-down during stop mode the PLLSEL bit is cleared and the MCU runs on OSCCLK after leaving stop mode. The software must set the PLLSEL bit again, in order to switch system and core clocks to the PLLCLK. Table 4-12 summarizes the outcome of a clock loss while in pseudo-stop mode.
MC9S12E128 Data Sheet, Rev. 1.07 194 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
Table 4-12. Outcome of Clock Loss in Pseudo-Stop Mode
CME 0 1 1 SCME X 0 1 SCMIE X X 0 Clock failure --> No action, clock loss not detected. Clock failure --> CRG performs Clock Monitor Reset immediately Clock Monitor failure --> Scenario 1: OSCCLK recovers prior to exiting Pseudo-Stop Mode. - MCU remains in Pseudo-Stop Mode, - VREG enabled, - PLL enabled, - SCM activated, - Start Clock Quality Check, - Set SCMIF interrupt flag. Some time later OSCCLK recovers. - CM no longer indicates a failure, - 4096 OSCCLK cycles later Clock Quality Check indicates clock o.k., - SCM deactivated, - PLL disabled, - VREG disabled. - MCU remains in Pseudo-Stop Mode. Some time later either a wakeup interrupt occurs (no SCM interrupt) - Exit Pseudo-Stop Mode using OSCCLK as system clock (SYSCLK), - Continue normal operation. or an External Reset is applied. - Exit Pseudo-Stop Mode using OSCCLK as system clock, - Start reset sequence. Scenario 2: OSCCLK does not recover prior to exiting Pseudo-Stop Mode. - MCU remains in Pseudo-Stop Mode, - VREG enabled, - PLL enabled, - SCM activated, - Start Clock Quality Check, - Set SCMIF interrupt flag, - Keep performing Clock Quality Checks (could continue infinitely) while in Pseudo-Stop Mode. Some time later either a wakeup interrupt occurs (no SCM interrupt) - Exit Pseudo-Stop Mode in SCM using PLL clock (fSCM) as system clock - Continue to perform additional Clock Quality Checks until OSCCLK is o.k. again. or an External RESET is applied. - Exit Pseudo-Stop Mode in SCM using PLL clock (fSCM) as system clock - Start reset sequence, - Continue to perform additional Clock Quality Checks until OSCCLK is o.k.again. CRG Actions
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 195
Chapter 4 Clocks and Reset Generator (CRGV4)
Table 4-12. Outcome of Clock Loss in Pseudo-Stop Mode (continued)
CME 1 SCME 1 SCMIE 1 Clock failure --> - VREG enabled, - PLL enabled, - SCM activated, - Start Clock Quality Check, - SCMIF set. SCMIF generates Self-Clock Mode wakeup interrupt. - Exit Pseudo-Stop Mode in SCM using PLL clock (fSCM) as system clock, - Continue to perform a additional Clock Quality Checks until OSCCLK is o.k. again. CRG Actions
4.4.10.2
Wake-up from Full Stop (PSTP=0)
The MCU requires an external interrupt or an external reset in order to wake-up from stop mode. If the MCU gets an external reset during full stop mode active, the CRG asynchronously restores all configuration bits in the register space to its default settings and will perform a maximum of 50 clock check_windows (see Section 4.4.4, "Clock Quality Checker"). After completing the clock quality check the CRG starts the reset generator. After completing the reset sequence processing begins by fetching the normal reset vector. Full stop mode is exited and the MCU is in run mode again. If the MCU is woken-up by an interrupt, the CRG will also perform a maximum of 50 clock check_windows (see Section 4.4.4, "Clock Quality Checker"). If the clock quality check is successful, the CRG will release all system and core clocks and will continue with normal operation. If all clock checks within the timeout-window are failing, the CRG will switch to self-clock mode or generate a clock monitor reset (CMRESET) depending on the setting of the SCME bit. Because the PLL has been powered-down during stop mode the PLLSEL bit is cleared and the MCU runs on OSCCLK after leaving stop mode. The software must manually set the PLLSEL bit again, in order to switch system and core clocks to the PLLCLK. NOTE In full stop mode, the clock monitor is disabled and any loss of clock will not be detected.
4.5
Resets
This section describes how to reset the CRGV4 and how the CRGV4 itself controls the reset of the MCU. It explains all special reset requirements. Because the reset generator for the MCU is part of the CRG, this section also describes all automatic actions that occur during or as a result of individual reset conditions. The reset values of registers and signals are provided in Section 4.3, "Memory Map and Register
MC9S12E128 Data Sheet, Rev. 1.07 196 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
Definition." All reset sources are listed in Table 4-13. Refer to the device overview chapter for related vector addresses and priorities.
Table 4-13. Reset Summary
Reset Source Power-on Reset Low Voltage Reset External Reset Clock Monitor Reset COP Watchdog Reset Local Enable None None None PLLCTL (CME=1, SCME=0) COPCTL (CR[2:0] nonzero)
The reset sequence is initiated by any of the following events: * * * * * Low level is detected at the RESET pin (external reset). Power on is detected. Low voltage is detected. COP watchdog times out. Clock monitor failure is detected and self-clock mode was disabled (SCME = 0).
Upon detection of any reset event, an internal circuit drives the RESET pin low for 128 SYSCLK cycles (see Figure 4-25). Because entry into reset is asynchronous it does not require a running SYSCLK. However, the internal reset circuit of the CRGV4 cannot sequence out of current reset condition without a running SYSCLK. The number of 128 SYSCLK cycles might be increased by n = 3 to 6 additional SYSCLK cycles depending on the internal synchronization latency. After 128+n SYSCLK cycles the RESET pin is released. The reset generator of the CRGV4 waits for additional 64 SYSCLK cycles and then samples the RESET pin to determine the originating source. Table 4-14 shows which vector will be fetched.
Table 4-14. Reset Vector Selection
Sampled RESET Pin (64 Cycles After Release) 1 1 1 0 Clock Monitor Reset Pending 0 1 0 X COP Reset Pending 0 X 1 X Vector Fetch POR / LVR / External Reset Clock Monitor Reset COP Reset POR / LVR / External Reset with rise of RESET pin
NOTE External circuitry connected to the RESET pin should not include a large capacitance that would interfere with the ability of this signal to rise to a valid logic 1 within 64 SYSCLK cycles after the low drive is released.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 197
Chapter 4 Clocks and Reset Generator (CRGV4)
The internal reset of the MCU remains asserted while the reset generator completes the 192 SYSCLK long reset sequence. The reset generator circuitry always makes sure the internal reset is deasserted synchronously after completion of the 192 SYSCLK cycles. In case the RESET pin is externally driven low for more than these 192 SYSCLK cycles (external reset), the internal reset remains asserted too.
RESET )( )(
RESET pin released
CRG drives RESET pin low
SYSCLK
) ( 128+n cycles
possibly SYSCLK not running with n being min 3 / max 6 cycles depending on internal synchronization delay
) ( 64 cycles
) (
possibly RESET driven low externally
Figure 4-25. RESET Timing
4.5.1
* * *
Clock Monitor Reset
Clock monitor is enabled (CME=1) Loss of clock is detected Self-clock mode is disabled (SCME=0)
The CRGV4 generates a clock monitor reset in case all of the following conditions are true:
The reset event asynchronously forces the configuration registers to their default settings (see Section 4.3, "Memory Map and Register Definition"). In detail the CME and the SCME are reset to logical `1' (which doesn't change the state of the CME bit, because it has already been set). As a consequence, the CRG immediately enters self-clock mode and starts its internal reset sequence. In parallel the clock quality check starts. As soon as clock quality check indicates a valid oscillator clock the CRG switches to OSCCLK and leaves self-clock mode. Because the clock quality checker is running in parallel to the reset generator, the CRG may leave self-clock mode while completing the internal reset sequence. When the reset sequence is finished the CRG checks the internally latched state of the clock monitor fail circuit. If a clock monitor fail is indicated processing begins by fetching the clock monitor reset vector.
4.5.2
Computer Operating Properly Watchdog (COP) Reset
When COP is enabled, the CRG expects sequential write of 0x0055 and 0x00AA (in this order) to the ARMCOP register during the selected time-out period. As soon as this is done, the COP time-out period restarts. If the program fails to do this the CRG will generate a reset. Also, if any value other than 0x0055 or 0x00AA is written, the CRG immediately generates a reset. In case windowed COP operation is enabled
MC9S12E128 Data Sheet, Rev. 1.07 198 Freescale Semiconductor
Chapter 4 Clocks and Reset Generator (CRGV4)
writes (0x0055 or 0x00AA) to the ARMCOP register must occur in the last 25% of the selected time-out period. A premature write the CRG will immediately generate a reset. As soon as the reset sequence is completed the reset generator checks the reset condition. If no clock monitor failure is indicated and the latched state of the COP timeout is true, processing begins by fetching the COP vector.
4.5.3
Power-On Reset, Low Voltage Reset
The on-chip voltage regulator detects when VDD to the MCU has reached a certain level and asserts power-on reset or low voltage reset or both. As soon as a power-on reset or low voltage reset is triggered the CRG performs a quality check on the incoming clock signal. As soon as clock quality check indicates a valid oscillator clock signal the reset sequence starts using the oscillator clock. If after 50 check windows the clock quality check indicated a non-valid oscillator clock the reset sequence starts using self-clock mode. Figure 4-26 and Figure 4-27 show the power-up sequence for cases when the RESET pin is tied to VDD and when the RESET pin is held low.
RESET
Clock Quality Check (no Self-Clock Mode) )(
Internal POR )( 128 SYSCLK Internal RESET )( 64 SYSCLK
Figure 4-26. RESET Pin Tied to VDD (by a Pull-Up Resistor)
RESET
Clock Quality Check (no Self-Clock Mode) )(
Internal POR )( 128 SYSCLK Internal RESET )( 64 SYSCLK
Figure 4-27. RESET Pin Held Low Externally
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 199
Chapter 4 Clocks and Reset Generator (CRGV4)
4.6
Interrupts
The interrupts/reset vectors requested by the CRG are listed in Table 4-15. Refer to the device overview chapter for related vector addresses and priorities.
Table 4-15. CRG Interrupt Vectors
Interrupt Source Real-time interrupt LOCK interrupt SCM interrupt CCR Mask I bit I bit I bit Local Enable CRGINT (RTIE) CRGINT (LOCKIE) CRGINT (SCMIE)
4.6.1
Real-Time Interrupt
The CRGV4 generates a real-time interrupt when the selected interrupt time period elapses. RTI interrupts are locally disabled by setting the RTIE bit to 0. The real-time interrupt flag (RTIF) is set to 1 when a timeout occurs, and is cleared to 0 by writing a 1 to the RTIF bit. The RTI continues to run during pseudo-stop mode if the PRE bit is set to 1. This feature can be used for periodic wakeup from pseudo-stop if the RTI interrupt is enabled.
4.6.2
PLL Lock Interrupt
The CRGV4 generates a PLL lock interrupt when the LOCK condition of the PLL has changed, either from a locked state to an unlocked state or vice versa. Lock interrupts are locally disabled by setting the LOCKIE bit to 0. The PLL Lock interrupt flag (LOCKIF) is set to1 when the LOCK condition has changed, and is cleared to 0 by writing a 1 to the LOCKIF bit.
4.6.3
Self-Clock Mode Interrupt
The CRGV4 generates a self-clock mode interrupt when the SCM condition of the system has changed, either entered or exited self-clock mode. SCM conditions can only change if the self-clock mode enable bit (SCME) is set to 1. SCM conditions are caused by a failing clock quality check after power-on reset (POR) or low voltage reset (LVR) or recovery from full stop mode (PSTP = 0) or clock monitor failure. For details on the clock quality check refer to Section 4.4.4, "Clock Quality Checker." If the clock monitor is enabled (CME = 1) a loss of external clock will also cause a SCM condition (SCME = 1). SCM interrupts are locally disabled by setting the SCMIE bit to 0. The SCM interrupt flag (SCMIF) is set to 1 when the SCM condition has changed, and is cleared to 0 by writing a 1 to the SCMIF bit.
MC9S12E128 Data Sheet, Rev. 1.07 200 Freescale Semiconductor
Chapter 5 Oscillator (OSCV2)
5.1 Introduction
The OSCV2 module provides two alternative oscillator concepts: * A low noise and low power Colpitts oscillator with amplitude limitation control (ALC) * A robust full swing Pierce oscillator with the possibility to feed in an external square wave
5.1.1
Features
The Colpitts OSCV2 option provides the following features: * Amplitude limitation control (ALC) loop: -- Low power consumption and low current induced RF emission -- Sinusoidal waveform with low RF emission -- Low crystal stress (an external damping resistor is not required) -- Normal and low amplitude mode for further reduction of power and emission * An external biasing resistor is not required The Pierce OSC option provides the following features: * Wider high frequency operation range * No DC voltage applied across the crystal * Full rail-to-rail (2.5 V nominal) swing oscillation with low EM susceptibility * Fast start up Common features: * Clock monitor (CM) * Operation from the VDDPLL 2.5 V (nominal) supply rail
5.1.2
Modes of Operation
Two modes of operation exist: * Amplitude limitation controlled Colpitts oscillator mode suitable for power and emission critical applications * Full swing Pierce oscillator mode that can also be used to feed in an externally generated square wave suitable for high frequency operation and harsh environments
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 201
Chapter 5 Oscillator (OSCV2)
5.2
External Signal Description
This section lists and describes the signals that connect off chip.
5.2.1
VDDPLL and VSSPLL -- PLL Operating Voltage, PLL Ground
These pins provide the operating voltage (VDDPLL) and ground (VSSPLL) for the OSCV2 circuitry. This allows the supply voltage to the OSCV2 to be independently bypassed.
5.2.2
EXTAL and XTAL -- Clock/Crystal Source Pins
These pins provide the interface for either a crystal or a CMOS compatible clock to control the internal clock generator circuitry. EXTAL is the external clock input or the input to the crystal oscillator amplifier. XTAL is the output of the crystal oscillator amplifier. All the MCU internal system clocks are derived from the EXTAL input frequency. In full stop mode (PSTP = 0) the EXTAL pin is pulled down by an internal resistor of typical 200 k. NOTE Freescale Semiconductor recommends an evaluation of the application board and chosen resonator or crystal by the resonator or crystal supplier. The Crystal circuit is changed from standard. The Colpitts circuit is not suited for overtone resonators and crystals.
EXTAL CDC* MCU XTAL C2 VSSPLL * Due to the nature of a translated ground Colpitts oscillator a DC voltage bias is applied to the crystal. Please contact the crystal manufacturer for crystal DC bias conditions and recommended capacitor value CDC. C1 Crystal or Ceramic Resonator
Figure 5-1. Colpitts Oscillator Connections (XCLKS = 0)
NOTE The Pierce circuit is not suited for overtone resonators and crystals without a careful component selection.
MC9S12E128 Data Sheet, Rev. 1.07 202 Freescale Semiconductor
Chapter 5 Oscillator (OSCV2)
EXTAL MCU RS* XTAL C4 VSSPLL * Rs can be zero (shorted) when used with higher frequency crystals. Refer to manufacturer's data. C3 Crystal or Ceramic Resonator
RB
Figure 5-2. Pierce Oscillator Connections (XCLKS = 1)
EXTAL MCU XTAL
CMOS-Compatible External Oscillator (VDDPLL Level)
Not Connected
Figure 5-3. External Clock Connections (XCLKS = 1)
5.2.3
XCLKS -- Colpitts/Pierce Oscillator Selection Signal
The XCLKS is an input signal which controls whether a crystal in combination with the internal Colpitts (low power) oscillator is used or whether the Pierce oscillator/external clock circuitry is used. The XCLKS signal is sampled during reset with the rising edge of RESET. Table 5-1 lists the state coding of the sampled XCLKS signal. Refer to the device overview chapter for polarity of the XCLKS pin.
Table 5-1. Clock Selection Based on XCLKS XCLKS
0 1
Description
Colpitts oscillator selected Pierce oscillator/external clock selected
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 203
Chapter 5 Oscillator (OSCV2)
5.3
Memory Map and Register Definition
The CRG contains the registers and associated bits for controlling and monitoring the OSCV2 module.
5.4
Functional Description
The OSCV2 block has two external pins, EXTAL and XTAL. The oscillator input pin, EXTAL, is intended to be connected to either a crystal or an external clock source. The selection of Colpitts oscillator or Pierce oscillator/external clock depends on the XCLKS signal which is sampled during reset. The XTAL pin is an output signal that provides crystal circuit feedback. A buffered EXTAL signal, OSCCLK, becomes the internal reference clock. To improve noise immunity, the oscillator is powered by the VDDPLL and VSSPLL power supply pins. The Pierce oscillator can be used for higher frequencies compared to the low power Colpitts oscillator.
5.4.1
Amplitude Limitation Control (ALC)
The Colpitts oscillator is equipped with a feedback system which does not waste current by generating harmonics. Its configuration is "Colpitts oscillator with translated ground." The transconductor used is driven by a current source under the control of a peak detector which will measure the amplitude of the AC signal appearing on EXTAL node in order to implement an amplitude limitation control (ALC) loop. The ALC loop is in charge of reducing the quiescent current in the transconductor as a result of an increase in the oscillation amplitude. The oscillation amplitude can be limited to two values. The normal amplitude which is intended for non power saving modes and a small amplitude which is intended for low power operation modes. Please refer to the CRG block description chapter for the control and assignment of the amplitude value to operation modes.
5.4.2
Clock Monitor (CM)
The clock monitor circuit is based on an internal resistor-capacitor (RC) time delay so that it can operate without any MCU clocks. If no OSCCLK edges are detected within this RC time delay, the clock monitor indicates a failure which asserts self clock mode or generates a system reset depending on the state of SCME bit. If the clock monitor is disabled or the presence of clocks is detected no failure is indicated.The clock monitor function is enabled/disabled by the CME control bit, described in the CRG block description chapter.
5.5
Interrupts
OSCV2 contains a clock monitor, which can trigger an interrupt or reset. The control bits and status bits for the clock monitor are described in the CRG block description chapter.
MC9S12E128 Data Sheet, Rev. 1.07 204 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.1 Introduction
The ATD10B16C is a 16-channel, 10-bit, multiplexed input successive approximation analog-to-digital converter. Refer to the Electrical Specifications chapter for ATD accuracy.
6.1.1
* * * * * * * * * * * *
Features
8-/10-bit resolution 7 s, 10-bit single conversion time Sample buffer amplifier Programmable sample time Left/right justified, signed/unsigned result data External trigger control Conversion completion interrupt generation Analog input multiplexer for 16 analog input channels Analog/digital input pin multiplexing 1 to 16 conversion sequence lengths Continuous conversion mode Multiple channel scans
6.1.2
Modes of Operation
There is software programmable selection between performing single or continuous conversion on a single channel or multiple channels.
6.1.3
Block Diagram
Refer to Figure 6-1 for a block diagram of the ATD0B16C block.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 205
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Bus Clock
Clock Prescaler
ATD clock
ATD10B16C
Mode and Timing Control
Sequence Complete Interrupt
ATDDIEN
VDDA VSSA VRH VRL AN15 AN14 AN13 AN12 AN11 AN10 AN9 AN8 Analog MUX
PORTAD Successive Approximation Register (SAR) and DAC
Results ATD 0 ATD 1 ATD 2 ATD 3 ATD 4 ATD 5 ATD 6 ATD 7 ATD 8 ATD 9 ATD 10 ATD 11 ATD 12 ATD 13 ATD 14 ATD 15
+ Sample & Hold 1 1 Comparator
AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0
Figure 6-1. ATD10B16C Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 206 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.2
External Signal Description
This section lists all inputs to the ATD10B16C block.
6.2.1
AN15/ETRIG -- Analog Input Channel 15 / External trigger Pin
This pin serves as the analog input channel 15. It can also be configured as general-purpose digital input and/or external trigger for the ATD conversion.
6.2.2
ANx (x = 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) -- Analog Input Channel x Pins
This pin serves as the analog input channel x. It can also be configured as general-purpose digital input .
6.2.3
VRH, VRL -- High Reference Voltage Pin, Low Reference Voltage Pin
VRH is the high reference voltage, VRL is the low reference voltage for ATD conversion.
6.2.4
VDDA, VSSA -- Analog Circuitry Power Supply Pins
These pins are the power supplies for the analog circuitry of the ATD10B16CV2 block.
6.3
Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the ATD10B16C.
6.3.1
Module Memory Map
Table 6-1 gives an overview of all ATD10B16C registers
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 207
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
.
Table 6-1. ATD10B16CV2 Memory Map
Address Offset 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 0x000A 0x000B 0x000C 0x000D 0x000E 0x000F 0x0010, 0x0011 0x0012, 0x0013 0x0014, 0x0015 0x0016, 0x0017 0x0018, 0x0019 0x001A, 0x001B 0x001C, 0x001D 0x001E, 0x001F 0x0020, 0x0021 0x0022, 0x0023 0x0024, 0x0025 0x0026, 0x0027 0x0028, 0x0029 0x002A, 0x002B 0x002C, 0x002D 0x002E, 0x002F
1 2
Use ATD Control Register 0 (ATDCTL0) ATD Control Register 1 (ATDCTL1)
1 2
Access R/W R/W R/W R/W R/W R/W R/W R R/W R R R/W R/W R R R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
ATD Control Register 2 (ATDCTL2) ATD Control Register 3 (ATDCTL3) ATD Control Register 4 (ATDCTL4) ATD Control Register 5 (ATDCTL5) ATD Status Register 0 (ATDSTAT0) Unimplemented ATD Test Register 0 (ATDTEST0)3 ATD Test Register 1 (ATDTEST1) ATD Status Register 2 (ATDSTAT2) ATD Status Register 1 (ATDSTAT1) ATD Input Enable Register 0 (ATDDIEN0) ATD Input Enable Register 1 (ATDDIEN1) Port Data Register 0 (PORTAD0) Port Data Register 1 (PORTAD1) ATD Result Register 0 (ATDDR0H, ATDDR0L) ATD Result Register 1 (ATDDR1H, ATDDR1L) ATD Result Register 2 (ATDDR2H, ATDDR2L) ATD Result Register 3 (ATDDR3H, ATDDR3L) ATD Result Register 4 (ATDDR4H, ATDDR4L) ATD Result Register 5 (ATDDR5H, ATDDR5L) ATD Result Register 6 (ATDDR6H, ATDDR6L) ATD Result Register 7 (ATDDR7H, ATDDR7L) ATD Result Register 8 (ATDDR8H, ATDDR8L) ATD Result Register 9 (ATDDR9H, ATDDR9L) ATD Result Register 10 (ATDDR10H, ATDDR10L) ATD Result Register 11 (ATDDR11H, ATDDR11L) ATD Result Register 12 (ATDDR12H, ATDDR12L) ATD Result Register 13 (ATDDR13H, ATDDR13L) ATD Result Register 14 (ATDDR14H, ATDDR14L) ATD Result Register 15 (ATDDR15H, ATDDR15L)
ATDCTL0 is intended for factory test purposes only. ATDCTL1 is intended for factory test purposes only. 3 ATDTEST0 is intended for factory test purposes only.
NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level.
MC9S12E128 Data Sheet, Rev. 1.07 208 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2
Register Descriptions
This section describes in address order all the ATD10B16C registers and their individual bits.
Register Name 0x0000 ATDCTL0 R W R W R W R W R W R W R W R W R W R W R W R W R W IEN15 IEN14 IEN13 IEN12 IEN11 IEN10 IEN9 IEN8 CCF7 CCF6 CCF5 CCF4 CCF3 CCF2 CCF1 CCF0 CCF15 CCF14 CCF13 CCF12 CCF11 CCF10 CCF9 Unimplemented SC CCF8 Unimplemented SRES8 ADPU 0 AFFC AWAI ETRIGLE ETRIGP ETRIGE ASCIE ASCIF 0 0 0 0 0 0 0 0 Bit 7 0 6 0 5 0 4 0 3 0 2 0 1 0 Bit 0 0
0x0001 ATDCTL1 0x0002 ATDCTL2 0x0003 ATDCTL3 0x0004 ATDCTL4 0x0005 ATDCTL5 0x0006 ATDSTAT0 0x0007 Unimplemented 0x0008 ATDTEST0 0x0009 ATDTEST1 0x000A ATDSTAT2 0x000B ATDSTAT1 0x000C ATDDIEN0
S8C
S4C
S2C
S1C
FIFO
FRZ1
FRZ0
SMP1
SMP0
PRS4
PRS3
PRS2
PRS1
PRS0
DJM
DSGN 0
SCAN
MULT
CD CC3
CC CC2
CB CC1
CA CC0
SCF
ETORF
FIFOR
= Unimplemented or Reserved
u = Unaffected
Figure 6-2. ATD Register Summary
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 209
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Register Name 0x000D ATDDIEN1 0x000E PORTAD0 0x000F PORTAD1 R W R W R W
Bit 7 IEN7 PTAD15
6 IEN6 PTAD14
5 IEN5 PTAD13
4 IEN4 PTAD12
3 IEN3 PTAD11
2 IEN2 PTAD10
1 IEN1 PTAD9
Bit 0 IEN0 PTAD8
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
R BIT 9 MSB BIT 7 MSB 0x0010-0x002F W ATDDRxH- ATDDRxL R W
BIT 8 BIT 6
BIT 7 BIT 5
BIT 6 BIT 4
BIT 5 BIT 3
BIT 4 BIT 2
BIT 3 BIT 1
BIT 2 BIT 0
BIT 1 u
BIT 0 u
0 0
0 0
0 0
0 0
0 0
0 0
= Unimplemented or Reserved
u = Unaffected
Figure 6-2. ATD Register Summary (continued)
6.3.2.1
Reserved Register (ATDCTL0)
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
= Unimplemented or Reserved
Figure 6-3. Reserved Register (ATDCTL0)
Read: always read $00 in normal modes Write: unimplemented in normal modes
6.3.2.2
Reserved Register (ATDCTL1)
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
= Unimplemented or Reserved
Figure 6-4. Reserved Register (ATDCTL1)
MC9S12E128 Data Sheet, Rev. 1.07 210 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Read: always read $00 in normal modes Write: unimplemented in normal modes
6.3.2.3
ATD Control Register 2 (ATDCTL2)
This register controls power down, interrupt and external trigger. Writes to this register will abort current conversion sequence but will not start a new sequence.
7 6 5 4 3 2 1 0
R ADPU W Reset 0 0 0 0 0 0 0 AFFC AWAI ETRIGLE ETRIGP ETRIGE ASCIE
ASCIF
0
= Unimplemented or Reserved
Figure 6-5. ATD Control Register 2 (ATDCTL2)
Read: Anytime Write: Anytime
Table 6-2. ATDCTL2 Field Descriptions
Field 7 ADPU Description ATD Power Down -- This bit provides on/off control over the ATD10B16C block allowing reduced MCU power consumption. Because analog electronic is turned off when powered down, the ATD requires a recovery time period after ADPU bit is enabled. 0 Power down ATD 1 Normal ATD functionality ATD Fast Flag Clear All 0 ATD flag clearing operates normally (read the status register ATDSTAT1 before reading the result register to clear the associate CCF flag). 1 Changes all ATD conversion complete flags to a fast clear sequence. Any access to a result register will cause the associate CCF flag to clear automatically. ATD Power Down in Wait Mode -- When entering Wait Mode this bit provides on/off control over the ATD10B16C block allowing reduced MCU power. Because analog electronic is turned off when powered down, the ATD requires a recovery time period after exit from Wait mode. 0 ATD continues to run in Wait mode 1 Halt conversion and power down ATD during Wait mode After exiting Wait mode with an interrupt conversion will resume. But due to the recovery time the result of this conversion should be ignored. External Trigger Level/Edge Control -- This bit controls the sensitivity of the external trigger signal. See Table 6-3 for details. External Trigger Polarity -- This bit controls the polarity of the external trigger signal. See Table 6-3 for details. External Trigger Mode Enable -- This bit enables the external trigger on ATD channel 15. The external trigger allows to synchronize the start of conversion with external events. 0 Disable external trigger 1 Enable external trigger
6 AFFC
5 AWAI
4 ETRIGLE 3 ETRIGP 2 ETRIGE
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 211
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Table 6-2. ATDCTL2 Field Descriptions (continued)
Field 1 ASCIE 0 ASCIF Description ATD Sequence Complete Interrupt Enable 0 ATD Sequence Complete interrupt requests are disabled. 1 ATD Interrupt will be requested whenever ASCIF = 1 is set. ATD Sequence Complete Interrupt Flag -- If ASCIE = 1 the ASCIF flag equals the SCF flag (see Section 6.3.2.7, "ATD Status Register 0 (ATDSTAT0)"), else ASCIF reads zero. Writes have no effect. 0 No ATD interrupt occurred 1 ATD sequence complete interrupt pending
Table 6-3. External Trigger Configurations
ETRIGLE 0 0 1 1 ETRIGP 0 1 0 1 External Trigger Sensitivity Falling Edge Ring Edge Low Level High Level
MC9S12E128 Data Sheet, Rev. 1.07 212 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.4
ATD Control Register 3 (ATDCTL3)
This register controls the conversion sequence length, FIFO for results registers and behavior in Freeze Mode. Writes to this register will abort current conversion sequence but will not start a new sequence.
7 6 5 4 3 2 1 0
R W Reset
0 S8C 0 0 S4C 1 S2C 0 S1C 0 FIFO 0 FRZ1 0 FRZ0 0
= Unimplemented or Reserved
Figure 6-6. ATD Control Register 3 (ATDCTL3)
Read: Anytime Write: Anytime
Table 6-4. ATDCTL3 Field Descriptions
Field 6 S8C 5 S4C 4 S2C 3 S1C Description Conversion Sequence Length -- This bit controls the number of conversions per sequence. Table 6-5 shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12 Family. Conversion Sequence Length -- This bit controls the number of conversions per sequence. Table 6-5 shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12 Family. Conversion Sequence Length -- This bit controls the number of conversions per sequence. Table 6-5 shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12 Family. Conversion Sequence Length -- This bit controls the number of conversions per sequence. Table 6-5 shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12 Family.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 213
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Table 6-4. ATDCTL3 Field Descriptions (continued)
Field 2 FIFO Description Result Register FIFO Mode --If this bit is zero (non-FIFO mode), the A/D conversion results map into the result registers based on the conversion sequence; the result of the first conversion appears in the first result register, the second result in the second result register, and so on. If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or ending of a conversion sequence; sequential conversion results are placed in consecutive result registers. In a continuously scanning conversion sequence, the result register counter will wrap around when it reaches the end of the result register file. The conversion counter value (CC3-0 in ATDSTAT0) can be used to determine where in the result register file, the current conversion result will be placed. Aborting a conversion or starting a new conversion by write to an ATDCTL register (ATDCTL5-0) clears the conversion counter even if FIFO=1. So the first result of a new conversion sequence, started by writing to ATDCTL5, will always be place in the first result register (ATDDDR0). Intended usage of FIFO mode is continuos conversion (SCAN=1) or triggered conversion (ETRIG=1). Finally, which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear mode may or may not be useful in a particular application to track valid data. 0 Conversion results are placed in the corresponding result register up to the selected sequence length. 1 Conversion results are placed in consecutive result registers (wrap around at end). Background Debug Freeze Enable -- When debugging an application, it is useful in many cases to have the ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond to a breakpoint as shown in Table 6-6. Leakage onto the storage node and comparator reference capacitors may compromise the accuracy of an immediately frozen conversion depending on the length of the freeze period.
1:0 FRZ[1:0]
Table 6-5. Conversion Sequence Length Coding
S8C 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 S4C 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 S2C 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 S1C 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Number of Conversions per Sequence 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
MC9S12E128 Data Sheet, Rev. 1.07 214 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Table 6-6. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1 0 0 1 1 FRZ0 0 1 0 1 Behavior in Freeze Mode Continue conversion Reserved Finish current conversion, then freeze Freeze Immediately
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 215
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.5
ATD Control Register 4 (ATDCTL4)
This register selects the conversion clock frequency, the length of the second phase of the sample time and the resolution of the A/D conversion (i.e., 8-bits or 10-bits). Writes to this register will abort current conversion sequence but will not start a new sequence.
7 6 5 4 3 2 1 0
R SRES8 W Reset 0 0 0 0 0 1 0 1 SMP1 SMP0 PRS4 PRS3 PRS2 PRS1 PRS0
Figure 6-7. ATD Control Register 4 (ATDCTL4)
Read: Anytime Write: Anytime
Table 6-7. ATDCTL4 Field Descriptions
Field 7 SRES8 Description A/D Resolution Select -- This bit selects the resolution of A/D conversion results as either 8 or 10 bits. The A/D converter has an accuracy of 10 bits. However, if low resolution is required, the conversion can be speeded up by selecting 8-bit resolution. 0 10 bit resolution 1 8 bit resolution Sample Time Select --These two bits select the length of the second phase of the sample time in units of ATD conversion clock cycles. Note that the ATD conversion clock period is itself a function of the prescaler value (bits PRS4-0). The sample time consists of two phases. The first phase is two ATD conversion clock cycles long and transfers the sample quickly (via the buffer amplifier) onto the A/D machine's storage node. The second phase attaches the external analog signal directly to the storage node for final charging and high accuracy. Table 6-8 lists the lengths available for the second sample phase. ATD Clock Prescaler -- These 5 bits are the binary value prescaler value PRS. The ATD conversion clock frequency is calculated as follows: [ BusClock ] ATDclock = ------------------------------- x 0.5 [ PRS + 1 ] Note: The maximum ATD conversion clock frequency is half the bus clock. The default (after reset) prescaler value is 5 which results in a default ATD conversion clock frequency that is bus clock divided by 12. Table 6-9 illustrates the divide-by operation and the appropriate range of the bus clock.
6:5 SMP[1:0]
4:0 PRS[4:0]
Table 6-8. Sample Time Select
SMP1 0 0 1 1 SMP0 0 1 0 1 Length of 2nd Phase of Sample Time 2 A/D conversion clock periods 4 A/D conversion clock periods 8 A/D conversion clock periods 16 A/D conversion clock periods
MC9S12E128 Data Sheet, Rev. 1.07 216 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Table 6-9. Clock Prescaler Values
Prescale Value 00000 00001 00010 00011 00100 00101 00110 00111 01000 01001 01010 01011 01100 01101 01110 01111 10000 10001 10010 10011 10100 10101 10110 10111 11000 11001 11010 11011 11100 11101 11110 11111
1
Total Divisor Value Divide by 2 Divide by 4 Divide by 6 Divide by 8 Divide by 10 Divide by 12 Divide by 14 Divide by 16 Divide by 18 Divide by 20 Divide by 22 Divide by 24 Divide by 26 Divide by 28 Divide by 30 Divide by 32 Divide by 34 Divide by 36 Divide by 38 Divide by 40 Divide by 42 Divide by 44 Divide by 46 Divide by 48 Divide by 50 Divide by 52 Divide by 54 Divide by 56 Divide by 58 Divide by 60 Divide by 62 Divide by 64
Max. Bus Clock1 4 MHz 8 MHz 12 MHz 16 MHz 20 MHz 24 MHz 28 MHz 32 MHz 36 MHz 40 MHz 44 MHz 48 MHz 52 MHz 56 MHz 60 MHz 64 MHz 68 MHz 72 MHz 76 MHz 80 MHz 84 MHz 88 MHz 92 MHz 96 MHz 100 MHz 104 MHz 108 MHz 112 MHz 116 MHz 120 MHz 124 MHz 128 MHz
Min. Bus Clock2 1 MHz 2 MHz 3 MHz 4 MHz 5 MHz 6 MHz 7 MHz 8 MHz 9 MHz 10 MHz 11 MHz 12 MHz 13 MHz 14 MHz 15 MHz 16 MHz 17 MHz 18 MHz 19 MHz 20 MHz 21 MHz 22 MHz 23 MHz 24 MHz 25 MHz 26 MHz 27 MHz 28 MHz 29 MHz 30 MHz 31 MHz 32 MHz
Maximum ATD conversion clock frequency is 2 MHz. The maximum allowed bus clock frequency is shown in this column. 2 Minimum ATD conversion clock frequency is 500 kHz. The minimum allowed bus clock frequency is shown in this column.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 217
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.6
ATD Control Register 5 (ATDCTL5)
This register selects the type of conversion sequence and the analog input channels sampled. Writes to this register will abort current conversion sequence and start a new conversion sequence. If external trigger is enabled (ETRIGE = 1) an initial write to ATDCTL5 is required to allow starting of a conversion sequence which will then occur on each trigger event. Start of conversion means the beginning of the sampling phase.
7 6 5 4 3 2 1 0
R DJM W Reset 0 0 0 0 0 0 0 0 DSGN SCAN MULT CD CC CB CA
Figure 6-8. ATD Control Register 5 (ATDCTL5)
Read: Anytime Write: Anytime
Table 6-10. ATDCTL5 Field Descriptions
Field 7 DJM Description Result Register Data Justification -- This bit controls justification of conversion data in the result registers. See Section 6.3.2.16, "ATD Conversion Result Registers (ATDDRx)" for details. 0 Left justified data in the result registers. 1 Right justified data in the result registers. Result Register Data Signed or Unsigned Representation -- This bit selects between signed and unsigned conversion data representation in the result registers. Signed data is represented as 2's complement. Signed data is not available in right justification. See 6.3.2.16 ATD Conversion Result Registers (ATDDRx) for details. 0 Unsigned data representation in the result registers. 1 Signed data representation in the result registers. Table 6-11 summarizes the result data formats available and how they are set up using the control bits. Table 6-12 illustrates the difference between the signed and unsigned, left justified output codes for an input signal range between 0 and 5.12 Volts. Continuous Conversion Sequence Mode -- This bit selects whether conversion sequences are performed continuously or only once. If external trigger is enabled (ETRIGE=1) setting this bit has no effect, that means each trigger event starts a single conversion sequence. 0 Single conversion sequence 1 Continuous conversion sequences (scan mode) Multi-Channel Sample Mode -- When MULT is 0, the ATD sequence controller samples only from the specified analog input channel for an entire conversion sequence. The analog channel is selected by channel selection code (control bits CD/CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller samples across channels. The number of channels sampled is determined by the sequence length value (S8C, S4C, S2C, S1C). The first analog channel examined is determined by channel selection code (CC, CB, CA control bits); subsequent channels sampled in the sequence are determined by incrementing the channel selection code or wrapping around to AN0 (channel 0. 0 Sample only one channel 1 Sample across several channels
6 DSGN
5 SCAN
4 MULT
MC9S12E128 Data Sheet, Rev. 1.07 218 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Table 6-10. ATDCTL5 Field Descriptions (continued)
Field 3:0 C[D:A} Description Analog Input Channel Select Code -- These bits select the analog input channel(s) whose signals are sampled and converted to digital codes. Table 6-13 lists the coding used to select the various analog input channels. In the case of single channel conversions (MULT = 0), this selection code specified the channel to be examined. In the case of multiple channel conversions (MULT = 1), this selection code represents the first channel to be examined in the conversion sequence. Subsequent channels are determined by incrementing the channel selection code or wrapping around to AN0 (after converting the channel defined by the Wrap Around Channel Select Bits WRAP[3:0] in ATDCTL0). In case starting with a channel number higher than the one defined by WRAP[3:0] the first wrap around will be AN15 to AN0.
Table 6-11. Available Result Data Formats.
SRES8 1 1 1 0 0 0 DJM 0 0 1 0 0 1 DSGN 0 1 X 0 1 X Result Data Formats Description and Bus Bit Mapping 8-bit / left justified / unsigned -- bits 15:8 8-bit / left justified / signed -- bits 15:8 8-bit / right justified / unsigned -- bits 7:0 10-bit / left justified / unsigned -- bits 15:6 10-bit / left justified / signed --- bits 15:6 10-bit / right justified / unsigned -- bits 9:0
Table 6-12. Left Justified, Signed and Unsigned ATD Output Codes.
Input Signal VRL = 0 Volts VRH = 5.12 Volts 5.120 Volts 5.100 5.080 2.580 2.560 2.540 0.020 0.000 Signed 8-Bit Codes 7F 7F 7E 01 00 FF 81 80 Unsigned 8-Bit Codes FF FF FE 81 80 7F 01 00 Signed 10-Bit Codes 7FC0 7F00 7E00 0100 0000 FF00 8100 8000 Unsigned 10-Bit Codes FFC0 FF00 FE00 8100 8000 7F00 0100 0000
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 219
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Table 6-13. Analog Input Channel Select Coding
CD 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 CC 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 CB 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 CA 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Analog Input Channel AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 AN12 AN13 AN14 AN15
MC9S12E128 Data Sheet, Rev. 1.07 220 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.7
ATD Status Register 0 (ATDSTAT0)
This read-only register contains the Sequence Complete Flag, overrun flags for external trigger and FIFO mode, and the conversion counter.
7 6 5 4 3 2 1 0
R SCF W Reset 0
0 ETORF 0 0 FIFOR 0
CC3
CC2
CC1
CC0
0
0
0
0
= Unimplemented or Reserved
Figure 6-9. ATD Status Register 0 (ATDSTAT0)
Read: Anytime Write: Anytime (No effect on CC[3:0])
Table 6-14. ATDSTAT0 Field Descriptions
Field 7 SCF Description Sequence Complete Flag -- This flag is set upon completion of a conversion sequence. If conversion sequences are continuously performed (SCAN = 1), the flag is set after each one is completed. This flag is cleared when one of the following occurs: * Write "1" to SCF * Write to ATDCTL5 (a new conversion sequence is started) * If AFFC = 1 and read of a result register 0 Conversion sequence not completed 1 Conversion sequence has completed External Trigger Overrun Flag --While in edge trigger mode (ETRIGLE = 0), if additional active edges are detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the following occurs: * Write "1" to ETORF * Write to ATDCTL0,1,2,3,4 (a conversion sequence is aborted) * Write to ATDCTL5 (a new conversion sequence is started) 0 No External trigger over run error has occurred 1 External trigger over run error has occurred
5 ETORF
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 221
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Table 6-14. ATDSTAT0 Field Descriptions (continued)
Field 4 FIFOR Description FIFO Over Run Flag -- This bit indicates that a result register has been written to before its associated conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because the flag potentially indicates that result registers are out of sync with the input channels. However, it is also practical for non-FIFO modes, and indicates that a result register has been over written before it has been read (i.e., the old data has been lost). This flag is cleared when one of the following occurs: * Write "1" to FIFOR * Start a new conversion sequence (write to ATDCTL5 or external trigger) 0 No over run has occurred 1 Overrun condition exists (result register has been written while associated CCFx flag remained set) Conversion Counter -- These 4 read-only bits are the binary value of the conversion counter. The conversion counter points to the result register that will receive the result of the current conversion. For example, CC3 = 0, CC2 = 1, CC1 = 1, CC0 = 0 indicates that the result of the current conversion will be in ATD Result Register 6. If in non-FIFO mode (FIFO = 0) the conversion counter is initialized to zero at the begin and end of the conversion sequence. If in FIFO mode (FIFO = 1) the register counter is not initialized. The conversion counters wraps around when its maximum value is reached. Aborting a conversion or starting a new conversion by write to an ATDCTL register (ATDCTL5-0) clears the conversion counter even if FIFO=1.
3:0 CC[3:0}
MC9S12E128 Data Sheet, Rev. 1.07 222 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.8
Reserved Register 0 (ATDTEST0)
7 6 5 4 3 2 1 0
R W Reset
u
u
u
u
u
u
u
u
1
0
0
0
0
0
0
0
= Unimplemented or Reserved
u = Unaffected
Figure 6-10. Reserved Register 0 (ATDTEST0)
Read: Anytime, returns unpredictable values Write: Anytime in special modes, unimplemented in normal modes NOTE Writing to this register when in special modes can alter functionality.
6.3.2.9
ATD Test Register 1 (ATDTEST1)
This register contains the SC bit used to enable special channel conversions.
7 6 5 4 3 2 1 0
R W Reset
u
u
u
u
u
u
u SC
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
u = Unaffected
Figure 6-11. Reserved Register 1 (ATDTEST1)
Read: Anytime, returns unpredictable values for bit 7 and bit 6 Write: Anytime NOTE Writing to this register when in special modes can alter functionality.
Table 6-15. ATDTEST1 Field Descriptions
Field 0 SC Description Special Channel Conversion Bit -- If this bit is set, then special channel conversion can be selected using CC, CB, and CA of ATDCTL5. Table 6-16 lists the coding. 0 Special channel conversions disabled 1 Special channel conversions enabled
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 223
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
Table 6-16. Special Channel Select Coding
SC 1 1 1 1 1 1 CD 0 0 0 0 0 1 CC 0 1 1 1 1 X CB X 0 0 1 1 X CA X 0 1 0 1 X Analog Input Channel Reserved VRH VRL (VRH+VRL) / 2 Reserved Reserved
6.3.2.10
ATD Status Register 2 (ATDSTAT2)
This read-only register contains the Conversion Complete Flags CCF15 to CCF8.
7 6 5 4 3 2 1 0
R W Reset
CCF15
CCF14
CCF13
CCF12
CCF11
CCF10
CCF9
CCF8
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-12. ATD Status Register 2 (ATDSTAT2)
Read: Anytime Write: Anytime, no effect
Table 6-17. ATDSTAT2 Field Descriptions
Field 7:0 CCF[15:8] Description Conversion Complete Flag Bits -- A conversion complete flag is set at the end of each conversion in a conversion sequence. The flags are associated with the conversion position in a sequence (and also the result register number). Therefore, CCF8 is set when the ninth conversion in a sequence is complete and the result is available in result register ATDDR8; CCF9 is set when the tenth conversion in a sequence is complete and the result is available in ATDDR9, and so forth. A flag CCFx (x = 15, 14, 13, 12, 11, 10, 9, 8) is cleared when one of the following occurs: * Write to ATDCTL5 (a new conversion sequence is started) * If AFFC = 0 and read of ATDSTAT2 followed by read of result register ATDDRx * If AFFC = 1 and read of result register ATDDRx In case of a concurrent set and clear on CCFx: The clearing by method A) will overwrite the set. The clearing by methods B) or C) will be overwritten by the set. 0 Conversion number x not completed 1 Conversion number x has completed, result ready in ATDDRx
MC9S12E128 Data Sheet, Rev. 1.07 224 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.11
ATD Status Register 1 (ATDSTAT1)
This read-only register contains the Conversion Complete Flags CCF7 to CCF0
7 6 5 4 3 2 1 0
R W Reset
CCF7
CCF6
CCF5
CCF4
CCF3
CCF2
CCF1
CCF0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-13. ATD Status Register 1 (ATDSTAT1)
Read: Anytime Write: Anytime, no effect
Table 6-18. ATDSTAT1 Field Descriptions
Field 7:0 CCF[7:0] Description Conversion Complete Flag Bits -- A conversion complete flag is set at the end of each conversion in a conversion sequence. The flags are associated with the conversion position in a sequence (and also the result register number). Therefore, CCF0 is set when the first conversion in a sequence is complete and the result is available in result register ATDDR0; CCF1 is set when the second conversion in a sequence is complete and the result is available in ATDDR1, and so forth. A CCF flag is cleared when one of the following occurs: * Write to ATDCTL5 (a new conversion sequence is started) * If AFFC = 0 and read of ATDSTAT1 followed by read of result register ATDDRx * If AFFC = 1 and read of result register ATDDRx In case of a concurrent set and clear on CCFx: The clearing by method A) will overwrite the set. The clearing by methods B) or C) will be overwritten by the set. Conversion number x not completed Conversion number x has completed, result ready in ATDDRx
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 225
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.12
ATD Input Enable Register 0 (ATDDIEN0)
7 6 5 4 3 2 1 0
R IEN15 W Reset 0 0 0 0 0 0 0 0 IEN14 IEN13 IEN12 IEN11 IEN10 IEN9 IEN8
Figure 6-14. ATD Input Enable Register 0 (ATDDIEN0)
Read: Anytime Write: anytime
Table 6-19. ATDDIEN0 Field Descriptions
Field 7:0 IEN[15:8] Description ATD Digital Input Enable on Channel Bits -- This bit controls the digital input buffer from the analog input pin (ANx) to PTADx data register. 0 Disable digital input buffer to PTADx 1 Enable digital input buffer to PTADx. Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while simultaneously using it as an analog port, there is potentially increased power consumption because the digital input buffer maybe in the linear region.
6.3.2.13
ATD Input Enable Register 1 (ATDDIEN1)
7 6 5 4 3 2 1 0
R IEN7 W Reset 0 0 0 0 0 0 0 0 IEN6 IEN5 IEN4 IEN3 IEN2 IEN1 IEN0
Figure 6-15. ATD Input Enable Register 1 (ATDDIEN1)
Read: Anytime Write: Anytime
Table 6-20. ATDDIEN1 Field Descriptions
Field 7:0 IEN[7:0] Description ATD Digital Input Enable on Channel Bits -- This bit controls the digital input buffer from the analog input pin (ANx) to PTADx data register. 0 Disable digital input buffer to PTADx 1 Enable digital input buffer to PTADx. Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while simultaneously using it as an analog port, there is potentially increased power consumption because the digital input buffer maybe in the linear region.
MC9S12E128 Data Sheet, Rev. 1.07 226 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.14
Port Data Register 0 (PORTAD0)
The data port associated with the ATD is input-only. The port pins are shared with the analog A/D inputs AN[15:8].
7 6 5 4 3 2 1 0
R W Reset Pin Function
PTAD15
PTAD14
PTAD13
PTAD12
PTAD11
PTAD10
PTAD9
PTAD8
1 AN15
1 AN14
1 AN13
1 AN12
1 AN11
1 AN10
1 AN9
1 AN8
= Unimplemented or Reserved
Figure 6-16. Port Data Register 0 (PORTAD0)
Read: Anytime Write: Anytime, no effect The A/D input channels may be used for general-purpose digital input.
Table 6-21. PORTAD0 Field Descriptions
Field 7:0 PTAD[15:8] Description A/D Channel x (ANx) Digital Input Bits-- If the digital input buffer on the ANx pin is enabled (IENx = 1) or channel x is enabled as external trigger (ETRIGE = 1, ETRIGCH[3-0] = x, ETRIGSEL = 0) read returns the logic level on ANx pin (signal potentials not meeting VIL or VIH specifications will have an indeterminate value)). If the digital input buffers are disabled (IENx = 0) and channel x is not enabled as external trigger, read returns a "1". Reset sets all PORTAD0 bits to "1".
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Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.15
Port Data Register 1 (PORTAD1)
The data port associated with the ATD is input-only. The port pins are shared with the analog A/D inputs AN7-0.
7 6 5 4 3 2 1 0
R W Reset Pin Function
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
1 AN 7
1 AN6
1 AN5
1 AN4
1 AN3
1 AN2
1 AN1
1 AN0
= Unimplemented or Reserved
Figure 6-17. Port Data Register 1 (PORTAD1)
Read: Anytime Write: Anytime, no effect The A/D input channels may be used for general-purpose digital input.
Table 6-22. PORTAD1 Field Descriptions
Field 7:0 PTAD[7:8] Description A/D Channel x (ANx) Digital Input Bits -- If the digital input buffer on the ANx pin is enabled (IENx=1) or channel x is enabled as external trigger (ETRIGE = 1, ETRIGCH[3-0] = x, ETRIGSEL = 0) read returns the logic level on ANx pin (signal potentials not meeting VIL or VIH specifications will have an indeterminate value)). If the digital input buffers are disabled (IENx = 0) and channel x is not enabled as external trigger, read returns a "1". Reset sets all PORTAD1 bits to "1".
MC9S12E128 Data Sheet, Rev. 1.07 228 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.16
ATD Conversion Result Registers (ATDDRx)
The A/D conversion results are stored in 16 read-only result registers. The result data is formatted in the result registers bases on two criteria. First there is left and right justification; this selection is made using the DJM control bit in ATDCTL5. Second there is signed and unsigned data; this selection is made using the DSGN control bit in ATDCTL5. Signed data is stored in 2's complement format and only exists in left justified format. Signed data selected for right justified format is ignored. Read: Anytime Write: Anytime in special mode, unimplemented in normal modes 6.3.2.16.1 Left Justified Result Data
7 6 5 4 3 2 1 0
R (10-BIT) BIT 9 MSB R (8-BIT) BIT 7 MSB W Reset 0
BIT 8 BIT 6
BIT 7 BIT 5
BIT 6 BIT 4
BIT 5 BIT 3
BIT 4 BIT 2
BIT 3 BIT 1
BIT 2 BIT 0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-18. Left Justified, ATD Conversion Result Register x, High Byte (ATDDRxH)
7 6 5 4 3 2 1 0
R (10-BIT) R (8-BIT) W Reset
BIT 1 u
BIT 0 u
0 0
0 0
0 0
0 0
0 0
0 0
0
0
0
0
0
0 u = Unaffected
0
0
= Unimplemented or Reserved
Figure 6-19. Left Justified, ATD Conversion Result Register x, Low Byte (ATDDRxL)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 229
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.3.2.16.2
Right Justified Result Data
7 6 5 4 3 2 1 0
R (10-BIT) R (8-BIT) W Reset
0 0
0 0
0 0
0 0
0 0
0 0
BIT 9 MSB 0
BIT 8 0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-20. Right Justified, ATD Conversion Result Register x, High Byte (ATDDRxH)
7 6 5 4 3 2 1 0
R (10-BIT) BIT 7 R (8-BIT) BIT 7 MSB W Reset 0
BIT 6 BIT 6
BIT 5 BIT 5
BIT 4 BIT 4
BIT 3 BIT 3
BIT 2 BIT 2
BIT 1 BIT 1
BIT 0 BIT 0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-21. Right Justified, ATD Conversion Result Register x, Low Byte (ATDDRxL)
6.4
Functional Description
The ATD10B16C is structured in an analog and a digital sub-block.
6.4.1
Analog Sub-block
The analog sub-block contains all analog electronics required to perform a single conversion. Separate power supplies VDDA and VSSA allow to isolate noise of other MCU circuitry from the analog sub-block.
6.4.1.1
Sample and Hold Machine
The sample and hold (S/H) machine accepts analog signals from the external world and stores them as capacitor charge on a storage node. The sample process uses a two stage approach. During the first stage, the sample amplifier is used to quickly charge the storage node.The second stage connects the input directly to the storage node to complete the sample for high accuracy. When not sampling, the sample and hold machine disables its own clocks. The analog electronics continue drawing their quiescent current. The power down (ADPU) bit must be set to disable both the digital clocks and the analog power consumption. The input analog signals are unipolar and must fall within the potential range of VSSA to VDDA.
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Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.4.1.2
Analog Input Multiplexer
The analog input multiplexer connects one of the 16 external analog input channels to the sample and hold machine.
6.4.1.3
Sample Buffer Amplifier
The sample amplifier is used to buffer the input analog signal so that the storage node can be quickly charged to the sample potential.
6.4.1.4
Analog-to-Digital (A/D) Machine
The A/D machine performs analog to digital conversions. The resolution is program selectable at either 8 or 10 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the stored analog sample potential with a series of digitally generated analog potentials. By following a binary search algorithm, the A/D machine locates the approximating potential that is nearest to the sampled potential. When not converting the A/D machine disables its own clocks. The analog electronics continue drawing quiescent current. The power down (ADPU) bit must be set to disable both the digital clocks and the analog power consumption. Only analog input signals within the potential range of VRL to VRH (A/D reference potentials) will result in a non-railed digital output codes.
6.4.2
Digital Sub-Block
This subsection explains some of the digital features in more detail. See register descriptions for all details.
6.4.2.1
External Trigger Input (ETRIG)
The external trigger feature allows the user to synchronize ATD conversions to the external environment events rather than relying on software to signal the ATD module when ATD conversions are to take place. The external trigger signal (ATD channel 15) is programmable to be edge or level sensitive with polarity control. Table 6-23 gives a brief description of the different combinations of control bits and their effect on the external trigger function.
Table 6-23. External Trigger Control Bits
ETRIGLE X X 0 0 1 1 ETRIGP X X 0 1 0 1 ETRIGE 0 0 1 1 1 1 SCAN 0 1 X X X X Description Ignores external trigger. Performs one conversion sequence and stops. Ignores external trigger. Performs continuous conversion sequences. Falling edge triggered. Performs one conversion sequence per trigger. Rising edge triggered. Performs one conversion sequence per trigger. Trigger active low. Performs continuous conversions while trigger is active. Trigger active high. Performs continuous conversions while trigger is active.
During a conversion, if additional active edges are detected the overrun error flag ETORF is set.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 231
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
In either level or edge triggered modes, the first conversion begins when the trigger is received. In both cases, the maximum latency time is one bus clock cycle plus any skew or delay introduced by the trigger circuitry. After ETRIGE is enabled, conversions cannot be started by a write to ATDCTL5, but rather must be triggered externally. If the level mode is active and the external trigger both de-asserts and re-asserts itself during a conversion sequence, this does not constitute an overrun. Therefore, the flag is not set. If the trigger remains asserted in level mode while a sequence is completing, another sequence will be triggered immediately.
6.4.2.2
General-Purpose Digital Input Port Operation
The input channel pins can be multiplexed between analog and digital data. As analog inputs, they are multiplexed and sampled to supply signals to the A/D converter. As digital inputs, they supply external input data that can be accessed through the digital port registers (PORTAD0 & PORTAD1) (input-only). The analog/digital multiplex operation is performed in the input pads. The input pad is always connected to the analog inputs of the ATD10B16C. The input pad signal is buffered to the digital port registers. This buffer can be turned on or off with the ATDDIEN0 & ATDDIEN1 register. This is important so that the buffer does not draw excess current when analog potentials are presented at its input.
6.4.3
Operation in Low Power Modes
The ATD10B16C can be configured for lower MCU power consumption in three different ways: * Stop Mode Stop Mode: This halts A/D conversion. Exit from Stop mode will resume A/D conversion, But due to the recovery time the result of this conversion should be ignored. Entering stop mode causes all clocks to halt and thus the system is placed in a minimum power standby mode. This halts any conversion sequence in progress. During recovery from stop mode, there must be a minimum delay for the stop recovery time tSR before initiating a new ATD conversion sequence. * Wait Mode Wait Mode with AWAI = 1: This halts A/D conversion. Exit from Wait mode will resume A/D conversion, but due to the recovery time the result of this conversion should be ignored. Entering wait mode, the ATD conversion either continues or halts for low power depending on the logical value of the AWAIT bit. * Freeze Mode Writing ADPU = 0 (Note that all ATD registers remain accessible.): This aborts any A/D conversion in progress. In freeze mode, the ATD10B16C will behave according to the logical values of the FRZ1 and FRZ0 bits. This is useful for debugging and emulation. NOTE The reset value for the ADPU bit is zero. Therefore, when this module is reset, it is reset into the power down state.
MC9S12E128 Data Sheet, Rev. 1.07 232 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
6.5
Resets
At reset the ATD10B16C is in a power down state. The reset state of each individual bit is listed within Section 6.3, "Memory Map and Register Definition," which details the registers and their bit fields.
6.6
Interrupts
The interrupt requested by the ATD10B16C is listed in Table 6-24. Refer to MCU specification for related vector address and priority.
Table 6-24. ATD Interrupt Vectors
Interrupt Source Sequence Complete Interrupt CCR Mask I bit Local Enable ASCIE in ATDCTL2
See Section 6.3.2, "Register Descriptions," for further details.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 233
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
MC9S12E128 Data Sheet, Rev. 1.07 234 Freescale Semiconductor
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 235
Chapter 6 Analog-to-Digital Converter (ATD10B16CV2)
MC9S12E128 Data Sheet, Rev. 1.07 236 Freescale Semiconductor
Chapter 7 Digital-to-Analog Converter (DAC8B1CV1)
7.1 Introduction
The DAC8B1C is a 8-bit, 1-channel digital-to-analog converter module.
7.1.1
Features
The DAC8B1C includes these features: * 8-bit resolution. * One output independent monotonic channel.
7.1.2
Modes of Operation
The DAC8B1C functions the same in normal, special, and emulation modes. It has two low-power modes, wait and stop modes.
7.1.2.1
Run Mode
Normal mode of operation.
7.1.2.2
Wait Mode
Entering wait mode, the DAC conversion either continues or aborts for low power, depending on the logical state of the DACWAI bit.
7.1.2.3
Stop Mode
The DAC8B1C module is disabled in stop mode for reduced power consumption. The STOP instruction does not affect DAC register states.
7.1.3
Block Diagram
Figure 7-1 illustrates the functional block diagram of the DAC8B1C module.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 237
Chapter 7 Digital-to-Analog Converter (DAC8B1CV1)
CONTROL CIRCUIT
DAC CHANNEL VREF DACC O/P VOLTAGE
Name DAO VDDA VSSA VREF VRL Function DAC channel output DAC power supply DAC ground supply Reference voltage for DAC conversion Reference ground voltage connected to VSSA outside the DAC boundary MC9S12E128 Data Sheet, Rev. 1.07 238 Freescale Semiconductor
VRL
VDDA VSSA
DAO
ANALOG SUB-BLOCK
Figure 7-1. DAC8B1C Functional Block Diagram
7.2
External Signal Description
Table 7-1. DAC8B1C External Pin Descriptions
The DAC8B1C module requires four external pins. These pins are listed in Table 7-1 below.
DACD
Chapter 7 Digital-to-Analog Converter (DAC8B1CV1)
7.2.1
DAO -- DAC Channel Output
This pin is used as the analog output pin of the DAC8B1C module. The value represents the analog voltage level between VSSA and VREF.
7.2.2
VDDA -- DAC Power Supply
This pin serves as the power supply pin.l
7.2.3
VSSA -- DAC Ground Supply
This pin serves as an analog ground reference to the DAC.
7.2.4
VREF -- DAC Reference Supply
This pin serves as the source for the high reference potential. Separation from the power supply pins accommodates the filtering necessary to achieve the accuracy of which the system is capable.
7.2.5
VRL -- DAC Reference Ground Supply
This pin serves as the ground for the low reference potential. This pin is connected to VSSA outside the DAC module boundary to accommodate the filtering necessary to achieve the accuracy of which the system is capable.
7.3
Memory Map and Registers
This section provides a detailed description of all memory and registers accessible to the end user.
7.3.1
Module Memory Map
Figure 7-2 summarizes the DAC8B1C memory map. The base address is defined at the chip level and the address offset is defined at the module level.
Address 0x0000 0x0001 0x0002 0x0003 Name DACC0 DACC1 DACD (Left Justified) DACD (Right Justified) R W R W R W R W Bit 7 DACE 0 6 DACTE 0 5 0 0 4 0 0 3 DJM 0 2 DSGN 0 1 DACWAI 0 Bit 0 DACOE 0
BIT 7 BIT 7
BIT 6 BIT 6
BIT 5 BIT 5
BIT 4 BIT 4
BIT 3 BIT 3
BIT 2 BIT 2
BIT 1 BIT 1
BIT 0 BIT 0
= Unimplemented or Reserved
Figure 7-2. DAC8B1C Register Summary
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 239
Chapter 7 Digital-to-Analog Converter (DAC8B1CV1)
7.3.2
Register Descriptions
This section consists of register descriptions arranged in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in descending bit order.
7.3.2.1
DAC Control Register 0 (DACC0)
Module Base + 0x0000
7 6 5 4 3 2 1 0
R DACE W Reset 0
DACTE
0
0 DJM DSGN 0 DACWAI 0 DACOE 0
0
0
0
0
= Unimplemented or Reserved
Figure 7-3. DAC Control Register 0 (DACC0)
Read: anytime (reserved locations read zero) Write: anytime except DACTE is available only in special modes
Table 7-2. DACC0 Field Descriptions
Field 7 DACE Description DAC Enable -- This bit enables digital-to-analog converter functionality. When enabled, an analog voltage based on the digital value in the DAC data register will be output. When disabled, DAO pin is high-impedance. 0 DAC is disabled and powered down 1 DAC is enabled for conversion DAC Test Enable -- This reserved bit is designed for factory test purposes only and is not intended for general user access. Writing to this bit when in special test modes can alter DAC functionality. Data Register Data Justification -- This bit controls the justification of the data in the DAC data register (DACD). If DJM is clear (left-justified), the data to be converted must be written to left justified DACD and the right justified DACD register will read zeroes. If DJM is set (right-justified), the data to be converted is written to right justified DACD register and left justified DACD register reads zeroes. Data is preserved if DJM bit is changed after data is written. 0 Left justified data in DAC data register 1 Right justified data in DAC data register Data Register Signed -- This bit selects between signed and unsigned conversion data representation in the DAC data register. Signed data is represented as 2's complement. 0 Unsigned data representation in DAC data register 1 Signed data representation in DAC data register DAC Stop in WAIT Mode -- DACWAI disables the DAC8B1C module (no new conversion is done) during wait mode. 0 DAC is enabled during wait mode 1 DAC is disabled and powered down during wait mode DAC Output Enable -- This bit enables the output on the DAO pin. To output the DAC voltage, the DACOE bit and the DACE bit must be set. When disabled, DAO pin is high-impedance. 0 Output is not available for external use 1 Output on DAO pin enabled. MC9S12E128 Data Sheet, Rev. 1.07 240 Freescale Semiconductor
6 DACTE 3 DJM
2 DSGN
1 DACWAI
0 DACOE
Chapter 7 Digital-to-Analog Converter (DAC8B1CV1)
7.3.2.2
Reserved Register (DACC1)
This register is reserved.
Module Base + 0x0000
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-4. Reserved Register (DACC1)
Read: always read $00 Write: unimplemented
7.3.2.3
DAC Data Register -- Left Justified (DACD)
Module Base + 0x0002
7 6 5 4 3 2 1 0
R BIT 7 W Reset 0 0 0 0 0 0 0 0 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
Figure 7-5. DAC Data Register -- Left Justified (DACD)
Read: read zeroes when DJM is set Write: unimplemented when DJM is set The DAC data register is an 8-bit readable/writable register that stores the data to be converted when DJM bit is clear. When the DACE bit is set, the value in this register is converted into an analog voltage such that values from $00 to $FF result in equal voltage increments from VSSA to VREF. When DJM bit is set, this register reads zeroes and cannot be written.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 241
Chapter 7 Digital-to-Analog Converter (DAC8B1CV1)
7.3.2.4
DAC Data Register -- Right Justified (DACD)
Module Base + 0x0003
7 6 5 4 3 2 1 0
R BIT 7 W Reset 0 0 0 0 0 0 0 0 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
Figure 7-6. DAC Data Register -- Right Justified (DACD)
Read: read zeroes when DJM is clear Write: unimplemented when DJM is clear The DAC data register is an 8-bit readable/writable register that stores the data to be converted when DJM bit is set. When the DACE bit is set, the value in this register is converted into an analog voltage such that values from $00 to $FF result in equal voltage increments from VSSA to VREF. When DJM bit is clear, this register reads zeroes and cannot be written.
MC9S12E128 Data Sheet, Rev. 1.07 242 Freescale Semiconductor
Chapter 7 Digital-to-Analog Converter (DAC8B1CV1)
7.4
Functional Description
The DAC8B1C module consists of analog and digital sub-blocks.
7.4.1
Functional Description
Data to be converted is written to DACD register. The data can be mapped either to left end or right end of DACD register by clearing or setting DJM bit of DACC0 register. Also, the data written to DACD can be a signed or unsigned data depending on DSGN bit of DACC0 register. See Table 7-3 below for data formats. The maximum unsigned data that can be written to DACD register is $FF while the minimum value is $00. If the data is signed, the maximum value that can be written to DACD is $7F while the minimum value is $80, where $7F (signed) corresponds to $FF (unsigned) and $80 (signed) corresponds to $00 (unsigned). Table 7-4 shows this characteristic between signed, unsigned data values and their corresponding voltage output. See Table 7-4 for DAC signed and un-signed data and DAC output codes.
Table 7-3. Data Formats
DJM 0 0 1 1 DSGN 0 1 0 1 Description and Bus Bit Mapping 8 bit/left justified/unsigned -- bits 15-8 8 bit/left justified/signed -- bits 15-8 8 bit/right justified/unsigned -- bits 7-0 8 bit/right justified/signed bits -- 7-0
Table 7-4. Signed and Unsigned Data and DAC Output Codes
Input signal VRL = 0 VREF/VRH = 5.12volts 5.12 5.08 5.07 Signed 8-Bit Codes 7F 7E 7D Unsigned 8-Bit Codes FF FE FD
2.580 2.56 2.54 2.52
01 00 FF FE
81 80 7F 7E
0.020 0.000
81 80
01 00
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Chapter 7 Digital-to-Analog Converter (DAC8B1CV1)
Conversion of the data in DACD register takes place as soon as DACE bit of DACC0 is set. The transfer characteristic of the day module is shown in Figure 7-7.
256 LSB
255 LSB
Analog Output Voltage
3 LSB
2 LSB
1 LSB
$01
$00
$02
Digital Input 1 LSB = 21.5 mV when VDDA = 5.5 V 1 LSB = 11.5 mV when VDDA = 3.0 V
Figure 7-7. DAC8B1C Transfer Function
7.5
7.5.1
Resets
General
The DAC8B1C module is reset on a system reset. If the system reset signal is activated, the DAC registers are initialized to their reset state and the DAC8B1C module is powered down. This occurs as a function of the register file initialization. If the module is performing a conversion, the current conversion is terminated.
MC9S12E128 Data Sheet, Rev. 1.07 244 Freescale Semiconductor
$FE
$FF
Chapter 8 Serial Communication Interface (SCIV3)
8.1 Introduction
This block description chapter provides an overview of serial communication interface (SCI) module. The SCI allows full duplex, asynchronous, serial communication between the CPU and remote devices, including other CPUs. The SCI transmitter and receiver operate independently, although they use the same baud rate generator. The CPU monitors the status of the SCI, writes the data to be transmitted, and processes received data.
8.1.1
IR: infrared
Glossary
IrDA: Infrared Design Association IRQ: interrupt request LSB: least significant bit MSB: most significant bit NRZ: non-return-to-Zero RZI: return-to-zero-inverted RXD: receive pin SCI: serial communication interface TXD: transmit pin
8.1.2
Features
The SCI includes these distinctive features: * Full-duplex or single-wire operation * Standard mark/space non-return-to-zero (NRZ) format * Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths * 13-bit baud rate selection * Programmable 8-bit or 9-bit data format * Separately enabled transmitter and receiver * Programmable transmitter output parity
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 245
Chapter 8 Serial Communication Interface (SCIV3)
*
*
* * *
Two receiver wakeup methods: -- Idle line wakeup -- Address mark wakeup Interrupt-driven operation with eight flags: -- Transmitter empty -- Transmission complete -- Receiver full -- Idle receiver input -- Receiver overrun -- Noise error -- Framing error -- Parity error Receiver framing error detection Hardware parity checking 1/16 bit-time noise detection
8.1.3
Modes of Operation
The SCI functions the same in normal, special, and emulation modes. It has two low-power modes, wait and stop modes.
8.1.3.1
Run Mode
Normal mode of operation.
8.1.3.2
Wait Mode
SCI operation in wait mode depends on the state of the SCISWAI bit in the SCI control register 1 (SCICR1). * If SCISWAI is clear, the SCI operates normally when the CPU is in wait mode. * If SCISWAI is set, SCI clock generation ceases and the SCI module enters a power-conservation state when the CPU is in wait mode. Setting SCISWAI does not affect the state of the receiver enable bit, RE, or the transmitter enable bit, TE. If SCISWAI is set, any transmission or reception in progress stops at wait mode entry. The transmission or reception resumes when either an internal or external interrupt brings the CPU out of wait mode. Exiting wait mode by reset aborts any transmission or reception in progress and resets the SCI.
8.1.3.3
Stop Mode
The SCI is inactive during stop mode for reduced power consumption. The STOP instruction does not affect the SCI register states, but the SCI bus clock will be disabled. The SCI operation resumes after an
MC9S12E128 Data Sheet, Rev. 1.07 246 Freescale Semiconductor
Chapter 8 Serial Communication Interface (SCIV3)
external interrupt brings the CPU out of stop mode. Exiting stop mode by reset aborts any transmission or reception in progress and resets the SCI.
8.1.4
Block Diagram
Figure 8-1 is a high level block diagram of the SCI module, showing the interaction of various function blocks.
SCI Data Register IDLE Interrupt Request RXD Data In Infrared Decoder Receive Shift Register IRQ Generation
Receive & Wakeup Control
RDRF/OR Interrupt Request TDRE Interrupt Request
Bus Clk
BAUD Generator
/16
Data Format Control
SCI Interrupt Request
Transmit Control
Transmit Shift Register
IRQ Generation TC Interrupt Request
SCI Data Register
Infrared Encoder
Data Out
TXD
Figure 8-1. SCI Block Diagram
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Chapter 8 Serial Communication Interface (SCIV3)
8.2
External Signal Description
The SCI module has a total of two external pins.
8.2.1
TXD -- SCI Transmit Pin
The TXD pin transmits SCI (standard or infrared) data. It will idle high in either mode and is high impedance anytime the transmitter is disabled.
8.2.2
RXD -- SCI Receive Pin
The RXD pin receives SCI (standard or infrared) data. An idle line is detected as a line high. This input is ignored when the receiver is disabled and should be terminated to a known voltage.
8.3
Memory Map and Register Definition
This subsection provides a detailed description of all the SCI registers.
8.3.1
Module Memory Map
The memory map for the SCI module is given in Figure 8-2. The address listed for each register is the address offset. The total address for each register is the sum of the base address for the SCI module and the address offset for each register.
8.3.2
Register Descriptions
This subsection consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Writes to reserved register locations do not have any effect and reads of these locations return a 0. Details of register bit and field function follow the register diagrams, in bit order.
Register Name SCIBDH R IREN W SCIBDL R SBR7 W SCICR1 R LOOPS W = Unimplemented or Reserved SCISWAI RSRC M WAKE ILT PE PT SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 TNP1 TNP0 SBR12 SBR11 SBR10 SBR9 SBR8
Bit 7
6
5
4
3
2
1
Bit 0
Figure 8-2. SCI Registers Summary
MC9S12E128 Data Sheet, Rev. 1.07 248 Freescale Semiconductor
Chapter 8 Serial Communication Interface (SCIV3)
Register Name SCICR2 R
Bit 7
6
5
4
3
2
1
Bit 0
TIE W SCISR1 R W SCISR2 R W SCIDRH R W SCIDRL R W R7 T7 R8 0 TDRE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
TC
RDRF
IDLE
OR
NF
FE
PF
0
0
0
0 BRK13 TXDIR
RAF
0 T8
0
0
0
0
0
R6 T6
R5 T5
R4 T4
R3 T3
R2 T2
R1 T1
R0 T0
= Unimplemented or Reserved
Figure 8-2. SCI Registers Summary
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Chapter 8 Serial Communication Interface (SCIV3)
8.3.2.1
SCI Baud Rate Registers (SCIBDH and SCIBDL)
7 6 5 4 3 2 1 0
R IREN W Reset 0 0 0 0 0 0 0 0 TNP1 TNP0 SBR12 SBR11 SBR10 SBR9 SBR8
Figure 8-3. SCI Baud Rate Register High (SCIBDH) Table 8-1. SCIBDH Field Descriptions
Field 7 IREN 6:5 TNP[1:0] 4:0 SBR[11:8] Description Infrared Enable Bit -- This bit enables/disables the infrared modulation/demodulation submodule. 0 IR disabled 1 IR enabled Transmitter Narrow Pulse Bits -- These bits determine if the SCI will transmit a 1/16, 3/16 or 1/32 narrow pulse. Refer to Table 8-3. SCI Baud Rate Bits -- The baud rate for the SCI is determined by the bits in this register. The baud rate is calculated two different ways depending on the state of the IREN bit. The formulas for calculating the baud rate are: When IREN = 0 then, SCI baud rate = SCI module clock / (16 x SBR[12:0]) When IREN = 1 then, SCI baud rate = SCI module clock / (32 x SBR[12:1])
7
6
5
4
3
2
1
0
R SBR7 W Reset 0 0 0 0 0 1 0 0 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
Figure 8-4. SCI Baud Rate Register Low (SCIBDL) Table 8-2. SCIBDL Field Descriptions
Field 7:0 SBR[7:0] Description SCI Baud Rate Bits -- The baud rate for the SCI is determined by the bits in this register. The baud rate is calculated two different ways depending on the state of the IREN bit. The formulas for calculating the baud rate are: When IREN = 0 then, SCI baud rate = SCI module clock / (16 x SBR[12:0]) When IREN = 1 then, SCI baud rate = SCI module clock / (32 x SBR[12:1])
Read: anytime
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Chapter 8 Serial Communication Interface (SCIV3)
NOTE If only SCIBDH is written to, a read will not return the correct data until SCIBDL is written to as well, following a write to SCIBDH. Write: anytime The SCI baud rate register is used to determine the baud rate of the SCI and to control the infrared modulation/demodulation submodule.
Table 8-3. IRSCI Transmit Pulse Width
TNP[1:0] 11 10 01 00 Narrow Pulse Width Reserved 1/32 1/16 3/16
NOTE The baud rate generator is disabled after reset and not started until the TE bit or the RE bit is set for the first time. The baud rate generator is disabled when (SBR[12:0] = 0 and IREN = 0) or (SBR[12:1] = 0 and IREN = 1). Writing to SCIBDH has no effect without writing to SCIBDL, because writing to SCIBDH puts the data in a temporary location until SCIBDL is written to.
8.3.2.2
SCI Control Register 1 (SCICR1)
7 6 5 4 3 2 1 0
R LOOPS W Reset 0 0 0 0 0 0 0 0 SCISWAI RSRC M WAKE ILT PE PT
Figure 8-5. SCI Control Register 1 (SCICR1)
Read: anytime Write: anytime
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Chapter 8 Serial Communication Interface (SCIV3)
Table 8-4. SCICR1 Field Descriptions
Field 7 LOOPS Description Loop Select Bit -- LOOPS enables loop operation. In loop operation, the RXD pin is disconnected from the SCI and the transmitter output is internally connected to the receiver input. Both the transmitter and the receiver must be enabled to use the loop function. 0 Normal operation enabled 1 Loop operation enabled The receiver input is determined by the RSRC bit. SCI Stop in Wait Mode Bit -- SCISWAI disables the SCI in wait mode. 0 SCI enabled in wait mode 1 SCI disabled in wait mode Receiver Source Bit -- When LOOPS = 1, the RSRC bit determines the source for the receiver shift register input. 0 Receiver input internally connected to transmitter output 1 Receiver input connected externally to transmitter Refer to Table 8-5. Data Format Mode Bit -- MODE determines whether data characters are eight or nine bits long. 0 One start bit, eight data bits, one stop bit 1 One start bit, nine data bits, one stop bit Wakeup Condition Bit -- WAKE determines which condition wakes up the SCI: a logic 1 (address mark) in the most significant bit position of a received data character or an idle condition on the RXD pin. 0 Idle line wakeup 1 Address mark wakeup Idle Line Type Bit -- ILT determines when the receiver starts counting logic 1s as idle character bits. The counting begins either after the start bit or after the stop bit. If the count begins after the start bit, then a string of logic 1s preceding the stop bit may cause false recognition of an idle character. Beginning the count after the stop bit avoids false idle character recognition, but requires properly synchronized transmissions. 0 Idle character bit count begins after start bit 1 Idle character bit count begins after stop bit Parity Enable Bit -- PE enables the parity function. When enabled, the parity function inserts a parity bit in the most significant bit position. 0 Parity function disabled 1 Parity function enabled Parity Type Bit -- PT determines whether the SCI generates and checks for even parity or odd parity. With even parity, an even number of 1s clears the parity bit and an odd number of 1s sets the parity bit. With odd parity, an odd number of 1s clears the parity bit and an even number of 1s sets the parity bit. 0 Even parity 1 Odd parity
6 SCISWAI 5 RSRC
4 M 3 WAKE
2 ILT
1 PE
0 PT
Table 8-5. Loop Functions
LOOPS 0 1 1 RSRC x 0 1 Normal operation Loop mode with transmitter output internally connected to receiver input Single-wire mode with TXD pin connected to receiver input Function
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Chapter 8 Serial Communication Interface (SCIV3)
8.3.2.3
SCI Control Register 2 (SCICR2)
7 6 5 4 3 2 1 0
R TIE W Reset 0 0 0 0 0 0 0 0 TCIE RIE ILIE TE RE RWU SBK
Figure 8-6. SCI Control Register 2 (SCICR2)
Read: anytime Write: anytime
Table 8-6. SCICR2 Field Descriptions
Field 7 TIE Description Transmitter Interrupt Enable Bit --TIE enables the transmit data register empty flag, TDRE, to generate interrupt requests. 0 TDRE interrupt requests disabled 1 TDRE interrupt requests enabled Transmission Complete Interrupt Enable Bit -- TCIE enables the transmission complete flag, TC, to generate interrupt requests. 0 TC interrupt requests disabled 1 TC interrupt requests enabled Receiver Full Interrupt Enable Bit -- RIE enables the receive data register full flag, RDRF, or the overrun flag, OR, to generate interrupt requests. 0 RDRF and OR interrupt requests disabled 1 RDRF and OR interrupt requests enabled Idle Line Interrupt Enable Bit -- ILIE enables the idle line flag, IDLE, to generate interrupt requests. 0 IDLE interrupt requests disabled 1 IDLE interrupt requests enabled Transmitter Enable Bit -- TE enables the SCI transmitter and configures the TXD pin as being controlled by the SCI. The TE bit can be used to queue an idle preamble. 0 Transmitter disabled 1 Transmitter enabled Receiver Enable Bit -- RE enables the SCI receiver. 0 Receiver disabled 1 Receiver enabled Receiver Wakeup Bit -- Standby state 0 Normal operation. 1 RWU enables the wakeup function and inhibits further receiver interrupt requests. Normally, hardware wakes the receiver by automatically clearing RWU. Send Break Bit -- Toggling SBK sends one break character (10 or 11 logic 0s, respectively 13 or 14 logics 0s if BRK13 is set). Toggling implies clearing the SBK bit before the break character has finished transmitting. As long as SBK is set, the transmitter continues to send complete break characters (10 or 11 bits, respectively 13 or 14 bits). 0 No break characters 1 Transmit break characters
6 TCIE
5 RIE
4 ILIE 3 TE
2 RE 1 RWU
0 SBK
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Chapter 8 Serial Communication Interface (SCIV3)
8.3.2.4
SCI Status Register 1 (SCISR1)
The SCISR1 and SCISR2 registers provide inputs to the MCU for generation of SCI interrupts. Also, these registers can be polled by the MCU to check the status of these bits. The flag-clearing procedures require that the status register be read followed by a read or write to the SCI data register. It is permissible to execute other instructions between the two steps as long as it does not compromise the handling of I/O. Note that the order of operations is important for flag clearing.
7 6 5 4 3 2 1 0
R W Reset
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-7. SCI Status Register 1 (SCISR1)
Read: anytime Write: has no meaning or effect
Table 8-7. SCISR1 Field Descriptions
Field 7 TDRE Description Transmit Data Register Empty Flag -- TDRE is set when the transmit shift register receives a byte from the SCI data register. When TDRE is 1, the transmit data register (SCIDRH/L) is empty and can receive a new value to transmit.Clear TDRE by reading SCI status register 1 (SCISR1), with TDRE set and then writing to SCI data register low (SCIDRL). 0 No byte transferred to transmit shift register 1 Byte transferred to transmit shift register; transmit data register empty Transmit Complete Flag -- TC is set low when there is a transmission in progress or when a preamble or break character is loaded. TC is set high when the TDRE flag is set and no data, preamble, or break character is being transmitted.When TC is set, the TXD pin becomes idle (logic 1). Clear TC by reading SCI status register 1 (SCISR1) with TC set and then writing to SCI data register low (SCIDRL). TC is cleared automatically when data, preamble, or break is queued and ready to be sent. TC is cleared in the event of a simultaneous set and clear of the TC flag (transmission not complete). 0 Transmission in progress 1 No transmission in progress Receive Data Register Full Flag -- RDRF is set when the data in the receive shift register transfers to the SCI data register. Clear RDRF by reading SCI status register 1 (SCISR1) with RDRF set and then reading SCI data register low (SCIDRL). 0 Data not available in SCI data register 1 Received data available in SCI data register Idle Line Flag1 -- IDLE is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M = 1) appear on the receiver input. After the IDLE flag is cleared, a valid frame must again set the RDRF flag before an idle condition can set the IDLE flag.Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE set and then reading SCI data register low (SCIDRL). 0 Receiver input is either active now or has never become active since the IDLE flag was last cleared 1 Receiver input has become idle
6 TC
5 RDRF
4 IDLE
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Chapter 8 Serial Communication Interface (SCIV3)
Table 8-7. SCISR1 Field Descriptions (continued)
Field 3 OR Description Overrun Flag2 -- OR is set when software fails to read the SCI data register before the receive shift register receives the next frame. The OR bit is set immediately after the stop bit has been completely received for the second frame. The data in the shift register is lost, but the data already in the SCI data registers is not affected. Clear OR by reading SCI status register 1 (SCISR1) with OR set and then reading SCI data register low (SCIDRL). 0 No overrun 1 Overrun Noise Flag -- NF is set when the SCI detects noise on the receiver input. NF bit is set during the same cycle as the RDRF flag but does not get set in the case of an overrun. Clear NF by reading SCI status register 1(SCISR1), and then reading SCI data register low (SCIDRL). 0 No noise 1 Noise Framing Error Flag -- FE is set when a logic 0 is accepted as the stop bit. FE bit is set during the same cycle as the RDRF flag but does not get set in the case of an overrun. FE inhibits further data reception until it is cleared. Clear FE by reading SCI status register 1 (SCISR1) with FE set and then reading the SCI data register low (SCIDRL). 0 No framing error 1 Framing error Parity Error Flag -- PF is set when the parity enable bit (PE) is set and the parity of the received data does not match the parity type bit (PT). PF bit is set during the same cycle as the RDRF flag but does not get set in the case of an overrun. Clear PF by reading SCI status register 1 (SCISR1), and then reading SCI data register low (SCIDRL). 0 No parity error 1 Parity error
2 NF
1 FE
0 PF
1 2
When the receiver wakeup bit (RWU) is set, an idle line condition does not set the IDLE flag. The OR flag may read back as set when RDRF flag is clear. This may happen if the following sequence of events occurs: 1. After the first frame is received, read status register SCISR1 (returns RDRF set and OR flag clear); 2. Receive second frame without reading the first frame in the data register (the second frame is not received and OR flag is set); 3. Read data register SCIDRL (returns first frame and clears RDRF flag in the status register); 4. Read status register SCISR1 (returns RDRF clear and OR set). Event 3 may be at exactly the same time as event 2 or any time after. When this happens, a dummy SCIDRL read following event 4 will be required to clear the OR flag if further frames are to be received.
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Chapter 8 Serial Communication Interface (SCIV3)
8.3.2.5
SCI Status Register 2 (SCISR2)
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0 BRK13 TXDIR 0
RAF
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-8. SCI Status Register 2 (SCISR2)
Read: anytime Write: anytime
Table 8-8. SCISR2 Field Descriptions
Field 2 BRK13 Description Break Transmit Character Length -- This bit determines whether the transmit break character is 10 or 11 bit respectively 13 or 14 bits long. The detection of a framing error is not affected by this bit. 0 Break character is 10 or 11 bit long 1 Break character is 13 or 14 bit long Transmitter Pin Data Direction in Single-Wire Mode -- This bit determines whether the TXD pin is going to be used as an input or output, in the single-wire mode of operation. This bit is only relevant in the single-wire mode of operation. 0 TXD pin to be used as an input in single-wire mode 1 TXD pin to be used as an output in single-wire mode Receiver Active Flag -- RAF is set when the receiver detects a logic 0 during the RT1 time period of the start bit search. RAF is cleared when the receiver detects an idle character. 0 No reception in progress 1 Reception in progress
1 TXDIR
0 RAF
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Chapter 8 Serial Communication Interface (SCIV3)
8.3.2.6
SCI Data Registers (SCIDRH and SCIDRL)
7 6 5 4 3 2 1 0
R W Reset
R8 T8 0 0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-9. SCI Data Register High (SCIDRH)
Table 8-9. SCIDRH Field Descriptions
Field 7 R8 6 T8 Description Received Bit 8 -- R8 is the ninth data bit received when the SCI is configured for 9-bit data format (M = 1). Transmit Bit 8 -- T8 is the ninth data bit transmitted when the SCI is configured for 9-bit data format (M = 1).
7
6
5
4
3
2
1
0
R W Reset
R7 T7 0
R6 T6 0
R5 T5 0
R4 T4 0
R3 T3 0
R2 T2 0
R1 T1 0
R0 T0 0
Figure 8-10. SCI Data Register Low (SCIDRL)
Read: anytime; reading accesses SCI receive data register Write: anytime; writing accesses SCI transmit data register; writing to R8 has no effect
Table 8-10. SCIDRL Field Descriptions
Field 7:0 R[7:0] T[7:0} Description Received bits 7 through 0 -- For 9-bit or 8-bit data formats Transmit bits 7 through 0 -- For 9-bit or 8-bit formats
NOTE If the value of T8 is the same as in the previous transmission, T8 does not have to be rewritten.The same value is transmitted until T8 is rewritten In 8-bit data format, only SCI data register low (SCIDRL) needs to be accessed. When transmitting in 9-bit data format and using 8-bit write instructions, write first to SCI data register high (SCIDRH) then to SCIDRL.
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Chapter 8 Serial Communication Interface (SCIV3)
8.4
Functional Description
This subsection provides a complete functional description of the SCI block, detailing the operation of the design from the end user's perspective in a number of descriptions. Figure 8-11 shows the structure of the SCI module. The SCI allows full duplex, asynchronous, serial communication between the CPU and remote devices, including other CPUs. The SCI transmitter and receiver operate independently, although they use the same baud rate generator. The CPU monitors the status of the SCI, writes the data to be transmitted, and processes received data.
IREN SCI DATA REGISTER RXD INFRARED RECEIVE DECODER R8 Ir_RXD SCRXD RECEIVE SHIFT REGISTER RE R16XCLK RECEIVE AND WAKEUP CONTROL RWU LOOPS RSRC M BAUD RATE GENERATOR WAKE DATA FORMAT CONTROL ILT PE SBR12-SBR0 PT TE /16 TRANSMIT CONTROL LOOPS SBK RSRC T8 TRANSMIT SHIFT REGISTER SCI DATA REGISTER R16XCLK R32XCLK TNP[1:0] IREN INFRARED TRANSMIT ENCODER TXD Ir_TXD TDRE TC TCIE SCTXD TC TDRE TIE SCI Interrupt Request RIE NF FE PF RAF IDLE RDRF OR RDRF/OR ILIE IDLE
BUS CLOCK
Figure 8-11. Detailed SCI Block Diagram
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Chapter 8 Serial Communication Interface (SCIV3)
8.4.1
Infrared Interface Submodule
This module provides the capability of transmitting narrow pulses to an IR LED and receiving narrow pulses and transforming them to serial bits, which are sent to the SCI. The IrDA physical layer specification defines a half-duplex infrared communication link for exchange data. The full standard includes data rates up to 16 Mbits/s. This design covers only data rates between 2.4 kbits/s and 115.2 kbits/s. The infrared submodule consists of two major blocks: the transmit encoder and the receive decoder. The SCI transmits serial bits of data which are encoded by the infrared submodule to transmit a narrow pulse for every 0 bit. No pulse is transmitted for every 1 bit. When receiving data, the IR pulses should be detected using an IR photo diode and transformed to CMOS levels by the IR receive decoder (external from the MCU). The narrow pulses are then stretched by the infrared submodule to get back to a serial bit stream to be received by the SCI. The polarity of transmitted pulses and expected receive pulses can be inverted so that a direct connection can be made to external IrDA transceiver modules that uses active low pulses. The infrared submodule receives its clock sources from the SCI. One of these two clocks are selected in the infrared submodule in order to generate either 3/16, 1/16, or 1/32 narrow pulses during transmission. The infrared block receives two clock sources from the SCI, R16XCLK, and R32XCLK, which are configured to generate the narrow pulse width during transmission. The R16XCLK and R32XCLK are internal clocks with frequencies 16 and 32 times the baud rate respectively. Both R16XCLK and R32XCLK clocks are used for transmitting data. The receive decoder uses only the R16XCLK clock.
8.4.1.1
Infrared Transmit Encoder
The infrared transmit encoder converts serial bits of data from transmit shift register to the TXD pin. A narrow pulse is transmitted for a 0 bit and no pulse for a 1 bit. The narrow pulse is sent in the middle of the bit with a duration of 1/32, 1/16, or 3/16 of a bit time.
8.4.1.2
Infrared Receive Decoder
The infrared receive block converts data from the RXD pin to the receive shift register. A narrow pulse is expected for each 0 received and no pulse is expected for each 1 received. This receive decoder meets the edge jitter requirement as defined by the IrDA serial infrared physical layer specification.
8.4.2
Data Format
The SCI uses the standard NRZ mark/space data format. When Infrared is enabled, the SCI uses RZI data format where 0s are represented by light pulses and 1s remain low. See Figure 8-12.
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Chapter 8 Serial Communication Interface (SCIV3)
8-BIT DATA FORMAT (BIT M IN SCICR1 CLEAR) START BIT
POSSIBLE PARITY BIT BIT 6 BIT 7 STOP BIT
BIT 0
BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
NEXT START BIT
STANDARD SCI DATA
INFRARED SCI DATA
9-BIT DATA FORMAT (BIT M IN SCICR1 SET) START BIT BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7
POSSIBLE PARITY BIT BIT 8 STOP BIT
NEXT START BIT
STANDARD SCI DATA
INFRARED SCI DATA
Figure 8-12. SCI Data Formats
Each data character is contained in a frame that includes a start bit, eight or nine data bits, and a stop bit. Clearing the M bit in SCI control register 1 configures the SCI for 8-bit data characters. A frame with eight data bits has a total of 10 bits. Setting the M bit configures the SCI for nine-bit data characters. A frame with nine data bits has a total of 11 bits
Table 8-11. Example of 8-bit Data Formats
Start Bit 1 1 1
1
Data Bits 8 7 7
Address Bits 0 0 1
1
Parity Bits 0 1 0
Stop Bit 1 1 1
The address bit identifies the frame as an address character. See Section 8.4.5.6, "Receiver Wakeup".
When the SCI is configured for 9-bit data characters, the ninth data bit is the T8 bit in SCI data register high (SCIDRH). It remains unchanged after transmission and can be used repeatedly without rewriting it. A frame with nine data bits has a total of 11 bits.
Table 8-12. Example of 9-Bit Data Formats
Start Bit 1 1 1
1
Data Bits 9 8 8
Address Bits 0 0 11
Parity Bits 0 1 0
Stop Bit 1 1 1
The address bit identifies the frame as an address character. See Section 8.4.5.6, "Receiver Wakeup".
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Chapter 8 Serial Communication Interface (SCIV3)
8.4.3
Baud Rate Generation
A 13-bit modulus counter in the baud rate generator derives the baud rate for both the receiver and the transmitter. The value from 0 to 8191 written to the SBR[12:0] bits determines the module clock divisor. The SBR bits are in the SCI baud rate registers (SCIBDH and SCIBDL). The baud rate clock is synchronized with the bus clock and drives the receiver. The baud rate clock divided by 16 drives the transmitter. The receiver has an acquisition rate of 16 samples per bit time. Baud rate generation is subject to one source of error: * Integer division of the module clock may not give the exact target frequency. Table 8-13 lists some examples of achieving target baud rates with a module clock frequency of 10.2 MHz. When IREN = 0 then, SCI baud rate = SCI module clock / (16 * SCIBR[12:0])
Table 8-13. Baud Rates (Example: Module Clock = 10.2 MHz)
Bits SBR[12-0] 17 33 66 133 266 531 1062 2125 4250 5795 Receiver Clock (Hz) 600,000.0 309,090.9 154,545.5 76,691.7 38,345.9 19,209.0 9604.5 4800.0 2400.0 1760.1 Transmitter Clock (Hz) 37,500.0 19,318.2 9659.1 4793.2 2396.6 1200.6 600.3 300.0 150.0 110.0 Target Baud Rate 38,400 19,200 9600 4800 2400 1200 600 300 150 110 Error (%) 2.3 .62 .62 .14 .14 .11 .05 .00 .00 .00
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Chapter 8 Serial Communication Interface (SCIV3)
8.4.4
Transmitter
INTERNAL BUS
BUS CLOCK
BAUD DIVIDER
/ 16
SCI DATA REGISTERS
STOP
SBR12-SBR0
11-BIT TRANSMIT SHIFT REGISTER 8 7 6 5 4 3 2 1 0
START
SCTXD L
M
H
MSB
PREAMBLE (ALL ONES)
LOAD FROM SCIDR
T8
LOOP CONTROL
TO RECEIVER
PE PT
PARITY GENERATION
BREAK (ALL 0s)
SHIFT ENABLE
LOOPS RSRC
TRANSMITTER CONTROL
TDRE INTERRUPT REQUEST
TDRE TIE TC TCIE
TE
SBK
TC INTERRUPT REQUEST
Figure 8-13. Transmitter Block Diagram
8.4.4.1
Transmitter Character Length
The SCI transmitter can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI control register 1 (SCICR1) determines the length of data characters. When transmitting 9-bit data, bit T8 in SCI data register high (SCIDRH) is the ninth bit (bit 8).
8.4.4.2
Character Transmission
To transmit data, the MCU writes the data bits to the SCI data registers (SCIDRH/SCIDRL), which in turn are transferred to the transmitter shift register. The transmit shift register then shifts a frame out through the TXD pin, after it has prefaced them with a start bit and appended them with a stop bit. The SCI data registers (SCIDRH and SCIDRL) are the write-only buffers between the internal data bus and the transmit shift register. The SCI also sets a flag, the transmit data register empty flag (TDRE), every time it transfers data from the buffer (SCIDRH/L) to the transmitter shift register. The transmit driver routine may respond to this
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Chapter 8 Serial Communication Interface (SCIV3)
flag by writing another byte to the transmitter buffer (SCIDRH/SCIDRL), while the shift register is shifting out the first byte. To initiate an SCI transmission: 1. Configure the SCI: a) Select a baud rate. Write this value to the SCI baud registers (SCIBDH/L) to begin the baud rate generator. Remember that the baud rate generator is disabled when the baud rate is 0. Writing to the SCIBDH has no effect without also writing to SCIBDL. b) Write to SCICR1 to configure word length, parity, and other configuration bits (LOOPS, RSRC, M, WAKE, ILT, PE, and PT). c) Enable the transmitter, interrupts, receive, and wake up as required, by writing to the SCICR2 register bits (TIE, TCIE, RIE, ILIE, TE, RE, RWU, and SBK). A preamble or idle character will now be shifted out of the transmitter shift register. 2. Transmit procedure for each byte: a) Poll the TDRE flag by reading the SCISR1 or responding to the TDRE interrupt. Keep in mind that the TDRE bit resets to 1. b) If the TDRE flag is set, write the data to be transmitted to SCIDRH/L, where the ninth bit is written to the T8 bit in SCIDRH if the SCI is in 9-bit data format. A new transmission will not result until the TDRE flag has been cleared. 3. Repeat step 2 for each subsequent transmission. NOTE The TDRE flag is set when the shift register is loaded with the next data to be transmitted from SCIDRH/L, which happens, generally speaking, a little over half-way through the stop bit of the previous frame. Specifically, this transfer occurs 9/16ths of a bit time AFTER the start of the stop bit of the previous frame. Writing the TE bit from 0 to a 1 automatically loads the transmit shift register with a preamble of 10 logic 1s (if M = 0) or 11 logic 1s (if M = 1). After the preamble shifts out, control logic transfers the data from the SCI data register into the transmit shift register. A logic 0 start bit automatically goes into the least significant bit position of the transmit shift register. A logic 1 stop bit goes into the most significant bit position. Hardware supports odd or even parity. When parity is enabled, the most significant bit (MSB) of the data character is the parity bit. The transmit data register empty flag, TDRE, in SCI status register 1 (SCISR1) becomes set when the SCI data register transfers a byte to the transmit shift register. The TDRE flag indicates that the SCI data register can accept new data from the internal data bus. If the transmit interrupt enable bit, TIE, in SCI control register 2 (SCICR2) is also set, the TDRE flag generates a transmitter interrupt request. When the transmit shift register is not transmitting a frame, the TXD pin goes to the idle condition, logic 1. If at any time software clears the TE bit in SCI control register 2 (SCICR2), the transmitter enable signal goes low and the transmit signal goes idle.
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If software clears TE while a transmission is in progress (TC = 0), the frame in the transmit shift register continues to shift out. To avoid accidentally cutting off the last frame in a message, always wait for TDRE to go high after the last frame before clearing TE. To separate messages with preambles with minimum idle line time, use this sequence between messages: 1. Write the last byte of the first message to SCIDRH/L. 2. Wait for the TDRE flag to go high, indicating the transfer of the last frame to the transmit shift register. 3. Queue a preamble by clearing and then setting the TE bit. 4. Write the first byte of the second message to SCIDRH/L.
8.4.4.3
Break Characters
Writing a logic 1 to the send break bit, SBK, in SCI control register 2 (SCICR2) loads the transmit shift register with a break character. A break character contains all logic 0s and has no start, stop, or parity bit. Break character length depends on the M bit in SCI control register 1 (SCICR1). As long as SBK is at logic 1, transmitter logic continuously loads break characters into the transmit shift register. After software clears the SBK bit, the shift register finishes transmitting the last break character and then transmits at least one logic 1. The automatic logic 1 at the end of a break character guarantees the recognition of the start bit of the next frame. The SCI recognizes a break character when a start bit is followed by eight or nine logic 0 data bits and a logic 0 where the stop bit should be. Receiving a break character has these effects on SCI registers: * Sets the framing error flag, FE * Sets the receive data register full flag, RDRF * Clears the SCI data registers (SCIDRH/L) * May set the overrun flag, OR, noise flag, NF, parity error flag, PE, or the receiver active flag, RAF (see Section 8.3.2.4, "SCI Status Register 1 (SCISR1)" and Section 8.3.2.5, "SCI Status Register 2 (SCISR2)").
8.4.4.4
Idle Characters
An idle character (or preamble) contains all logic 1s and has no start, stop, or parity bit. Idle character length depends on the M bit in SCI control register 1 (SCICR1). The preamble is a synchronizing idle character that begins the first transmission initiated after writing the TE bit from 0 to 1. If the TE bit is cleared during a transmission, the TXD pin becomes idle after completion of the transmission in progress. Clearing and then setting the TE bit during a transmission queues an idle character to be sent after the frame currently being transmitted. NOTE When queueing an idle character, return the TE bit to logic 1 before the stop bit of the current frame shifts out through the TXD pin. Setting TE after the stop bit appears on TXD causes data previously written to the SCI data register to be lost. Toggle the TE bit for a queued idle character while the
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Chapter 8 Serial Communication Interface (SCIV3)
TDRE flag is set and immediately before writing the next byte to the SCI data register. If the TE bit is clear and the transmission is complete, the SCI is not the master of the TXD pin
8.4.5
Receiver
INTERNAL BUS
SBR12-SBR0
SCI DATA REGISTER
11-BIT RECEIVE SHIFT REGISTER 8 7 6 5 4 3 2 1 0
SCRXD
DATA RECOVERY ALL ONES
H
RE RAF
MSB
FROM TXD PIN OR TRANSMITTER
LOOP CONTROL
LOOPS RSRC
FE M WAKE ILT PE PT WAKEUP LOGIC NF PE RWU
PARITY CHECKING IDLE ILIE RDRF
R8
IDLE INTERRUPT REQUEST
RDRF/OR INTERRUPT REQUEST RIE
OR
Figure 8-14. SCI Receiver Block Diagram
8.4.5.1
Receiver Character Length
The SCI receiver can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI control register 1 (SCICR1) determines the length of data characters. When receiving 9-bit data, bit R8 in SCI data register high (SCIDRH) is the ninth bit (bit 8).
8.4.5.2
Character Reception
During an SCI reception, the receive shift register shifts a frame in from the RXD pin. The SCI data register is the read-only buffer between the internal data bus and the receive shift register. After a complete frame shifts into the receive shift register, the data portion of the frame transfers to the SCI data register. The receive data register full flag, RDRF, in SCI status register 1 (SCISR1) becomes set,
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START L
STOP
BUS CLOCK
BAUD DIVIDER
Chapter 8 Serial Communication Interface (SCIV3)
indicating that the received byte can be read. If the receive interrupt enable bit, RIE, in SCI control register 2 (SCICR2) is also set, the RDRF flag generates an RDRF interrupt request.
8.4.5.3
Data Sampling
The receiver samples the RXD pin at the RT clock rate. The RT clock is an internal signal with a frequency 16 times the baud rate. To adjust for baud rate mismatch, the RT clock (see Figure 8-15) is re-synchronized: * After every start bit * After the receiver detects a data bit change from logic 1 to logic 0 (after the majority of data bit samples at RT8, RT9, and RT10 returns a valid logic 1 and the majority of the next RT8, RT9, and RT10 samples returns a valid logic 0) To locate the start bit, data recovery logic does an asynchronous search for a logic 0 preceded by three logic 1s. When the falling edge of a possible start bit occurs, the RT clock begins to count to 16.
START BIT RXD SAMPLES 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 LSB
START BIT QUALIFICATION
START BIT VERIFICATION
DATA SAMPLING
RT CLOCK RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT2 RT3
RT4
RT5
RT6
RT7
RT8
RT9
RT1
RT2
RT3
RT10
RT11
RT12
RT13
RT14
RT15
RT CLOCK COUNT RESET RT CLOCK
Figure 8-15. Receiver Data Sampling
To verify the start bit and to detect noise, data recovery logic takes samples at RT3, RT5, and RT7. Table 8-14 summarizes the results of the start bit verification samples.
Table 8-14. Start Bit Verification
RT3, RT5, and RT7 Samples 000 001 010 011 100 101 110 111 Start Bit Verification Yes Yes Yes No Yes No No No Noise Flag 0 1 1 0 1 0 0 0
If start bit verification is not successful, the RT clock is reset and a new search for a start bit begins.
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To determine the value of a data bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 8-15 summarizes the results of the data bit samples.
Table 8-15. Data Bit Recovery
RT8, RT9, and RT10 Samples 000 001 010 011 100 101 110 111 Data Bit Determination 0 0 0 1 0 1 1 1 Noise Flag 0 1 1 1 1 1 1 0
NOTE The RT8, RT9, and RT10 samples do not affect start bit verification. If any or all of the RT8, RT9, and RT10 start bit samples are logic 1s following a successful start bit verification, the noise flag (NF) is set and the receiver assumes that the bit is a start bit (logic 0). To verify a stop bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 8-16 summarizes the results of the stop bit samples.
Table 8-16. Stop Bit Recovery
RT8, RT9, and RT10 Samples 000 001 010 011 100 101 110 111 Framing Error Flag 1 1 1 0 1 0 0 0 Noise Flag 0 1 1 1 1 1 1 0
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Chapter 8 Serial Communication Interface (SCIV3)
In Figure 8-16 the verification samples RT3 and RT5 determine that the first low detected was noise and not the beginning of a start bit. The RT clock is reset and the start bit search begins again. The noise flag is not set because the noise occurred before the start bit was found.
START BIT RXD SAMPLES 1 1 1 0 1 1 1 0 0 0 0 0 0 0 LSB
RT CLOCK RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT1 RT1 RT2
RT3
RT4
RT5
RT6
RT7
RT8
RT9
RT1
RT2 LSB RT6
RT10
RT11
RT12
RT13
RT14
RT15
RT CLOCK COUNT RESET RT CLOCK
Figure 8-16. Start Bit Search Example 1
In Figure 8-17, verification sample at RT3 is high. The RT3 sample sets the noise flag. Although the perceived bit time is misaligned, the data samples RT8, RT9, and RT10 are within the bit time and data recovery is successful.
PERCEIVED START BIT ACTUAL START BIT RXD SAMPLES 1 1 1 1 1 0 1 0 0 0 0 0
RT CLOCK RT1 RT1 RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT6
RT7
RT8
RT9
RT1
RT2
RT3
RT4
RT16
RT5
RT10
RT11
RT12
RT13
RT14
RT15
RT CLOCK COUNT RESET RT CLOCK
Figure 8-17. Start Bit Search Example 2
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Chapter 8 Serial Communication Interface (SCIV3)
In Figure 8-18, a large burst of noise is perceived as the beginning of a start bit, although the test sample at RT5 is high. The RT5 sample sets the noise flag. Although this is a worst-case misalignment of perceived bit time, the data samples RT8, RT9, and RT10 are within the bit time and data recovery is successful.
PERCEIVED START BIT ACTUAL START BIT RXD SAMPLES 1 1 1 0 0 1 0 0 0 0 LSB
RT CLOCK RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8
RT9
RT1
RT2
RT3
RT4
RT5
RT6
RT7
RT8 LSB RT2
RT10
RT11
RT12
RT13
RT14
RT15
RT CLOCK COUNT RESET RT CLOCK
Figure 8-18. Start Bit Search Example 3
Figure 8-19 shows the effect of noise early in the start bit time. Although this noise does not affect proper synchronization with the start bit time, it does set the noise flag.
PERCEIVED AND ACTUAL START BIT RXD SAMPLES 1 1 1 1 1 1 1 1 1 0 1 0
RT CLOCK RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT2
RT3
RT4
RT5
RT6
RT7
RT8
RT9
RT16
RT1
RT10
RT11
RT12
RT13
RT14
RT15
RT CLOCK COUNT RESET RT CLOCK
Figure 8-19. Start Bit Search Example 4
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Figure 8-20 shows a burst of noise near the beginning of the start bit that resets the RT clock. The sample after the reset is low but is not preceded by three high samples that would qualify as a falling edge. Depending on the timing of the start bit search and on the data, the frame may be missed entirely or it may set the framing error flag.
START BIT NO START BIT FOUND 1 1 1 1 1 1 1 1 1 0 0 1 1 0 0 0 0 0 0 0 0 LSB
RXD SAMPLES
RT CLOCK RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT2
RT3
RT4
RT5
RT6
RT7
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1 LSB RT2
RT CLOCK COUNT RESET RT CLOCK
Figure 8-20. Start Bit Search Example 5
In Figure 8-21, a noise burst makes the majority of data samples RT8, RT9, and RT10 high. This sets the noise flag but does not reset the RT clock. In start bits only, the RT8, RT9, and RT10 data samples are ignored.
START BIT RXD SAMPLES 1 1 1 1 1 1 1 1 1 0 0 0 0 1 0 1
RT CLOCK RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT2
RT3
RT4
RT5
RT6
RT7
RT8
RT9
RT1
RT10
RT11
RT12
RT13
RT14
RT15
RT CLOCK COUNT RESET RT CLOCK
Figure 8-21. Start Bit Search Example 6
8.4.5.4
Framing Errors
If the data recovery logic does not detect a logic 1 where the stop bit should be in an incoming frame, it sets the framing error flag, FE, in SCI status register 1 (SCISR1). A break character also sets the FE flag because a break character has no stop bit. The FE flag is set at the same time that the RDRF flag is set.
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8.4.5.5
Baud Rate Tolerance
A transmitting device may be operating at a baud rate below or above the receiver baud rate. Accumulated bit time misalignment can cause one of the three stop bit data samples (RT8, RT9, and RT10) to fall outside the actual stop bit. A noise error will occur if the RT8, RT9, and RT10 samples are not all the same logical values. A framing error will occur if the receiver clock is misaligned in such a way that the majority of the RT8, RT9, and RT10 stop bit samples are a logic 0. As the receiver samples an incoming frame, it re-synchronizes the RT clock on any valid falling edge within the frame. Re synchronization within frames will correct a misalignment between transmitter bit times and receiver bit times. 8.4.5.5.1 Slow Data Tolerance
Figure 8-22 shows how much a slow received frame can be misaligned without causing a noise error or a framing error. The slow stop bit begins at RT8 instead of RT1 but arrives in time for the stop bit data samples at RT8, RT9, and RT10.
MSB STOP
RECEIVER RT CLOCK RT10 RT11 RT12 RT13 RT14 RT15 RT16 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9
DATA SAMPLES
Figure 8-22. Slow Data
Let's take RTr as receiver RT clock and RTt as transmitter RT clock. For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles +7 RTr cycles =151 RTr cycles to start data sampling of the stop bit. With the misaligned character shown in Figure 8-22, the receiver counts 151 RTr cycles at the point when the count of the transmitting device is 9 bit times x 16 RTt cycles = 144 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a slow 8-bit data character with no errors is: ((151 - 144) / 151) x 100 = 4.63% For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 7 RTr cycles = 167 RTr cycles to start data sampling of the stop bit. With the misaligned character shown in Figure 8-22, the receiver counts 167 RTr cycles at the point when the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a slow 9-bit character with no errors is: ((167 - 160) / 167) X 100 = 4.19%
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8.4.5.5.2
Fast Data Tolerance
Figure 8-23 shows how much a fast received frame can be misaligned. The fast stop bit ends at RT10 instead of RT16 but continues to be sampled at RT8, RT9, and RT10.
STOP
IDLE OR NEXT FRAME
RECEIVER RT CLOCK RT10 RT11 RT12 RT13 RT14 RT15 RT16 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9
DATA SAMPLES
Figure 8-23. Fast Data
For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles + 10 RTr cycles = 154 RTr cycles to finish data sampling of the stop bit. With the misaligned character shown in Figure 8-23, the receiver counts 154 RTr cycles at the point when the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a fast 8-bit character with no errors is: ((160 - 154) / 160) x 100 = 3.75% For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 10 RTr cycles = 170 RTr cycles to finish data sampling of the stop bit. With the misaligned character shown in Figure 8-23, the receiver counts 170 RTr cycles at the point when the count of the transmitting device is 11 bit times x 16 RTt cycles = 176 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a fast 9-bit character with no errors is: ((176 - 170) / 176) x 100 = 3.40%
8.4.5.6
Receiver Wakeup
To enable the SCI to ignore transmissions intended only for other receivers in multiple-receiver systems, the receiver can be put into a standby state. Setting the receiver wakeup bit, RWU, in SCI control register 2 (SCICR2) puts the receiver into standby state during which receiver interrupts are disabled.The SCI will continue to load the receive data into the SCIDRH/L registers, but it will not set the RDRF flag. The transmitting device can address messages to selected receivers by including addressing information in the initial frame or frames of each message. The WAKE bit in SCI control register 1 (SCICR1) determines how the SCI is brought out of the standby state to process an incoming message. The WAKE bit enables either idle line wakeup or address mark wakeup.
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Chapter 8 Serial Communication Interface (SCIV3)
8.4.5.6.1
Idle Input Line Wakeup (WAKE = 0)
In this wakeup method, an idle condition on the RXD pin clears the RWU bit and wakes up the SCI. The initial frame or frames of every message contain addressing information. All receivers evaluate the addressing information, and receivers for which the message is addressed process the frames that follow. Any receiver for which a message is not addressed can set its RWU bit and return to the standby state. The RWU bit remains set and the receiver remains on standby until another idle character appears on the RXD pin. Idle line wakeup requires that messages be separated by at least one idle character and that no message contains idle characters. The idle character that wakes a receiver does not set the receiver idle bit, IDLE, or the receive data register full flag, RDRF. The idle line type bit, ILT, determines whether the receiver begins counting logic 1s as idle character bits after the start bit or after the stop bit. ILT is in SCI control register 1 (SCICR1). 8.4.5.6.2 Address Mark Wakeup (WAKE = 1)
In this wakeup method, a logic 1 in the most significant bit (MSB) position of a frame clears the RWU bit and wakes up the SCI. The logic 1 in the MSB position marks a frame as an address frame that contains addressing information. All receivers evaluate the addressing information, and the receivers for which the message is addressed process the frames that follow. Any receiver for which a message is not addressed can set its RWU bit and return to the standby state. The RWU bit remains set and the receiver remains on standby until another address frame appears on the RXD pin. The logic 1 MSB of an address frame clears the receiver's RWU bit before the stop bit is received and sets the RDRF flag. Address mark wakeup allows messages to contain idle characters but requires that the MSB be reserved for use in address frames. NOTE With the WAKE bit clear, setting the RWU bit after the RXD pin has been idle can cause the receiver to wake up immediately.
8.4.6
Single-Wire Operation
Normally, the SCI uses two pins for transmitting and receiving. In single-wire operation, the RXD pin is disconnected from the SCI. The SCI uses the TXD pin for both receiving and transmitting.
TRANSMITTER TXD
RECEIVER
RXD
Figure 8-24. Single-Wire Operation (LOOPS = 1, RSRC = 1)
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Chapter 8 Serial Communication Interface (SCIV3)
Enable single-wire operation by setting the LOOPS bit and the receiver source bit, RSRC, in SCI control register 1 (SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Setting the RSRC bit connects the TXD pin to the receiver. Both the transmitter and receiver must be enabled (TE = 1 and RE = 1).The TXDIR bit (SCISR2[1]) determines whether the TXD pin is going to be used as an input (TXDIR = 0) or an output (TXDIR = 1) in this mode of operation.
8.4.7
Loop Operation
In loop operation the transmitter output goes to the receiver input. The RXD pin is disconnected from the SCI
.
TRANSMITTER
TXD
RECEIVER
RXD
Figure 8-25. Loop Operation (LOOPS = 1, RSRC = 0)
Enable loop operation by setting the LOOPS bit and clearing the RSRC bit in SCI control register 1 (SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Clearing the RSRC bit connects the transmitter output to the receiver input. Both the transmitter and receiver must be enabled (TE = 1 and RE = 1).
8.5
Interrupts
This section describes the interrupt originated by the SCI block.The MCU must service the interrupt requests. Table 8-17 lists the five interrupt sources of the SCI.
Table 8-17. SCI Interrupt Sources
Interrupt TDRE Source SCISR1[7] Local Enable TIE Description Active high level. Indicates that a byte was transferred from SCIDRH/L to the transmit shift register. Active high level. Indicates that a transmit is complete. Active high level. The RDRF interrupt indicates that received data is available in the SCI data register. Active high level. This interrupt indicates that an overrun condition has occurred. ILIE Active high level. Indicates that receiver input has become idle.
TC RDRF
SCISR1[6] SCISR1[5]
TCIE RIE
OR IDLE
SCISR1[3] SCISR1[4]
8.5.1
Description of Interrupt Operation
The SCI only originates interrupt requests. The following is a description of how the SCI makes a request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt number are
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chip dependent. The SCI only has a single interrupt line (SCI interrupt signal, active high operation) and all the following interrupts, when generated, are ORed together and issued through that port.
8.5.1.1
TDRE Description
The TDRE interrupt is set high by the SCI when the transmit shift register receives a byte from the SCI data register. A TDRE interrupt indicates that the transmit data register (SCIDRH/L) is empty and that a new byte can be written to the SCIDRH/L for transmission.Clear TDRE by reading SCI status register 1 with TDRE set and then writing to SCI data register low (SCIDRL).
8.5.1.2
TC Description
The TC interrupt is set by the SCI when a transmission has been completed.A TC interrupt indicates that there is no transmission in progress. TC is set high when the TDRE flag is set and no data, preamble, or break character is being transmitted. When TC is set, the TXD pin becomes idle (logic 1). Clear TC by reading SCI status register 1 (SCISR1) with TC set and then writing to SCI data register low (SCIDRL).TC is cleared automatically when data, preamble, or break is queued and ready to be sent.
8.5.1.3
RDRF Description
The RDRF interrupt is set when the data in the receive shift register transfers to the SCI data register. A RDRF interrupt indicates that the received data has been transferred to the SCI data register and that the byte can now be read by the MCU. The RDRF interrupt is cleared by reading the SCI status register one (SCISR1) and then reading SCI data register low (SCIDRL).
8.5.1.4
OR Description
The OR interrupt is set when software fails to read the SCI data register before the receive shift register receives the next frame. The newly acquired data in the shift register will be lost in this case, but the data already in the SCI data registers is not affected. The OR interrupt is cleared by reading the SCI status register one (SCISR1) and then reading SCI data register low (SCIDRL).
8.5.1.5
IDLE Description
The IDLE interrupt is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M = 1) appear on the receiver input. After the IDLE is cleared, a valid frame must again set the RDRF flag before an idle condition can set the IDLE flag. Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE set and then reading SCI data register low (SCIDRL).
8.5.2
Recovery from Wait Mode
The SCI interrupt request can be used to bring the CPU out of wait mode.
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MC9S12E128 Data Sheet, Rev. 1.07 276 Freescale Semiconductor
Chapter 9 Serial Peripheral Interface (SPIV3)
9.1 Introduction
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral devices. Software can poll the SPI status flags or the SPI operation can be interrupt driven.
9.1.1
Features
The SPIV3 includes these distinctive features: * Master mode and slave mode * Bidirectional mode * Slave select output * Mode fault error flag with CPU interrupt capability * Double-buffered data register * Serial clock with programmable polarity and phase * Control of SPI operation during wait mode
9.1.2
Modes of Operation
The SPI functions in three modes, run, wait, and stop. * Run Mode This is the basic mode of operation. * Wait Mode SPI operation in wait mode is a configurable low power mode, controlled by the SPISWAI bit located in the SPICR2 register. In wait mode, if the SPISWAI bit is clear, the SPI operates like in Run Mode. If the SPISWAI bit is set, the SPI goes into a power conservative state, with the SPI clock generation turned off. If the SPI is configured as a master, any transmission in progress stops, but is resumed after CPU goes into Run Mode. If the SPI is configured as a slave, reception and transmission of a byte continues, so that the slave stays synchronized to the master. * Stop Mode The SPI is inactive in stop mode for reduced power consumption. If the SPI is configured as a master, any transmission in progress stops, but is resumed after CPU goes into run mode. If the SPI is configured as a slave, reception and transmission of a byte continues, so that the slave stays synchronized to the master. This is a high level description only, detailed descriptions of operating modes are contained in Section 9.4, "Functional Description."
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9.1.3
Block Diagram
Figure 9-1 gives an overview on the SPI architecture. The main parts of the SPI are status, control, and data registers, shifter logic, baud rate generator, master/slave control logic, and port control logic.
SPI 2 SPI Control Register 1 BIDIROE SPI Control Register 2 2 SPC0 SPI Status Register SPIF SPI Interrupt Request Baud Rate Generator Counter Bus Clock Prescaler Clock Select SPPR 3 SPR 3 Shifter SPI Baud Rate Register LSBFE=1 8 SPI Data Register 8 LSBFE=0 MSB LSBFE=0 LSBFE=1 LSBFE=0 LSBFE=1 LSB data out data in Baud Rate Shift Clock Sample Clock MODF SPTEF Slave Control
CPOL
CPHA
MOSI
Interrupt Control
Phase + SCK in Slave Baud Rate Polarity Control Master Baud Rate Phase + SCK out Polarity Control Master Control
Port Control Logic
SCK
SS
Figure 9-1. SPI Block Diagram
9.2
External Signal Description
This section lists the name and description of all ports including inputs and outputs that do, or may, connect off chip. The SPIV3 module has a total of four external pins.
9.2.1
MOSI -- Master Out/Slave In Pin
This pin is used to transmit data out of the SPI module when it is configured as a master and receive data when it is configured as slave.
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9.2.2
MISO -- Master In/Slave Out Pin
This pin is used to transmit data out of the SPI module when it is configured as a slave and receive data when it is configured as master.
9.2.3
SS -- Slave Select Pin
This pin is used to output the select signal from the SPI module to another peripheral with which a data transfer is to take place when its configured as a master and its used as an input to receive the slave select signal when the SPI is configured as slave.
9.2.4
SCK -- Serial Clock Pin
This pin is used to output the clock with respect to which the SPI transfers data or receive clock in case of slave.
9.3
Memory Map and Register Definition
This section provides a detailed description of address space and registers used by the SPI. The memory map for the SPIV3 is given below in Table 9-1. The address listed for each register is the sum of a base address and an address offset. The base address is defined at the SoC level and the address offset is defined at the module level. Reads from the reserved bits return zeros and writes to the reserved bits have no effect.
9.3.1
Module Memory Map
Table 9-1. SPIV3 Memory Map
Address 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007
1 2
Use SPI Control Register 1 (SPICR1) SPI Control Register 2 (SPICR2) SPI Baud Rate Register (SPIBR) SPI Status Register (SPISR) Reserved SPI Data Register (SPIDR) Reserved Reserved
Access R/W R/W1 R/W1 R2 -- 2,3 R/W -- 2,3 -- 2,3
Certain bits are non-writable. Writes to this register are ignored. 3 Reading from this register returns all zeros.
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9.3.2
Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order.
Name SPICR1 R W R W R W R W R W R W R W R W = Unimplemented or Reserved Bit 7 6 5 4 3 2 2 Bit 0 SPIF 0 SPPR2 0 SPPR1 SPTEF 7 SPIE 0 6 SPE 0 5 SPTIE 0 4 MSTR 3 CPOL 2 CPHA 0 1 SSOE 0 LSBFE
SPICR2
MODFEN
BIDIROE 0
SPISWAI
SPC0
SPIBR
SPPR0 MODF
SPR2 0
SPR1 0
SPR0 0
SPISR
0
Reserved
SPIDR
Reserved
Reserved
Figure 9-2. SPI Register Summary
9.3.2.1
SPI Control Register 1 (SPICR1)
7 6 5 4 3 2 1 0
R SPIE W Reset 0 0 0 0 0 1 0 0 SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
Figure 9-3. SPI Control Register 1 (SPICR1)
Read: anytime Write: anytime
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Table 9-2. SPICR1 Field Descriptions
Field 7 SPIE 6 SPE Description SPI Interrupt Enable Bit -- This bit enables SPI interrupt requests, if SPIF or MODF status flag is set. 0 SPI interrupts disabled. 1 SPI interrupts enabled. SPI System Enable Bit -- This bit enables the SPI system and dedicates the SPI port pins to SPI system functions. If SPE is cleared, SPI is disabled and forced into idle state, status bits in SPISR register are reset. 0 SPI disabled (lower power consumption). 1 SPI enabled, port pins are dedicated to SPI functions. SPI Transmit Interrupt Enable -- This bit enables SPI interrupt requests, if SPTEF flag is set. 0 SPTEF interrupt disabled. 1 SPTEF interrupt enabled. SPI Master/Slave Mode Select Bit -- This bit selects, if the SPI operates in master or slave mode. Switching the SPI from master to slave or vice versa forces the SPI system into idle state. 0 SPI is in slave mode 1 SPI is in master mode SPI Clock Polarity Bit -- This bit selects an inverted or non-inverted SPI clock. To transmit data between SPI modules, the SPI modules must have identical CPOL values. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Active-high clocks selected. In idle state SCK is low. 1 Active-low clocks selected. In idle state SCK is high. SPI Clock Phase Bit -- This bit is used to select the SPI clock format. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Sampling of data occurs at odd edges (1,3,5,...,15) of the SCK clock 1 Sampling of data occurs at even edges (2,4,6,...,16) of the SCK clock Slave Select Output Enable -- The SS output feature is enabled only in master mode, if MODFEN is set, by asserting the SSOE as shown in Table 9-3. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. LSB-First Enable -- This bit does not affect the position of the MSB and LSB in the data register. Reads and writes of the data register always have the MSB in bit 7. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Data is transferred most significant bit first. 1 Data is transferred least significant bit first.
5 SPTIE 4 MSTR
3 CPOL
2 CPHA
1 SSOE 0 LSBFE
Table 9-3. SS Input / Output Selection
MODFEN 0 0 1 1 SSOE 0 1 0 1 Master Mode SS not used by SPI SS not used by SPI SS input with MODF feature SS is slave select output Slave Mode SS input SS input SS input SS input
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9.3.2.2
SPI Control Register 2 (SPICR2)
7 6 5 4 3 2 1 0
R W Reset
0
0
0 MODFEN BIDIROE 0
0 SPISWAI 0 0 SPC0 0
0
0
0
0
= Unimplemented or Reserved
Figure 9-4. SPI Control Register 2 (SPICR2)
Read: anytime Write: anytime; writes to the reserved bits have no effect
Table 9-4. SPICR2 Field Descriptions
Field 4 MODFEN Description Mode Fault Enable Bit -- This bit allows the MODF failure being detected. If the SPI is in master mode and MODFEN is cleared, then the SS port pin is not used by the SPI. In slave mode, the SS is available only as an input regardless of the value of MODFEN. For an overview on the impact of the MODFEN bit on the SS port pin configuration refer to Table 9-3. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 SS port pin is not used by the SPI 1 SS port pin with MODF feature Output Enable in the Bidirectional Mode of Operation -- This bit controls the MOSI and MISO output buffer of the SPI, when in bidirectional mode of operation (SPC0 is set). In master mode this bit controls the output buffer of the MOSI port, in slave mode it controls the output buffer of the MISO port. In master mode, with SPC0 set, a change of this bit will abort a transmission in progress and force the SPI into idle state. 0 Output buffer disabled 1 Output buffer enabled SPI Stop in Wait Mode Bit -- This bit is used for power conservation while in wait mode. 0 SPI clock operates normally in wait mode 1 Stop SPI clock generation when in wait mode Serial Pin Control Bit 0 -- This bit enables bidirectional pin configurations as shown in Table 9-5. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state
3 BIDIROE
1 SPISWAI 0 SPC0
Table 9-5. Bidirectional Pin Configurations
Pin Mode SPC0 BIDIROE MISO MOSI
Master Mode of Operation Normal Bidirectional 0 1 X 0 1 Slave Mode of Operation Normal Bidirectional 0 1 X 0 1 Slave Out Slave In Slave I/O Slave In MOSI not used by SPI Master In MISO not used by SPI Master Out Master In Master I/O
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9.3.2.3
SPI Baud Rate Register (SPIBR)
7 6 5 4 3 2 1 0
R W Reset
0 SPPR2 0 0 SPPR1 0 SPPR0 0
0 SPR2 0 0 SPR1 0 SPR0 0
= Unimplemented or Reserved
Figure 9-5. SPI Baud Rate Register (SPIBR)
Read: anytime Write: anytime; writes to the reserved bits have no effect
Table 9-6. SPIBR Field Descriptions
Field 6:4 SPPR[2:0] 2:0 SPR[2:0} Description SPI Baud Rate Preselection Bits -- These bits specify the SPI baud rates as shown in Table 9-7. In master mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state. SPI Baud Rate Selection Bits -- These bits specify the SPI baud rates as shown in Table 9-7. In master mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state.
The baud rate divisor equation is as follows:
BaudRateDivisor = ( SPPR + 1 ) * 2 ( SPR + 1 )
The baud rate can be calculated with the following equation:
Baud Rate = BusClock BaudRateDivisor
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Table 9-7. Example SPI Baud Rate Selection (25 MHz Bus Clock)
SPPR2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 SPPR1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 SPPR0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 SPR2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 SPR1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 SPR0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Baud Rate Divisor 2 4 8 16 32 64 128 256 4 8 16 32 64 128 256 512 6 12 24 48 96 192 384 768 8 16 32 64 128 256 512 1024 10 20 40 80 160 320 640 Baud Rate 12.5 MHz 6.25 MHz 3.125 MHz 1.5625 MHz 781.25 kHz 390.63 kHz 195.31 kHz 97.66 kHz 6.25 MHz 3.125 MHz 1.5625 MHz 781.25 kHz 390.63 kHz 195.31 kHz 97.66 kHz 48.83 kHz 4.16667 MHz 2.08333 MHz 1.04167 MHz 520.83 kHz 260.42 kHz 130.21 kHz 65.10 kHz 32.55 kHz 3.125 MHz 1.5625 MHz 781.25 kHz 390.63 kHz 195.31 kHz 97.66 kHz 48.83 kHz 24.41 kHz 2.5 MHz 1.25 MHz 625 kHz 312.5 kHz 156.25 kHz 78.13 kHz 39.06 kHz
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Table 9-7. Example SPI Baud Rate Selection (25 MHz Bus Clock) (continued)
SPPR2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SPPR1 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SPPR0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 SPR2 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 SPR1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 SPR0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Baud Rate Divisor 1280 12 24 48 96 192 384 768 1536 14 28 56 112 224 448 896 1792 16 32 64 128 256 512 1024 2048 Baud Rate 19.53 kHz 2.08333 MHz 1.04167 MHz 520.83 kHz 260.42 kHz 130.21 kHz 65.10 kHz 32.55 kHz 16.28 kHz 1.78571 MHz 892.86 kHz 446.43 kHz 223.21 kHz 111.61 kHz 55.80 kHz 27.90 kHz 13.95 kHz 1.5625 MHz 781.25 kHz 390.63 kHz 195.31 kHz 97.66 kHz 48.83 kHz 24.41 kHz 12.21 kHz
NOTE In slave mode of SPI S-clock speed DIV2 is not supported.
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9.3.2.4
SPI Status Register (SPISR)
7 6 5 4 3 2 1 0
R W Reset
SPIF
0
SPTEF
MODF
0
0
0
0
0
0
1
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-6. SPI Status Register (SPISR)
Read: anytime Write: has no effect
Table 9-8. SPISR Field Descriptions
Field 7 SPIF Description SPIF Interrupt Flag -- This bit is set after a received data byte has been transferred into the SPI Data Register. This bit is cleared by reading the SPISR register (with SPIF set) followed by a read access to the SPI Data Register. 0 Transfer not yet complete 1 New data copied to SPIDR SPI Transmit Empty Interrupt Flag -- If set, this bit indicates that the transmit data register is empty. To clear this bit and place data into the transmit data register, SPISR has to be read with SPTEF = 1, followed by a write to SPIDR. Any write to the SPI Data Register without reading SPTEF = 1, is effectively ignored. 0 SPI Data register not empty 1 SPI Data register empty Mode Fault Flag -- This bit is set if the SS input becomes low while the SPI is configured as a master and mode fault detection is enabled, MODFEN bit of SPICR2 register is set. Refer to MODFEN bit description in Section 9.3.2.2, "SPI Control Register 2 (SPICR2)." The flag is cleared automatically by a read of the SPI Status Register (with MODF set) followed by a write to the SPI Control Register 1. 0 Mode fault has not occurred. 1 Mode fault has occurred.
5 SPTEF
4 MODF
9.3.2.5
SPI Data Register (SPIDR)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 2 Bit 0
= Unimplemented or Reserved
Figure 9-7. SPI Data Register (SPIDR)
Read: anytime; normally read only after SPIF is set Write: anytime
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The SPI Data Register is both the input and output register for SPI data. A write to this register allows a data byte to be queued and transmitted. For a SPI configured as a master, a queued data byte is transmitted immediately after the previous transmission has completed. The SPI Transmitter Empty Flag SPTEF in the SPISR register indicates when the SPI Data Register is ready to accept new data. Reading the data can occur anytime from after the SPIF is set to before the end of the next transfer. If the SPIF is not serviced by the end of the successive transfers, those data bytes are lost and the data within the SPIDR retains the first byte until SPIF is serviced.
9.4
Functional Description
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral devices. Software can poll the SPI status flags or SPI operation can be interrupt driven. The SPI system is enabled by setting the SPI enable (SPE) bit in SPI Control Register 1. While SPE bit is set, the four associated SPI port pins are dedicated to the SPI function as: * Slave select (SS) * Serial clock (SCK) * Master out/slave in (MOSI) * Master in/slave out (MISO) The main element of the SPI system is the SPI Data Register. The 8-bit data register in the master and the 8-bit data register in the slave are linked by the MOSI and MISO pins to form a distributed 16-bit register. When a data transfer operation is performed, this 16-bit register is serially shifted eight bit positions by the S-clock from the master, so data is exchanged between the master and the slave. Data written to the master SPI Data Register becomes the output data for the slave, and data read from the master SPI Data Register after a transfer operation is the input data from the slave. A read of SPISR with SPTEF = 1 followed by a write to SPIDR puts data into the transmit data register. When a transfer is complete, received data is moved into the receive data register. Data may be read from this double-buffered system any time before the next transfer has completed. This 8-bit data register acts as the SPI receive data register for reads and as the SPI transmit data register for writes. A single SPI register address is used for reading data from the read data buffer and for writing data to the transmit data register. The clock phase control bit (CPHA) and a clock polarity control bit (CPOL) in the SPI Control Register 1 (SPICR1) select one of four possible clock formats to be used by the SPI system. The CPOL bit simply selects a non-inverted or inverted clock. The CPHA bit is used to accommodate two fundamentally different protocols by sampling data on odd numbered SCK edges or on even numbered SCK edges (see Section 9.4.3, "Transmission Formats"). The SPI can be configured to operate as a master or as a slave. When the MSTR bit in SPI Control Register1 is set, master mode is selected, when the MSTR bit is clear, slave mode is selected.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 287
Chapter 9 Serial Peripheral Interface (SPIV3)
9.4.1
Master Mode
The SPI operates in master mode when the MSTR bit is set. Only a master SPI module can initiate transmissions. A transmission begins by writing to the master SPI Data Register. If the shift register is empty, the byte immediately transfers to the shift register. The byte begins shifting out on the MOSI pin under the control of the serial clock. * S-clock The SPR2, SPR1, and SPR0 baud rate selection bits in conjunction with the SPPR2, SPPR1, and SPPR0 baud rate preselection bits in the SPI Baud Rate register control the baud rate generator and determine the speed of the transmission. The SCK pin is the SPI clock output. Through the SCK pin, the baud rate generator of the master controls the shift register of the slave peripheral. * MOSI and MISO Pins In master mode, the function of the serial data output pin (MOSI) and the serial data input pin (MISO) is determined by the SPC0 and BIDIROE control bits. * SS Pin If MODFEN and SSOE bit are set, the SS pin is configured as slave select output. The SS output becomes low during each transmission and is high when the SPI is in idle state. If MODFEN is set and SSOE is cleared, the SS pin is configured as input for detecting mode fault error. If the SS input becomes low this indicates a mode fault error where another master tries to drive the MOSI and SCK lines. In this case, the SPI immediately switches to slave mode, by clearing the MSTR bit and also disables the slave output buffer MISO (or SISO in bidirectional mode). So the result is that all outputs are disabled and SCK, MOSI and MISO are inputs. If a transmission is in progress when the mode fault occurs, the transmission is aborted and the SPI is forced into idle state. This mode fault error also sets the mode fault (MODF) flag in the SPI Status Register (SPISR). If the SPI interrupt enable bit (SPIE) is set when the MODF flag gets set, then an SPI interrupt sequence is also requested. When a write to the SPI Data Register in the master occurs, there is a half SCK-cycle delay. After the delay, SCK is started within the master. The rest of the transfer operation differs slightly, depending on the clock format specified by the SPI clock phase bit, CPHA, in SPI Control Register 1 (see Section 9.4.3, "Transmission Formats"). NOTE A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0, BIDIROE with SPC0 set, SPPR2-SPPR0 and SPR2-SPR0 in master mode will abort a transmission in progress and force the SPI into idle state. The remote slave cannot detect this, therefore the master has to ensure that the remote slave is set back to idle state.
MC9S12E128 Data Sheet, Rev. 1.07 288 Freescale Semiconductor
Chapter 9 Serial Peripheral Interface (SPIV3)
9.4.2
Slave Mode
The SPI operates in slave mode when the MSTR bit in SPI Control Register1 is clear. * SCK Clock In slave mode, SCK is the SPI clock input from the master. * MISO and MOSI Pins In slave mode, the function of the serial data output pin (MISO) and serial data input pin (MOSI) is determined by the SPC0 bit and BIDIROE bit in SPI Control Register 2. * SS Pin The SS pin is the slave select input. Before a data transmission occurs, the SS pin of the slave SPI must be low. SS must remain low until the transmission is complete. If SS goes high, the SPI is forced into idle state. The SS input also controls the serial data output pin, if SS is high (not selected), the serial data output pin is high impedance, and, if SS is low the first bit in the SPI Data Register is driven out of the serial data output pin. Also, if the slave is not selected (SS is high), then the SCK input is ignored and no internal shifting of the SPI shift register takes place. Although the SPI is capable of duplex operation, some SPI peripherals are capable of only receiving SPI data in a slave mode. For these simpler devices, there is no serial data out pin. NOTE When peripherals with duplex capability are used, take care not to simultaneously enable two receivers whose serial outputs drive the same system slave's serial data output line. As long as no more than one slave device drives the system slave's serial data output line, it is possible for several slaves to receive the same transmission from a master, although the master would not receive return information from all of the receiving slaves. If the CPHA bit in SPI Control Register 1 is clear, odd numbered edges on the SCK input cause the data at the serial data input pin to be latched. Even numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit. If the CPHA bit is set, even numbered edges on the SCK input cause the data at the serial data input pin to be latched. Odd numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit. When CPHA is set, the first edge is used to get the first data bit onto the serial data output pin. When CPHA is clear and the SS input is low (slave selected), the first bit of the SPI data is driven out of the serial data output pin. After the eighth shift, the transfer is considered complete and the received data is transferred into the SPI Data Register. To indicate transfer is complete, the SPIF flag in the SPI Status Register is set. NOTE A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0 and BIDIROE with SPC0 set in slave mode will corrupt a transmission in progress and has to be avoided.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 289
Chapter 9 Serial Peripheral Interface (SPIV3)
9.4.3
Transmission Formats
During an SPI transmission, data is transmitted (shifted out serially) and received (shifted in serially) simultaneously. The serial clock (SCK) synchronizes shifting and sampling of the information on the two serial data lines. A slave select line allows selection of an individual slave SPI device, slave devices that are not selected do not interfere with SPI bus activities. Optionally, on a master SPI device, the slave select line can be used to indicate multiple-master bus contention.
MASTER SPI MISO MOSI SCK BAUD RATE GENERATOR SS MISO MOSI SCK SS SLAVE SPI
SHIFT REGISTER
SHIFT REGISTER
VDD
Figure 9-8. Master/Slave Transfer Block Diagram
9.4.3.1
Clock Phase and Polarity Controls
Using two bits in the SPI Control Register1, software selects one of four combinations of serial clock phase and polarity. The CPOL clock polarity control bit specifies an active high or low clock and has no significant effect on the transmission format. The CPHA clock phase control bit selects one of two fundamentally different transmission formats. Clock phase and polarity should be identical for the master SPI device and the communicating slave device. In some cases, the phase and polarity are changed between transmissions to allow a master device to communicate with peripheral slaves having different requirements.
9.4.3.2
CPHA = 0 Transfer Format
The first edge on the SCK line is used to clock the first data bit of the slave into the master and the first data bit of the master into the slave. In some peripherals, the first bit of the slave's data is available at the slave's data out pin as soon as the slave is selected. In this format, the first SCK edge is issued a half cycle after SS has become low. A half SCK cycle later, the second edge appears on the SCK line. When this second edge occurs, the value previously latched from the serial data input pin is shifted into the LSB or MSB of the shift register, depending on LSBFE bit. After this second edge, the next bit of the SPI master data is transmitted out of the serial data output pin of the master to the serial input pin on the slave. This process continues for a total of 16 edges on the SCK line, with data being latched on odd numbered edges and shifted on even numbered edges.
MC9S12E128 Data Sheet, Rev. 1.07 290 Freescale Semiconductor
Chapter 9 Serial Peripheral Interface (SPIV3)
Data reception is double buffered. Data is shifted serially into the SPI shift register during the transfer and is transferred to the parallel SPI Data Register after the last bit is shifted in. After the 16th (last) SCK edge: * Data that was previously in the master SPI Data Register should now be in the slave data register and the data that was in the slave data register should be in the master. * The SPIF flag in the SPI Status Register is set indicating that the transfer is complete. Figure 9-9 is a timing diagram of an SPI transfer where CPHA = 0. SCK waveforms are shown for CPOL = 0 and CPOL = 1. The diagram may be interpreted as a master or slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal is the output from the slave and the MOSI signal is the output from the master. The SS pin of the master must be either high or reconfigured as a general-purpose output not affecting the SPI.
End of Idle State SCK Edge Nr. SCK (CPOL = 0) SCK (CPOL = 1) 1 2 Begin 3 4 5 6 Transfer 7 8 9 10 11 12 End 13 14 15 16 Begin of Idle State
CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tL MSB first (LSBFE = 0): MSB Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 LSB first (LSBFE = 1): LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 tL = Minimum leading time before the first SCK edge tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time) tL, tT, and tI are guaranteed for the master mode and required for the slave mode. Bit 1 Bit 6 tT tI tL
LSB Minimum 1/2 SCK for tT, tl, tL MSB
Figure 9-9. SPI Clock Format 0 (CPHA = 0)
In slave mode, if the SS line is not deasserted between the successive transmissions then the content of the SPI Data Register is not transmitted, instead the last received byte is transmitted. If the SS line is deasserted for at least minimum idle time (half SCK cycle) between successive transmissions then the content of the SPI Data Register is transmitted.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 291
If next transfer begins here
SAMPLE I MOSI/MISO
Chapter 9 Serial Peripheral Interface (SPIV3)
In master mode, with slave select output enabled the SS line is always deasserted and reasserted between successive transfers for at least minimum idle time.
9.4.3.3
CPHA = 1 Transfer Format
Some peripherals require the first SCK edge before the first data bit becomes available at the data out pin, the second edge clocks data into the system. In this format, the first SCK edge is issued by setting the CPHA bit at the beginning of the 8-cycle transfer operation. The first edge of SCK occurs immediately after the half SCK clock cycle synchronization delay. This first edge commands the slave to transfer its first data bit to the serial data input pin of the master. A half SCK cycle later, the second edge appears on the SCK pin. This is the latching edge for both the master and slave. When the third edge occurs, the value previously latched from the serial data input pin is shifted into the LSB or MSB of the SPI shift register, depending on LSBFE bit. After this edge, the next bit of the master data is coupled out of the serial data output pin of the master to the serial input pin on the slave. This process continues for a total of 16 edges on the SCK line with data being latched on even numbered edges and shifting taking place on odd numbered edges. Data reception is double buffered, data is serially shifted into the SPI shift register during the transfer and is transferred to the parallel SPI Data Register after the last bit is shifted in. After the 16th SCK edge: * Data that was previously in the SPI Data Register of the master is now in the data register of the slave, and data that was in the data register of the slave is in the master. * The SPIF flag bit in SPISR is set indicating that the transfer is complete. Figure 9-10 shows two clocking variations for CPHA = 1. The diagram may be interpreted as a master or slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal is the output from the slave, and the MOSI signal is the output from the master. The SS line is the slave select input to the slave. The SS pin of the master must be either high or reconfigured as a general-purpose output not affecting the SPI. The SS line can remain active low between successive transfers (can be tied low at all times). This format is sometimes preferred in systems having a single fixed master and a single slave that drive the MISO data line. * Back-to-back transfers in master mode In master mode, if a transmission has completed and a new data byte is available in the SPI Data Register, this byte is send out immediately without a trailing and minimum idle time. The SPI interrupt request flag (SPIF) is common to both the master and slave modes. SPIF gets set one half SCK cycle after the last SCK edge.
MC9S12E128 Data Sheet, Rev. 1.07 292 Freescale Semiconductor
Chapter 9 Serial Peripheral Interface (SPIV3)
End of Idle State SCK Edge Nr. SCK (CPOL = 0) SCK (CPOL = 1) 1 2 3
Begin 4 5 6 7
Transfer 8 9 10 11 12
End 13 14 15 16
Begin of Idle State
CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tL MSB first (LSBFE = 0): LSB first (LSBFE = 1): tT tI tL
MSB Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB Minimum 1/2 SCK for tT, tl, tL LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 MSB tL = Minimum leading time before the first SCK edge, not required for back to back transfers tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time), not required for back to back transfers
Figure 9-10. SPI Clock Format 1 (CPHA = 1)
9.4.4
SPI Baud Rate Generation
Baud rate generation consists of a series of divider stages. Six bits in the SPI Baud Rate register (SPPR2, SPPR1, SPPR0, SPR2, SPR1, and SPR0) determine the divisor to the SPI module clock which results in the SPI baud rate. The SPI clock rate is determined by the product of the value in the baud rate preselection bits (SPPR2-SPPR0) and the value in the baud rate selection bits (SPR2-SPR0). The module clock divisor equation is shown in Figure 9-11 When all bits are clear (the default condition), the SPI module clock is divided by 2. When the selection bits (SPR2-SPR0) are 001 and the preselection bits (SPPR2-SPPR0) are 000, the module clock divisor becomes 4. When the selection bits are 010, the module clock divisor becomes 8 etc. When the preselection bits are 001, the divisor determined by the selection bits is multiplied by 2. When the preselection bits are 010, the divisor is multiplied by 3, etc. See Table 9-7 for baud rate calculations for all bit conditions, based on a 25-MHz bus clock. The two sets of selects allows the clock to be divided by a non-power of two to achieve other baud rates such as divide by 6, divide by 10, etc.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 293
If next transfer begins here
SAMPLE I MOSI/MISO
Chapter 9 Serial Peripheral Interface (SPIV3)
The baud rate generator is activated only when the SPI is in the master mode and a serial transfer is taking place. In the other cases, the divider is disabled to decrease IDD current.
BaudRateDivisor = ( SPPR + 1 ) * 2 ( SPR + 1 )
Figure 9-11. Baud Rate Divisor Equation
9.4.5
9.4.5.1
Special Features
SS Output
The SS output feature automatically drives the SS pin low during transmission to select external devices and drives it high during idle to deselect external devices. When SS output is selected, the SS output pin is connected to the SS input pin of the external device. The SS output is available only in master mode during normal SPI operation by asserting SSOE and MODFEN bit as shown in Table 9-3. The mode fault feature is disabled while SS output is enabled. NOTE Care must be taken when using the SS output feature in a multimaster system because the mode fault feature is not available for detecting system errors between masters.
9.4.5.2
Bidirectional Mode (MOSI or MISO)
The bidirectional mode is selected when the SPC0 bit is set in SPI Control Register 2 (see Table 9-9). In this mode, the SPI uses only one serial data pin for the interface with external device(s). The MSTR bit decides which pin to use. The MOSI pin becomes the serial data I/O (MOMI) pin for the master mode, and the MISO pin becomes serial data I/O (SISO) pin for the slave mode. The MISO pin in master mode and MOSI pin in slave mode are not used by the SPI.
Table 9-9. Normal Mode and Bidirectional Mode
When SPE = 1 Master Mode MSTR = 1
Serial Out MOSI
Slave Mode MSTR = 0
Serial In SPI MISO Serial Out MISO MOSI
Normal Mode SPC0 = 0
SPI Serial In
Serial Out
MOMI BIDIROE
Serial In BIDIROE SPI Serial Out SISO
Bidirectional Mode SPC0 = 1
SPI Serial In
MC9S12E128 Data Sheet, Rev. 1.07 294 Freescale Semiconductor
Chapter 9 Serial Peripheral Interface (SPIV3)
The direction of each serial I/O pin depends on the BIDIROE bit. If the pin is configured as an output, serial data from the shift register is driven out on the pin. The same pin is also the serial input to the shift register. The SCK is output for the master mode and input for the slave mode. The SS is the input or output for the master mode, and it is always the input for the slave mode. The bidirectional mode does not affect SCK and SS functions. NOTE In bidirectional master mode, with mode fault enabled, both data pins MISO and MOSI can be occupied by the SPI, though MOSI is normally used for transmissions in bidirectional mode and MISO is not used by the SPI. If a mode fault occurs, the SPI is automatically switched to slave mode, in this case MISO becomes occupied by the SPI and MOSI is not used. This has to be considered, if the MISO pin is used for other purpose.
9.4.6
Error Conditions
The SPI has one error condition: * Mode fault error
9.4.6.1
Mode Fault Error
If the SS input becomes low while the SPI is configured as a master, it indicates a system error where more than one master may be trying to drive the MOSI and SCK lines simultaneously. This condition is not permitted in normal operation, the MODF bit in the SPI Status Register is set automatically provided the MODFEN bit is set. In the special case where the SPI is in master mode and MODFEN bit is cleared, the SS pin is not used by the SPI. In this special case, the mode fault error function is inhibited and MODF remains cleared. In case the SPI system is configured as a slave, the SS pin is a dedicated input pin. Mode fault error doesn't occur in slave mode. If a mode fault error occurs the SPI is switched to slave mode, with the exception that the slave output buffer is disabled. So SCK, MISO and MOSI pins are forced to be high impedance inputs to avoid any possibility of conflict with another output driver. A transmission in progress is aborted and the SPI is forced into idle state. If the mode fault error occurs in the bidirectional mode for a SPI system configured in master mode, output enable of the MOMI (MOSI in bidirectional mode) is cleared if it was set. No mode fault error occurs in the bidirectional mode for SPI system configured in slave mode. The mode fault flag is cleared automatically by a read of the SPI Status Register (with MODF set) followed by a write to SPI Control Register 1. If the mode fault flag is cleared, the SPI becomes a normal master or slave again.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 295
Chapter 9 Serial Peripheral Interface (SPIV3)
9.4.7
Operation in Run Mode
In run mode with the SPI system enable (SPE) bit in the SPI control register clear, the SPI system is in a low-power, disabled state. SPI registers remain accessible, but clocks to the core of this module are disabled.
9.4.8
Operation in Wait Mode
SPI operation in wait mode depends upon the state of the SPISWAI bit in SPI Control Register 2. * If SPISWAI is clear, the SPI operates normally when the CPU is in wait mode * If SPISWAI is set, SPI clock generation ceases and the SPI module enters a power conservation state when the CPU is in wait mode. -- If SPISWAI is set and the SPI is configured for master, any transmission and reception in progress stops at wait mode entry. The transmission and reception resumes when the SPI exits wait mode. -- If SPISWAI is set and the SPI is configured as a slave, any transmission and reception in progress continues if the SCK continues to be driven from the master. This keeps the slave synchronized to the master and the SCK. If the master transmits several bytes while the slave is in wait mode, the slave will continue to send out bytes consistent with the operation mode at the start of wait mode (i.e. If the slave is currently sending its SPIDR to the master, it will continue to send the same byte. Else if the slave is currently sending the last received byte from the master, it will continue to send each previous master byte). NOTE Care must be taken when expecting data from a master while the slave is in wait or stop mode. Even though the shift register will continue to operate, the rest of the SPI is shut down (i.e. a SPIF interrupt will not be generated until exiting stop or wait mode). Also, the byte from the shift register will not be copied into the SPIDR register until after the slave SPI has exited wait or stop mode. A SPIF flag and SPIDR copy is only generated if wait mode is entered or exited during a tranmission. If the slave enters wait mode in idle mode and exits wait mode in idle mode, neither a SPIF nor a SPIDR copy will occur.
9.4.9
Operation in Stop Mode
Stop mode is dependent on the system. The SPI enters stop mode when the module clock is disabled (held high or low). If the SPI is in master mode and exchanging data when the CPU enters stop mode, the transmission is frozen until the CPU exits stop mode. After stop, data to and from the external SPI is exchanged correctly. In slave mode, the SPI will stay synchronized with the master. The stop mode is not dependent on the SPISWAI bit.
MC9S12E128 Data Sheet, Rev. 1.07 296 Freescale Semiconductor
Chapter 9 Serial Peripheral Interface (SPIV3)
9.5
Reset
The reset values of registers and signals are described in the Memory Map and Registers section (see Section 9.3, "Memory Map and Register Definition") which details the registers and their bit-fields. * If a data transmission occurs in slave mode after reset without a write to SPIDR, it will transmit garbage, or the byte last received from the master before the reset. * Reading from the SPIDR after reset will always read a byte of zeros.
9.6
Interrupts
The SPIV3 only originates interrupt requests when SPI is enabled (SPE bit in SPICR1 set). The following is a description of how the SPIV3 makes a request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt priority are chip dependent. The interrupt flags MODF, SPIF and SPTEF are logically ORed to generate an interrupt request.
9.6.1
MODF
MODF occurs when the master detects an error on the SS pin. The master SPI must be configured for the MODF feature (see Table 9-3). After MODF is set, the current transfer is aborted and the following bit is changed: * MSTR = 0, The master bit in SPICR1 resets. The MODF interrupt is reflected in the status register MODF flag. Clearing the flag will also clear the interrupt. This interrupt will stay active while the MODF flag is set. MODF has an automatic clearing process which is described in Section 9.3.2.4, "SPI Status Register (SPISR)."
9.6.2
SPIF
SPIF occurs when new data has been received and copied to the SPI Data Register. After SPIF is set, it does not clear until it is serviced. SPIF has an automatic clearing process which is described in Section 9.3.2.4, "SPI Status Register (SPISR)." In the event that the SPIF is not serviced before the end of the next transfer (i.e. SPIF remains active throughout another transfer), the latter transfers will be ignored and no new data will be copied into the SPIDR.
9.6.3
SPTEF
SPTEF occurs when the SPI Data Register is ready to accept new data. After SPTEF is set, it does not clear until it is serviced. SPTEF has an automatic clearing process which is described in Section 9.3.2.4, "SPI Status Register (SPISR)."
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 297
Chapter 9 Serial Peripheral Interface (SPIV3)
MC9S12E128 Data Sheet, Rev. 1.07 298 Freescale Semiconductor
Chapter 10 Inter-Integrated Circuit (IICV2)
10.1 Introduction
The inter-IC bus (IIC) is a two-wire, bidirectional serial bus that provides a simple, efficient method of data exchange between devices. Being a two-wire device, the IIC bus minimizes the need for large numbers of connections between devices, and eliminates the need for an address decoder. This bus is suitable for applications requiring occasional communications over a short distance between a number of devices. It also provides flexibility, allowing additional devices to be connected to the bus for further expansion and system development. The interface is designed to operate up to 100 kbps with maximum bus loading and timing. The device is capable of operating at higher baud rates, up to a maximum of clock/20, with reduced bus loading. The maximum communication length and the number of devices that can be connected are limited by a maximum bus capacitance of 400 pF.
10.1.1
Features
The IIC module has the following key features: * Compatible with I2C bus standard * Multi-master operation * Software programmable for one of 256 different serial clock frequencies * Software selectable acknowledge bit * Interrupt driven byte-by-byte data transfer * Arbitration lost interrupt with automatic mode switching from master to slave * Calling address identification interrupt * Start and stop signal generation/detection * Repeated start signal generation * Acknowledge bit generation/detection * Bus busy detection
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10.1.2
Modes of Operation
The IIC functions the same in normal, special, and emulation modes. It has two low power modes: wait and stop modes.
10.1.3
Block Diagram
The block diagram of the IIC module is shown in Figure 10-1.
IIC Start Stop Arbitration Control
Registers
Interrupt Clock Control
bus_clock
In/Out Data Shift Register
SCL
SDA
Address Compare
Figure 10-1. IIC Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 300 Freescale Semiconductor
Chapter 10 Inter-Integrated Circuit (IICV2)
10.2
External Signal Description
The IICV2 module has two external pins.
10.2.1
IIC_SCL -- Serial Clock Line Pin
This is the bidirectional serial clock line (SCL) of the module, compatible to the IIC bus specification.
10.2.2
IIC_SDA -- Serial Data Line Pin
This is the bidirectional serial data line (SDA) of the module, compatible to the IIC bus specification.
10.3
Memory Map and Register Definition
This section provides a detailed description of all memory and registers for the IIC module.
10.3.1
Module Memory Map
The memory map for the IIC module is given below in Table 10-1. The address listed for each register is the address offset.The total address for each register is the sum of the base address for the IIC module and the address offset for each register.
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Chapter 10 Inter-Integrated Circuit (IICV2)
10.3.2
Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order.
Table 10-1. IIC Register Summary
Register Name IBAD R W IBFD R W IBCR R W IBSR R W IBDR R W D7 D6 D5 Bit 7 ADR7 6 ADR6 5 ADR5 4 ADR4 3 ADR3 2 ADR2 1 ADR1 Bit 0 0
IBC7
IBC6
IBC5
IBC4
IBC3
IBC2 0
IBC1 0
IBC0
IBEN TCF
IBIE IAAS
MS/SL IBB
Tx/Rx
TXAK 0
RSTA
SRW IBIF
IBSWAI RXAK
IBAL
D4
D3
D2
D1
D0
= Unimplemented or Reserved
10.3.2.1
IIC Address Register (IBAD)
7 6 5 4 3 2 1 0
R ADR7 W Reset 0 0 0 0 0 0 0 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1
0
0
= Unimplemented or Reserved
Figure 10-2. IIC Bus Address Register (IBAD)
Read and write anytime This register contains the address the IIC bus will respond to when addressed as a slave; note that it is not the address sent on the bus during the address transfer.
Table 10-2. IBAD Field Descriptions
Field 7:1 ADR[7:1] 0 Reserved Description Slave Address -- Bit 1 to bit 7 contain the specific slave address to be used by the IIC bus module.The default mode of IIC bus is slave mode for an address match on the bus. Reserved -- Bit 0 of the IBAD is reserved for future compatibility. This bit will always read 0.
MC9S12E128 Data Sheet, Rev. 1.07 302 Freescale Semiconductor
Chapter 10 Inter-Integrated Circuit (IICV2)
10.3.2.2
IIC Frequency Divider Register (IBFD)
7 6 5 4 3 2 1 0
R IBC7 W Reset 0 0 0 0 0 0 0 0 IBC6 IBC5 IBC4 IBC3 IBC2 IBC1 IBC0
= Unimplemented or Reserved
Figure 10-3. IIC Bus Frequency Divider Register (IBFD)
Read and write anytime
Table 10-3. IBFD Field Descriptions
Field 7:0 IBC[7:0] Description I Bus Clock Rate 7:0 -- This field is used to prescale the clock for bit rate selection. The bit clock generator is implemented as a prescale divider -- IBC7:6, prescaled shift register -- IBC5:3 select the prescaler divider and IBC2-0 select the shift register tap point. The IBC bits are decoded to give the tap and prescale values as shown in Table 10-4.
Table 10-4. I-Bus Tap and Prescale Values
IBC2-0 (bin) 000 001 010 011 100 101 110 111 IBC5-3 (bin) 000 001 010 011 100 101 110 111 scl2start (clocks) 2 2 2 6 14 30 62 126 SCL Tap (clocks) 5 6 7 8 9 10 12 15 scl2stop (clocks) 7 7 9 9 17 33 65 129 SDA Tap (clocks) 1 1 2 2 3 3 4 4 scl2tap (clocks) 4 4 6 6 14 30 62 126 tap2tap (clocks) 1 2 4 8 16 32 64 128
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 303
Chapter 10 Inter-Integrated Circuit (IICV2)
Table 10-5. Multiplier Factor
IBC7-6 00 01 10 11 MUL 01 02 04 RESERVED
The number of clocks from the falling edge of SCL to the first tap (Tap[1]) is defined by the values shown in the scl2tap column of Table 10-4, all subsequent tap points are separated by 2IBC5-3 as shown in the tap2tap column in Table 10-4. The SCL Tap is used to generated the SCL period and the SDA Tap is used to determine the delay from the falling edge of SCL to SDA changing, the SDA hold time. IBC7-6 defines the multiplier factor MUL. The values of MUL are shown in the Table 10-5.
SCL Divider
SCL
SDA
SDA Hold
SDA
SCL Hold(start)
SCL Hold(stop)
SCL
START condition
STOP condition
Figure 10-4. SCL Divider and SDA Hold
The equation used to generate the divider values from the IBFD bits is: SCL Divider = MUL x {2 x (scl2tap + [(SCL_Tap -1) x tap2tap] + 2)}
MC9S12E128 Data Sheet, Rev. 1.07 304 Freescale Semiconductor
Chapter 10 Inter-Integrated Circuit (IICV2)
The SDA hold delay is equal to the CPU clock period multiplied by the SDA Hold value shown in Table 10-6. The equation used to generate the SDA Hold value from the IBFD bits is: SDA Hold = MUL x {scl2tap + [(SDA_Tap - 1) x tap2tap] + 3} The equation for SCL Hold values to generate the start and stop conditions from the IBFD bits is: SCL Hold(start) = MUL x [scl2start + (SCL_Tap - 1) x tap2tap] SCL Hold(stop) = MUL x [scl2stop + (SCL_Tap - 1) x tap2tap]
Table 10-6. IIC Divider and Hold Values (Sheet 1 of 5)
IBC[7:0] (hex) SCL Divider (clocks) 20 22 24 26 28 30 34 40 28 32 36 40 44 48 56 68 48 56 64 72 80 88 104 128 80 96 112 128 144 160 192 240 160 192 224 SDA Hold (clocks) 7 7 8 8 9 9 10 10 7 7 9 9 11 11 13 13 9 9 13 13 17 17 21 21 9 9 17 17 25 25 33 33 17 17 33 SCL Hold (start) 6 7 8 9 10 11 13 16 10 12 14 16 18 20 24 30 18 22 26 30 34 38 46 58 38 46 54 62 70 78 94 118 78 94 110 SCL Hold (stop) 11 12 13 14 15 16 18 21 15 17 19 21 23 25 29 35 25 29 33 37 41 45 53 65 41 49 57 65 73 81 97 121 81 97 113
MUL=1
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 20 21 22
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Chapter 10 Inter-Integrated Circuit (IICV2)
Table 10-6. IIC Divider and Hold Values (Sheet 2 of 5)
IBC[7:0] (hex) 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F SCL Divider (clocks) 256 288 320 384 480 320 384 448 512 576 640 768 960 640 768 896 1024 1152 1280 1536 1920 1280 1536 1792 2048 2304 2560 3072 3840 40 44 48 52 56 60 68 80 56 64 72 80 88 96 112 SDA Hold (clocks) 33 49 49 65 65 33 33 65 65 97 97 129 129 65 65 129 129 193 193 257 257 129 129 257 257 385 385 513 513 14 14 16 16 18 18 20 20 14 14 18 18 22 22 26 SCL Hold (start) 126 142 158 190 238 158 190 222 254 286 318 382 478 318 382 446 510 574 638 766 958 638 766 894 1022 1150 1278 1534 1918 12 14 16 18 20 22 26 32 20 24 28 32 36 40 48 SCL Hold (stop) 129 145 161 193 241 161 193 225 257 289 321 385 481 321 385 449 513 577 641 769 961 641 769 897 1025 1153 1281 1537 1921 22 24 26 28 30 32 36 42 30 34 38 42 46 50 58
MUL=2
40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E
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Chapter 10 Inter-Integrated Circuit (IICV2)
Table 10-6. IIC Divider and Hold Values (Sheet 3 of 5)
IBC[7:0] (hex) 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B SCL Divider (clocks) 136 96 112 128 144 160 176 208 256 160 192 224 256 288 320 384 480 320 384 448 512 576 640 768 960 640 768 896 1024 1152 1280 1536 1920 1280 1536 1792 2048 2304 2560 3072 3840 2560 3072 3584 4096 SDA Hold (clocks) 26 18 18 26 26 34 34 42 42 18 18 34 34 50 50 66 66 34 34 66 66 98 98 130 130 66 66 130 130 194 194 258 258 130 130 258 258 386 386 514 514 258 258 514 514 SCL Hold (start) 60 36 44 52 60 68 76 92 116 76 92 108 124 140 156 188 236 156 188 220 252 284 316 380 476 316 380 444 508 572 636 764 956 636 764 892 1020 1148 1276 1532 1916 1276 1532 1788 2044 SCL Hold (stop) 70 50 58 66 74 82 90 106 130 82 98 114 130 146 162 194 242 162 194 226 258 290 322 386 482 322 386 450 514 578 642 770 962 642 770 898 1026 1154 1282 1538 1922 1282 1538 1794 2050
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Table 10-6. IIC Divider and Hold Values (Sheet 4 of 5)
IBC[7:0] (hex) 7C 7D 7E 7F SCL Divider (clocks) 4608 5120 6144 7680 80 88 96 104 112 120 136 160 112 128 144 160 176 192 224 272 192 224 256 288 320 352 416 512 320 384 448 512 576 640 768 960 640 768 896 1024 1152 1280 1536 1920 SDA Hold (clocks) 770 770 1026 1026 28 28 32 32 36 36 40 40 28 28 36 36 44 44 52 52 36 36 52 52 68 68 84 84 36 36 68 68 100 100 132 132 68 68 132 132 196 196 260 260 SCL Hold (start) 2300 2556 3068 3836 24 28 32 36 40 44 52 64 40 48 56 64 72 80 96 120 72 88 104 120 136 152 184 232 152 184 216 248 280 312 376 472 312 376 440 504 568 632 760 952 SCL Hold (stop) 2306 2562 3074 3842 44 48 52 56 60 64 72 84 60 68 76 84 92 100 116 140 100 116 132 148 164 180 212 260 164 196 228 260 292 324 388 484 324 388 452 516 580 644 772 964
MUL=4
80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7
MC9S12E128 Data Sheet, Rev. 1.07 308 Freescale Semiconductor
Chapter 10 Inter-Integrated Circuit (IICV2)
Table 10-6. IIC Divider and Hold Values (Sheet 5 of 5)
IBC[7:0] (hex) A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF SCL Divider (clocks) 1280 1536 1792 2048 2304 2560 3072 3840 2560 3072 3584 4096 4608 5120 6144 7680 5120 6144 7168 8192 9216 10240 12288 15360 SDA Hold (clocks) 132 132 260 260 388 388 516 516 260 260 516 516 772 772 1028 1028 516 516 1028 1028 1540 1540 2052 2052 SCL Hold (start) 632 760 888 1016 1144 1272 1528 1912 1272 1528 1784 2040 2296 2552 3064 3832 2552 3064 3576 4088 4600 5112 6136 7672 SCL Hold (stop) 644 772 900 1028 1156 1284 1540 1924 1284 1540 1796 2052 2308 2564 3076 3844 2564 3076 3588 4100 4612 5124 6148 7684
10.3.2.3
IIC Control Register (IBCR)
7 6 5 4 3 2 1 0
R IBEN W Reset 0 0 0 0 0 IBIE MS/SL Tx/Rx TXAK
0
0 IBSWAI
RSTA
0 0 0
= Unimplemented or Reserved
Figure 10-5. IIC Bus Control Register (IBCR)
Read and write anytime
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Chapter 10 Inter-Integrated Circuit (IICV2)
Table 10-7. IBCR Field Descriptions
Field 7 IBEN Description I-Bus Enable -- This bit controls the software reset of the entire IIC bus module. 0 The module is reset and disabled. This is the power-on reset situation. When low the interface is held in reset but registers can be accessed 1 The IIC bus module is enabled.This bit must be set before any other IBCR bits have any effect If the IIC bus module is enabled in the middle of a byte transfer the interface behaves as follows: slave mode ignores the current transfer on the bus and starts operating whenever a subsequent start condition is detected. Master mode will not be aware that the bus is busy, hence if a start cycle is initiated then the current bus cycle may become corrupt. This would ultimately result in either the current bus master or the IIC bus module losing arbitration, after which bus operation would return to normal. I-Bus Interrupt Enable 0 Interrupts from the IIC bus module are disabled. Note that this does not clear any currently pending interrupt condition 1 Interrupts from the IIC bus module are enabled. An IIC bus interrupt occurs provided the IBIF bit in the status register is also set. Master/Slave Mode Select Bit -- Upon reset, this bit is cleared. When this bit is changed from 0 to 1, a START signal is generated on the bus, and the master mode is selected. When this bit is changed from 1 to 0, a STOP signal is generated and the operation mode changes from master to slave.A STOP signal should only be generated if the IBIF flag is set. MS/SL is cleared without generating a STOP signal when the master loses arbitration. 0 Slave Mode 1 Master Mode Transmit/Receive Mode Select Bit -- This bit selects the direction of master and slave transfers. When addressed as a slave this bit should be set by software according to the SRW bit in the status register. In master mode this bit should be set according to the type of transfer required. Therefore, for address cycles, this bit will always be high. 0 Receive 1 Transmit Transmit Acknowledge Enable -- This bit specifies the value driven onto SDA during data acknowledge cycles for both master and slave receivers. The IIC module will always acknowledge address matches, provided it is enabled, regardless of the value of TXAK. Note that values written to this bit are only used when the IIC bus is a receiver, not a transmitter. 0 An acknowledge signal will be sent out to the bus at the 9th clock bit after receiving one byte data 1 No acknowledge signal response is sent (i.e., acknowledge bit = 1) Repeat Start -- Writing a 1 to this bit will generate a repeated START condition on the bus, provided it is the current bus master. This bit will always be read as a low. Attempting a repeated start at the wrong time, if the bus is owned by another master, will result in loss of arbitration. 1 Generate repeat start cycle
6 IBIE
5 MS/SL
4 Tx/Rx
3 TXAK
2 RSTA
1 Reserved -- Bit 1 of the IBCR is reserved for future compatibility. This bit will always read 0. RESERVED 0 IBSWAI I Bus Interface Stop in Wait Mode 0 IIC bus module clock operates normally 1 Halt IIC bus module clock generation in wait mode
Wait mode is entered via execution of a CPU WAI instruction. In the event that the IBSWAI bit is set, all clocks internal to the IIC will be stopped and any transmission currently in progress will halt.If the CPU were woken up by a source other than the IIC module, then clocks would restart and the IIC would resume
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Chapter 10 Inter-Integrated Circuit (IICV2)
from where was during the previous transmission. It is not possible for the IIC to wake up the CPU when its internal clocks are stopped. If it were the case that the IBSWAI bit was cleared when the WAI instruction was executed, the IIC internal clocks and interface would remain alive, continuing the operation which was currently underway. It is also possible to configure the IIC such that it will wake up the CPU via an interrupt at the conclusion of the current operation. See the discussion on the IBIF and IBIE bits in the IBSR and IBCR, respectively.
10.3.2.4
IIC Status Register (IBSR)
7 6 5 4 3 2 1 0
R W Reset
TCF
IAAS
IBB IBAL
0
SRW IBIF
RXAK
1
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 10-6. IIC Bus Status Register (IBSR)
This status register is read-only with exception of bit 1 (IBIF) and bit 4 (IBAL), which are software clearable.
Table 10-8. IBSR Field Descriptions
Field 7 TCF Description Data Transferring Bit -- While one byte of data is being transferred, this bit is cleared. It is set by the falling edge of the 9th clock of a byte transfer. Note that this bit is only valid during or immediately following a transfer to the IIC module or from the IIC module. 0 Transfer in progress 1 Transfer complete Addressed as a Slave Bit -- When its own specific address (I-bus address register) is matched with the calling address, this bit is set.The CPU is interrupted provided the IBIE is set.Then the CPU needs to check the SRW bit and set its Tx/Rx mode accordingly.Writing to the I-bus control register clears this bit. 0 Not addressed 1 Addressed as a slave Bus Busy Bit 0 This bit indicates the status of the bus. When a START signal is detected, the IBB is set. If a STOP signal is detected, IBB is cleared and the bus enters idle state. 1 Bus is busy Arbitration Lost -- The arbitration lost bit (IBAL) is set by hardware when the arbitration procedure is lost. Arbitration is lost in the following circumstances: 1. SDA sampled low when the master drives a high during an address or data transmit cycle. 2. SDA sampled low when the master drives a high during the acknowledge bit of a data receive cycle. 3. A start cycle is attempted when the bus is busy. 4. A repeated start cycle is requested in slave mode. 5. A stop condition is detected when the master did not request it. This bit must be cleared by software, by writing a one to it. A write of 0 has no effect on this bit.
6 IAAS
5 IBB
4 IBAL
3 Reserved -- Bit 3 of IBSR is reserved for future use. A read operation on this bit will return 0. RESERVED
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Chapter 10 Inter-Integrated Circuit (IICV2)
Table 10-8. IBSR Field Descriptions (continued)
Field 2 SRW Description Slave Read/Write -- When IAAS is set this bit indicates the value of the R/W command bit of the calling address sent from the master This bit is only valid when the I-bus is in slave mode, a complete address transfer has occurred with an address match and no other transfers have been initiated. Checking this bit, the CPU can select slave transmit/receive mode according to the command of the master. 0 Slave receive, master writing to slave 1 Slave transmit, master reading from slave I-Bus Interrupt -- The IBIF bit is set when one of the following conditions occurs: -- Arbitration lost (IBAL bit set) -- Byte transfer complete (TCF bit set) -- Addressed as slave (IAAS bit set) It will cause a processor interrupt request if the IBIE bit is set. This bit must be cleared by software, writing a one to it. A write of 0 has no effect on this bit. Received Acknowledge -- The value of SDA during the acknowledge bit of a bus cycle. If the received acknowledge bit (RXAK) is low, it indicates an acknowledge signal has been received after the completion of 8 bits data transmission on the bus. If RXAK is high, it means no acknowledge signal is detected at the 9th clock. 0 Acknowledge received 1 No acknowledge received
1 IBIF
0 RXAK
10.3.2.5
IIC Data I/O Register (IBDR)
7 6 5 4 3 2 1 0
R D7 W Reset 0 0 0 0 0 0 0 0 D6 D5 D4 D3 D2 D1 D0
Figure 10-7. IIC Bus Data I/O Register (IBDR)
In master transmit mode, when data is written to the IBDR a data transfer is initiated. The most significant bit is sent first. In master receive mode, reading this register initiates next byte data receiving. In slave mode, the same functions are available after an address match has occurred.Note that the Tx/Rx bit in the IBCR must correctly reflect the desired direction of transfer in master and slave modes for the transmission to begin. For instance, if the IIC is configured for master transmit but a master receive is desired, then reading the IBDR will not initiate the receive. Reading the IBDR will return the last byte received while the IIC is configured in either master receive or slave receive modes. The IBDR does not reflect every byte that is transmitted on the IIC bus, nor can software verify that a byte has been written to the IBDR correctly by reading it back. In master transmit mode, the first byte of data written to IBDR following assertion of MS/SL is used for the address transfer and should com.prise of the calling address (in position D7:D1) concatenated with the required R/W bit (in position D0).
MC9S12E128 Data Sheet, Rev. 1.07 312 Freescale Semiconductor
Chapter 10 Inter-Integrated Circuit (IICV2)
10.4
Functional Description
This section provides a complete functional description of the IICV2.
10.4.1
I-Bus Protocol
The IIC bus system uses a serial data line (SDA) and a serial clock line (SCL) for data transfer. All devices connected to it must have open drain or open collector outputs. Logic AND function is exercised on both lines with external pull-up resistors. The value of these resistors is system dependent. Normally, a standard communication is composed of four parts: START signal, slave address transmission, data transfer and STOP signal. They are described briefly in the following sections and illustrated in Figure 10-8.
MSB SCL 1 2 3 4 5 6 7 LSB 8 9 MSB 1 2 3 4 5 6 7 LSB 8 9
SDA
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
XXX
D7
D6
D5
D4
D3
D2
D1
D0
Start Signal
Calling Address
Read/ Write
Ack Bit
Data Byte
No Stop Ack Signal Bit LSB
MSB SCL 1 2 3 4 5 6 7
LSB 8 9
MSB 1 2 3 4 5 6 7
8
9
SDA
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
XX
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
Start Signal
Calling Address
Read/ Write
Ack Bit
Repeated Start Signal
New Calling Address
Read/ Write
No Stop Ack Signal Bit
Figure 10-8. IIC-Bus Transmission Signals
10.4.1.1
START Signal
When the bus is free, i.e. no master device is engaging the bus (both SCL and SDA lines are at logical high), a master may initiate communication by sending a START signal.As shown in Figure 10-8, a START signal is defined as a high-to-low transition of SDA while SCL is high. This signal denotes the beginning of a new data transfer (each data transfer may contain several bytes of data) and brings all slaves out of their idle states.
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SDA
SCL
START Condition
STOP Condition
Figure 10-9. Start and Stop Conditions
10.4.1.2
Slave Address Transmission
The first byte of data transfer immediately after the START signal is the slave address transmitted by the master. This is a seven-bit calling address followed by a R/W bit. The R/W bit tells the slave the desired direction of data transfer. 1 = Read transfer, the slave transmits data to the master. 0 = Write transfer, the master transmits data to the slave. Only the slave with a calling address that matches the one transmitted by the master will respond by sending back an acknowledge bit. This is done by pulling the SDA low at the 9th clock (see Figure 10-8). No two slaves in the system may have the same address. If the IIC bus is master, it must not transmit an address that is equal to its own slave address. The IIC bus cannot be master and slave at the same time.However, if arbitration is lost during an address cycle the IIC bus will revert to slave mode and operate correctly even if it is being addressed by another master.
10.4.1.3
Data Transfer
As soon as successful slave addressing is achieved, the data transfer can proceed byte-by-byte in a direction specified by the R/W bit sent by the calling master All transfers that come after an address cycle are referred to as data transfers, even if they carry sub-address information for the slave device. Each data byte is 8 bits long. Data may be changed only while SCL is low and must be held stable while SCL is high as shown in Figure 10-8. There is one clock pulse on SCL for each data bit, the MSB being transferred first. Each data byte has to be followed by an acknowledge bit, which is signalled from the receiving device by pulling the SDA low at the ninth clock. So one complete data byte transfer needs nine clock pulses. If the slave receiver does not acknowledge the master, the SDA line must be left high by the slave. The master can then generate a stop signal to abort the data transfer or a start signal (repeated start) to commence a new calling.
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Chapter 10 Inter-Integrated Circuit (IICV2)
If the master receiver does not acknowledge the slave transmitter after a byte transmission, it means 'end of data' to the slave, so the slave releases the SDA line for the master to generate STOP or START signal.
10.4.1.4
STOP Signal
The master can terminate the communication by generating a STOP signal to free the bus. However, the master may generate a START signal followed by a calling command without generating a STOP signal first. This is called repeated START. A STOP signal is defined as a low-to-high transition of SDA while SCL at logical 1 (see Figure 10-8). The master can generate a STOP even if the slave has generated an acknowledge at which point the slave must release the bus.
10.4.1.5
Repeated START Signal
As shown in Figure 10-8, a repeated START signal is a START signal generated without first generating a STOP signal to terminate the communication. This is used by the master to communicate with another slave or with the same slave in different mode (transmit/receive mode) without releasing the bus.
10.4.1.6
Arbitration Procedure
The Inter-IC bus is a true multi-master bus that allows more than one master to be connected on it. If two or more masters try to control the bus at the same time, a clock synchronization procedure determines the bus clock, for which the low period is equal to the longest clock low period and the high is equal to the shortest one among the masters. The relative priority of the contending masters is determined by a data arbitration procedure, a bus master loses arbitration if it transmits logic 1 while another master transmits logic 0. The losing masters immediately switch over to slave receive mode and stop driving SDA output. In this case the transition from master to slave mode does not generate a STOP condition. Meanwhile, a status bit is set by hardware to indicate loss of arbitration.
10.4.1.7
Clock Synchronization
Because wire-AND logic is performed on SCL line, a high-to-low transition on SCL line affects all the devices connected on the bus. The devices start counting their low period and as soon as a device's clock has gone low, it holds the SCL line low until the clock high state is reached.However, the change of low to high in this device clock may not change the state of the SCL line if another device clock is within its low period. Therefore, synchronized clock SCL is held low by the device with the longest low period. Devices with shorter low periods enter a high wait state during this time (see Figure 10-9). When all devices concerned have counted off their low period, the synchronized clock SCL line is released and pulled high. There is then no difference between the device clocks and the state of the SCL line and all the devices start counting their high periods.The first device to complete its high period pulls the SCL line low again.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 315
Chapter 10 Inter-Integrated Circuit (IICV2) Start Counting High Period
WAIT SCL1
SCL2
SCL
Internal Counter Reset
Figure 10-10. IIC-Bus Clock Synchronization
10.4.1.8
Handshaking
The clock synchronization mechanism can be used as a handshake in data transfer. Slave devices may hold the SCL low after completion of one byte transfer (9 bits). In such case, it halts the bus clock and forces the master clock into wait states until the slave releases the SCL line.
10.4.1.9
Clock Stretching
The clock synchronization mechanism can be used by slaves to slow down the bit rate of a transfer. After the master has driven SCL low the slave can drive SCL low for the required period and then release it.If the slave SCL low period is greater than the master SCL low period then the resulting SCL bus signal low period is stretched.
10.4.2
Operation in Run Mode
This is the basic mode of operation.
10.4.3
Operation in Wait Mode
IIC operation in wait mode can be configured. Depending on the state of internal bits, the IIC can operate normally when the CPU is in wait mode or the IIC clock generation can be turned off and the IIC module enters a power conservation state during wait mode. In the later case, any transmission or reception in progress stops at wait mode entry.
10.4.4
Operation in Stop Mode
The IIC is inactive in stop mode for reduced power consumption. The STOP instruction does not affect IIC register states.
MC9S12E128 Data Sheet, Rev. 1.07 316 Freescale Semiconductor
Chapter 10 Inter-Integrated Circuit (IICV2)
10.5
Resets
The reset state of each individual bit is listed in Section 10.3, "Memory Map and Register Definition," which details the registers and their bit-fields.
10.6
Interrupts
Table 10-9. Interrupt Summary
Interrupt IIC Interrupt Offset -- Vector -- Priority -- Source Description
IICV2 uses only one interrupt vector.
IBAL, TCF, IAAS When either of IBAL, TCF or IAAS bits is set bits in IBSR may cause an interrupt based on arbitration register lost, transfer complete or address detect conditions
Internally there are three types of interrupts in IIC. The interrupt service routine can determine the interrupt type by reading the status register. IIC Interrupt can be generated on 1. Arbitration lost condition (IBAL bit set) 2. Byte transfer condition (TCF bit set) 3. Address detect condition (IAAS bit set) The IIC interrupt is enabled by the IBIE bit in the IIC control register. It must be cleared by writing 0 to the IBF bit in the interrupt service routine.
10.7
10.7.1
Initialization/Application Information
IIC Programming Examples
Initialization Sequence
10.7.1.1
Reset will put the IIC bus control register to its default status. Before the interface can be used to transfer serial data, an initialization procedure must be carried out, as follows: 1. Update the frequency divider register (IBFD) and select the required division ratio to obtain SCL frequency from system clock. 2. Update the IIC bus address register (IBAD) to define its slave address. 3. Set the IBEN bit of the IIC bus control register (IBCR) to enable the IIC interface system. 4. Modify the bits of the IIC bus control register (IBCR) to select master/slave mode, transmit/receive mode and interrupt enable or not.
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10.7.1.2
Generation of START
After completion of the initialization procedure, serial data can be transmitted by selecting the 'master transmitter' mode. If the device is connected to a multi-master bus system, the state of the IIC bus busy bit (IBB) must be tested to check whether the serial bus is free. If the bus is free (IBB=0), the start condition and the first byte (the slave address) can be sent. The data written to the data register comprises the slave calling address and the LSB set to indicate the direction of transfer required from the slave. The bus free time (i.e., the time between a STOP condition and the following START condition) is built into the hardware that generates the START cycle. Depending on the relative frequencies of the system clock and the SCL period it may be necessary to wait until the IIC is busy after writing the calling address to the IBDR before proceeding with the following instructions. This is illustrated in the following example. An example of a program which generates the START signal and transmits the first byte of data (slave address) is shown below:
CHFLAG TXSTART IBFREE BRSET BSET MOVB BRCLR IBSR,#$20,* IBCR,#$30 CALLING,IBDR IBSR,#$20,* ;WAIT FOR IBB FLAG TO CLEAR ;SET TRANSMIT AND MASTER MODE;i.e. GENERATE START CONDITION ;TRANSMIT THE CALLING ADDRESS, D0=R/W ;WAIT FOR IBB FLAG TO SET
10.7.1.3
Post-Transfer Software Response
Transmission or reception of a byte will set the data transferring bit (TCF) to 1, which indicates one byte communication is finished. The IIC bus interrupt bit (IBIF) is set also; an interrupt will be generated if the interrupt function is enabled during initialization by setting the IBIE bit. Software must clear the IBIF bit in the interrupt routine first. The TCF bit will be cleared by reading from the IIC bus data I/O register (IBDR) in receive mode or writing to IBDR in transmit mode. Software may service the IIC I/O in the main program by monitoring the IBIF bit if the interrupt function is disabled. Note that polling should monitor the IBIF bit rather than the TCF bit because their operation is different when arbitration is lost. Note that when an interrupt occurs at the end of the address cycle the master will always be in transmit mode, i.e. the address is transmitted. If master receive mode is required, indicated by R/W bit in IBDR, then the Tx/Rx bit should be toggled at this stage. During slave mode address cycles (IAAS=1), the SRW bit in the status register is read to determine the direction of the subsequent transfer and the Tx/Rx bit is programmed accordingly. For slave mode data cycles (IAAS=0) the SRW bit is not valid, the Tx/Rx bit in the control register should be read to determine the direction of the current transfer. The following is an example of a software response by a 'master transmitter' in the interrupt routine.
ISR BCLR BRCLR BRCLR BRSET MOVB IBSR,#$02 IBCR,#$20,SLAVE IBCR,#$10,RECEIVE IBSR,#$01,END DATABUF,IBDR ;CLEAR THE IBIF FLAG ;BRANCH IF IN SLAVE MODE ;BRANCH IF IN RECEIVE MODE ;IF NO ACK, END OF TRANSMISSION ;TRANSMIT NEXT BYTE OF DATA
TRANSMIT
MC9S12E128 Data Sheet, Rev. 1.07 318 Freescale Semiconductor
Chapter 10 Inter-Integrated Circuit (IICV2)
10.7.1.4
Generation of STOP
A data transfer ends with a STOP signal generated by the 'master' device. A master transmitter can simply generate a STOP signal after all the data has been transmitted. The following is an example showing how a stop condition is generated by a master transmitter.
MASTX TST BEQ BRSET MOVB DEC BRA BCLR RTI TXCNT END IBSR,#$01,END DATABUF,IBDR TXCNT EMASTX IBCR,#$20 ;GET VALUE FROM THE TRANSMITING COUNTER ;END IF NO MORE DATA ;END IF NO ACK ;TRANSMIT NEXT BYTE OF DATA ;DECREASE THE TXCNT ;EXIT ;GENERATE A STOP CONDITION ;RETURN FROM INTERRUPT
END EMASTX
If a master receiver wants to terminate a data transfer, it must inform the slave transmitter by not acknowledging the last byte of data which can be done by setting the transmit acknowledge bit (TXAK) before reading the 2nd last byte of data. Before reading the last byte of data, a STOP signal must be generated first. The following is an example showing how a STOP signal is generated by a master receiver.
MASR DEC BEQ MOVB DEC BNE BSET BRA BCLR MOVB RTI RXCNT ENMASR RXCNT,D1 D1 NXMAR IBCR,#$08 NXMAR IBCR,#$20 IBDR,RXBUF ;DECREASE THE RXCNT ;LAST BYTE TO BE READ ;CHECK SECOND LAST BYTE ;TO BE READ ;NOT LAST OR SECOND LAST ;SECOND LAST, DISABLE ACK ;TRANSMITTING ;LAST ONE, GENERATE `STOP' SIGNAL ;READ DATA AND STORE
LAMAR
ENMASR NXMAR
10.7.1.5
Generation of Repeated START
At the end of data transfer, if the master continues to want to communicate on the bus, it can generate another START signal followed by another slave address without first generating a STOP signal. A program example is as shown.
RESTART BSET MOVB IBCR,#$04 CALLING,IBDR ;ANOTHER START (RESTART) ;TRANSMIT THE CALLING ADDRESS;D0=R/W
10.7.1.6
Slave Mode
In the slave interrupt service routine, the module addressed as slave bit (IAAS) should be tested to check if a calling of its own address has just been received. If IAAS is set, software should set the transmit/receive mode select bit (Tx/Rx bit of IBCR) according to the R/W command bit (SRW). Writing to the IBCR clears the IAAS automatically. Note that the only time IAAS is read as set is from the interrupt at the end of the address cycle where an address match occurred, interrupts resulting from subsequent data transfers will have IAAS cleared. A data transfer may now be initiated by writing information to IBDR, for slave transmits, or dummy reading from IBDR, in slave receive mode. The slave will drive SCL low in-between byte transfers, SCL is released when the IBDR is accessed in the required mode.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 319
Chapter 10 Inter-Integrated Circuit (IICV2)
In slave transmitter routine, the received acknowledge bit (RXAK) must be tested before transmitting the next byte of data. Setting RXAK means an 'end of data' signal from the master receiver, after which it must be switched from transmitter mode to receiver mode by software. A dummy read then releases the SCL line so that the master can generate a STOP signal.
10.7.1.7
Arbitration Lost
If several masters try to engage the bus simultaneously, only one master wins and the others lose arbitration. The devices which lost arbitration are immediately switched to slave receive mode by the hardware. Their data output to the SDA line is stopped, but SCL continues to be generated until the end of the byte during which arbitration was lost. An interrupt occurs at the falling edge of the ninth clock of this transfer with IBAL=1 and MS/SL=0. If one master attempts to start transmission while the bus is being engaged by another master, the hardware will inhibit the transmission; switch the MS/SL bit from 1 to 0 without generating STOP condition; generate an interrupt to CPU and set the IBAL to indicate that the attempt to engage the bus is failed. When considering these cases, the slave service routine should test the IBAL first and the software should clear the IBAL bit if it is set.
MC9S12E128 Data Sheet, Rev. 1.07 320 Freescale Semiconductor
Chapter 10 Inter-Integrated Circuit (IICV2)
Clear IBIF
Y
Master Mode ?
N
TX
Tx/Rx ?
RX
Y
Arbitration Lost ? N
Last Byte Transmitted ? N
Y
Clear IBAL
RXAK=0 ? Y End Of Addr Cycle (Master Rx) ? N
N
Last Byte To Be Read ? N
Y
N
IAAS=1 ? Y
Y
IAAS=1 ? N
Address Transfer Y Y 2nd Last Byte To Be Read ? N Y (Read) SRW=1 ? N (Write) Y
Data Transfer TX/RX ? TX ACK From Receiver ? N Read Data From IBDR And Store RX
Write Next Byte To IBDR
Set TXAK =1
Generate Stop Signal
Set TX Mode
Write Data To IBDR
Tx Next Byte
Switch To Rx Mode
Set RX Mode
Switch To Rx Mode
Dummy Read From IBDR
Generate Stop Signal
Read Data From IBDR And Store
Dummy Read From IBDR
Dummy Read From IBDR
RTI
Figure 10-11. Flow-Chart of Typical IIC Interrupt Routine
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 321
Chapter 10 Inter-Integrated Circuit (IICV2)
MC9S12E128 Data Sheet, Rev. 1.07 322 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.1 Introduction
The Pulse width Modulator with Fault protection (PMF) module can be configured for one, two, or three complementary pairs. For example: * One complementary pair and four independent PWM outputs * Two complementary pair and two independent PWM outputs * Three complementary pair and zero independent PWM outputs * Zero complementary pair and six independent PWM outputs All PWM outputs can be generated from the same counter, or each pair can have its own counter for three independent PWM frequencies. Complementary operation permits programmable dead-time insertion, distortion correction through current sensing by software, and separate top and bottom output polarity control. Each counter value is programmable to support a continuously variable PWM frequency. Both edge- and center-aligned synchronous pulse width-control and full range modulation from 0 percent to 100 percent, are supported. The PMF is capable of controlling most motor types: AC induction motors (ACIM), both brushless (BLDC) and brush DC motors (BDC), switched (SRM), and variable reluctance motors (VRM), and stepper motors.
11.1.1
* * *
Features
* * * * * *
Three complementary PWM signal pairs, or six independent PWM signals Three 15-bit counters Features of complementary channel operation -- Deadtime insertion -- Separate top and bottom pulse width correction via current status inputs or software -- Separate top and bottom polarity control Edge-aligned or center-aligned PWM signals Half-cycle reload capability Integral reload rates from 1 to 16 Individual software-controlled PWM output Programmable fault protection Polarity control
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 323
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.1.2
Modes of Operation
Care must be exercised when using this module in the modes listed in Table 11-1. PWM outputs are placed in their inactive states in stop mode, and optionally under WAIT and freeze modes. PWM outputs will be reactivated (assuming they were active to begin with) when these modes are exited.
Table 11-1. Modes When PWM Operation is Restricted
Mode Stop Wait Freeze Description PWM outputs are disabled PWM outputs are disabled as a function of the PMFWAI bit. PWM outputs are disabled as a function of the PMFFRZ bit.
11.1.3
Block Diagrams
Figure 11-1 provides an overview of the PMF module. The Mux/Swap/Current Sense block is tightly integrated with the dead time insertion block . This detail is shown in Figure 11-2. NOTE It is possible to have both channels of a complementary pair to be high. For example, if the TOPNEGA (negative polarity for PWM0), BOTNEGA (negative polarity for PWM1), MASK0, and MASK1 bits are set, both the PWM complementary outputs of generator A will be high. See Section 11.3.2.2, "PMF Configure 1 Register (PMFCFG1)" for the description of TOPNEG and BOTNEG bits, and Section 11.3.2.3, "PMF Configure 2 Register (PMFCFG2)" for the description of the MSK0 and MSK1 bits.
MC9S12E128 Data Sheet, Rev. 1.07 324 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
PRSC1 PRSC0
BUS CLOCK
LDFQ0 LDFQ1
MTG
MULTIPLE REGISTERS OR BITS FOR TIMEBASE A, B, OR C
PRESCALER
LDFQ2 LDFQ3
PMFMOD REGISTERS PMFVAL0-5 REGISTERS PMFCNT REGISTERS PWM GENERATORS A,B,C
PWMRF EDGE HALF LDOK PWMEN IPOL INDEP OUT0 OUT2 OUT4 OUTCTL0 OUTCTL2 OUTCTL4 DT 0--5 OUT1 OUT3 OUT5 OUTCTL1 OUTCTL3 OUTCTL5
MUX, SWAP & CURRENT SENSE
DEADTIME INSERTION TOP/BOTTOM GENERATION 6
PMFDTM REGISTER TOPNEG BOTNEG PWM0 PIN PWM1 PIN PWM2 PIN PWM3 PIN PWM4 PIN PWM5 PIN FAULT0 PIN FAULT PIN FILTERS FAULT1 PIN FAULT2 PIN FAULT3 PIN
ISENS0 ISENS1 RELOAD A INTERRUPT REQUEST PWMRF PWMRIE FFLAG0 FINT0 FFLAG1 FINT1 FFLAG2 FINT2 FFLAG3 FINT3 INTERRUPT CONTROL FAULT0 INTERRUPT REQUEST FAULT1 INTERRUPT REQUEST FAULT2 INTERRUPT REQUEST FAULT3 INTERRUPT REQUEST RELOAD A INTERRUPT REQUEST RELOAD B INTERRUPT REQUEST RELOAD C INTERRUPT REQUEST
IS0 IS1 IS2 PIN PIN PIN PMDISMAP REGISTERS PMFFPIN REGISTER FAULT PROTECTION POLARITY CONTROL
FMODE0 FMODE1 FMODE2 FMODE3 FFLAG0 FFLAG1 FFLAG2 FFLAG3
QSMP0 QSMP1 QSMP2 QSMP3
Figure 11-1. PMF Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 325
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
PWM source selection is based on a number of factors: -- State of current sense pins -- IPOL bit -- OUTCTL bit -- Center vs edge aligned
SWAPA GENERATE COMPLEMENT & INSERT DEADTIME
IPOLA or ISENS0 or OUTCTL0 OUT0 PWM GENERATOR 0 OUTCTL0 1
PAD0 MSK0
1 INDEPA
FAULT & POLARITY CONTROL
PAD1
PWM GENERATOR 1
OUT1
1 OUTCTL1
1
MSK1
Figure 11-2. Detail of Mux, Swap, and Deadtime Functions
11.2
External Signal Description
The pulse width modulator has external pins named PWM0-5, FAULT0-3, and IS0-IS2.
11.2.1
PWM0-PWM5 Pins
PWM0-PWM5 are the output pins of the six PWM channels.
11.2.2
FAULT0-FAULT3 Pins
FAULT0-FAULT3 are input pins for disabling selected PWM outputs.
11.2.3
IS0-IS2 Pins
IS0-IS2 are current status pins for top/bottom pulse width correction in complementary channel operation while deadtime is asserted.
MC9S12E128 Data Sheet, Rev. 1.07 326 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3
11.3.1
Address 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006
Memory Map and Registers
Module Memory Map
Name PMFCFG0 PMFCFG1 PMFCFG2 PMFCFG3 PMFFCTL PMFFPIN PMFFSTA R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W = Unimplemented or Reserved 0 0 ISENS PMFVAL0 PMFVAL0 0 IPOLC IPOLB IPOLA 0 0 0 0 0 0 OUTCTL5 OUTCTL4 OUTCTL3 OUTCTL2 OUTCTL1 OUTCTL0 OUT5 DT5 OUT4 DT4 OUT3 DT3 OUT2 DT2 OUT1 DT1 OUT0 DT0 0 PMFWAI FMODE3 0 PMFFRZ FIE3 FPINE3 FFLAG3 QSMP3 DMP13 DMP33 DMP53 DMP12 DMP32 DMP52 Bit 7 WP ENHA 0 6 MTG 0 0 5 EDGEC 4 EDGEB 3 EDGEA 2 INDEPC 1 INDEPB Bit 0 INDEPA
BOTNEGC TOPNEGC BOTNEGB TOPNEGB BOTNEGA TOPNEGA MSK5 0 MSK4 MSK3 MSK2 SWAPC FIE1 FPINE1 FFLAG1 QSMP1 DMP03 DMP23 DMP43 DMP02 DMP22 DMP42 MSK1 SWAPB FMODE0 0 0 MSK0 SWAPA FIE0 FPINE0 FFLAG0 QSMP0 DMP01 DMP21 DMP41 DMP00 DMP20 DMP40
VLMODE FIE2 FPINE2 FFLAG2 QSMP2 FMODE1 0 0
FMODE2 0 0
0x0007 PMFQSMP 0x0008 PMFDMPA
DMP11 DMP31 DMP51
DMP10 DMP30 DMP50
0x0009 PMFDMPB 0x000A PMFDMPC 0x000B Reserved
0x000C PMFOUTC 0x000D PMFOUTB 0x000E PMFDTMS 0x000F 0x0010 0x0011 PMFCCTL PMFVAL0 PMFVAL0
Figure 11-3. PMF15B6C Register Summary (Sheet 1 of 3)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 327
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Address 0x0012 0x0013 0x0014 0x0015 0x0016 0x0017 0x0018 0x0019 0x001A 0x001B 0x001C 0X001F 0x0020 0x0021 0x0022 0x0023
Name PMFVAL1 PMFVAL1 PMFVAL2 PMFVAL2 PMFVAL3 PMFVAL3 PMFVAL4 PMFVAL4 PMFVAL5 PMFVAL5 R W R W R W R W R W R W R W R W R W R W R Reserved W PMFENCA PMFFQCA PMFCNTA PMFCNTA R W R W R W R W R W R W R W R W
Bit 7
6
5
4 PMFVAL1 PMFVAL1 PMFVAL2 PMFVAL2 PMFVAL3 PMFVAL3 PMFVAL4 PMFVAL4 PMFVAL5 PMFVAL5
3
2
1
Bit 0
PWMENA
0
0
0
0
0
LDOKA PRSCA
PWMRIEA PWMRFA
LDFQA 0
HALFA PMFCNTA PMFCNTA
0x0024 PMFMODA 0x0025 PMFMODA 0x0026 0x0027 PMFDTMA PMFDTMA
0
PMFMODA PMFMODA
0
0
0
0
PMFDTMA PMFDTMA
= Unimplemented or Reserved
Figure 11-3. PMF15B6C Register Summary (Sheet 2 of 3)
MC9S12E128 Data Sheet, Rev. 1.07 328 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Address 0x0028 0x0029 0x002A 0x002B
Name PMFENCB PMFFQCB PMFCNTB PMFCNTB R W R W R W R W R W R W
Bit 7 PWMENB
6 0
5 0
4 0
3 0
2 0
1 LDOKB PRSCB
Bit 0 PWMRIEB PWMRFB
LDFQB 0
HALFB PMFCNTB PMFCNTB
0x002C PMFMODB 0x002D PMFMODB 0x002E
0
PMFMODB PMFMODB
PMFDTMB R W R W R W R W R W R W R W R W R W R W R Reserved W
0
0
0
0
PMFDTMB PMFDTMB
0x002F PMFDTMB 0x0030 0x0031 0x0032 0x0033 PMFENCC PMFFQCC PMFCNTC PMFCNTC
PWMENC
0
0
0
0
0
LDOKC PRSCC
PWMRIEC PWMRFC
LDFQC 0
HALFC PMFCNTC PMFCNTC
0x0034 PMFMODC 0x0035 PMFMODC 0x0036 PMFDTMC 0x0037 PMFDTMC 0x0038 0X003F
0
PMFMODC PMFMODC
0
0
0
0
PMFDTMC
PMFDTMC
= Unimplemented or Reserved
Figure 11-3. PMF15B6C Register Summary (Sheet 3 of 3)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 329
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2
Register Descriptions
The address of a register is the sum of a base address and an address offset. The base address is defined at the chip level and the address offset is defined at the module level.
11.3.2.1
PMF Configure 0 Register (PMFCFG0)
Module Base + 0x0000
7 6 5 4 3 2 1 0
R WP W Reset 0 0 0 0 0 0 0 0 MTG EDGEC EDGEB EDGEA INDEPC INDEPB INDEPA
Figure 11-4. PMF Configure 0 Register (PMFCFG0)
Read anytime. See bit description for write conditions.
Table 11-2. PMFCFG0 Field Descriptions
Field 7 WP Description Write Protect -- This bit enables write protection to be used for all write-protectable registers. While clear, WP allows write-protected registers to be written. When set, WP prevents any further writes to write-protected registers. Once set, WP can be cleared only by reset. 0 Write-protectable registers may be written. 1 Write-protectable registers are write-protected. Multiple Timebase Generators -- This bit determines the number of timebase counters used. Once set, MTG can be cleared only by reset. If MTG is set, PWM generators B and C and registers $xx28-$xx37 are available. The three generators have their own variable frequencies and are not synchronized. If MTG is cleared, PMF registers from $xx28-$xx37 can not be written and read zeroes, and bits EDGEC and EDGEB are ignored. Pair A, Pair B and Pair C PWMs are synchronized to PWM generator A and use registers from $xx20-$xx27. 0 Single timebase generator. 1 Multiple timebase generators. Edge-Aligned or Center-Aligned PWM for Pair C -- This bit determines whether PWM4 and PWM5 channels will use edge-aligned or center-aligned waveforms. This bit has no effect if MTG bit is cleared. This bit cannot be modified after the WP bit is set. 0 PWM4 and PWM5 are center-aligned PWMs 1 PWM4 and PWM5 are edge-aligned PWMs Edge-Aligned or Center-Aligned PWM for Pair B -- This bit determines whether PWM2 and PWM3 channels will use edge-aligned or center-aligned waveforms. This bit has no effect if MTG bit is cleared. This bit cannot be modified after the WP bit is set. 0 PWM2 and PWM3 are center-aligned PWMs 1 PWM2 and PWM3 are edge-aligned PWMs
6 MTG
5 EDGEC
4 EDGEB
MC9S12E128 Data Sheet, Rev. 1.07 330 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Table 11-2. PMFCFG0 Field Descriptions (continued)
Field 3 EDGEA Description Edge-Aligned or Center-Aligned PWM for Pair A -- This bit determines whether PWM0 and PWM1 channels will use edge-aligned or center-aligned waveforms. It determines waveforms for Pair B and Pair C if the MTG bit is cleared. This bit cannot be modified after the WP bit is set. 0 PWM0 and PWM1 are center-aligned PWMs 1 PWM0 and PWM1 are edge-aligned PWMs Independent or Complimentary Operation for Pair C -- This bit determines if the PWM channels 4 and 5 will be independent PWMs or complementary PWMs. This bit cannot be modified after the WP bit is set. 0 PWM4 and PWM5 are complementary PWM pair 1 PWM4 and PWM5 are independent PWMs Independent or Complimentary Operation for Pair B -- This bit determines if the PWM channels 2 and 3 will be independent PWMs or complementary PWMs. This bit cannot be modified after the WP bit is set. 0 PWM2 and PWM3 are complementary PWM pair 1 PWM2 and PWM3 are independent PWMs Independent or Complimentary Operation for Pair A -- This bit determines if the PWM channels 0 and 1 will be independent PWMs or complementary PWMs. This bit cannot be modified after the WP bit is set. 0 PWM0 and PWM1 are complementary PWM pair 1 PWM0 and PWM1 are independent PWMs
2 INDEPC
1 INDEPB
0 INDEPA
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 331
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.2
PMF Configure 1 Register (PMFCFG1)
Module Base + 0x0001
7 6 5 4 3 2 1 0
R ENHA W Reset 0
0 BOTNEGC 0 0 TOPNEGC 0 BOTNEGB 0 TOPNEGB 0 BOTNEGA 0 TOPNEGA 0
= Unimplemented or Reserved
Figure 11-5. PMF Configure 1 Register (PMFCFG1)
Read anytime. This register cannot be modified after the WP bit is set. A normal PWM output or positive polarity means that the PWM channel outputs high when the counter value is smaller than or equal to the pulse width value and outputs low otherwise. An inverted output or negative polarity means that the PWM channel outputs low when the counter value is smaller than or equal to the pulse width value and outputs high otherwise.
Table 11-3. PMFCFG1 Field Descriptions
Field 7 ENHA Description Enable Hardware Acceleration -- This bit enables writing to the VLMODE[1:0], SWAPC, SWAPB, and SWAPA bits in the PMFCFG3 register. This bit cannot be modified after the WP bit is set. 0 Disable writing to VLMODE[1:0], SWAPC, SWAPB, and SWAPA bits 1 Enable writing to VLMODE[1:0], SWAPC, SWAPB, and SWAPA bits Pair C Bottom-side PWM Polarity -- This bit determines the polarity for Pair C bottom-side PWM (PWM5). This bit cannot be modified after the WP bit is set. 0 Positive PWM5 polarity 1 Negative PWM5 polarity Pair C Top-side PWM Polarity -- This bit determines the polarity for Pair C top-side PWM (PWM4). This bit cannot be modified after the WP bit is set. 0 Positive PWM4 polarity 1 Negative PWM4 polarity Pair B Bottom-side PWM Polarity -- This bit determines the polarity for Pair B bottom-side PWM (PWM3). This bit cannot be modified after the WP bit is set. 0 Positive PWM3 polarity 1 Negative PWM3 polarity Pair B Top-side PWM Polarity -- This bit determines the polarity for Pair B top-side PWM (PWM2). This bit cannot be modified after the WP bit is set. 0 Positive PWM2 polarity 1 Negative PWM2 polarity Pair A Bottom-side PWM Polarity -- This bit determines the polarity for Pair A bottom-side PWM (PWM1). This bit cannot be modified after the WP bit is set. 0 Positive PWM1 polarity 1 Negative PWM1 polarity Pair A Top-side PWM Polarity -- This bit determines the polarity for Pair A top-side PWM (PWM0). This bit cannot be modified after the WP bit is set. 0 Positive PWM0 polarity 1 Negative PWM0 polarity MC9S12E128 Data Sheet, Rev. 1.07 332 Freescale Semiconductor
5 BOTNEGC
4 TOPNEGC
3 BOTNEGB
2 TOPNEGB
1 BOTNEGA
0 TOPNEGA
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.3
PMF Configure 2 Register (PMFCFG2)
Module Base + 0x0002
7 6 5 4 3 2 1 0
R W Reset
0
0 MSK5 MSK4 0 MSK3 0 MSK2 0 MSK1 0 MSK0 0
0
0
0
= Unimplemented or Reserved
Figure 11-6. PMF Configure 2 Register (PMFCFG2)
Read and write anytime.
Table 11-4. PMFCFG2 Field Descriptions
Field 5-0 MSK[5:0] Description Mask PWMx-- Where x is 0, 1, 2, 3, 4, and 5. 0 PWMx is unmasked. 1 PWMx is masked and the channel is set to a value of 0 percent duty cycle. Note: WARNING When using the TOPNEG/BOTNEG bits and the MSKx bits at the same time, when in complementary mode, it is possible to have both pmf channel outputs of a channel pair set to one.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 333
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.4
PMF Configure 3 Register (PMFCFG3)
Module Base + 0x0003
7 6 5 4 3 2 1 0
R PMFWAI W Reset 0 0 PMFFRZ
0 VLMODE 0 0 0 SWAPC 0 SWAPB 0 SWAPA 0
= Unimplemented or Reserved
Figure 11-7. PMF Configure 3 Register (PMFCFG3)
Read and write anytime.
Table 11-5. PMFCFG3 Field Descriptions
Field 7 PMFWAI Description PMF Stops While in Wait Mode -- When set to zero, the PWM generators will continue to run while the chip is in wait mode. In this mode, the peripheral clock continues to run but the CPU clock does not. If the device enters wait mode and this bit is one, then the PWM outputs will be switched to their inactive state until wait mode is exited. At that point the PWM pins will resume operation as programmed in the PWM registers. 0 PMF continues to run in wait mode. 1 PMF is disabled in wait mode. PMF Stops While in Freeze Mode -- When set to zero, the PWM generators will continue to run while the chip is in freeze mode. If the device enters freeze mode and this bit is one, then the PWM outputs will be switched to their inactive state until freeze mode is exited. At that point the PWM pins will resume operation as programmed in the PWM registers. 0 PMF continues to run in freeze mode. 1 PMF is disabled in freeze mode. Value Register Load Mode -- This field determines the way the value registers are being loaded. This field can only be written if ENHA is set. 00 = Each value register is accessed independently 01 = Writing to value register zero also writes to value registers one to five 10 = Writing to value register zero also writes to value registers one to three 11 = Reserved (defaults to independent access) Swap Pair C -- This bit can only be written if ENHA is set. 0 No swap. 1 PWM4 and PWM5 are swapped only in complementary mode. Swap Pair B -- This bit can only be written if ENHA is set. 0 No swap. 1 PWM2 and PWM3 are swapped only in complementary mode. Swap Pair A --This bit can only be written if ENHA is set. 0 No swap. 1 PWM0 and PWM1 are swapped only in complementary mode.
6 PMFFRZ
4-3 VLMODE
2 SWAPC 1 SWAPB 0 SWAPC
MC9S12E128 Data Sheet, Rev. 1.07 334 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.5
PMF Fault Control Register (PMFFCTL)
Module Base + 0x0004
7 6 5 4 3 2 1 0
R FMODE3 W Reset 0 0 0 0 0 0 0 0 FIE3 FMODE2 FIE2 FMODE1 FIE1 FMODE0 FIE0
Figure 11-8. PMF Fault Control Register (PMFFCTL))
Read and write anytime.
Table 11-6. PMFFCTL Field Descriptions
Field Description
7, 5, 3, 1 Fault x Pin Clearing Mode -- This bit selects automatic or manual clearing of FAULTx pin faults. See FMODE[3:0] Section 11.4.8.2, "Automatic Fault Clearing" and Section 11.4.8.3, "Manual Fault Clearing" for more details. 0 Manual fault clearing of FAULTx pin faults. 1 Automatic fault clearing of FAULTx pin faults. where x is 0, 1, 2, and 3. 6, 4, 2, 0 FIE[3:0] Fault x Pin Interrupt Enable -- This bit enables CPU interrupt requests to be generated by the FAULTx pin. The fault protection circuit is independent of the FIEx bit and is active when FPINEx is set. If a fault is detected, the PWM pins are disabled according to the PMF Disable Mapping registers. 0 Fault x CPU interrupt requests disabled. 1 Fault x CPU interrupt requests enabled. where x is 0, 1, 2 and 3.
11.3.2.6
PMF Fault Pin Enable Register (PMFFPIN)
Module Base + 0x0005
7 6 5 4 3 2 1 0
R W Reset
0 FPINE3 0 0
0 FPINE2 0 0
0 FPINE1 0 0
0 FPINE0 0 0
= Unimplemented or Reserved
Figure 11-9. PMF Fault Pin Enable Register (PMFFPIN)
Read anytime. This register cannot be modified after the WP bit is set.
Table 11-7. PMFFPIN Field Descriptions
Field 6, 4, 2, 0 FPINE[2:0] Fault x Pin Enable -- Where x is 0, 1, 2 and 3. 0 FAULTx pin is disabled for fault protection. 1 FAULTx pin is enabled for fault protection. Description
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 335
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.7
PMF Fault Status Register (PMFFSTA)
Module Base + 0x0006
7 6 5 4 3 2 1 0
R W Reset
0 FFLAG3 0 0
0 FFLAG2 0 0
0 FFLAG1 0 0
0 FFLAG0 0 0
= Unimplemented or Reserved
Figure 11-10. PMF Fault Flag Register (PMFFSTA)
Read and write anytime.
Table 11-8. PMFFSTA Field Descriptions
Field Description
6, 4, 2, 0 Fault x Pin Flag -- This flag is set after the required number of samples have been detected after a rising edge FFLAG[3:0] on the FAULTx pin. Writing a logic one to FFLAGx clears it. Writing a logic zero has no effect. The fault protection is enabled when FPINEx is set even when the PWMs are not enabled; therefore, a fault will be latched in, requiring to be cleared in order to prevent an interrupt. 0 No fault on the FAULTx pin. 1 Fault on the FAULTx pin. Note: Clearing FFLAGx satisfies pending FFLAGx CPU interrupt requests. where x is 0, 1, 2 and 3.
11.3.2.8
PMF Fault Qualifying Samples Register (PMFQSMP)
Module Base + 0x0007
7 6 5 4 3 2 1 0
R QSMP3 W Reset 0 0 0 0 0 0 0 0 QSMP2 QSMP1 QSMP0
Figure 11-11. PMF Fault Qualifying Samples Register (PMFQSMP))
Read anytime. This register cannot be modified after the WP bit is set.
Table 11-9. PMFQSMP Field Descriptions
Field 7-0 QSMP[3:0] Description Fault x Qualifying Samples -- This field indicates the number of consecutive samples taken at the FAULTx pin to determine if a fault is detected. The first sample is qualified after two bus cycles from the time the fault is present and each sample after that is taken every four bus cycles. See Table 11-10. where x is 0, 1, 2 and 3.
MC9S12E128 Data Sheet, Rev. 1.07 336 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Table 11-10. Qualifying Samples
QSMPx 00 01 10 11
1
Number of Samples 1 sample1 5 samples 10 samples 15 samples
There is an asynchronous path from fault pin to disable PWMs immediately but the fault is qualified in two bus cycles.
11.3.2.9
PMF Disable Mapping Registers
Module Base + 0x0008
7 6 5 4 3 2 1 0
R DMP13 W Reset 0 0 0 0 0 0 0 0 DMP12 DMP11 DMP10 DMP03 DMP02 DMP01 DMP00
Figure 11-12. PMF Disable Mapping A Register (PMFDMPA)
Module Base + 0x0009
7 6 5 4 3 2 1 0
R DMP33 W Reset 0 0 0 0 0 0 0 0 DMP32 DMP31 DMP30 DMP23 DMP22 DMP21 DMP20
Figure 11-13. PMF Disable Mapping B Register (PMFDMPB)
Module Base + 0x000A
7 6 5 4 3 2 1 0
R DMP53 W Reset 0 0 0 0 0 0 0 0 DMP52 DMP51 DMP50 DMP43 DMP42 DMP41 DMP40
Figure 11-14. PMF Disable Mapping C Register (PMFDMPC)
Read anytime. These registers cannot be modified after the WP bit is set.
Table 11-11. PMFDMPA, PMFDMPB, and PMFDMPC Field Descriptions
Field Description
7-0 PMF Disable Mapping Bits -- The fault decoder disables PWM pins selected by the fault logic and the disable DMP[00:53] mapping registers. See Figure 11-15. Each bank of four bits in the disable mapping registers control the mapping of a single PWM pin. Refer to Table 11-12.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 337
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
DMPx3 DMPx2 DMPx1 DMPx0
Fault0 Fault1 Fault2 Fault3 where X is 0, 1, 2, 3, 4, 5 DISABLE PWM PIN x
Figure 11-15. Fault Decoder Table 11-12. Fault Mapping
PWM Pin PWM0 PWM1 PWM2 PWM3 PWM4 PWM5 Controlling Register Bits DMP03 - DMP00 DMP13 - DMP10 DMP23 - DMP20 DMP33 - DMP30 DMP43 - DMP40 DMP53
- DMP50
11.3.2.10 PMF Output Control Register (PMFOUTC)
Module Base + 0x000C
7 6 5 4 3 2 1 0
R W Reset
0
0 OUTCTL5 OUTCTL4 0 OUTCTL3 0 OUTCTL2 0 OUTCTL1 0 OUTCTL0 0
0
0
0
= Unimplemented or Reserved
Figure 11-16. PMF Output Control Register (PMFOUTC)
Read and write anytime.
Table 11-13. PMFOUTC Field Descriptions
Field Description
5-0 PMF Output Control Bits -- These bits enable software control of their corresponding PWM pin. When OUTCTL[5:0] OUTCTLx is set, the OUTx bit activates and deactivates the PWMx output. When operating the PWM in complementary mode, these bits must be switched in pairs for proper operation. That is OUTCTL0 and OUTCTL1 must have the same value; OUTCTL2 and OUTCTL3 must have the same value; and OUTCTL4 and OUTCTL5 must have the same value. 0 Software control disabled 1 Software control enabled where X is 0, 1, 2, 3, 4 and 5
MC9S12E128 Data Sheet, Rev. 1.07 338 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.11 PMF Output Control Bit Register (PMFOUTB)
Module Base + 0x000D
7 6 5 4 3 2 1 0
R W Reset
0
0 OUT5 OUT4 0 OUT3 0 OUT2 0 OUT1 0 OUT0 0
0
0
0
= Unimplemented or Reserved
Figure 11-17. PMF Output Control Bit Register (PMFOUTB)
Read and write anytime.
Table 11-14. PMFOUTB Field Descriptions
Field 5-0 OUT[5:0] Description PMF Output Control Bits -- When the corresponding OUTCTL bit is set, these bits control the PWM pins, illustrated in Table 11-15.
Table 11-15. Software Output Control
OUTx Bit OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 Complementary Channel Operation 1--PWM0 is active 0--PWM0 is inactive 1--PWM1 is complement of PWM0 0--PWM1 is inactive 1--PWM2 is active 0--PWM2 is inactive 1--PWM3 is complement of PWM2 0--PWM3 is inactive 1--PWM4 is active 0--PWM4 is inactive 1--PWM5 is complement of PWM4 0--PWM5 is inactive Independent Channel Operation 1--PWM0 is active 0--PWM0 is inactive 1--PWM1 is active 0--PWM1 is inactive 1--PWM2 is active 0--PWM2 is inactive 1--PWM3 is active 0--PWM3 is inactive 1--PWM4 is active 0--PWM4 is inactive 1--PWM5 is active 0--PWM5 is inactive
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 339
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.12 PMF Deadtime Sample Register (PMFDTMS)
Module Base + 0x000E
7 6 5 4 3 2 1 0
R W Reset
0
0
DT5
DT4
DT3
DT2
DT1
DT0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-18. PMF Deadtime Sample Register (PMFDTMS))
Read anytime and writes have no effect.
Table 11-16. PMFDTMS Field Descriptions
Field 5-0 DT[5:0] Description PMF Deadtime Sample Bits -- The DTx bits are grouped in pairs, DT0 and DT1, DT2 and DT3, DT4, and DT5. Each pair reflects the corresponding ISx pin value as sampled at the end of deadtime.
11.3.2.13 PMF Correction Control Register (PMFCCTL)
Module Base + 0x000F
7 6 5 4 3 2 1 0
R W Reset
0
0 ISENS
0 IPOLC 0 0 0 IPOLB 0 IPOLA 0
0
0
0
= Unimplemented or Reserved
Figure 11-19. PMF Correction Control Register (PMFCCTL)
Read and write anytime.
Table 11-17. PMFCCTL Field Descriptions
Field 5-4 ISENS Description Current Status Sensing Method -- This field selects the top/bottom correction scheme, illustrated in Table 11-18. Note: Assume the user will provide current sensing circuitry causing the voltage at the corresponding input pin to be low for positive current and high for negative current. In addition, it assumes the top PWMs are PWM 0, 2, and 4 while the bottom PWMs are PWM 1, 3, and 5. Note: The ISENS bits are not buffered. Changing the current status sensing method can affect the present PWM cycle.
MC9S12E128 Data Sheet, Rev. 1.07 340 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Table 11-17. PMFCCTL Field Descriptions (continued)
Field 2 IPOLC Description Current Polarity -- This buffered bit selects the PMF Value register for the PWM4 and PWM5 pins in top/bottom software correction in complementary mode. 0 PMF Value 4 register in next PWM cycle. 1 PMF Value 5 register in next PWM cycle. Note: The IPOLx bits take effect at the beginning of the next load cycle, regardless of the state of the load okay bit, LDOK. Select top/bottom software correction by writing 01 to the current select bits, ISENS[1:0], in the PWM control register. Reading the IPOLx bits read the buffered value and not necessarily the value currently in effect. Current Polarity -- This buffered bit selects the PMF Value register for the PWM2 and PWM3 pins in top/bottom software correction in complementary mode. 0 PMF Value 2 register in next PWM cycle. 1 PMF Value 3 register in next PWM cycle. Note: The IPOLx bits take effect at the beginning of the next load cycle, regardless of the state of the load okay bit, LDOK. Select top/bottom software correction by writing 01 to the current select bits, ISENS[1:0], in the PWM control register. Reading the IPOLx bits read the buffered value and not necessarily the value currently in effect. Current Polarity -- This buffered bit selects the PMF Value register for the PWM0 and PWM1 pins in top/bottom software correction in complementary mode. 0 PMF Value 0 register in next PWM cycle. 1 PMF Value 1 register in next PWM cycle. Note: The IPOLx bits take effect at the beginning of the next load cycle, regardless of the state of the load okay bit, LDOK. Select top/bottom software correction by writing 01 to the current select bits, ISENS[1:0], in the PWM control register. Reading the IPOLx bits read the buffered value and not necessarily the value currently in effect.
1 IPOLB
0 IPOLA
Table 11-18. Correction Method Selection
ISENS 00 01 10 11 No correction1 Manual correction Current status sample correction on pins IS0, IS1, and IS2 during deadtime2 Current status sample on pins IS0, IS1, and IS23 At the half cycle in center-aligned operation At the end of the cycle in edge-aligned operation Correction Method
1 2
The current status pins can be used as general purpose input/output ports. The polarity of the ISx pin is latched when both the top and bottom PWMs are off. At the 0% and 100% duty cycle boundaries, there is no deadtime, so no new current value is sensed. 3 Current is sensed even with 0% or 100% duty cycle.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 341
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.14 PMF Value 0 Register (PMFVAL0)
Module Base + 0x0010
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset 0 0 0 0 0 0 0
PMFVAL0 0 0 0 0 0 0 0 0 0
Figure 11-20. PMF Value 0 Register (PMFVAL0)
Read and write anytime.
Table 11-19. PMFVAL0 Field Descriptions
Field 16-0 PMFVAL0 Description PMF Value 0 Bits -- The 16-bit signed value in this buffered register is the pulse width in PWM0 clock period. A value less than or equal to zero deactivates the PWM output for the entire PWM period. A value greater than, or equal to the modulus, activates the PWM output for the entire PWM period. See Table 11-46. The terms activate and deactivate refer to the high and low logic states of the PWM output. Note: PMFVAL0 is buffered. The value written does not take effect until the LDOK bit is set and the next PWM load cycle begins Reading PMFVAL0 reads the value in the buffer and not necessarily the value the PWM generator is currently using.
11.3.2.15 PMF Value 1 Register (PMFVAL1)
Module Base + 0x0012
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset 0 0 0 0 0 0 0
PMFVAL1 0 0 0 0 0 0 0 0 0
Figure 11-21. PMF Value 1 Register (PMFVAL1)
Read and write anytime.
Table 11-20. PMFVAL1 Field Descriptions
Field 16-0 PMFVAL1 Description PMF Value 1 Bits -- The 16-bit signed value in this buffered register is the pulse width in PWM1 clock period. A value less than or equal to zero deactivates the PWM output for the entire PWM period. A value greater than, or equal to the modulus, activates the PWM output for the entire PWM period. See Table 11-46. The terms activate and deactivate refer to the high and low logic states of the PWM output. Note: PMFVAL1 is buffered. The value written does not take effect until the LDOK bit is set and the next PWM load cycle begins. Reading PMFVAL1 reads the value in the buffer and not necessarily the value the PWM generator is currently using.
MC9S12E128 Data Sheet, Rev. 1.07 342 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.16 PMF Value 2 Register (PMFVAL2)
Module Base + 0x0014
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset 0 0 0 0 0 0 0
PMFVAL2 0 0 0 0 0 0 0 0 0
Figure 11-22. PMF Value 2 Register (PMFVAL2)
Read and write anytime.
Table 11-21. PMFVAL2 Field Descriptions
Field 16-0 PMFVAL2 Description PMF Value 2 Bits -- The 16-bit signed value in this buffered register is the pulse width in PWM2 clock period. A value less than or equal to zero deactivates the PWM output for the entire PWM period. A value greater than, or equal to the modulus, activates the PWM output for the entire PWM period. See Table 11-46. The terms activate and deactivate refer to the high and low logic states of the PWM output. Note: PMFVAL2 is buffered. The value written does not take effect until the LDOK bit is set and the next PWM load cycle begins. Reading PMFVAL2 reads the value in the buffer and not necessarily the value the PWM generator is currently using.
11.3.2.17 PMF Value 3 Register (PMFVAL3)
Module Base + 0x0016
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset 0 0 0 0 0 0 0
PMFVAL3 0 0 0 0 0 0 0 0 0
Figure 11-23. PMF Value 3 Register (PMFVAL3)
Read and write anytime.
Table 11-22. PMFVAL3 Field Descriptions
Field 16-0 PMFVAL3 Description PMF Value 3 Bits -- The 16-bit signed value in this buffered register is the pulse width in PWM3 clock period. A value less than or equal to zero deactivates the PWM output for the entire PWM period. A value greater than, or equal to the modulus, activates the PWM output for the entire PWM period. See Table 11-46. The terms activate and deactivate refer to the high and low logic states of the PWM output. Note: PMFVAL3 is buffered. The value written does not take effect until the LDOK bit is set and the next PWM load cycle begins. Reading PMFVAL3 reads the value in the buffer and not necessarily the value the PWM generator is currently using.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 343
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.18 PMF Value 4 Register (PMFVAL4)
Module Base + 0x0018
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset 0 0 0 0 0 0 0
PMFVAL4 0 0 0 0 0 0 0 0 0
Figure 11-24. PMF Value 4 Register (PMFVAL4)
Read and write anytime.
Table 11-23. PMFVAL4 Field Descriptions
Field 16-0 PMFVAL4 Description PMF Value 4 Bits -- The 16-bit signed value in this buffered register is the pulse width in PWM4 clock period. A value less than or equal to zero deactivates the PWM output for the entire PWM period. A value greater than, or equal to the modulus, activates the PWM output for the entire PWM period. See Table 11-46. The terms activate and deactivate refer to the high and low logic states of the PWM output. Note: PMFVAL4 is buffered. The value written does not take effect until the LDOK bit is set and the next PWM load cycle begins. Reading PMFVAL4 reads the value in the buffer and not necessarily the value the PWM generator is currently using.
11.3.2.19 PMF Value 5 Register (PMFVAL5)
Module Base + 0x001A
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset 0 0 0 0 0 0 0
PMFVAL5 0 0 0 0 0 0 0 0 0
Figure 11-25. PMF Value 5 Register (PMFVAL5)
Read and write anytime.
Table 11-24. PMFVAL5 Field Descriptions
Field 16-0 PMFVAL5 Description PMF Value 5 Bits -- The 16-bit signed value in this buffered register is the pulse width in PWM5 clock period. A value less than or equal to zero deactivates the PWM output for the entire PWM period. A value greater than, or equal to the modulus, activates the PWM output for the entire PWM period. See Table 11-46. The terms activate and deactivate refer to the high and low logic states of the PWM output. Note: PMFVAL5 is buffered. The value written does not take effect until the LDOK bit is set and the next PWM load cycle begins. Reading PMFVAL5 reads the value in the buffer and not necessarily the value the PWM generator is currently using.
MC9S12E128 Data Sheet, Rev. 1.07 344 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.20 PMF Enable Control A Register (PMFENCA)
Module Base + 0x0020
7 6 5 4 3 2 1 0
R PWMENA W Reset 0
0
0
0
0
0 LDOKA PWMRIEA 0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-26. PMF Enable Control A Register (PMFENCA)
Read and write anytime.
Table 11-25. PMFENCA Field Descriptions
Field 7 PWMENA Description PWM Generator A Enable -- When MTG is clear, this bit when set enables the PWM generators A, B and C and the PWM0-5 pins. When PWMENA is clear, PWM generators A, B and C are disabled, and the PWM0-5 pins are in their inactive states unless the corresponding OUTCTLx bits are set. When MTG is set, this bit when set enables the PWM generator A and the PWM0 and PWM1 pins. When PWMENA is clear, the PWM generator A is disabled and PWM0 and PWM1 pins are in their inactive states unless the OUTCTL0 and OUTCTL1 bits are set. 0 PWM generator A and PWM0-1 (2-5 if MTG=0) pins disabled unless the respective OUTCTL bit is set. 1 PWM generator A and PWM0-1 (2-5 if MTG=0) pins enabled. Load Okay A -- When MTG is clear, this bit allows loads of the PRSCA bits, the PMFMODA register and the PWMVAL0-5 registers into a set of buffers. The buffered prescaler A divisor, PWM counter modulus A value, and all PWM pulse widths take effect at the next PWM reload. When MTG is set, this bit allows loads of the PRSCA bits, the PMFMODA register and the PWMVAL0-1 registers into a set of buffers. The buffered prescaler divisor A, PWM counter modulus A value, PWM0-1 pulse widths take effect at the next PWM reload. Set LDOKA by reading it when it is logic zero and then writing a logic one to it. LDOKA is automatically cleared after the new values are loaded, or can be manually cleared before a reload by writing a logic zero to it. Reset clears LDOKA. 0 Do not load new modulus A, prescaler A, and PWM0-1 (2-5 if MTG=0) values 1 Load prescaler A, modulus A, and PWM0-1 (2-5 if MTG=0) values Note: Do not set PWMENA bit before setting the LDOKA bit and do not clear the LDOKA bit at the same time as setting the PWMENA bit. PWM Reload Interrupt Enable A -- This bit enables the PWMRFA flag to generate CPU interrupt requests. 0 PWMRFA CPU interrupt requests disabled 1 PWMRFA CPU interrupt requests enabled
1 LDOKA
0 PWMRIEA
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 345
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.21 PMF Frequency Control A Register (PMFFQCA)
Module Base + 0x0021
7 6 5 4 3 2 1 0
R LDFQA W Reset 0 0 0 0 0 0 0 0 HALFA PRSCA PWMRFA
Figure 11-27. PMF Frequency Control A Register (PMFFQCA)
Read and write anytime.
Table 11-26. PMFFQCA Field Descriptions
Field 7-4 LDFQA Description Load Frequency A -- This field selects the PWM load frequency according to Table 11-27. See Section 11.4.7.2, "Load Frequency" for more details. Note: The LDFQA field takes effect when the current load cycle is complete, regardless of the state of the load okay bit, LDOKA. Reading the LDFQA field reads the buffered value and not necessarily the value currently in effect. Half Cycle Reload A -- This bit enables half-cycle reloads in center-aligned PWM mode. This bit has no effect on edge-aligned PWMs. 0 Half-cycle reloads disabled 1 Half-cycle reloads enabled Prescaler A -- This buffered field selects the PWM clock frequency illustrated in Table 11-28. Note: Reading the PRSCA field reads the buffered value and not necessarily the value currently in effect. The PRSCA field takes effect at the beginning of the next PWM cycle and only when the load okay bit, LDOKA, is set. PWM Reload Flag A -- This flag is set at the beginning of every reload cycle regardless of the state of the LDOKA bit. Clear PWMRFA by reading PMFFQCA with PWMRFA set and then writing a logic one to the PWMRFA bit. If another reload occurs before the clearing sequence is complete, writing logic one to PWMRFA has no effect. 0 No new reload cycle since last PWMRFA clearing 1 New reload cycle since last PWMRFA clearing Note: Clearing PWMRFA satisfies pending PWMRFA CPU interrupt requests.
3 HALFA
2-1 PRSCA
0 PWMRFA
Table 11-27. PWM Reload Frequency A
LDFQA 0000 0001 0010 0011 0100 0101 0110 0111 PWM Reload Frequency Every PWM opportunity Every 2 PWM opportunities Every 3 PWM opportunities Every 4 PWM opportunities Every 5 PWM opportunities Every 6 PWM opportunities Every 7 PWM opportunities Every 8 PWM opportunities LDFQ[3:0] 1000 1001 1010 1011 1100 1101 1110 1111 PWM Reload Frequency Every 9 PWM opportunities Every 10 PWM opportunities Every 11 PWM opportunities Every 12 PWM opportunities Every 13 PWM opportunities Every 14 PWM opportunities Every 15 PWM opportunities Every 16 PWM opportunities
MC9S12E128 Data Sheet, Rev. 1.07 346 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Table 11-28. PWM Prescaler A
PRSCA 00 01 10 11 PWM Clock Frequency fbus fbus/2 fbus/4 fbus/8
11.3.2.22 PMF Counter A Register (PMFCNTA)
Module Base + 0x0022
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset
0 0 0 0 0 0 0 0 0
PMFCNTA 0 0 0 0 0 0 0 0
= Unimplemented or Reserved
Figure 11-28. PMF Counter A Register (PMFCNTA)
Read anytime and writes have no effect.
Table 11-29. PMFCNTA Field Descriptions
Field 14-0 PMFCNTA Description PMF Counter A Bits -- This register displays the state of the 15-bit PWM A counter.
11.3.2.23 PMF Counter Modulo A Register (PMFMODA)
Module Base + 0x0024
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset
0 0 0 0 0 0 0 0 0
PMFMODA 0 0 0 0 0 0 0 0
= Unimplemented or Reserved
Figure 11-29. PMF Counter Modulo A Register (PMFMODA)
Read and write anytime.
Table 11-30. PMFMODA Field Descriptions
Field Description
14-0 PMF Counter Modulo A Bits -- The 15-bit unsigned value written to this register is the PWM period in PWM PMFMODA clock periods. Do not write a modulus value of zero. Note: The PWM counter modulo register is buffered. The value written does not take effect until the LDOKA bit is set and the next PWM load cycle begins. Reading PMFMODA reads the value in the buffer. It is not necessarily the value the PWM generator A is currently using.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 347
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.24 PMF Deadtime A Register (PMFDTMA)
Module Base + 0x0026
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset
0 0
0 0
0 0
0 0 1 1 1 1 1
PMFDTMA 1 1 1 1 1 1 1
= Unimplemented or Reserved
Figure 11-30. PMF Deadtime A Register (PMFDTMA)
Read anytime. This register cannot be modified after the WP bit is set.
Table 11-31. PMFDTMA Field Descriptions
Field 11-0 PMFDTMA Description PMF Deadtime A Bits -- The 12-bit value written to this register is the number of PWM clock cycles in complementary channel operation. A reset sets the PWM deadtime register to a default value of 0x0FFF, selecting a deadtime of 256-PWM clock cycles minus one bus clock cycle. Note: Deadtime is affected by changes to the prescaler value. The deadtime duration is determined as follows: DT = P x PMFDTMA - 1, where DT is deadtime, P is the prescaler value, PMFDTMA is the programmed value of dead time. For example: if the prescaler is programmed for a divide-by-two and the PMFDTMA is set to five, then P = 2 and the deadtime value is equal to DT = 2 x 5 - 1 = 9 IPbus clock cycles. A special case exists when the P = 1, then DT = PMFDTMA.
MC9S12E128 Data Sheet, Rev. 1.07 348 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.25 PMF Enable Control B Register (PMFENCB)
Module Base + 0x0028
7 6 5 4 3 2 1 0
R PWMENB W Reset 0
0
0
0
0
0 LDOKB PWMRIEB 0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-31. PMF Enable Control B Register (PMFENCB)
Read anytime and write only if MTG is set.
Table 11-32. PMFENCB Field Descriptions
Field 7 PWMENB Description PWM Generator B Enable -- If MTG is clear, this bit reads zero and cannot be written. If MTG is set, this bit when set enables the PWM generator B and the PWM2 and PWM3 pins. When PWMENB is clear, PWM generator B is disabled, and the PWM2 and PWM3 pins are in their inactive states unless the OUTCTL2 and OUTCTL3 bits are set. 0 PWM generator B and PWM2-3 pins disabled unless the respective OUTCTL bit is set. 1 PWM generator B and PWM2-3 pins enabled. Load Okay B -- If MTG is clear, this bit reads zero and cannot be written. If MTG is set, this bit loads the PRSCB bits, the PMFMODB register and the PWMVAL2-3 registers into a set of buffers. The buffered prescaler divisor B, PWM counter modulus B value, PWM2-3 pulse widths take effect at the next PWM reload. Set LDOKB by reading it when it is logic zero and then writing a logic one to it. LDOKB is automatically cleared after the new values are loaded, or can be manually cleared before a reload by writing a logic zero to it. Reset clears LDOKB. 0 Do not load new modulus B, prescaler B, and PWM2-3 values. 1 Load prescaler B, modulus B, and PWM2-3 values. Note: Do not set PWMENB bit before setting the LDOKB bit and do not clear the LDOKB bit at the same time as setting the PWMENB bit. PWM Reload Interrupt Enable B -- If MTG is clear, this bit reads zero and cannot be written. If MTG is set, this bit enables the PWMRFB flag to generate CPU interrupt requests. 0 PWMRFB CPU interrupt requests disabled 1 PWMRFB CPU interrupt requests enabled
1 LDOKB
0 PWMRIEB
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 349
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.26 PMF Frequency Control B Register (PMFFQCB)
Module Base + 0x0029
7 6 5 4 3 2 1 0
R LDFQB W Reset 0 0 0 0 0 0 0 0 HALFB PRSCB PWMRFB
Figure 11-32. PMF Frequency Control B Register (PMFFQCB)
Read anytime and write only if MTG is set.
Table 11-33. PMFFQCB Field Descriptions
Field 7-4 LDFQB Description Load Frequency B -- This field selects the PWM load frequency according to Table 11-34. See Section 11.4.7.2, "Load Frequency" for more details. Note: The LDFQB field takes effect when the current load cycle is complete, regardless of the state of the load okay bit, LDOKB. Reading the LDFQB field reads the buffered value and not necessarily the value currently in effect. Half Cycle Reload B -- This bit enables half-cycle reloads in center-aligned PWM mode. This bit has no effect on edge-aligned PWMs. 0 Half-cycle reloads disabled 1 Half-cycle reloads enabled Prescaler B -- This buffered field selects the PWM clock frequency illustrated in Table 11-35. Note: Reading the PRSCB field reads the buffered value and not necessarily the value currently in effect. The PRSCB field takes effect at the beginning of the next PWM cycle and only when the load okay bit, LDOKB, is set. PWM Reload Flag B -- This flag is set at the beginning of every reload cycle regardless of the state of the LDOKB bit. Clear PWMRFB by reading PMFFQCB with PWMRFB set and then writing a logic one to the PWMRFB bit. If another reload occurs before the clearing sequence is complete, writing logic one to PWMRFB has no effect. 0 No new reload cycle since last PWMRFB clearing 1 New reload cycle since last PWMRFB clearing Note: Clearing PWMRFB satisfies pending PWMRFB CPU interrupt requests.
3 HALFB
2-1 PRSCB
0 PWMRFB
Table 11-34. PWM Reload Frequency B
LDFQB 0000 0001 0010 0011 0100 0101 0110 0111 PWM Reload Frequency Every PWM opportunity Every 2 PWM opportunities Every 3 PWM opportunities Every 4 PWM opportunities Every 5 PWM opportunities Every 6 PWM opportunities Every 7 PWM opportunities Every 8 PWM opportunities LDFQ[3:0] 1000 1001 1010 1011 1100 1101 1110 1111 PWM Reload Frequency Every 9 PWM opportunities Every 10 PWM opportunities Every 11 PWM opportunities Every 12 PWM opportunities Every 13 PWM opportunities Every 14 PWM opportunities Every 15 PWM opportunities Every 16 PWM opportunities
MC9S12E128 Data Sheet, Rev. 1.07 350 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Table 11-35. PWM Prescaler B
PRSCB 00 01 10 11 PWM Clock Frequency fbus fbus/2 fbus/4 fbus/8
11.3.2.27 PMF Counter B Register (PMFCNTB)
Module Base + 0x002A
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset
0 0 0 0 0 0 0 0 0
PMFCNTB 0 0 0 0 0 0 0 0
= Unimplemented or Reserved
Figure 11-33. PMF Counter B Register (PMFCNTB)
Read anytime and writes have no effect.
Table 11-36. PMFCNTB Field Descriptions
Field 14-0 PMFCNTB Description PMF Counter B -- This register displays the state of the 15-bit PWM B counter.
11.3.2.28 PMF Counter Modulo B Register (PMFMODB)
Module Base + 0x002C
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset
0 0 0 0 0 0 0 0 0
PMFMODB 0 0 0 0 0 0 0 0
= Unimplemented or Reserved
Figure 11-34. PMF Counter Modulo B Register (PMFMODB)
Read anytime and write only if MTG is set.
Table 11-37. PMFMODB Field Descriptions
Field Description
14-0 PMF Counter Modulo B -- The 15-bit unsigned value written to this register is the PWM period in PWM clock PMFMODB periods. Do not write a modulus value of zero. Note: The PWM counter modulo register is buffered. The value written does not take effect until the LDOKB bit is set and the next PWM load cycle begins. Reading PMFMODB reads the value in the buffer. It is not necessarily the value the PWM generator B is currently using.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 351
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.29 PMF Deadtime B Register (PMFDTMB)
Module Base + 0x002E
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset
0 0
0 0
0 0
0 0 1 1 1 1 1
PMFDTMB 1 1 1 1 1 1 1
= Unimplemented or Reserved
Figure 11-35. PMF Deadtime B Register (PMFDTMB)
Read anytime and write only if MTG is set. This register cannot be modified after the WP bit is set.
Table 11-38. PMFDTMB Field Descriptions
Field 11-0 PMFDTMB Description PMF Deadtime B -- The 12-bit value written to this register is the number of PWM clock cycles in complementary channel operation. A reset sets the PWM deadtime register to a default value of 0x0FFF, selecting a deadtime of 256-PWM clock cycles minus one bus clock cycle. Note: Deadtime is affected by changes to the prescaler value. The deadtime duration is determined as follows: DT = P x PMFDTMB - 1, where DT is deadtime, P is the prescaler value, PMFDTMB is the programmed value of dead time. For example: if the prescaler is programmed for a divide-by-two and the PMFDTMB is set to five, then P = 2 and the deadtime value is equal to DT = 2 x 5 - 1 = 9 IPbus clock cycles. A special case exists when the P = 1, then DT = PMFDTMB.
MC9S12E128 Data Sheet, Rev. 1.07 352 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.30 PMF Enable Control C Register (PMFENCC)
Module Base + 0x0030
7 6 5 4 3 2 1 0
R PWMENC W Reset 0
0
0
0
0
0 LDOKC PWMRIEC 0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-36. PMF Enable Control C Register (PMFENCC)
Read anytime and write only if MTG is set.
Table 11-39. PMFENCC Field Descriptions
Field 7 PWMENC Description PWM Generator C Enable -- If MTG is clear, this bit reads zero and cannot be written. If MTG is set, this bit when set enables the PWM generator C and the PWM4 and PWM5 pins. When PWMENC is clear, PWM generator C is disabled, and the PWM4 and PWM5 pins are in their inactive states unless the OUTCTL4 and OUTCTL5 bits are set. 0 PWM generator C and PWM4-5 pins disabled unless the respective OUTCTL bit is set. 1 PWM generator C and PWM4-5 pins enabled. Load Okay C -- If MTG is clear, this bit reads zero and can not be written. If MTG is set, this bit loads the PRSCC bits, the PMFMODC register and the PWMVAL4-5 registers into a set of buffers. The buffered prescaler divisor C, PWM counter modulus C value, PWM4-5 pulse widths take effect at the next PWM reload. Set LDOKC by reading it when it is logic zero and then writing a logic one to it. LDOKC is automatically cleared after the new values are loaded, or can be manually cleared before a reload by writing a logic zero to it. Reset clears LDOKC. 0 Do not load new modulus C, prescaler C, and PWM4-5 values. 1 Load prescaler C, modulus C, and PWM4-5 values. Note: Do not set PWMENC bit before setting the LDOKC bit and do not clear the LDOKC bit at the same time as setting the PWMENC bit. PWM Reload Interrupt Enable C -- If MTG is clear, this bit reads zero and cannot be written. If MTG is set, this bit enables the PWMRFC flag to generate CPU interrupt requests. 0 PWMRFC CPU interrupt requests disabled 1 PWMRFC CPU interrupt requests enabled
1 LDOKC
0 PWMRIEC
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 353
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.31 PMF Frequency Control C Register (PMFFQCC)
Module Base + 0x0031
7 6 5 4 3 2 1 0
R LDFQC W Reset 0 0 0 0 0 0 0 0 HALFC PRSCC PWMRFC
Figure 11-37. PMF Frequency Control C Register (PMFFQCC)
Read anytime and write only if MTG is set.
Table 11-40. PMFFQCC Field Descriptions
Field 7-4 LDFQC Description Load Frequency C -- This field selects the PWM load frequency according to Table 11-41. See Section 11.4.7.2, "Load Frequency" for more details. Note: The LDFQC field takes effect when the current load cycle is complete, regardless of the state of the load okay bit, LDOKC. Reading the LDFQC field reads the buffered value and not necessarily the value currently in effect. Half Cycle Reload C -- This bit enables half-cycle reloads in center-aligned PWM mode. This bit has no effect on edge-aligned PWMs. 0 Half-cycle reloads disabled 1 Half-cycle reloads enabled Prescaler C -- This buffered field selects the PWM clock frequency illustrated in Table 11-42. Note: Reading the PRSCC field reads the buffered value and not necessarily the value currently in effect. The PRSCC field takes effect at the beginning of the next PWM cycle and only when the load okay bit, LDOKC, is set. PWM Reload Flag C -- This flag is set at the beginning of every reload cycle regardless of the state of the LDOKC bit. Clear PWMRFC by reading PMFFQCC with PWMRFC set and then writing a logic one to the PWMRFC bit. If another reload occurs before the clearing sequence is complete, writing logic one to PWMRFC has no effect. 0 No new reload cycle since last PWMRFC clearing 1 New reload cycle since last PWMRFC clearing Note: Clearing PWMRFC satisfies pending PWMRFC CPU interrupt requests.
3 HALFC
2 PRSCC
0 PWMRFC
Table 11-41. PWM Reload Frequency C
LDFQC 0000 0001 0010 0011 0100 0101 0110 0111 PWM Reload Frequency Every PWM opportunity Every 2 PWM opportunities Every 3 PWM opportunities Every 4 PWM opportunities Every 5 PWM opportunities Every 6 PWM opportunities Every 7 PWM opportunities Every 8 PWM opportunities LDFQ[3:0] 1000 1001 1010 1011 1100 1101 1110 1111 PWM Reload Frequency Every 9 PWM opportunities Every 10 PWM opportunities Every 11 PWM opportunities Every 12 PWM opportunities Every 13 PWM opportunities Every 14 PWM opportunities Every 15 PWM opportunities Every 16 PWM opportunities
MC9S12E128 Data Sheet, Rev. 1.07 354 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Table 11-42. PWM Prescaler C
PRSCC 00 01 10 11 PWM Clock Frequency fbus fbus/2 fbus/4 fbus/8
11.3.2.32 PMF Counter C Register (PMFCNTC)
Module Base + 0x0032
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset
0 0 0 0 0 0 0 0 0
PMFCNTC 0 0 0 0 0 0 0 0
= Unimplemented or Reserved
Figure 11-38. PMF Counter C Register (PMFCNTC)
Read anytime and writes have no effect.
Table 11-43. PMFCNTC Field Descriptions
Field Description
14-0 PMF Counter C -- This register displays the state of the 15-bit PWM C counter. PMFCNTC`
11.3.2.33 PMF Counter Modulo C Register (PMFMODC)
Module Base + 0x0034
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset
0 0 0 0 0 0 0 0 0
PMFMODC 0 0 0 0 0 0 0 0
= Unimplemented or Reserved
Figure 11-39. PMF Counter Modulo C Register (PMFMODC)
Read anytime and write only if MTG is set.
Table 11-44. PMFMODC Field Descriptions
Field Description
14-0 PMF Couner Modulo C -- The 15-bit unsigned value written to this register is the PWM period in PWM clock PMFMODC periods. Do not write a modulus value of zero. Note: The PWM counter modulo register is buffered. The value written does not take effect until the LDOKC bit is set and the next PWM load cycle begins. Reading PMFMODC reads the value in the buffer. It is not necessarily the value the PWM generator A is currently using.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 355
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.3.2.34 PMF Deadtime C Register (PMFDTMC)
Module Base + 0x0000
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R W Reset
0 0
0 0
0 0
0 0 1 1 1 1 1
PMFDTMC 1 1 1 1 1 1 1
= Unimplemented or Reserved
Figure 11-40. PMF Deadtime C Register (PMFDTMC)
Read anytime and write only if MTG is set. This register cannot be modified after the WP bit is set.
Table 11-45. PMFDTMC Field Descriptions
Field 11-0 PMFDTMC Description PMF Deadtime C -- The 12-bit value written to this register is the number of PWM clock cycles in complementary channel operation. A reset sets the PWM deadtime register to a default value of 0x0FFF, selecting a deadtime of 4096-PWM clock cycles minus one bus clock cycle. Note: Deadtime is affected by changes to the prescaler value. The deadtime duration is determined as follows: DT = P x PMFDTMC - 1, where DT is deadtime, P is the prescaler value, PMFDTMC is the programmed value of dead time. For example: if the prescaler is programmed for a divide-by-two and the PMFDTMC is set to five, then P = 2 and the deadtime value is equal to DT = 2 x 5 - 1 = 9 IPbus clock cycles. A special case exists when the P = 1, then DT = PMFDTMC.
MC9S12E128 Data Sheet, Rev. 1.07 356 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.4
11.4.1
Functional Description
Block Diagram
A block diagram of the PMF is shown in Figure 11-1. The MTG bit allows the use of multiple PWM generators (A, B, and C) or just a single generator (A). PWM0 and PWM1 constitute Pair A, PWM2 and PWM3 constitute Pair B, and PWM4 and PWM5 constitute Pair C.
11.4.2
Prescaler
To permit lower PWM frequencies, the prescaler produces the PWM clock frequency by dividing the bus clock frequency by one, two, four, and eight. Each PWM generator has its own prescaler divisor. Each prescaler is buffered and will not be used by its PWM generator until the corresponding Load OK bit is set and a new PWM reload cycle begins.
11.4.3
PWM Generator
Each PWM generator contains a 15-bit up/down PWM counter producing output signals with software-selectables: * Alignment--The logic state of each pair EDGE bit determines whether the PWM pair outputs are edge-aligned or center-aligned * Period--The value written to each pair PWM counter modulo register is used to determine the PWM pair period. The period can also be varied by using the prescaler -- With edge-aligned output, the modulus is the period of the PWM output in clock cycles -- With center-aligned output, the modulus is one-half of the PWM output period in clock cycles * Pulse width--The number written to the PWM value register determines the pulse width duty cycle of the PWM output in clock cycles -- With center-aligned output, the pulse width is twice the value written to the PWM value register -- With edge-aligned output, the pulse width is the value written to the PWM value register
11.4.3.1
Alignment
Each edge-align bit, EDGEx, selects either center-aligned or edge-aligned PWM generator outputs.
ALIGNMENT REFERENCE
UP/DOWN COUNTER MODULUS = 4
PWM OUTPUT DUTY CYCLE = 50%
Figure 11-41. Center-Aligned PWM Output
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 357
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
ALIGNMENT REFERENCE
UP COUNTER MODULUS = 4
PWM OUTPUT DUTY CYCLE = 50%
Figure 11-42. Edge-Aligned PWM Output
NOTE Because of the equals-comparator architecture of this PMF, the modulus equals zero case is considered illegal. Therefore, the modulus register does not return to zero, and a modulus value of zero will result in waveforms inconsistent with the other modulus waveforms. If a modulus of zero is loaded, the counter will continually count down from $7FFF. This operation will not be tested or guaranteed. Consider it illegal. However, the dead-time constraints and fault conditions will still be guaranteed.
11.4.3.2
Period
A PWM period is determined by the value written to the PWM counter modulo register. The PWM counter is an up/down counter in a center-aligned operation. In this mode the PWM highest output resolution is two bus clock cycles. PWM period = (PWM modulus) x (PWM clock period) x 2
COUNT 1 2 3 4 3 2 1 0
UP/DOWN COUNTER MODULUS = 4
PWM CLOCK PERIOD PWM PERIOD = 8 x PWM CLOCK PERIOD
Figure 11-43. Center-Aligned PWM Period
MC9S12E128 Data Sheet, Rev. 1.07 358 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
In an edge-aligned operation, the PWM counter is an up counter. The PWM output resolution is one bus clock cycle. PWM period = PWM modulus x PWM clock period
COUNT 1 2 3 4
UP COUNTER MODULUS = 4
PWM CLOCK PERIOD PWM PERIOD = 4 x PWM CLOCK PERIOD
Figure 11-44. Edge-Aligned PWM Period
11.4.3.3
Duty Cycle
The signed 16-bit number written to the PMF value registers is the pulse width in PWM clock periods of the PWM generator output.
PMFVAL Duty cycle = ------------------------------- x 100 MODULUS
NOTE A PWM value less than or equal to zero deactivates the PWM output for the entire PWM period. A PWM value greater than or equal to the modulus activates the PWM output for the entire PWM period.
Table 11-46. PWM Value and Underflow Conditions
PMFVALx $0000-$7FFF $8000-$FFFF Condition Normal Underflow PWM Value Used Value in registers $0000
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 359
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Center-aligned operation is illustrated in Figure 11-45. PWM pulse width = (PWM value) x (PWM clock period) x 2
COUNT 0 1 2 3 4 3 2 1 0 1 2 3 4 3 2 1
UP/DOWN COUNTER MODULUS = 4
PWM VALUE = 0 0/4 = 0% PWM VALUE = 1 1/4 = 25% PWM VALUE = 2 2/4 = 50% PWM VALUE = 3 3/4 = 75% PWM VALUE = 4 4/4 = 100%
Figure 11-45. Center-Aligned PWM Pulse Width
Edge-aligned operation is illustrated in Figure 11-46. PWM pulse width = (PWM value) x (PWM clock period)
COUNT 1 2 30
UP COUNTER MODULUS = 4
PWM VALUE = 0 0/4 = 0% PWM VALUE = 1 1/4 = 25% PWM VALUE = 2 2/4 = 50% PWM VALUE = 3 3/4 = 75% PWM VALUE = 4 4/4 = 100%
Figure 11-46. Edge-Aligned PWM Pulse Width
MC9S12E128 Data Sheet, Rev. 1.07 360 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.4.4
Independent or Complementary Channel Operation
Writing a logic one to a INDEPx bit configures a pair of the PWM outputs as two independent PWM channels. Each PWM output has its own PWM value register operating independently of the other channels in independent channel operation. Writing a logic zero to a INDEPx bit configures the PWM output as a pair of complementary channels. The PWM pins are paired as shown in Figure 11-47 in complementary channel operation.
PMFVAL0 REGISTER PAIR A PWM CHANNELS 0 AND 1 TOP BOTTOM PMFVAL2 REGISTER PAIR B PWM CHANNELS 2 AND 3 TOP BOTTOM PMFVAL4 REGISTER PAIR C PWM CHANNELS 4 AND 5 TOP BOTTOM PMFVAL5 REGISTER PMFVAL3 REGISTER PMFVAL1 REGISTER
Figure 11-47. Complementary Channel Pairs
The complementary channel operation is for driving top and bottom transistors in a motor drive circuit, such as the one in Figure 11-48.
PWM 0
PWM 2
PWM 4
AC INPUTS
TO MOTOR
PWM 1
PWM 3
PWM 5
Figure 11-48. Typical 3 Phase AC Motor Drive
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 361
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
In complementary channel operation, there are three additional features: * Deadtime insertion * Separate top and bottom pulse width correction for distortions are caused by deadtime inserted and the motor drive characteristics * Separate top and bottom output polarity control * Swap functionality
11.4.5
Deadtime Generators
While in the complementary mode, each PWM pair can be used to drive top/bottom transistors, as shown in Figure 11-49. Ideally, the PWM pairs are an inversion of each other. When the top PWM channel is active, the bottom PWM channel is inactive, and vice versa. NOTE To avoid a short-circuit on the DC bus and endangering the transistor, there must be no overlap of conducting intervals between top and bottom transistor. But the transistor's characteristics make its switching-off time longer than switching-on time. To avoid the conducting overlap of top and bottom transistors, deadtime needs to be inserted in the switching period. Deadtime generators automatically insert software-selectable activation delays into each pair of PWM outputs. The deadtime register (PMFDTMx) specifies the number of PWM clock cycles to use for deadtime delay. Every time the deadtime generator inputs changes state, deadtime is inserted. Deadtime forces both PWM outputs in the pair to the inactive state. A method of correcting this, adding to or subtracting from the PWM value used, is discussed next.
TOP (PWM0) OUT1 OUT0 MUX PWM0 & PWM1 DEADTIME GENERATOR TOP/BOTTOM GENERATOR BOTTOM (PWM1) TO FAULT PROTECTION
OUTCTL0 TOP (PWM2) OUT3 TOP/BOTTOM GENERATOR BOTTOM (PWM3) TO FAULT PROTECTION
OUT2 PWM GENERATOR CURRENT STATUS MUX PWM2 & PWM3
DEADTIME GENERATOR
OUTCTL2 TOP (PWM4) OUT5 TOP/BOTTOM GENERATOR BOTTOM (PWM5) TO FAULT PROTECTION
OUT4 MUX PWM4 & PWM5
DEADTIME GENERATOR
OUTCTL4
Figure 11-49. Deadtime Generators
MC9S12E128 Data Sheet, Rev. 1.07 362 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
MODULUS = 4 PWM VALUE = 2
PWM0, NO DEADTIME PWM1, NO DEADTIME PWM0, DEADTIME = 1 PWM1, DEADTIME = 1
Figure 11-50. Deadtime Insertion, Center Alignment
MODULUS = 3 PWM VALUE = 1 PWM Value = 3 PWM0, NO DEADTIME PWM1, NO DEADTIME PWM0, DEADTIME = 2 PWM1, DEADTIME = 2 PWM VALUE = 3 PWM VALUE = 3
Figure 11-51. Deadtime at Duty Cycle Boundaries
MODULUS = 3
PWM VALUE PWM0, NO DEADTIME PWM1, NO DEADTIME PWM0, DEADTIME = 3 PWM1, DEADTIME = 3
2
PWM VALUE = 3 PWM VALUE = 2
PWM VALUE = 1
Figure 11-52. Deadtime and Small Pulse Widths
NOTE The waveform at the pad is delayed by two bus clock cycles for deadtime insertion.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 363
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.4.5.1
Top/Bottom Correction
In complementary mode, either the top or the bottom transistor controls the output voltage. However, deadtime has to be inserted to avoid overlap of conducting interval between the top and bottom transistor. Both transistors in complementary mode are off during deadtime, allowing the output voltage to be determined by the current status of load and introduce distortion in the output voltage. See Figure 11-53. On AC induction motors running open-loop, the distortion typically manifests itself as poor low-speed performance, such as torque ripple and rough operation.
DESIRED LOAD VOLTAGE DEADTIME PWM TO TOP TRANSISTOR POSITIVE CURRENT V+
NEGATIVE CURRENT PWM TO BOTTOM TRANSISTOR POSITIVE CURRENT LOAD VOLTAGE NEGATIVE CURRENT LOAD VOLTAGE
Figure 11-53. Deadtime Distortion
During deadtime, load inductance distorts output voltage by keeping current flowing through the diodes. This deadtime current flow creates a load voltage that varies with current direction. With a positive current flow, the load voltage during deadtime is equal to the bottom supply, putting the top transistor in control. With a negative current flow, the load voltage during deadtime is equal to the top supply putting the bottom transistor in control. Remembering that the original PWM pulse widths were shortened by deadtime insertion, the averaged sinusoidal output will be less than desired value. However, when deadtime is inserted, it creates a distortion in motor current waveform. This distortion is aggravated by dissimilar turn-on and turn-off delays of each of the transistors. By giving the PWM module information on which transistor is controlling at a given time this distortion can be corrected. For a typical circuit in complementary channel operation, only one of the transistors will be effective in controlling the output voltage at any given time. This depends on the direction of the motor current for that pair. See Figure 11-53. To correct distortion one of two different factors must be added to the desired PWM value, depending on whether the top or bottom transistor is controlling the output voltage. Therefore, the software is responsible for calculating both compensated PWM values prior to placing them in an odd-numbered/even numbered PWM register pair. Either the odd or the even PMFVAL register controls the pulse width at any given time.
MC9S12E128 Data Sheet, Rev. 1.07 364 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
For a given PWM pair, whether the odd or even PMFVAL register is active depends on either: * The state of the current status pin, ISx, for that driver * The state of the odd/even correction bit, IPOLx, for that driver To correct deadtime distortion, software can decrease or increase the value in the appropriate PMFVAL register. * In edge-aligned operation, decreasing or increasing the PWM value by a correction value equal to the deadtime typically compensates for deadtime distortion. * In center-aligned operation, decreasing or increasing the PWM value by a correction value equal to one-half the deadtime typically compensates for deadtime distortion. In the complementary channel operation, ISENS selects one of three correction methods: * Manual correction * Automatic current status correction during deadtime * Automatic current status correction when the PWM counter value equals the value in the PWM counter modulus registers
Table 11-47. Correction Method Selection
ISENS 00 01 10 11 No correction1 Manual correction Current status sample correction on pins IS0, IS1, and IS2 during deadtime2 Current status sample on pins IS0, IS1, and IS23 At the half cycle in center-aligned operation At the end of the cycle in edge-aligned operation Correction Method
1 2
The current status pins can be used as general purpose input/output ports. The polarity of the ISx pin is latched when both the top and bottom PWMs are off. At the 0% and 100% duty cycle boundaries, there is no deadtime, so no new current value is sensed. 3 Current is sensed even with 0% or 100% duty cycle.
NOTE Assume the user will provide current status sensing circuitry causing the voltage at the corresponding input pin to be low for positive current and high for negative current. In addition, it assumes the top PWMs are PWM 0, 2, and 4 while the bottom PWMS are PWM 1, 3, and 5.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 365
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.4.5.2
Manual Correction
The IPOLx bits select either the odd or the even PWM value registers to use in the next PWM cycle.
Table 11-48. Top/Bottom Manual Correction
Bit IPOLA Logic Atate 0 1 IPOLB 0 1 IPOLC 0 1 Output Control PMFVAL0 controls PWM0/PWM1 pair PMFVAL1 controls PWM0/PWM1 pair PMFVAL2 controls PWM2/PWM3 pair PMFVAL3 controls PWM2/PWM3 pair PMFVAL4 controls PWM4/PWM5 pair PMFVAL5 controls PWM4/PWM5 pair
NOTE IPOLx bits are buffered so only one PWM register is used per PWM cycle. If an IPOLx bit changes during a PWM period, the new value does not take effect until the next PWM period. IPOLx bits take effect at the end of each PWM cycle regardless of the state of the load okay bit, LDOK.
PWM CONTROLLED BY ODD PWMVALREGISTER PWM CONTROLLED BY EVEN PWMVAL REGISTER D CLK Q A DEADTIME GENERATOR B A/B BOTTOM PWM
TOP PWM
IPOLx BIT PWM CYCLE START
Figure 11-54. Internal Correction Logic when ISENS = 01
To detect the current status, the voltage on each ISx pin is sampled twice in a PWM period, at the end of each deadtime. The value is stored in the DTx bits in the PMF Deadtime Sample register (PMFDTMS). The DTx bits are a timing marker especially indicating when to toggle between PWM value registers. Software can then set the IPOLx bit to toggle PMFVAL registers according to DTx values.
MC9S12E128 Data Sheet, Rev. 1.07 366 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
PWM0 POSITIVE CURRENT NEGATIVE CURRENT PWM1 VOLTAGE SENSOR PWM1 D PWM0 CLK Q DT0
IS0 PIN D CLK Q DT1
Figure 11-55. Current-Status Sense Scheme for Deadtime Correction
If both D flip-flops latch low, DT0 = 0, DT1 = 0, during deadtime periods if current is large and flowing out of the complementary circuit. See Figure 11-55. If both D flip-flops latch the high, DT0 = 1, DT1 = 1, during deadtime periods if current is also large and flowing into the complementary circuit. However, under low-current, the output voltage of the complementary circuit during deadtime is somewhere between the high and low levels. The current cannot free-wheel throughout the opposition anti-body diode, regardless of polarity, giving additional distortion when the current crosses zero. Sampled results will be DT0 = 0 and DT1 = 1. Thus, the best time to change one PWM value register to another is just before the current zero crossing.
T DEADTIME PWM TO TOP TRANSISTOR B T B V+
POSITIVE CURRENT
NEGATIVE CURRENT PWM TO BOTTOM TRANSISTOR LOAD VOLTAGE WITH HIGH POSITIVE CURRENT LOAD VOLTAGE WITH LOW POSITIVE CURRENT LOAD VOLTAGE WITH HIGH NEGATIVE CURRENT LOAD VOLTAGE WITH NEGATIVE CURRENT T = DEADTIME INTERVAL BEFORE ASSERTION OF TOP PWM B = DEADTIME INTERVAL BEFORE ASSERTION OF BOTTOM PWM
Figure 11-56. Output Voltage Waveforms
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 367
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.4.5.3
Current-Sensing Correction
A current sense pin, ISx, for a PWM pair selects either the odd or the even PWM value registers to use in the next PWM cycle. The selection is based on user-provided current sense circuitry driving the ISx pin high for negative current and low for positive current.
Table 11-49. Top/Bottom Current-Sense Correction
Pin IS0 IS1 IS2 Logic State 0 1 0 1 0 1 Output Control PMFVAL0 controls PWM0/PWM1 pair PMFVAL1 controls PWM0/PWM1 pair PMFVAL2 controls PWM2/PWM3 pair PMFVAL3 controls PWM2/PWM3 pair PMFVAL4 controls PWM4/PWM5 pair PMFVAL5 controls PWM4/PWM5 pair
Previously shown, the current direction can be determined by the output voltage during deadtime. Thus, a simple external voltage sensor can be used when current status is completed during deadtime, ISENS = 10. Deadtime does not exists at the 100 percent and zero percent duty cycle boundaries. Therefore, the second automatic mode must be used for correction, ISENS = 11, where current status is sampled at the half cycle in center-aligned operation and at the end of cycle in edge-aligned operation. Using this mode requires external circuitry. It actually senses current direction.
PWM CONTROLLED BY ODD PWMVAL REGISTER PWM CONTROLLED BY EVEN PWMVAL REGISTER INITIAL VALUE = 0 ISx PIN IN DEADTIME D CLK Q D CLK Q A DEADTIME GENERATOR B A/B BOTTOM PWM TOP PWM
PWM CYCLE START
Figure 11-57. Internal Correction Logic when ISENS = 10
PWM CONTROLLED BY ODD PWMVAL REGISTER PWM CONTROLLED BY EVEN PWMVAL REGISTER INITIAL VALUE = 0 ISx PIN PMFCNT = PMFMOD D CLK Q D CLK Q
A DEADTIME GENERATOR B A/B
TOP PWM BOTTOM PWM
PWM CYCLE START
Figure 11-58. Internal Correction Logic when ISENS = 11
MC9S12E128 Data Sheet, Rev. 1.07 368 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
NOTE Values latched on the ISx pins are buffered so only one PWM register is used per PWM cycle. If a current status changes during a PWM period, the new value does not take effect until the next PWM period. When initially enabled by setting the PWMEN bit, no current status has previously been sampled. PWM value registers one, three, and five initially control the three PWM pairs when configured for current status correction.
11.4.5.4
Output Polarity
Output polarity of the PWMs is determined by two options: TOPNEG and BOTNEG. The top polarity option, TOPNEG, controls the polarity of PWM0, PWM2 and PWM4. The bottom polarity option, BOTNEG, controls the polarity of PWM1, PWM3 and PWM5. Positive polarity means when the PWM is active its output is high. Conversely, negative polarity means when the PWM is active its output is low. The TOPNEG and BOTNEG are in the configure register. TOPNEG is the output of PWM0, PWM2 and PWM4. They are active low. If TOPNEG is set, PWM0, PWM2, and PWM4 outputs become active-low. When BOTNEG is set, PWM1, PWM3, and PWM5 outputs are active-low. When these bits are clear, their respective PWM pins are active-high. See Figure 11-59 and Figure 11-60.
DESIRED LOAD VOLTAGE TOP PWM BOTTOM PWM LOAD VOLTAGE
Figure 11-59. Correction with Positive Current
DESIRED LOAD VOLTAGE TOP PWM BOTTOM PWM LOAD VOLTAGE
Figure 11-60. Correction with Negative Current
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 369
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
UP/DOWN COUNTER MODULUS = 4
UP COUNTER MODULUS = 4 PWM = 0
PWM = 0 CENTER-ALIGNED PWM = 1 POSITIVE POLARITY PWM = 2 PWM = 3 PWM = 4 UP/DOWN COUNTER MODULUS = 4
PWM = 1 EDGE-ALIGNED PWM = 2 POSITIVE POLARITY PWM = 3 PWM = 4
UP COUNTER MODULUS = 4 PWM = 0
PWM = 0 PWM = 1 CENTER-ALIGNED PWM = 2 NEGATIVE POLARITY PWM = 3 PWM = 4
PWM = 1 EDGE-ALIGNED PWM = 2 NEGATIVE POLARITY PWM = 3 PWM = 4
Figure 11-61. PWM Polarity
11.4.6
Software Output Control
Setting output control enable bit, OUTCTLx, enables software to drive the PWM outputs rather than the PWM generator. In an independent mode, with OUTCTLx = 1, the output bit OUTx, controls the PWMx channel. In a complementary channel operation the even OUTCTL bit is used to enable software output control for the pair. But the OUTCTL bits must be switched in pairs for proper operation. The OUTCTLx and OUTx bits are in the PWM output control register. NOTE During software output control, TOPNEG and BOTNEG still control output polarity. It will take upto 3 clock cycles to see the effect of output control on the PWM output pins. In independent PWM operation, setting or clearing the OUTx bit activates or deactivates the PWMx output. In complementary channel operation, the even-numbered OUTx bits replace the PWM generator outputs as inputs to the deadtime generators. Complementary channel pairs still cannot be active simultaneously, and the deadtime generators continue to insert deadtime in both channels of that pair, whenever an even OUTx bit toggles. Even OUTx bits control the top PWM signals while the odd OUTx bits control the bottom PWM signals with respect to the even OUTx bits. Setting the odd OUTx bit makes its corresponding PWMx the complement of its even pair, while clearing the odd OUTx bit deactivates the odd PWMx.
MC9S12E128 Data Sheet, Rev. 1.07 370 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
Setting the OUTCTLx bits do not disable the PWM generators and current status sensing circuitry. They continue to run, but no longer control the output pins. When the OUTCTLx bits are cleared, the outputs of the PWM generator become the inputs to the deadtime generators at the beginning of the next PWM cycle. Software can drive the PWM outputs even when PWM enable bit (PWMEN) is set to zero. NOTE Avoid an unexpected deadtime insertion by clearing the OUTx bits before setting and after clearing the OUTCTLx bits.
MODULUS = 4 PWM VALUE = 2 DEADTIME = 2
PWM0 PWM1 PWM0 WITH DEADTIME PWM1 WITH DEADTIME
OUTCTL0 OUT0 OUT1 PWM0 PWM1
Figure 11-62. Setting OUT0 with OUTCTL Set in Complementary Mode
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 371
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
MODULUS = 4 PWM VALUE = 2 DEADTIME = 2
PWM0 PWM1 PWM0 WITH DEADTIME PWM1 WITH DEADTIME
OUTCTL0 OUT0 OUT1 PWM0 PWM1
Figure 11-63. Clearing OUT0 with OUTCTL Set In Complementary Mode
MODULUS = 4 PWM VALUE = 2 DEADTIME = 2
PWM0 PWM1 PWM0 WITH DEADTIME PWM1 WITH DEADTIME
OUTCTL0 OUT0 OUT1 PWM0 PWM1
Figure 11-64. Setting OUTCTL with OUT0 Set in Complementary Mode
MC9S12E128 Data Sheet, Rev. 1.07 372 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.4.7
11.4.7.1
PWM Generator Loading
Load Enable
The load okay bit, LDOK, enables loading the PWM generator with: * A prescaler divisor--from the PRSC1 and PRSC0 bits in PWM control register * A PWM period--from the PWM counter modulus registers * A PWM pulse width--from the PWM value registers LDOK prevents reloading of these PWM parameters before software is finished calculating them Setting LDOK allows the prescaler bits, PMFMOD and PMFVALx registers to be loaded into a set of buffers. The loaded buffers use the PWM generator at the beginning of the next PWM reload cycle. Set LDOK by reading it when it is a logic zero and then writing a logic one to it. After loading, LDOK is automatically cleared.
11.4.7.2
Load Frequency
The LDFQ3, LDFQ2, LDFQ1, and LDFQ0 bits in the PWM control register (PWMCTL) select an integral loading frequency of one to 16-PWM reload opportunities. The LDFQ bits take effect at every PWM reload opportunity, regardless the state of the load okay bit, LDOK. The half bit in the PWMCTL register controls half-cycle reloads for center-aligned PWMs. If the half bit is set, a reload opportunity occurs at the beginning of every PWM cycle and half cycle when the count equals the modulus. If the half bit is not set, a reload opportunity occurs only at the beginning of every cycle. Reload opportunities can only occur at the beginning of a PWM cycle in edge-aligned mode. NOTE Loading a new modulus on a half cycle will force the count to the new modulus value minus one on the next clock cycle. Half cycle reloads are possible only in center-aligned mode. Enabling or disabling half-cycle reloads in edge-aligned mode will have no effect on the reload rate.
UP/DOWN COUNTER RELOAD CHANGE RELOAD FREQUENCY
TO EVERY TWO OPPORTUNITIES
TO EVERY FOUR OPPORTUNITIES
TO EVERY OPPORTUNITY
Figure 11-65. Full Cycle Reload Frequency Change
UP/DOWN COUNTER RELOAD CHANGE RELOAD FREQUENCY
TO EVERY TWO OPPORTUNITIES
TO EVERY TO EVERY TO EVERY FOUR OPPORTUNITIES OPPORTUNITY TWO OPPORTUNITIES
Figure 11-66. Half Cycle Reload Frequency Change
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 373
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.4.7.3
Reload Flag
With a reload opportunity, regardless an actual reload occurs as determined by LDOK bit, the PWMF reload flag is set. If the PWM reload interrupt enable bit, PWMRIE is set, the PWMF flag generates CPU interrupt requests allowing software to calculate new PWM parameters in real time. When PWMRIE is not set, reloads still occur at the selected reload rate without generating CPU interrupt requests.
READ PWMRF AS 1 THEN WRITE 0 TO PWMF RESET Vdd D PWM Reload CLR Q PWMRIE PWMRF CPU Interrupt Request
CLK
Figure 11-67. PWMRF Reload Interrupt Request
HALF = 0, LDFQ[3:0] = 00 = Reload every cycle
UP/DOWN COUNTER
LDOK = 1 MODULUS = 3 PWM VALUE = 1 PWMRF = 1 PWM
0 3 2 1
1 3 2 1
0 3 1 1
Figure 11-68. Full-Cycle Center-Aligned PWM Value Loading
HALF = 0, LDFQ[3:0] = 00 = Reload every cycle
Up/Down COUNTER
LDOK = 1 MODULUS = 2 PWM VALUE = 1 PWMRF = 1 PWM
1 3 1 1
1 2 1 1
1 1 1 1
0 2 1 1
Figure 11-69. Full-Cycle Center-Aligned Modulus Loading
MC9S12E128 Data Sheet, Rev. 1.07 374 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
HALF = 1, LDFQ[3:0] = 00 = Reload EVERY HALF-CYCLE
UP/DOWN COUNTER 1 3 1 1
LDOK = 1 MODULUS = 3 PWM VALUE = 1 PWMRF = 1 PWM
1 3 2 1
0 3 2 1
0 3 2 1
1 3 1 1
1 3 3 1
0 3 3 1
Figure 11-70. Half-Cycle Center-Aligned PWM Value Loading
HALF = 1, LDFQ[3:0] = 00 = Reload every HALF-cycle
Up/Down COUNTER 1 1 1 1 1 4 1 1
LDOK = 1 MODULUS = 2 PWM VALUE = 1 PWMRF = 1
0 2 1 1
0 3 1 1
1 4 1 1
0 4 1 1
0 2 1 1
PWM
Figure 11-71. Half-Cycle Center-Aligned Modulus Loading
LDFQ[3:0] = 00 = Reload every cycle
Up-Only COUNTER
LDOK = 1 MODULUS = 3 PWM VALUE = 1 PWMRF = 1
0 3 2 1
1 3 2 1
0 3 1 1
0 3 1 1
PWM
Figure 11-72. Edge-Aligned PWM Value Loading
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 375
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
LDFQ[3:0] = 00 = Reload every cycle
Up-Only COUNTER
LDOK = 1 MODULUS = 3 PWM VALUE = 2 PWMRF = 1 PWM
1 4 2 1
1 2 2 1
0 1 2 1
Figure 11-73. Untitled Figure
11.4.7.4
Initialization
Initialize all registers and set the LDOK bit before setting the PWMEN bit. With LDOK set, setting PWMEN for the first time after reset, immediately loads the PWM generator thereby setting the PWMRF flag. PWMRF generates a CPU interrupt request if the PWMRIE bit is set. In complementary channel operation with current-status correction selected, PWM value registers one, three, and five control the outputs for the first PWM cycle. NOTE Even if LDOK is not set, setting PWMEN also sets the PWMRF flag. To prevent a CPU interrupt request, clear the PWMRIE bit before setting PWMEN. Setting PWMEN for the first time after reset without first setting LDOK loads a prescaler divisor of one, a PWM value of $0000, and an unknown modulus. The PWM generator uses the last values loaded if PWMEN is cleared and then set while LDOK equals zero.Initializing the deadtime register, after setting PWMEN or OUTCTLx, can cause an improper deadtime insertion. However, the deadtime can never be shorter than the specified value.
IPBus CLOCK PWMEN BIT PWM PINS HI-Z ACTIVE HI-Z
Figure 11-74. PWMEN and PWM Pins in Independent Operation
IPBus CLOCK PWMEN BIT PWM PINS HI-Z ACTIVE HI-Z
Figure 11-75. PWMEN and PWM Pins in Complementary Operation
MC9S12E128 Data Sheet, Rev. 1.07 376 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
When the PWMEN bit is cleared: * The PWMx outputs will be tri-stated unless OUTCTLx = 1 * The PWM counter is cleared and does not count * The PWM generator forces its outputs to zero * The PWMRF flag and pending CPU interrupt requests are not cleared * All fault circuitry remains active unless FPINEx = 0 * Software output control remains active * Deadtime insertion continues during software output control
11.4.8
Fault Protection
Fault protection can disable any combination of PWM pins. Faults are generated by a logic one on any of the FAULT pins. Each FAULT pin can be mapped arbitrarily to any of the PWM pins. When fault protection hardware disables PWM pins, the PWM generator continues to run, only the output pins are deactivated. The fault decoder disables PWM pins selected by the fault logic and the disable mapping register. See Figure 11-15. Each bank of four bits in the disable mapping register control the mapping for a single PWM pin. Refer to Table 11-12. The fault protection is enabled even when the PWM is not enabled; therefore, a fault will be latched in and will be cleared in order to prevent an interrupt when the PWM is enabled.
11.4.8.1
Fault Pin Sample Filter
Each fault pin has a sample filter to test for fault conditions. After every bus cycle setting the FAULTx pin at logic zero, the filter synchronously samples the pin once every four bus cycles. QSMP determines the number of consecutive samples that must be logic one for a fault to be detected. When a fault is detected, the corresponding FAULTx pin flag, FFLAGx, is set. Clear FFLAGx by writing a logic one to it. If the FIEx, FAULTx pin interrupt enable bit is set, the FFLAGx flag generates a CPU interrupt request. The interrupt request latch remains set until: * Software clears the FFLAGx flag by writing a logic one to it * Software clears the FIEx bit by writing a logic zero to it * A reset occurs
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 377
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.4.8.2
Automatic Fault Clearing
Setting a fault mode bit, FMODEx, configures faults from the FAULTx pin for automatic clearing. When FMODEx is set, disabled PWM pins are enabled when the FAULTx pin returns to logic zero and a new PWM half cycle begins. See Figure 11-76. Clearing the FFLAGx flag does not affect disabled PWM pins when FMODEx is set.
FAULT PIN
PWMS ENABLED
PWMS DISABLED
ENABLED DISABLED
PWMS ENABLED
Figure 11-76. Automatic Fault Clearing
11.4.8.3
Manual Fault Clearing
Clearing a fault mode bit, FMODEx, configures faults from the FAULTx pin for manual clearing: * PWM pins disabled by the FAULT0 pin or the FAULT2 pin are enabled by clearing the corresponding FFLAGx flag. The time at which the PWM pins are enabled depends on the corresponding QSMPx bit setting. If QSMPx = 00, the PWM pins are enabled on the next IP bus cycle when the logic level detected by the filter at the fault pin is logic zero. If QSMPx = 01,10 or 11, the PWMs are enabled when the next PWM half cycle begins regardless of the state of the logic level detected by the filter at the fault. See Figure 11-77 and Figure 11-78. * PWM pins disabled by the FAULT1 pin or the FAULT3 pin are enabled when -- Software clears the corresponding FFLAGx flag -- The filter detects a logic zero on the fault pin at the start of the next PWM half cycle boundary. See Figure 11-79.
FAULT0 OR FAULT2 PWMS ENABLED PWMS DISABLED FFLAGx CLEARED PWMS ENABLED
Figure 11-77. Manual Fault Clearing (Faults 0 & 2) -- QSMP = 00
MC9S12E128 Data Sheet, Rev. 1.07 378 Freescale Semiconductor
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
FAULT0 OR FAULT2 PWMS ENABLED PWMS DISABLED FFLAGx CLEARED PWMS ENABLED
Figure 11-78. Manual Fault Clearing (Faults 0 & 2) - QSMP=01, 10, or 11
FAULT1 OR FAULT3 PWMS ENABLED PWMS DISABLED FFLAGx CLEARED PWMS ENABLED
Figure 11-79. Manual Fault Clearing (Faults 1 & 3)
NOTE PWM half-cycle boundaries occur at both the PWM cycle start and when the counter equals the modulus, so in edge-aligned operation full-cycles and half-cycles are equal. NOTE Fault protection also applies during software output control when the OUTCTLx bits are set. Fault clearing still occurs at half PWM cycle boundaries while the PWM generator is engaged, PWMEN equals one. But the OUTx bits can control the PWM pins while the PWM generator is off, PWMEN equals zero. Thus, fault clearing occurs at IPbus cycles while the PWM generator is off and at the start of PWM cycles when the generator is engaged.
11.5
Resets
All PWM registers are reset to their default values upon any system reset.
11.6
Clocks
The system bus clock is the only clock required by this module.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 379
Chapter 11 Pulse Width Modulator with Fault Protection (PMF15B6CV2)
11.7
Interrupts
Seven PWM sources can generate CPU interrupt requests: * Reload flag x (PWMRFx)--PWMRFx is set at the beginning of every PWM Generator x reload cycle. The reload interrupt enable bit, PWMRIEx, enables PWMRFx to generate CPU interrupt requests. where x is A, B and C. * Fault flag x (FFLAGx)--The FFLAGx bit is set when a logic one occurs on the FAULTx pin. The fault pin interrupt enable x bit, FIEx, enables the FFLAGx flag to generate CPU interrupt requests. where x is 0, 1, 2 and 3.
MC9S12E128 Data Sheet, Rev. 1.07 380 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.1 Introduction
The pulse width modulation (PWM) definition is based on the HC12 PWM definitions. The PWM8B6CV1 module contains the basic features from the HC11 with some of the enhancements incorporated on the HC12, that is center aligned output mode and four available clock sources. The PWM8B6CV1 module has six channels with independent control of left and center aligned outputs on each channel. Each of the six PWM channels has a programmable period and duty cycle as well as a dedicated counter. A flexible clock select scheme allows a total of four different clock sources to be used with the counters. Each of the modulators can create independent continuous waveforms with software-selectable duty rates from 0% to 100%. The PWM outputs can be programmed as left aligned outputs or center aligned outputs
12.1.1
* * * * * * * * * *
Features
Six independent PWM channels with programmable period and duty cycle Dedicated counter for each PWM channel Programmable PWM enable/disable for each channel Software selection of PWM duty pulse polarity for each channel Period and duty cycle are double buffered. Change takes effect when the end of the effective period is reached (PWM counter reaches 0) or when the channel is disabled. Programmable center or left aligned outputs on individual channels Six 8-bit channel or three 16-bit channel PWM resolution Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies. Programmable clock select logic Emergency shutdown
12.1.2
Modes of Operation
There is a software programmable option for low power consumption in wait mode that disables the input clock to the prescaler. In freeze mode there is a software programmable option to disable the input clock to the prescaler. This is useful for emulation.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 381
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.1.3
Block Diagram
PWM8B6C
PWM Channels Channel 5 Bus Clock Clock Select PWM Clock Period and Duty Counter PWM5
Channel 4 Period and Duty Control Channel 3 Period and Duty Counter Counter
PWM4
PWM3
Channel 2 Enable Period and Duty Counter
PWM2
Polarity
Channel 1 Period and Duty Counter
PWM1
Alignment
Channel 0 Period and Duty Counter
PWM0
Figure 12-1. PWM8B6CV1 Block Diagram
12.2
External Signal Description
The PWM8B6CV1 module has a total of six external pins.
12.2.1
PWM5 -- Pulse Width Modulator Channel 5 Pin
This pin serves as waveform output of PWM channel 5 and as an input for the emergency shutdown feature.
12.2.2
PWM4 -- Pulse Width Modulator Channel 4 Pin
This pin serves as waveform output of PWM channel 4.
12.2.3
PWM3 -- Pulse Width Modulator Channel 3 Pin
This pin serves as waveform output of PWM channel 3.
MC9S12E128 Data Sheet, Rev. 1.07 382 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.2.4
PWM2 -- Pulse Width Modulator Channel 2 Pin
This pin serves as waveform output of PWM channel 2.
12.2.5
PWM1 -- Pulse Width Modulator Channel 1 Pin
This pin serves as waveform output of PWM channel 1.
12.2.6
PWM0 -- Pulse Width Modulator Channel 0 Pin
This pin serves as waveform output of PWM channel 0.
12.3
Memory Map and Register Definition
This subsection describes in detail all the registers and register bits in the PWM8B6CV1 module. The special-purpose registers and register bit functions that would not normally be made available to device end users, such as factory test control registers and reserved registers are clearly identified by means of shading the appropriate portions of address maps and register diagrams. Notes explaining the reasons for restricting access to the registers and functions are also explained in the individual register descriptions.
12.3.1
Module Memory Map
The following paragraphs describe the content of the registers in the PWM8B6CV1 module. The base address of the PWM8B6CV1 module is determined at the MCU level when the MCU is defined. The register decode map is fixed and begins at the first address of the module address offset. Table 12-1 shows the registers associated with the PWM and their relative offset from the base address. The register detail description follows the order in which they appear in the register map. Reserved bits within a register will always read as 0 and the write will be unimplemented. Unimplemented functions are indicated by shading the bit. Table 12-1 shows the memory map for the PWM8B6CV1 module. NOTE Register address = base address + address offset, where the base address is defined at the MCU level and the address offset is defined at the module level.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 383
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Table 12-1. PWM8B6CV1 Memory Map
Address Offset 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 0x000A 0x000B 0x000C 0x000D 0x000E 0x000F 0x0010 0x0011 0x0012 0x0013 0x0014 0x0015 0x0016 0x0017 0x0018 0x0019 0x001A 0x001B 0x001C 0x001D 0x001E
1 2
Register PWM Enable Register (PWME) PWM Polarity Register (PWMPOL) PWM Clock Select Register (PWMCLK) PWM Prescale Clock Select Register (PWMPRCLK) PWM Center Align Enable Register (PWMCAE) PWM Control Register (PWMCTL) PWM Test Register (PWMTST)
1 2
Access R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
PWM Prescale Counter Register (PWMPRSC) PWM Scale A Register (PWMSCLA) PWM Scale B Register (PWMSCLB) PWM Scale A Counter Register PWM Scale B Counter Register
(PWMSCNTA)3 (PWMSCNTB)4
PWM Channel 0 Counter Register (PWMCNT0) PWM Channel 1 Counter Register (PWMCNT1) PWM Channel 2 Counter Register (PWMCNT2) PWM Channel 3 Counter Register (PWMCNT3) PWM Channel 4 Counter Register (PWMCNT4) PWM Channel 5 Counter Register (PWMCNT5) PWM Channel 0 Period Register (PWMPER0) PWM Channel 1 Period Register (PWMPER1) PWM Channel 2 Period Register (PWMPER2) PWM Channel 3 Period Register (PWMPER3) PWM Channel 4 Period Register (PWMPER4) PWM Channel 5 Period Register (PWMPER5) PWM Channel 0 Duty Register (PWMDTY0) PWM Channel 1 Duty Register (PWMDTY1) PWM Channel 2 Duty Register (PWMDTY2) PWM Channel 3 Duty Register (PWMDTY3) PWM Channel 4 Duty Register (PWMDTY4) PWM Channel 5 Duty Register (PWMDTY5) PWM Shutdown Register (PWMSDN)
PWMTST is intended for factory test purposes only. PWMPRSC is intended for factory test purposes only. 3 PWMSCNTA is intended for factory test purposes only. 4 PWMSCNTB is intended for factory test purposes only.
MC9S12E128 Data Sheet, Rev. 1.07 384 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.3.2
Register Descriptions
The following paragraphs describe in detail all the registers and register bits in the PWM8B6CV1 module.
Register Name PWME R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 0 6 0 5 PWME5 4 PWME4 3 PWME3 2 PWME2 1 PWME1 Bit 0 PWME0
PWMPOL
0
0
PPOL5
PPOL4
PPOL3
PPOL2
PPOL1
PPOL0
PWMCLK
0
0
PCLK5
PCLK4
PCLK3 0
PCLK2
PCLK1
PCLK0
PWMPRCLK
0
PCKB2 0
PCKB1
PCKB0
PCKA2
PCKA1
PCKA0
PWMCAE
0
CAE5
CAE4
CAE2
CAE2
CAE1 0
CAE0 0
PWMCTL
0
CON45 0
CON23 0
CON01 0
PSWAI 0
PFRZ 0
PWMTST
0
0
0
PWMPRSC
0
0
0
0
0
0
0
0
PWMSCLA
Bit 7
6
5
4
3
2
1
Bit 0
PWMSCLB
Bit 7 0
6 0
5 0
4 0
3 0
2 0
1 0
Bit 0 0
PWMSCNTA
PWMSCNTB
0
0
0
0
0
0
0
0
PWMCNT0
Bit 7 0 Bit 7 0 Bit 7 0
6 0 6 0 6 0
5 0 5 0 5 0
4 0 4 0 4 0
3 0 3 0 3 0
2 0 2 0 2 0
1 0 1 0 1 0
Bit 0 0 Bit 0 0 Bit 0 0
PWMCNT1
PWMCNT2
= Unimplemented or Reserved
Figure 12-2. PWM Register Summary
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 385
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Register Name PWMCNT3 R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W
Bit 7 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7
6 6 0 6 0 6 0 6
5 5 0 5 0 5 0 5
4 4 0 4 0 4 0 4
3 3 0 3 0 3 0 3
2 2 0 2 0 2 0 2
1 1 0 1 0 1 0 1
Bit 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0
PWMCNT4
PWMCNT5
PWMPER0
PWMPER1
Bit 7
6
5
4
3
2
1
Bit 0
PWMPER2
Bit 7
6
5
4
3
2
1
Bit 0
PWMPER3
Bit 7
6
5
4
3
2
1
Bit 0
PWMPER4
Bit 7
6
5
4
3
2
1
Bit 0
PWMPER5
Bit 7
6
5
4
3
2
1
Bit 0
PWMDTY0
Bit 7
6
5
4
3
2
1
Bit 0
PWMPER1
Bit 7
6
5
4
3
2
1
Bit 0
PWMPER2
Bit 7
6
5
4
3
2
1
Bit 0
PWMPER3
Bit 7
6
5
4
3
2
1
Bit 0
PWMPER4
Bit 7
6
5
4
3
2
1
Bit 0
PWMPER5
Bit 7
6
5 0 PWMRSTRT
4
3 0
2 PWM5IN
1
Bit 0
PWMSDB
PWMIF
PWMIE
PWMLVL
PWM5INL PWM5ENA
= Unimplemented or Reserved
Figure 12-2. PWM Register Summary (continued)
MC9S12E128 Data Sheet, Rev. 1.07 386 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.3.2.1
PWM Enable Register (PWME)
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx bits are set (PWMEx = 1), the associated PWM output is enabled immediately. However, the actual PWM waveform is not available on the associated PWM output until its clock source begins its next cycle due to the synchronization of PWMEx and the clock source. NOTE The first PWM cycle after enabling the channel can be irregular. An exception to this is when channels are concatenated. After concatenated mode is enabled (CONxx bits set in PWMCTL register), enabling/disabling the corresponding 16-bit PWM channel is controlled by the low-order PWMEx bit. In this case, the high-order bytes PWMEx bits have no effect and their corresponding PWM output lines are disabled. While in run mode, if all six PWM channels are disabled (PWME5-PWME0 = 0), the prescaler counter shuts off for power savings.
7 6 5 4 3 2 1 0
R W Reset
0
0 PWME5 PWME4 0 PWME3 0 PWME2 0 PWME1 0 PWME0 0
0
0
0
= Unimplemented or Reserved
Figure 12-3. PWM Enable Register (PWME)
Read: anytime Write: anytime
Table 12-2. PWME Field Descriptions
Field 5 PWME5 Description Pulse Width Channel 5 Enable 0 Pulse width channel 5 is disabled. 1 Pulse width channel 5 is enabled. The pulse modulated signal becomes available at PWM,output bit 5 when its clock source begins its next cycle. Pulse Width Channel 4 Enable 0 Pulse width channel 4 is disabled. 1 Pulse width channel 4 is enabled. The pulse modulated signal becomes available at PWM, output bit 4 when its clock source begins its next cycle. If CON45 = 1, then bit has no effect and PWM output line 4 is disabled. Pulse Width Channel 3 Enable 0 Pulse width channel 3 is disabled. 1 Pulse width channel 3 is enabled. The pulse modulated signal becomes available at PWM, output bit 3 when its clock source begins its next cycle. Pulse Width Channel 2 Enable 0 Pulse width channel 2 is disabled. 1 Pulse width channel 2 is enabled. The pulse modulated signal becomes available at PWM, output bit 2 when its clock source begins its next cycle. If CON23 = 1, then bit has no effect and PWM output line 2 is disabled.
4 PWME4
3 PWME3
2 PWME2
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 387
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Table 12-2. PWME Field Descriptions (continued)
Field 1 PWME1 Description Pulse Width Channel 1 Enable 0 Pulse width channel 1 is disabled. 1 Pulse width channel 1 is enabled. The pulse modulated signal becomes available at PWM, output bit 1 when its clock source begins its next cycle. Pulse Width Channel 0 Enable 0 Pulse width channel 0 is disabled. 1 Pulse width channel 0 is enabled. The pulse modulated signal becomes available at PWM, output bit 0 when its clock source begins its next cycle. If CON01 = 1, then bit has no effect and PWM output line 0 is disabled.
0 PWME0
12.3.2.2
PWM Polarity Register (PWMPOL)
The starting polarity of each PWM channel waveform is determined by the associated PPOLx bit in the PWMPOL register. If the polarity bit is 1, the PWM channel output is high at the beginning of the cycle and then goes low when the duty count is reached. Conversely, if the polarity bit is 0 the output starts low and then goes high when the duty count is reached.
7 6 5 4 3 2 1 0
R W Reset
0
0 PPOL5 PPOL4 0 PPOL3 0 PPOL2 0 PPOL1 0 PPOL0 0
0
0
0
= Unimplemented or Reserved
Figure 12-4. PWM Polarity Register (PWMPOL)
Read: anytime Write: anytime NOTE PPOLx register bits can be written anytime. If the polarity is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition
Table 12-3. PWMPOL Field Descriptions
Field 5 PPOL5 4 PPOL4 3 PPOL3 Description Pulse Width Channel 5 Polarity 0 PWM channel 5 output is low at the beginning of the period, then goes high when the duty count is reached. 1 PWM channel 5 output is high at the beginning of the period, then goes low when the duty count is reached. Pulse Width Channel 4 Polarity 0 PWM channel 4 output is low at the beginning of the period, then goes high when the duty count is reached. 1 PWM channel 4 output is high at the beginning of the period, then goes low when the duty count is reached. Pulse Width Channel 3 Polarity 0 PWM channel 3 output is low at the beginning of the period, then goes high when the duty count is reached. 1 PWM channel 3 output is high at the beginning of the period, then goes low when the duty count is reached.
MC9S12E128 Data Sheet, Rev. 1.07 388 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Table 12-3. PWMPOL Field Descriptions (continued)
Field 2 PPOL2 1 PPOL1 0 PPOL0 Description Pulse Width Channel 2 Polarity 0 PWM channel 2 output is low at the beginning of the period, then goes high when the duty count is reached. 1 PWM channel 2 output is high at the beginning of the period, then goes low when the duty count is reached. Pulse Width Channel 1 Polarity 0 PWM channel 1 output is low at the beginning of the period, then goes high when the duty count is reached. 1 PWM channel 1 output is high at the beginning of the period, then goes low when the duty count is reached. Pulse Width Channel 0 Polarity 0 PWM channel 0 output is low at the beginning of the period, then goes high when the duty count is reached 1 PWM channel 0 output is high at the beginning of the period, then goes low when the duty count is reached.
12.3.2.3
PWM Clock Select Register (PWMCLK)
Each PWM channel has a choice of two clocks to use as the clock source for that channel as described below.
7 6 5 4 3 2 1 0
R W Reset
0
0 PCLK5 PCLK4 0 PCLK3 0 PCLK2 0 PCLK1 0 PCLK0 0
0
0
0
= Unimplemented or Reserved
Figure 12-5. PWM Clock Select Register (PWMCLK)
Read: anytime Write: anytime NOTE Register bits PCLK0 to PCLK5 can be written anytime. If a clock select is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition.
Table 12-4. PWMCLK Field Descriptions
Field 5 PCLK5 4 PCLK4 3 PCLK3 Description Pulse Width Channel 5 Clock Select 0 Clock A is the clock source for PWM channel 5. 1 Clock SA is the clock source for PWM channel 5. Pulse Width Channel 4 Clock Select 0 Clock A is the clock source for PWM channel 4. 1 Clock SA is the clock source for PWM channel 4. Pulse Width Channel 3 Clock Select 0 Clock B is the clock source for PWM channel 3. 1 Clock SB is the clock source for PWM channel 3.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 389
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Table 12-4. PWMCLK Field Descriptions (continued)
Field 2 PCLK2 1 PCLK1 0 PCLK0 Description Pulse Width Channel 2 Clock Select 0 Clock B is the clock source for PWM channel 2. 1 Clock SB is the clock source for PWM channel 2. Pulse Width Channel 1 Clock Select 0 Clock A is the clock source for PWM channel 1. 1 Clock SA is the clock source for PWM channel 1. Pulse Width Channel 0 Clock Select 0 Clock A is the clock source for PWM channel 0. 1 Clock SA is the clock source for PWM channel 0.
12.3.2.4
PWM Prescale Clock Select Register (PWMPRCLK)
This register selects the prescale clock source for clocks A and B independently.
7 6 5 4 3 2 1 0
R W Reset
0 PCKB2 0 0 PCKB1 0 PCKB0 0
0 PCKA2 0 0 PCKA1 0 PCKA0 0
= Unimplemented or Reserved
Figure 12-6. PWM Prescaler Clock Select Register (PWMPRCLK)
Read: anytime Write: anytime NOTE PCKB2-PCKB0 and PCKA2-PCKA0 register bits can be written anytime. If the clock prescale is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition.
Table 12-5. PWMPRCLK Field Descriptions
Field 6:5 PCKB[2:0] 2:0 PCKA[2:0] Description Prescaler Select for Clock B -- Clock B is 1 of two clock sources which can be used for channels 2 or 3. These three bits determine the rate of clock B, as shown in Table 12-6. Prescaler Select for Clock A -- Clock A is 1 of two clock sources which can be used for channels 0, 1, 4, or 5. These three bits determine the rate of clock A, as shown in Table 12-7.
MC9S12E128 Data Sheet, Rev. 1.07 390 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Table 12-6. Clock B Prescaler Selects
PCKB2 0 0 0 0 1 1 1 1 PCKB1 0 0 1 1 0 0 1 1 PCKB0 0 1 0 1 0 1 0 1 Value of Clock B Bus Clock Bus Clock / 2 Bus Clock / 4 Bus Clock / 8 Bus Clock / 16 Bus Clock / 32 Bus Clock / 64 Bus Clock / 128
Table 12-7. Clock A Prescaler Selects
PCKA2 0 0 0 0 1 1 1 1 PCKA1 0 0 1 1 0 0 1 1 PCKA0 0 1 0 1 0 1 0 1 Value of Clock A Bus Clock Bus Clock / 2 Bus Clock / 4 Bus Clock / 8 Bus Clock / 16 Bus Clock / 32 Bus Clock / 64 Bus Clock / 128
12.3.2.5
PWM Center Align Enable Register (PWMCAE)
The PWMCAE register contains six control bits for the selection of center aligned outputs or left aligned outputs for each PWM channel. If the CAEx bit is set to a 1, the corresponding PWM output will be center aligned. If the CAEx bit is cleared, the corresponding PWM output will be left aligned. Reference Section 12.4.2.5, "Left Aligned Outputs," and Section 12.4.2.6, "Center Aligned Outputs," for a more detailed description of the PWM output modes.
7 6 5 4 3 2 1 0
R W Reset
0
0 CAE5 CAE4 0 CAE3 0 CAE2 0 CAE1 0 CAE0 0
0
0
0
= Unimplemented or Reserved
Figure 12-7. PWM Center Align Enable Register (PWMCAE)
Read: anytime Write: anytime NOTE Write these bits only when the corresponding channel is disabled.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 391
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Table 12-8. PWMCAE Field Descriptions
Field 5 CAE5 4 CAE4 3 CAE3 2 CAE2 1 CAE1 0 CAE0 Description Center Aligned Output Mode on Channel 5 0 Channel 5 operates in left aligned output mode. 1 Channel 5 operates in center aligned output mode. Center Aligned Output Mode on Channel 4 0 Channel 4 operates in left aligned output mode. 1 Channel 4 operates in center aligned output mode. Center Aligned Output Mode on Channel 3 1 Channel 3 operates in left aligned output mode. 1 Channel 3 operates in center aligned output mode. Center Aligned Output Mode on Channel 2 0 Channel 2 operates in left aligned output mode. 1 Channel 2 operates in center aligned output mode. Center Aligned Output Mode on Channel 1 0 Channel 1 operates in left aligned output mode. 1 Channel 1 operates in center aligned output mode. Center Aligned Output Mode on Channel 0 0 Channel 0 operates in left aligned output mode. 1 Channel 0 operates in center aligned output mode.
12.3.2.6
PWM Control Register (PWMCTL)
The PWMCTL register provides for various control of the PWM module.
7 6 5 4 3 2 1 0
R W Reset
0 CON45 0 0 CON23 0 CON01 0 PSWAI 0 PFRZ 0
0
0
0
0
= Unimplemented or Reserved
Figure 12-8. PWM Control Register (PWMCTL)
Read: anytime Write: anytime There are three control bits for concatenation, each of which is used to concatenate a pair of PWM channels into one 16-bit channel. When channels 4 and 5 are concatenated, channel 4 registers become the high-order bytes of the double-byte channel. When channels 2 and 3 are concatenated, channel 2 registers become the high-order bytes of the double-byte channel. When channels 0 and 1 are concatenated, channel 0 registers become the high-order bytes of the double-byte channel. Reference Section 12.4.2.7, "PWM 16-Bit Functions," for a more detailed description of the concatenation PWM function.
MC9S12E128 Data Sheet, Rev. 1.07 392 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
NOTE Change these bits only when both corresponding channels are disabled.
Table 12-9. PWMCTL Field Descriptions
Field 6 CON45 Description Concatenate Channels 4 and 5 0 Channels 4 and 5 are separate 8-bit PWMs. 1 Channels 4 and 5 are concatenated to create one 16-bit PWM channel. Channel 4 becomes the high-order byte and channel 5 becomes the low-order byte. Channel 5 output pin is used as the output for this 16-bit PWM (bit 5 of port PWMP). Channel 5 clock select control bit determines the clock source, channel 5 polarity bit determines the polarity, channel 5 enable bit enables the output and channel 5 center aligned enable bit determines the output mode. Concatenate Channels 2 and 3 0 Channels 2 and 3 are separate 8-bit PWMs. 1 Channels 2 and 3 are concatenated to create one 16-bit PWM channel. Channel 2 becomes the high-order byte and channel 3 becomes the low-order byte. Channel 3 output pin is used as the output for this 16-bit PWM (bit 3 of port PWMP). Channel 3 clock select control bit determines the clock source, channel 3 polarity bit determines the polarity, channel 3 enable bit enables the output and channel 3 center aligned enable bit determines the output mode. Concatenate Channels 0 and 1 0 Channels 0 and 1 are separate 8-bit PWMs. 1 Channels 0 and 1 are concatenated to create one 16-bit PWM channel. Channel 0 becomes the high-order byte and channel 1 becomes the low-order byte. Channel 1 output pin is used as the output for this 16-bit PWM (bit 1 of port PWMP). Channel 1 clock select control bit determines the clock source, channel 1 polarity bit determines the polarity, channel 1 enable bit enables the output and channel 1 center aligned enable bit determines the output mode. PWM Stops in Wait Mode -- Enabling this bit allows for lower power consumption in wait mode by disabling the input clock to the prescaler. 0 Allow the clock to the prescaler to continue while in wait mode. 1 Stop the input clock to the prescaler whenever the MCU is in wait mode. PWM Counters Stop in Freeze Mode -- In freeze mode, there is an option to disable the input clock to the prescaler by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze mode the input clock to the prescaler is disabled. This feature is useful during emulation as it allows the PWM function to be suspended. In this way, the counters of the PWM can be stopped while in freeze mode so that after normal program flow is continued, the counters are re-enabled to simulate real-time operations. Because the registers remain accessible in this mode, to re-enable the prescaler clock, either disable the PFRZ bit or exit freeze mode. 0 Allow PWM to continue while in freeze mode. 1 Disable PWM input clock to the prescaler whenever the part is in freeze mode. This is useful for emulation.
5 CON23
4 CON01
3 PSWAI
2 PFRZ
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 393
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.3.2.7
Reserved Register (PWMTST)
This register is reserved for factory testing of the PWM module and is not available in normal modes.
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-9. Reserved Register (PWMTST)
Read: always read 0x0000 in normal modes Write: unimplemented in normal modes NOTE Writing to this register when in special modes can alter the PWM functionality.
12.3.2.8
Reserved Register (PWMPRSC)
This register is reserved for factory testing of the PWM module and is not available in normal modes.
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-10. Reserved Register (PWMPRSC)
Read: always read 0x0000 in normal modes Write: unimplemented in normal modes NOTE Writing to this register when in special modes can alter the PWM functionality.
MC9S12E128 Data Sheet, Rev. 1.07 394 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.3.2.9
PWM Scale A Register (PWMSCLA)
PWMSCLA is the programmable scale value used in scaling clock A to generate clock SA. Clock SA is generated by taking clock A, dividing it by the value in the PWMSCLA register and dividing that by two. Clock SA = Clock A / (2 * PWMSCLA) NOTE When PWMSCLA = 0x0000, PWMSCLA value is considered a full scale value of 256. Clock A is thus divided by 512. Any value written to this register will cause the scale counter to load the new scale value (PWMSCLA).
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 12-11. PWM Scale A Register (PWMSCLA)
Read: anytime Write: anytime (causes the scale counter to load the PWMSCLA value)
12.3.2.10 PWM Scale B Register (PWMSCLB)
PWMSCLB is the programmable scale value used in scaling clock B to generate clock SB. Clock SB is generated by taking clock B, dividing it by the value in the PWMSCLB register and dividing that by two. Clock SB = Clock B / (2 * PWMSCLB) NOTE When PWMSCLB = 0x0000, PWMSCLB value is considered a full scale value of 256. Clock B is thus divided by 512. Any value written to this register will cause the scale counter to load the new scale value (PWMSCLB).
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 12-12. PWM Scale B Register (PWMSCLB)
Read: anytime Write: anytime (causes the scale counter to load the PWMSCLB value).
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 395
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.3.2.11 Reserved Registers (PWMSCNTx)
The registers PWMSCNTA and PWMSCNTB are reserved for factory testing of the PWM module and are not available in normal modes.
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-13. Reserved Register (PWMSCNTA)
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-14. Reserved Register (PWMSCNTB)
Read: always read 0x0000 in normal modes Write: unimplemented in normal modes NOTE Writing to these registers when in special modes can alter the PWM functionality.
MC9S12E128 Data Sheet, Rev. 1.07 396 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.3.2.12 PWM Channel Counter Registers (PWMCNTx)
Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source. The counter can be read at any time without affecting the count or the operation of the PWM channel. In left aligned output mode, the counter counts from 0 to the value in the period register - 1. In center aligned output mode, the counter counts from 0 up to the value in the period register and then back down to 0. Any value written to the counter causes the counter to reset to 0x0000, the counter direction to be set to up, the immediate load of both duty and period registers with values from the buffers, and the output to change according to the polarity bit. The counter is also cleared at the end of the effective period (see Section 12.4.2.5, "Left Aligned Outputs," and Section 12.4.2.6, "Center Aligned Outputs," for more details). When the channel is disabled (PWMEx = 0), the PWMCNTx register does not count. When a channel becomes enabled (PWMEx = 1), the associated PWM counter starts at the count in the PWMCNTx register. For more detailed information on the operation of the counters, reference Section 12.4.2.4, "PWM Timer Counters." In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low- or high-order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by 16-bit access to maintain data coherency. NOTE Writing to the counter while the channel is enabled can cause an irregular PWM cycle to occur.
7 6 5 4 3 2 1 0
R W Reset
Bit 7 0 0
6 0 0
5 0 0
4 0 0
3 0 0
2 0 0
1 0 0
Bit 0 0 0
Figure 12-15. PWM Channel Counter Registers (PWMCNT0)
7 6 5 4 3 2 1 0
R W Reset
Bit 7 0 0
6 0 0
5 0 0
4 0 0
3 0 0
2 0 0
1 0 0
Bit 0 0 0
Figure 12-16. PWM Channel Counter Registers (PWMCNT1)
7 6 5 4 3 2 1 0
R W Reset
Bit 7 0 0
6 0 0
5 0 0
4 0 0
3 0 0
2 0 0
1 0 0
Bit 0 0 0
Figure 12-17. PWM Channel Counter Registers (PWMCNT2)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 397
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
7
6
5
4
3
2
1
0
R W Reset
Bit 7 0 0
6 0 0
5 0 0
4 0 0
3 0 0
2 0 0
1 0 0
Bit 0 0 0
Figure 12-18. PWM Channel Counter Registers (PWMCNT3)
7 6 5 4 3 2 1 0
R W Reset
Bit 7 0 0
6 0 0
5 0 0
4 0 0
3 0 0
2 0 0
1 0 0
Bit 0 0 0
Figure 12-19. PWM Channel Counter Registers (PWMCNT4)
7 6 5 4 3 2 1 0
R W Reset
Bit 7 0 0
6 0 0
5 0 0
4 0 0
3 0 0
2 0 0
1 0 0
Bit 0 0 0
Figure 12-20. PWM Channel Counter Registers (PWMCNT5)
Read: anytime Write: anytime (any value written causes PWM counter to be reset to 0x0000).
12.3.2.13 PWM Channel Period Registers (PWMPERx)
There is a dedicated period register for each channel. The value in this register determines the period of the associated PWM channel. The period registers for each channel are double buffered so that if they change while the channel is enabled, the change will NOT take effect until one of the following occurs: * The effective period ends * The counter is written (counter resets to 0x0000) * The channel is disabled In this way, the output of the PWM will always be either the old waveform or the new waveform, not some variation in between. If the channel is not enabled, then writes to the period register will go directly to the latches as well as the buffer. NOTE Reads of this register return the most recent value written. Reads do not necessarily return the value of the currently active period due to the double buffering scheme. Reference Section 12.4.2.3, "PWM Period and Duty," for more information.
MC9S12E128 Data Sheet, Rev. 1.07 398 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
To calculate the output period, take the selected clock source period for the channel of interest (A, B, SA, or SB) and multiply it by the value in the period register for that channel: * Left aligned output (CAEx = 0) * PWMx period = channel clock period * PWMPERx center aligned output (CAEx = 1) * PWMx period = channel clock period * (2 * PWMPERx) For boundary case programming values, please refer to Section 12.4.2.8, "PWM Boundary Cases."
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 12-21. PWM Channel Period Registers (PWMPER0)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 12-22. PWM Channel Period Registers (PWMPER1)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 12-23. PWM Channel Period Registers (PWMPER2)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 12-24. PWM Channel Period Registers (PWMPER3)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 12-25. PWM Channel Period Registers (PWMPER4)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 399
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
7
6
5
4
3
2
1
0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 12-26. PWM Channel Period Registers (PWMPER5)
Read: anytime Write: anytime
12.3.2.14 PWM Channel Duty Registers (PWMDTYx)
There is a dedicated duty register for each channel. The value in this register determines the duty of the associated PWM channel. The duty value is compared to the counter and if it is equal to the counter value a match occurs and the output changes state. The duty registers for each channel are double buffered so that if they change while the channel is enabled, the change will NOT take effect until one of the following occurs: * The effective period ends * The counter is written (counter resets to 0x0000) * The channel is disabled In this way, the output of the PWM will always be either the old duty waveform or the new duty waveform, not some variation in between. If the channel is not enabled, then writes to the duty register will go directly to the latches as well as the buffer. NOTE Reads of this register return the most recent value written. Reads do not necessarily return the value of the currently active duty due to the double buffering scheme. Reference Section 12.4.2.3, "PWM Period and Duty," for more information. NOTE Depending on the polarity bit, the duty registers will contain the count of either the high time or the low time. If the polarity bit is 1, the output starts high and then goes low when the duty count is reached, so the duty registers contain a count of the high time. If the polarity bit is 0, the output starts low and then goes high when the duty count is reached, so the duty registers contain a count of the low time. To calculate the output duty cycle (high time as a % of period) for a particular channel: * Polarity = 0 (PPOLx = 0) Duty cycle = [(PWMPERx PWMDTYx)/PWMPERx] * 100% * Polarity = 1 (PPOLx = 1) Duty cycle = [PWMDTYx / PWMPERx] * 100% * For boundary case programming values, please refer to Section 12.4.2.8, "PWM Boundary Cases."
MC9S12E128 Data Sheet, Rev. 1.07 400 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
7
6
5
4
3
2
1
0
R Bit 7 W Reset 1 1 1 1 1 1 1 1 6 5 4 3 2 1 Bit 0
Figure 12-27. PWM Channel Duty Registers (PWMDTY0)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 1 1 1 1 1 1 1 1 6 5 4 3 2 1 Bit 0
Figure 12-28. PWM Channel Duty Registers (PWMDTY1)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 1 1 1 1 1 1 1 1 6 5 4 3 2 1 Bit 0
Figure 12-29. PWM Channel Duty Registers (PWMDTY2)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 1 1 1 1 1 1 1 1 6 5 4 3 2 1 Bit 0
Figure 12-30. PWM Channel Duty Registers (PWMDTY3)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 1 1 1 1 1 1 1 1 6 5 4 3 2 1 Bit 0
Figure 12-31. PWM Channel Duty Registers (PWMDTY4)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 1 1 1 1 1 1 1 1 6 5 4 3 2 1 Bit 0
Figure 12-32. PWM Channel Duty Registers (PWMDTY5)
Read: anytime Write: anytime
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 401
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.3.2.15 PWM Shutdown Register (PWMSDN)
The PWMSDN register provides for the shutdown functionality of the PWM module in the emergency cases.
7 6 5 4 3 2 1 0
R PWMIF W Reset 0 0 PWMIE
0 PWMLVL PWMRSTRT 0 0
0
PWM5IN PWM5INL PWM5ENA 0
0
0
0
= Unimplemented or Reserved
Figure 12-33. PWM Shutdown Register (PWMSDN)
Read: anytime Write: anytime
Table 12-10. PWMSDN Field Descriptions
Field 7 PWMIF Description PWM Interrupt Flag -- Any change from passive to asserted (active) state or from active to passive state will be flagged by setting the PWMIF flag = 1. The flag is cleared by writing a logic 1 to it. Writing a 0 has no effect. 0 No change on PWM5IN input. 1 Change on PWM5IN input PWM Interrupt Enable -- If interrupt is enabled an interrupt to the CPU is asserted. 0 PWM interrupt is disabled. 1 PWM interrupt is enabled.
6 PWMIE
5 PWM Restart -- The PWM can only be restarted if the PWM channel input 5 is deasserted. After writing a logic 1 PWMRSTRT to the PWMRSTRT bit (trigger event) the PWM channels start running after the corresponding counter passes next "counter = 0" phase. Also, if the PWM5ENA bit is reset to 0, the PWM do not start before the counter passes 0x0000. The bit is always read as 0. 4 PWMLVL PWM Shutdown Output Level -- If active level as defined by the PWM5IN input, gets asserted all enabled PWM channels are immediately driven to the level defined by PWMLVL. 0 PWM outputs are forced to 0 1 PWM outputs are forced to 1. PWM Channel 5 Input Status -- This reflects the current status of the PWM5 pin. PWM Shutdown Active Input Level for Channel 5 -- If the emergency shutdown feature is enabled (PWM5ENA = 1), this bit determines the active level of the PWM5 channel. 0 Active level is low 1 Active level is high
2 PWM5IN 1 PWM5INL
0 PWM Emergency Shutdown Enable -- If this bit is logic 1 the pin associated with channel 5 is forced to input PWM5ENA and the emergency shutdown feature is enabled. All the other bits in this register are meaningful only if PWM5ENA = 1. 0 PWM emergency feature disabled. 1 PWM emergency feature is enabled.
MC9S12E128 Data Sheet, Rev. 1.07 402 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.4
12.4.1
Functional Description
PWM Clock Select
There are four available clocks called clock A, clock B, clock SA (scaled A), and clock SB (scaled B). These four clocks are based on the bus clock. Clock A and B can be software selected to be 1, 1/2, 1/4, 1/8,..., 1/64, 1/128 times the bus clock. Clock SA uses clock A as an input and divides it further with a reloadable counter. Similarly, clock SB uses clock B as an input and divides it further with a reloadable counter. The rates available for clock SA are software selectable to be clock A divided by 2, 4, 6, 8, ..., or 512 in increments of divide by 2. Similar rates are available for clock SB. Each PWM channel has the capability of selecting one of two clocks, either the pre-scaled clock (clock A or B) or the scaled clock (clock SA or SB). The block diagram in Figure 12-34 shows the four different clocks and how the scaled clocks are created.
12.4.1.1
Prescale
The input clock to the PWM prescaler is the bus clock. It can be disabled whenever the part is in freeze mode by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze mode the input clock to the prescaler is disabled. This is useful for emulation in order to freeze the PWM. The input clock can also be disabled when all six PWM channels are disabled (PWME5-PWME0 = 0) This is useful for reducing power by disabling the prescale counter. Clock A and clock B are scaled values of the input clock. The value is software selectable for both clock A and clock B and has options of 1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64, or 1/128 times the bus clock. The value selected for clock A is determined by the PCKA2, PCKA1, and PCKA0 bits in the PWMPRCLK register. The value selected for clock B is determined by the PCKB2, PCKB1, and PCKB0 bits also in the PWMPRCLK register.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 403
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Clock A
M U X PCLK0
Clock to PWM Ch 0
Clock A/2, A/4, A/6,....A/512 PCKA2 PCKA1 PCKA0 Count = 1 Load PWMSCLA M U X PCLK2 M U X PCLK3 Clock B M U X PCLK4 8-Bit Down Counter Count = 1 Load PWMSCLB DIV 2 Clock SB M U X PCLK5 Clock to PWM Ch 5 Clock to PWM Ch 4 Clock to PWM Ch 3 DIV 2 Clock SA
8-Bit Down Counter
M U X PCLK1 M U X
Clock to PWM Ch 1
Clock to PWM Ch 2
Divide by Prescaler Taps:
4
8 16 32 64 128
Clock B/2, B/4, B/6,....B/512 M U X
2
Bus Clock PFRZ FREEZE
PWME5:0
PRESCALE
PCKB2 PCKB1 PCKB0
SCALE
CLOCK SELECT
Figure 12-34. PWM Clock Select Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 404 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.4.1.2
Clock Scale
The scaled A clock uses clock A as an input and divides it further with a user programmable value and then divides this by 2. The scaled B clock uses clock B as an input and divides it further with a user programmable value and then divides this by 2. The rates available for clock SA are software selectable to be clock A divided by 2, 4, 6, 8, ..., or 512 in increments of divide by 2. Similar rates are available for clock SB. Clock A is used as an input to an 8-bit down counter. This down counter loads a user programmable scale value from the scale register (PWMSCLA). When the down counter reaches 1, two things happen; a pulse is output and the 8-bit counter is re-loaded. The output signal from this circuit is further divided by two. This gives a greater range with only a slight reduction in granularity. Clock SA equals clock A divided by two times the value in the PWMSCLA register. NOTE Clock SA = Clock A / (2 * PWMSCLA) When PWMSCLA = 0x0000, PWMSCLA value is considered a full scale value of 256. Clock A is thus divided by 512. Similarly, clock B is used as an input to an 8-bit down counter followed by a divide by two producing clock SB. Thus, clock SB equals clock B divided by two times the value in the PWMSCLB register. NOTE Clock SB = Clock B / (2 * PWMSCLB) When PWMSCLB = 0x0000, PWMSCLB value is considered a full scale value of 256. Clock B is thus divided by 512. As an example, consider the case in which the user writes 0x00FF into the PWMSCLA register. Clock A for this case will be bus clock divided by 4. A pulse will occur at a rate of once every 255 x 4 bus cycles. Passing this through the divide by two circuit produces a clock signal at a bus clock divided by 2040 rate. Similarly, a value of 0x0001 in the PWMSCLA register when clock A is bus clock divided by 4 will produce a bus clock divided by 8 rate. Writing to PWMSCLA or PWMSCLB causes the associated 8-bit down counter to be re-loaded. Otherwise, when changing rates the counter would have to count down to 0x0001 before counting at the proper rate. Forcing the associated counter to re-load the scale register value every time PWMSCLA or PWMSCLB is written prevents this. NOTE Writing to the scale registers while channels are operating can cause irregularities in the PWM outputs.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 405
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.4.1.3
Clock Select
Each PWM channel has the capability of selecting one of two clocks. For channels 0, 1, 4, and 5 the clock choices are clock A or clock SA. For channels 2 and 3 the choices are clock B or clock SB. The clock selection is done with the PCLKx control bits in the PWMCLK register. NOTE Changing clock control bits while channels are operating can cause irregularities in the PWM outputs.
12.4.2
PWM Channel Timers
The main part of the PWM module are the actual timers. Each of the timer channels has a counter, a period register and a duty register (each are 8 bit). The waveform output period is controlled by a match between the period register and the value in the counter. The duty is controlled by a match between the duty register and the counter value and causes the state of the output to change during the period. The starting polarity of the output is also selectable on a per channel basis. Figure 12-35 shows a block diagram for PWM timer.
Clock Source 8-Bit Counter GATE (clock edge sync) 8-Bit Compare = T PWMDTYx R 8-Bit Compare = PWMPERx PPOLx Q Q PWMCNTx From Port PWMP Data Register
up/down reset
M U X
M U X
To Pin Driver
Q Q
T R
CAEx
PWMEx
Figure 12-35. PWM Timer Channel Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 406 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.4.2.1
PWM Enable
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx bits are set (PWMEx = 1), the associated PWM output signal is enabled immediately. However, the actual PWM waveform is not available on the associated PWM output until its clock source begins its next cycle due to the synchronization of PWMEx and the clock source. An exception to this is when channels are concatenated. Refer to Section 12.4.2.7, "PWM 16-Bit Functions," for more detail. NOTE The first PWM cycle after enabling the channel can be irregular. On the front end of the PWM timer, the clock is enabled to the PWM circuit by the PWMEx bit being high. There is an edge-synchronizing circuit to guarantee that the clock will only be enabled or disabled at an edge. When the channel is disabled (PWMEx = 0), the counter for the channel does not count.
12.4.2.2
PWM Polarity
Each channel has a polarity bit to allow starting a waveform cycle with a high or low signal. This is shown on the block diagram as a mux select of either the Q output or the Q output of the PWM output flip-flop. When one of the bits in the PWMPOL register is set, the associated PWM channel output is high at the beginning of the waveform, then goes low when the duty count is reached. Conversely, if the polarity bit is 0, the output starts low and then goes high when the duty count is reached.
12.4.2.3
PWM Period and Duty
Dedicated period and duty registers exist for each channel and are double buffered so that if they change while the channel is enabled, the change will NOT take effect until one of the following occurs: * The effective period ends * The counter is written (counter resets to 0x0000) * The channel is disabled In this way, the output of the PWM will always be either the old waveform or the new waveform, not some variation in between. If the channel is not enabled, then writes to the period and duty registers will go directly to the latches as well as the buffer. A change in duty or period can be forced into effect "immediately" by writing the new value to the duty and/or period registers and then writing to the counter. This forces the counter to reset and the new duty and/or period values to be latched. In addition, because the counter is readable it is possible to know where the count is with respect to the duty value and software can be used to make adjustments. NOTE When forcing a new period or duty into effect immediately, an irregular PWM cycle can occur. Depending on the polarity bit, the duty registers will contain the count of either the high time or the low time.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 407
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.4.2.4
PWM Timer Counters
Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source (reference Figure 12-34 for the available clock sources and rates). The counter compares to two registers, a duty register and a period register as shown in Figure 12-35. When the PWM counter matches the duty register the output flip-flop changes state causing the PWM waveform to also change state. A match between the PWM counter and the period register behaves differently depending on what output mode is selected as shown in Figure 12-35 and described in Section 12.4.2.5, "Left Aligned Outputs," and Section 12.4.2.6, "Center Aligned Outputs." Each channel counter can be read at anytime without affecting the count or the operation of the PWM channel. Any value written to the counter causes the counter to reset to 0x0000, the counter direction to be set to up, the immediate load of both duty and period registers with values from the buffers, and the output to change according to the polarity bit. When the channel is disabled (PWMEx = 0), the counter stops. When a channel becomes enabled (PWMEx = 1), the associated PWM counter continues from the count in the PWMCNTx register. This allows the waveform to resume when the channel is re-enabled. When the channel is disabled, writing 0 to the period register will cause the counter to reset on the next selected clock. NOTE If the user wants to start a new "clean" PWM waveform without any "history" from the old waveform, the user must write to channel counter (PWMCNTx) prior to enabling the PWM channel (PWMEx = 1). Generally, writes to the counter are done prior to enabling a channel to start from a known state. However, writing a counter can also be done while the PWM channel is enabled (counting). The effect is similar to writing the counter when the channel is disabled except that the new period is started immediately with the output set according to the polarity bit. NOTE Writing to the counter while the channel is enabled can cause an irregular PWM cycle to occur. The counter is cleared at the end of the effective period (see Section 12.4.2.5, "Left Aligned Outputs," and Section 12.4.2.6, "Center Aligned Outputs," for more details).
Table 12-11. PWM Timer Counter Conditions
Counter Clears (0x0000) When PWMCNTx register written to any value Effective period ends Counter Counts When PWM channel is enabled (PWMEx = 1). Counts from last value in PWMCNTx. Counter Stops When PWM channel is disabled (PWMEx = 0)
MC9S12E128 Data Sheet, Rev. 1.07 408 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
12.4.2.5
Left Aligned Outputs
The PWM timer provides the choice of two types of outputs, left aligned or center aligned outputs. They are selected with the CAEx bits in the PWMCAE register. If the CAEx bit is cleared (CAEx = 0), the corresponding PWM output will be left aligned. In left aligned output mode, the 8-bit counter is configured as an up counter only. It compares to two registers, a duty register and a period register as shown in the block diagram in Figure 12-35. When the PWM counter matches the duty register the output flip-flop changes state causing the PWM waveform to also change state. A match between the PWM counter and the period register resets the counter and the output flip-flop as shown in Figure 12-35 as well as performing a load from the double buffer period and duty register to the associated registers as described in Section 12.4.2.3, "PWM Period and Duty." The counter counts from 0 to the value in the period register - 1. NOTE Changing the PWM output mode from left aligned output to center aligned output (or vice versa) while channels are operating can cause irregularities in the PWM output. It is recommended to program the output mode before enabling the PWM channel.
PPOLx = 0
PPOLx = 1 PWMDTYx Period = PWMPERx
Figure 12-36. PWM Left Aligned Output Waveform
To calculate the output frequency in left aligned output mode for a particular channel, take the selected clock source frequency for the channel (A, B, SA, or SB) and divide it by the value in the period register for that channel. * PWMx frequency = clock (A, B, SA, or SB) / PWMPERx * PWMx duty cycle (high time as a% of period): -- Polarity = 0 (PPOLx = 0) Duty cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100% -- Polarity = 1 (PPOLx = 1) Duty cycle = [PWMDTYx / PWMPERx] * 100% As an example of a left aligned output, consider the following case: Clock source = bus clock, where bus clock = 10 MHz (100 ns period) PPOLx = 0 PWMPERx = 4 PWMDTYx = 1 PWMx frequency = 10 MHz/4 = 2.5 MHz PWMx period = 400 ns PWMx duty cycle = 3/4 *100% = 75%
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 409
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Shown below is the output waveform generated.
E = 100 ns
DUTY CYCLE = 75% PERIOD = 400 ns
Figure 12-37. PWM Left Aligned Output Example Waveform
12.4.2.6
Center Aligned Outputs
For center aligned output mode selection, set the CAEx bit (CAEx = 1) in the PWMCAE register and the corresponding PWM output will be center aligned. The 8-bit counter operates as an up/down counter in this mode and is set to up whenever the counter is equal to 0x0000. The counter compares to two registers, a duty register and a period register as shown in the block diagram in Figure 12-35. When the PWM counter matches the duty register the output flip-flop changes state causing the PWM waveform to also change state. A match between the PWM counter and the period register changes the counter direction from an up-count to a down-count. When the PWM counter decrements and matches the duty register again, the output flip-flop changes state causing the PWM output to also change state. When the PWM counter decrements and reaches 0, the counter direction changes from a down-count back to an up-count and a load from the double buffer period and duty registers to the associated registers is performed as described in Section 12.4.2.3, "PWM Period and Duty." The counter counts from 0 up to the value in the period register and then back down to 0. Thus the effective period is PWMPERx*2. NOTE Changing the PWM output mode from left aligned output to center aligned output (or vice versa) while channels are operating can cause irregularities in the PWM output. It is recommended to program the output mode before enabling the PWM channel.
PPOLx = 0
PPOLx = 1 PWMDTYx PWMPERx Period = PWMPERx*2 PWMDTYx PWMPERx
Figure 12-38. PWM Center Aligned Output Waveform
MC9S12E128 Data Sheet, Rev. 1.07 410 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
To calculate the output frequency in center aligned output mode for a particular channel, take the selected clock source frequency for the channel (A, B, SA, or SB) and divide it by twice the value in the period register for that channel. * PWMx frequency = clock (A, B, SA, or SB) / (2*PWMPERx) * PWMx duty cycle (high time as a% of period): -- Polarity = 0 (PPOLx = 0) Duty cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100% -- Polarity = 1 (PPOLx = 1) Duty cycle = [PWMDTYx / PWMPERx] * 100% As an example of a center aligned output, consider the following case: Clock source = bus clock, where bus clock = 10 MHz (100 ns period) PPOLx = 0 PWMPERx = 4 PWMDTYx = 1 PWMx frequency = 10 MHz/8 = 1.25 MHz PWMx period = 800 ns PWMx duty cycle = 3/4 *100% = 75% Shown below is the output waveform generated.
E = 100 ns E = 100 ns
DUTY CYCLE = 75% PERIOD = 800 ns
Figure 12-39. PWM Center Aligned Output Example Waveform
12.4.2.7
PWM 16-Bit Functions
The PWM timer also has the option of generating 6-channels of 8-bits or 3-channels of 16-bits for greater PWM resolution}. This 16-bit channel option is achieved through the concatenation of two 8-bit channels. The PWMCTL register contains three control bits, each of which is used to concatenate a pair of PWM channels into one 16-bit channel. Channels 4 and 5 are concatenated with the CON45 bit, channels 2 and 3 are concatenated with the CON23 bit, and channels 0 and 1 are concatenated with the CON01 bit. NOTE Change these bits only when both corresponding channels are disabled. When channels 4 and 5 are concatenated, channel 4 registers become the high-order bytes of the double byte channel as shown in Figure 12-40. Similarly, when channels 2 and 3 are concatenated, channel 2 registers become the high-order bytes of the double byte channel. When channels 0 and 1 are concatenated, channel 0 registers become the high-order bytes of the double byte channel.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 411
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Clock Source 5 High PWMCNT4 Low PWCNT5
Period/Duty Compare
PWM5
Clock Source 3 High PWMCNT2 Low PWCNT3
Period/Duty Compare
PWM3
Clock Source 1 High PWMCNT0 Low PWCNT1
Period/Duty Compare
PWM1
Figure 12-40. PWM 16-Bit Mode
When using the 16-bit concatenated mode, the clock source is determined by the low-order 8-bit channel clock select control bits. That is channel 5 when channels 4 and 5 are concatenated, channel 3 when channels 2 and 3 are concatenated, and channel 1 when channels 0 and 1 are concatenated. The resulting PWM is output to the pins of the corresponding low-order 8-bit channel as also shown in Figure 12-40. The polarity of the resulting PWM output is controlled by the PPOLx bit of the corresponding low-order 8-bit channel as well. After concatenated mode is enabled (CONxx bits set in PWMCTL register), enabling/disabling the corresponding 16-bit PWM channel is controlled by the low-order PWMEx bit. In this case, the high-order bytes PWMEx bits have no effect and their corresponding PWM output is disabled. In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or high-order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by 16-bit access to maintain data coherency. Either left aligned or center aligned output mode can be used in concatenated mode and is controlled by the low-order CAEx bit. The high-order CAEx bit has no effect.
MC9S12E128 Data Sheet, Rev. 1.07 412 Freescale Semiconductor
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
Table 12-12 is used to summarize which channels are used to set the various control bits when in 16-bit mode.
Table 12-12. 16-bit Concatenation Mode Summary
CONxx CON45 CON23 CON01 PWMEx PWME5 PWME3 PWME1 PPOLx PPOL5 PPOL3 PPOL1 PCLKx PCLK5 PCLK3 PCLK1 CAEx CAE5 CAE3 CAE1 PWMx Output PWM5 PWM3 PWM1
12.4.2.8
PWM Boundary Cases
Table 12-13 summarizes the boundary conditions for the PWM regardless of the output mode (left aligned or center aligned) and 8-bit (normal) or 16-bit (concatenation):
Table 12-13. PWM Boundary Cases
PWMDTYx 0x0000 (indicates no duty) 0x0000 (indicates no duty) XX XX >= PWMPERx >= PWMPERx
1
PWMPERx >0x0000 >0x0000 0x00001 (indicates no period) 0x00001 (indicates no period) XX XX
PPOLx 1 0 1 0 1 0
PWMx Output Always Low Always High Always High Always Low Always High Always Low
Counter = 0x0000 and does not count.
12.5
Resets
The reset state of each individual bit is listed within the register description section (see Section 12.3, "Memory Map and Register Definition," which details the registers and their bit-fields. All special functions or modes which are initialized during or just following reset are described within this section. * The 8-bit up/down counter is configured as an up counter out of reset. * All the channels are disabled and all the counters don't count.
12.6
Interrupts
The PWM8B6CV1 module has only one interrupt which is generated at the time of emergency shutdown, if the corresponding enable bit (PWMIE) is set. This bit is the enable for the interrupt. The interrupt flag PWMIF is set whenever the input level of the PWM5 channel changes while PWM5ENA=1 or when PWMENA is being asserted while the level at PWM5 is active. A description of the registers involved and affected due to this interrupt is explained in Section 12.3.2.15, "PWM Shutdown Register (PWMSDN)."
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 413
Chapter 12 Pulse-Width Modulator (PWM8B6CV1)
MC9S12E128 Data Sheet, Rev. 1.07 414 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
13.1 Introduction
The basic timer consists of a 16-bit, software-programmable counter driven by a seven-stage programmable prescaler. This timer can be used for many purposes, including input waveform measurements while simultaneously generating an output waveform. Pulse widths can vary from microseconds to many seconds. This timer contains 4 complete input capture/output compare channels IOC[7:4] and one pulse accumulator. The input capture function is used to detect a selected transition edge and record the time. The output compare function is used for generating output signals or for timer software delays. The 16-bit pulse accumulator is used to operate as a simple event counter or a gated time accumulator. The pulse accumulator shares timer channel 7 when in event mode. A full access for the counter registers or the input capture/output compare registers should take place in one clock cycle. Accessing high byte and low byte separately for all of these registers may not yield the same result as accessing them in one word.
13.1.1
Features
The TIM16B4CV1 includes these distinctive features: * Four input capture/output compare channels. * Clock prescaling. * 16-bit counter. * 16-bit pulse accumulator.
13.1.2
Stop: Freeze: Wait: Normal:
Modes of Operation
Timer is off because clocks are stopped. Timer counter keep on running, unless TSFRZ in TSCR (0x0006) is set to 1. Counters keep on running, unless TSWAI in TSCR (0x0006) is set to 1. Timer counter keep on running, unless TEN in TSCR (0x0006) is cleared to 0.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 415
Chapter 13 Timer Module (TIM16B4CV1)
13.1.3
Block Diagrams
Bus clock
Prescaler
16-bit Counter
Timer overflow interrupt Timer channel 4 interrupt Registers
Channel 4 Input capture Output compare Channel 5 Input capture Output compare
IOC4
IOC5
Timer channel 7 interrupt
Channel 6 Input capture Output compare 16-bit Pulse accumulator Channel 7 Input capture Output compare
IOC6
PA overflow interrupt PA input interrupt
IOC7
Figure 13-1. TIM16B4CV1 Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 416 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
TIMCLK (Timer clock)
CLK1 CLK0
4:1 MUX
PACLK / 256
Prescaled clock (PCLK)
PACLK / 65536
Clock select (PAMOD) PACLK
Edge detector
PT7
Intermodule Bus
Interrupt
PACNT
MUX
Divide by 64
M clock
Figure 13-2. 16-Bit Pulse Accumulator Block Diagram
16-bit Main Timer
PTn
Edge detector
Set CnF Interrupt
TCn Input Capture Reg.
Figure 13-3. Interrupt Flag Setting
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 417
Chapter 13 Timer Module (TIM16B4CV1)
PULSE ACCUMULATOR CHANNEL 7 OUTPUT COMPARE OM7 OL7 OC7M7
PAD
Figure 13-4. Channel 7 Output Compare/Pulse Accumulator Logic
NOTE For more information see the respective functional descriptions in Section 13.4, "Functional Description," of this document.
13.2
External Signal Description
The TIM16B4CV1 module has a total of four external pins.
13.2.1
IOC7 -- Input Capture and Output Compare Channel 7 Pin
This pin serves as input capture or output compare for channel 7. This can also be configured as pulse accumulator input.
13.2.2
IOC6 -- Input Capture and Output Compare Channel 6 Pin
This pin serves as input capture or output compare for channel 6.
13.2.3
IOC5 -- Input Capture and Output Compare Channel 5 Pin
This pin serves as input capture or output compare for channel 5.
13.2.4
IOC4 -- Input Capture and Output Compare Channel 4 Pin
NOTE For the description of interrupts see Section 13.6, "Interrupts".
This pin serves as input capture or output compare for channel 4.
MC9S12E128 Data Sheet, Rev. 1.07 418 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
13.3
Memory Map and Register Definition
This section provides a detailed description of all memory and registers.
13.3.1
Module Memory Map
The memory map for the TIM16B4CV1 module is given below in Table 13-1. The address listed for each register is the address offset. The total address for each register is the sum of the base address for the TIM16B4CV1 module and the address offset for each register.
Table 13-1. TIM16B4CV1 Memory Map
Address Offset 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 0x000A 0x000B 0x000C 0x000D 0x000E 0x000F 0x0010 - 0x0017 0x0018 0x0019 0x001A 0x001B 0x001C 0x001D 0x001E 0x001F 0x0020 0x0021 0x0022 0x0023 0x002D
1
Use Timer Input Capture/Output Compare Select (TIOS) Timer Compare Force Register (CFORC) Output Compare 7 Mask Register (OC7M) Output Compare 7 Data Register (OC7D) Timer Count Register (TCNT(hi)) Timer Count Register (TCNT(lo)) Timer System Control Register1 (TSCR1) Timer Toggle Overflow Register (TTOV) Timer Control Register1 (TCTL1) Reserved Timer Control Register3 (TCTL3) Reserved Timer Interrupt Enable Register (TIE) Timer System Control Register2 (TSCR2) Main Timer Interrupt Flag1 (TFLG1) Main Timer Interrupt Flag2 (TFLG2) Reserved Timer Input Capture/Output Compare Register4 (TC4(hi)) Timer Input Capture/Output Compare Register 4 (TC4(lo)) Timer Input Capture/Output Compare Register 5 (TC5(hi)) Timer Input Capture/Output Compare Register 5 (TC5(lo)) Timer Input Capture/Output Compare Register 6 (TC6(hi)) Timer Input Capture/Output Compare Register 6 (TC6(lo)) Timer Input Capture/Output Compare Register 7 (TC7(hi)) Timer Input Capture/Output Compare Register 7 (TC7(lo)) 16-Bit Pulse Accumulator Control Register (PACTL) Pulse Accumulator Flag Register (PAFLG) Pulse Accumulator Count Register (PACNT(hi)) Pulse Accumulator Count Register (PACNT(lo)) Timer Test Register (TIMTST)
Access R/W R/W1 R/W R/W R/W2 R/W2 R/W R/W R/W --3 R/W --3 R/W R/W R/W R/W --3 R/W4 R/W4 R/W4 R/W4 R/W4 R/W4 R/W4 R/W4 R/W R/W R/W R/W --3 R/W2 --3
0x0024 - 0x002C Reserved 0x002E - 0x002F Reserved Always read 0x0000.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 419
Chapter 13 Timer Module (TIM16B4CV1)
2 3
Only writable in special modes (test_mode = 1). Write has no effect; return 0 on read 4 Write to these registers have no meaning or effect during input capture.
13.3.2
Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order.
Register Name 0x0000 TIOS R W R W R W R W R W R W R W R W R W R W R W EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A Bit 7 6 5 4 3 2 1 Bit 0
IOS7
IOS6
IOS5
IOS4
IOS3
IOS2
IOS1
IOS0
0x0001 CFORC 0x0002 OC7M 0x0003 OC7D 0x0004 TCNTH 0x0005 TCNTL 0x0006 TSCR2 0x0007 TTOV 0x0008 TCTL1 0x0009 Reserved 0x000A TCTL3
0 FOC7 OC7M7
0 FOC6 OC7M6
0 FOC5 OC7M5
0 FOC4 OC7M4
0 FOC3 OC7M3
0 FOC2 OC7M2
0 FOC1 OC7M1
0 FOC0 OC7M0
OC7D7
OC7D6
OC7D5
OC7D4
OC7D3
OC7D2
OC7D1
OC7D0
TCNT15
TCNT14
TCNT13
TCNT12
TCNT11
TCNT10
TCNT9
TCNT8
TCNT7
TCNT6
TCNT5
TCNT4
TCNT3 0
TCNT2 0
TCNT1 0
TCNT0 0
TEN
TSWAI
TSFRZ
TFFCA
TOV7
TOV6
TOV5
TOV4
TOV3
TOV2
TOV1
TOV0
OM7 0
OL7 0
OM6 0
OL6 0
OM5 0
OL5 0
OM4 0
OL4 0
= Unimplemented or Reserved
Figure 13-5. TIM16B4CV1 Register Summary
MC9S12E128 Data Sheet, Rev. 1.07 420 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
Register Name 0x000B Reserved 0x000C TIE 0x000D TSCR2 0x000E TFLG1 0x000F TFLG2 0x0010-0x0017 Reserved R W R W R W R W R W R W R 0x0018-0x001F TCxH-TCxL W R W 0x0020 PACTL 0x0021 PAFLG 0x0022 PACNTH 0x0023 PACNTL 0x0024-0x002F Reserved R W R W R W R W R W
Bit 7 0
6 0
5 0
4 0
3 0
2 0
1 0
Bit 0 0
C7I
C6I 0
C5I 0
C4I 0
C3I
C2I
C1I
C0I
TOI
TCRE
PR2
PR1
PR0
C7F
C6F 0
C5F 0
C4F 0
C3F 0
C2F 0
C1F 0
C0F 0
TOF 0
0
0
0
0
0
0
0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7 0
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
PAEN 0
PAMOD 0
PEDGE 0
CLK1 0
CLK0 0
PAOVI
PAI
0
PAOVF
PAIF
PACNT15
PACNT14
PACNT13
PACNT12
PACNT11
PACNT10
PACNT9
PACNT8
PACNT7
PACNT6
PACNT5
PACNT4
PACNT3
PACNT2
PACNT1
PACNT0
= Unimplemented or Reserved
Figure 13-5. TIM16B4CV1 Register Summary (continued)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 421
Chapter 13 Timer Module (TIM16B4CV1)
13.3.2.1
Timer Input Capture/Output Compare Select (TIOS)
7 6 5 4 3 2 1 0
R IOS7 W Reset 0 0 0 0 IOS6 IOS5 IOS4
0
0
0
0
0
0
0
0
Figure 13-6. Timer Input Capture/Output Compare Select (TIOS)
Read: Anytime Write: Anytime
Table 13-2. TIOS Field Descriptions
Field 7:4 IOS[7:4] Description Input Capture or Output Compare Channel Configuration 0 The corresponding channel acts as an input capture. 1 The corresponding channel acts as an output compare.
13.3.2.2
Timer Compare Force Register (CFORC)
7 6 5 4 3 2 1 0
R W Reset
0 FOC7 0
0 FOC6 0
0 FOC5 0
0 FOC4 0
0
0
0
0
0
0
0
0
Figure 13-7. Timer Compare Force Register (CFORC)
Read: Anytime but will always return 0x0000 (1 state is transient) Write: Anytime
Table 13-3. CFORC Field Descriptions
Field 7:4 FOC[7:4] Description Force Output Compare Action for Channel 7:4 -- A write to this register with the corresponding data bit(s) set causes the action which is programmed for output compare "x" to occur immediately. The action taken is the same as if a successful comparison had just taken place with the TCx register except the interrupt flag does not get set. Note: A successful channel 7 output compare overrides any channel 6:4 compares. If forced output compare on any channel occurs at the same time as the successful output compare then forced output compare action will take precedence and interrupt flag won't get set.
MC9S12E128 Data Sheet, Rev. 1.07 422 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
13.3.2.3
Output Compare 7 Mask Register (OC7M)
7 6 5 4 3 2 1 0
R OC7M7 W Reset 0 0 0 0 OC7M6 OC7M5 OC7M4
0
0
0
0
0
0
0
0
Figure 13-8. Output Compare 7 Mask Register (OC7M)
Read: Anytime Write: Anytime
Table 13-4. OC7M Field Descriptions
Field 7:4 OC7M[7:4] Description Output Compare 7 Mask -- Setting the OC7Mx (x ranges from 4 to 6) will set the corresponding port to be an output port when the corresponding TIOSx (x ranges from 4 to 6) bit is set to be an output compare. Note: A successful channel 7 output compare overrides any channel 6:4 compares. For each OC7M bit that is set, the output compare action reflects the corresponding OC7D bit.
13.3.2.4
Output Compare 7 Data Register (OC7D)
7 6 5 4 3 2 1 0
R OC7D7 W Reset 0 0 0 0 OC7D6 OC7D5 OC7D4
0
0
0
0
0
0
0
0
Figure 13-9. Output Compare 7 Data Register (OC7D)
Read: Anytime Write: Anytime
Table 13-5. OC7D Field Descriptions
Field 7:4 OC7D[7:4] Description Output Compare 7 Data -- A channel 7 output compare can cause bits in the output compare 7 data register to transfer to the timer port data register depending on the output compare 7 mask register.
13.3.2.5
Timer Count Register (TCNT)
15 14 13 12 11 10 9 9
R TCNT15 W Reset 0 0 0 0 0 0 0 0 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8
Figure 13-10. Timer Count Register High (TCNTH)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 423
Chapter 13 Timer Module (TIM16B4CV1)
7
6
5
4
3
2
1
0
R TCNT7 W Reset 0 0 0 0 0 0 0 0 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0
Figure 13-11. Timer Count Register Low (TCNTL)
The 16-bit main timer is an up counter. A full access for the counter register should take place in one clock cycle. A separate read/write for high byte and low byte will give a different result than accessing them as a word. Read: Anytime Write: Has no meaning or effect in the normal mode; only writable in special modes (test_mode = 1). The period of the first count after a write to the TCNT registers may be a different size because the write is not synchronized with the prescaler clock.
13.3.2.6
Timer System Control Register 1 (TSCR1)
7 6 5 4 3 2 1 0
R TEN W Reset 0 0 0 0 TSWAI TSFRZ TFFCA
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-12. Timer System Control Register 1 (TSCR2)
Read: Anytime Write: Anytime
Table 13-6. TSCR1 Field Descriptions
Field 7 TEN Description Timer Enable 0 Disables the main timer, including the counter. Can be used for reducing power consumption. 1 Allows the timer to function normally. If for any reason the timer is not active, there is no /64 clock for the pulse accumulator because the /64 is generated by the timer prescaler. Timer Module Stops While in Wait 0 Allows the timer module to continue running during wait. 1 Disables the timer module when the MCU is in the wait mode. Timer interrupts cannot be used to get the MCU out of wait. TSWAI also affects pulse accumulator.
6 TSWAI
MC9S12E128 Data Sheet, Rev. 1.07 424 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
Table 13-6. TSCR1 Field Descriptions (continued)
Field 5 TSFRZ Description Timer Stops While in Freeze Mode 0 Allows the timer counter to continue running while in freeze mode. 1 Disables the timer counter whenever the MCU is in freeze mode. This is useful for emulation. TSFRZ does not stop the pulse accumulator. Timer Fast Flag Clear All 0 Allows the timer flag clearing to function normally. 1 For TFLG1(0x000E), a read from an input capture or a write to the output compare channel (0x0010-0x001F) causes the corresponding channel flag, CnF, to be cleared. For TFLG2 (0x000F), any access to the TCNT register (0x0004, 0x0005) clears the TOF flag. Any access to the PACNT registers (0x0022, 0x0023) clears the PAOVF and PAIF flags in the PAFLG register (0x0021). This has the advantage of eliminating software overhead in a separate clear sequence. Extra care is required to avoid accidental flag clearing due to unintended accesses.
4 TFFCA
13.3.2.7
Timer Toggle On Overflow Register 1 (TTOV)
7 6 5 4 3 2 1 0
R TOV7 W Reset 0 0 0 0 TOV6 TOV5 TOV4
0
0
0
0
0
0
0
0
Figure 13-13. Timer Toggle On Overflow Register 1 (TTOV)
Read: Anytime Write: Anytime
Table 13-7. TTOV Field Descriptions
Field 7:4 TOV[7:4] Description Toggle On Overflow Bits -- TOVx toggles output compare pin on overflow. This feature only takes effect when in output compare mode. When set, it takes precedence over forced output compare but not channel 7 override events. 0 Toggle output compare pin on overflow feature disabled. 1 Toggle output compare pin on overflow feature enabled.
13.3.2.8
Timer Control Register 1 (TCTL1)
7 6 5 4 3 2 1 0
R OM7 W Reset 0 0 0 0 0 0 0 0 OL7 OM6 OL6 OM5 OL5 OM4 OL4
Figure 13-14. Timer Control Register 1 (TCTL1)
Read: Anytime Write: Anytime
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 425
Chapter 13 Timer Module (TIM16B4CV1)
Table 13-8. TCTL1/TCTL2 Field Descriptions
Field 7:4 OMx Description Output Mode -- These four pairs of control bits are encoded to specify the output action to be taken as a result of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to OCx. Note: To enable output action by OMx bits on timer port, the corresponding bit in OC7M should be cleared. Output Level -- These four pairs of control bits are encoded to specify the output action to be taken as a result of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to OCx. Note: To enable output action by OLx bits on timer port, the corresponding bit in OC7M should be cleared.
7:4 OLx
Table 13-9. Compare Result Output Action
OMx 0 0 1 1 OLx 0 1 0 1 Action Timer disconnected from output pin logic Toggle OCx output line Clear OCx output line to zero Set OCx output line to one
To operate the 16-bit pulse accumulator independently of input capture or output compare 7 and 4 respectively the user must set the corresponding bits IOSx = 1, OMx = 0 and OLx = 0. OC7M7 in the OC7M register must also be cleared.
MC9S12E128 Data Sheet, Rev. 1.07 426 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
13.3.2.9
Timer Control Register 3 (TCTL3)
7 6 5 4 3 2 1 0
R EDG7B W Reset 0 0 0 0 0 0 0 0 EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A
Figure 13-15. Timer Control Register 3 (TCTL3)
Read: Anytime Write: Anytime.
Table 13-10. TCTL3/TCTL4 Field Descriptions
Field 7:0 EDGnB EDGnA Description Input Capture Edge Control -- These eight pairs of control bits configure the input capture edge detector circuits.
Table 13-11. Edge Detector Circuit Configuration
EDGnB 0 0 1 1 EDGnA 0 1 0 1 Configuration Capture disabled Capture on rising edges only Capture on falling edges only Capture on any edge (rising or falling)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 427
Chapter 13 Timer Module (TIM16B4CV1)
13.3.2.10 Timer Interrupt Enable Register (TIE)
7 6 5 4 3 2 1 0
R C7I W Reset 0 0 0 0 C6I C5I C4I
0
0
0
0
0
0
0
0
Figure 13-16. Timer Interrupt Enable Register (TIE)
Read: Anytime Write: Anytime.
Table 13-12. TIE Field Descriptions
Field 7:4 C7I:C0I Description Input Capture/Output Compare "x" Interrupt Enable -- The bits in TIE correspond bit-for-bit with the bits in the TFLG1 status register. If cleared, the corresponding flag is disabled from causing a hardware interrupt. If set, the corresponding flag is enabled to cause a interrupt.
13.3.2.11 Timer System Control Register 2 (TSCR2)
7 6 5 4 3 2 1 0
R TOI W Reset 0
0
0
0 TCRE PR2 0 PR1 0 PR0 0
0
0
0
0
= Unimplemented or Reserved
Figure 13-17. Timer System Control Register 2 (TSCR2)
Read: Anytime Write: Anytime.
Table 13-13. TSCR2 Field Descriptions
Field 7 TOI 3 TCRE Description Timer Overflow Interrupt Enable 0 Interrupt inhibited. 1 Hardware interrupt requested when TOF flag set. Timer Counter Reset Enable -- This bit allows the timer counter to be reset by a successful output compare 7 event. This mode of operation is similar to an up-counting modulus counter. 0 Counter reset inhibited and counter free runs. 1 Counter reset by a successful output compare 7. If TC7 = 0x0000 and TCRE = 1, TCNT will stay at 0x0000 continuously. If TC7 = 0xFFFF and TCRE = 1, TOF will never be set when TCNT is reset from 0xFFFF to 0x0000. Timer Prescaler Select -- These three bits select the frequency of the timer prescaler clock derived from the Bus Clock as shown in Table 13-14.
2 PR[2:0]
MC9S12E128 Data Sheet, Rev. 1.07 428 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
Table 13-14. Timer Clock Selection
PR2 0 0 0 0 1 1 1 1 PR1 0 0 1 1 0 0 1 1 PR0 0 1 0 1 0 1 0 1 Timer Clock Bus Clock / 1 Bus Clock / 2 Bus Clock / 4 Bus Clock / 8 Bus Clock / 16 Bus Clock / 32 Bus Clock / 64 Bus Clock / 128
NOTE The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter stages equal zero.
13.3.2.12 Main Timer Interrupt Flag 1 (TFLG1)
7 6 5 4 3 2 1 0
R C7F W Reset 0 0 0 0 C6F C5F C4F
0
0
0
0
0
0
0
0
Figure 13-18. Main Timer Interrupt Flag 1 (TFLG1)
Read: Anytime Write: Used in the clearing mechanism (set bits cause corresponding bits to be cleared). Writing a zero will not affect current status of the bit.
Table 13-15. TRLG1 Field Descriptions
Field 7:4 C[7:4]F Description Input Capture/Output Compare Channel "x" Flag -- These flags are set when an input capture or output compare event occurs. Clear a channel flag by writing one to it. When TFFCA bit in TSCR register is set, a read from an input capture or a write into an output compare channel (0x0010-0x001F) will cause the corresponding channel flag CxF to be cleared.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 429
Chapter 13 Timer Module (TIM16B4CV1)
13.3.2.13 Main Timer Interrupt Flag 2 (TFLG2)
7 6 5 4 3 2 1 0
R TOF W Reset 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 13-19. Main Timer Interrupt Flag 2 (TFLG2)
TFLG2 indicates when interrupt conditions have occurred. To clear a bit in the flag register, write the bit to one. Read: Anytime Write: Used in clearing mechanism (set bits cause corresponding bits to be cleared). Any access to TCNT will clear TFLG2 register if the TFFCA bit in TSCR register is set.
Table 13-16. TRLG2 Field Descriptions
Field 7 TOF Description Timer Overflow Flag -- Set when 16-bit free-running timer overflows from 0xFFFF to 0x0000. This bit is cleared automatically by a write to the TFLG2 register with bit 7 set. (See also TCRE control bit explanation.)
13.3.2.14 Timer Input Capture/Output Compare Registers High and Low 4-7 (TCxH and TCxL)
15 14 11 12 11 10 9 0
R Bit 15 W Reset 0 0 0 0 0 0 0 0 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
Figure 13-20. Timer Input Capture/Output Compare Register x High (TCxH)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Figure 13-21. Timer Input Capture/Output Compare Register x Low (TCxL)
Depending on the TIOS bit for the corresponding channel, these registers are used to latch the value of the free-running counter when a defined transition is sensed by the corresponding input capture edge detector or to trigger an output action for output compare. Read: Anytime
MC9S12E128 Data Sheet, Rev. 1.07 430 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
Write: Anytime for output compare function.Writes to these registers have no meaning or effect during input capture. All timer input capture/output compare registers are reset to 0x0000. NOTE Read/Write access in byte mode for high byte should takes place before low byte otherwise it will give a different result.
13.3.2.15 16-Bit Pulse Accumulator Control Register (PACTL)
7 6 5 4 3 2 1 0
R W Reset
0 PAEN 0 0 PAMOD 0 PEDGE 0 CLK1 0 CLK0 0 PAOVI 0 PAI 0
Unimplemented or Reserved
Figure 13-22. 16-Bit Pulse Accumulator Control Register (PACTL)
When PAEN is set, the PACT is enabled.The PACT shares the input pin with IOC7. Read: Any time Write: Any time
Table 13-17. PACTL Field Descriptions
Field 6 PAEN Description Pulse Accumulator System Enable -- PAEN is independent from TEN. With timer disabled, the pulse accumulator can function unless pulse accumulator is disabled. 0 16-Bit Pulse Accumulator system disabled. 1 Pulse Accumulator system enabled. Pulse Accumulator Mode -- This bit is active only when the Pulse Accumulator is enabled (PAEN = 1). See Table 13-18. 0 Event counter mode. 1 Gated time accumulation mode. Pulse Accumulator Edge Control -- This bit is active only when the Pulse Accumulator is enabled (PAEN = 1). For PAMOD bit = 0 (event counter mode). See Table 13-18. 0 Falling edges on IOC7 pin cause the count to be incremented. 1 Rising edges on IOC7 pin cause the count to be incremented. For PAMOD bit = 1 (gated time accumulation mode). 0 IOC7 input pin high enables M (bus clock) divided by 64 clock to Pulse Accumulator and the trailing falling edge on IOC7 sets the PAIF flag. 1 IOC7 input pin low enables M (bus clock) divided by 64 clock to Pulse Accumulator and the trailing rising edge on IOC7 sets the PAIF flag. Clock Select Bits -- Refer to Table 13-19.
5 PAMOD
4 PEDGE
3:2 CLK[1:0]
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 431
Chapter 13 Timer Module (TIM16B4CV1)
Table 13-17. PACTL Field Descriptions (continued)
Field 1 PAOVI 0 PAI Pulse Accumulator Overflow Interrupt Enable 0 Interrupt inhibited. 1 Interrupt requested if PAOVF is set. Pulse Accumulator Input Interrupt Enable 0 Interrupt inhibited. 1 Interrupt requested if PAIF is set. Description
Table 13-18. Pin Action
PAMOD 0 0 1 1 PEDGE 0 1 0 1 Pin Action Falling edge Rising edge Div. by 64 clock enabled with pin high level Div. by 64 clock enabled with pin low level
NOTE If the timer is not active (TEN = 0 in TSCR), there is no divide-by-64 because the /64 clock is generated by the timer prescaler.
Table 13-19. Timer Clock Selection
CLK1 0 0 1 1 CLK0 0 1 0 1 Timer Clock Use timer prescaler clock as timer counter clock Use PACLK as input to timer counter clock Use PACLK/256 as timer counter clock frequency Use PACLK/65536 as timer counter clock frequency
For the description of PACLK please refer Figure 13-22. If the pulse accumulator is disabled (PAEN = 0), the prescaler clock from the timer is always used as an input clock to the timer counter. The change from one selected clock to the other happens immediately after these bits are written.
MC9S12E128 Data Sheet, Rev. 1.07 432 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
13.3.2.16 Pulse Accumulator Flag Register (PAFLG)
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0 PAOVF PAIF 0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 13-23. Pulse Accumulator Flag Register (PAFLG)
Read: Anytime Write: Anytime When the TFFCA bit in the TSCR register is set, any access to the PACNT register will clear all the flags in the PAFLG register.
Table 13-20. PAFLG Field Descriptions
Field 1 PAOVF 0 PAIF Description Pulse Accumulator Overflow Flag -- Set when the 16-bit pulse accumulator overflows from 0xFFFF to 0x0000. This bit is cleared automatically by a write to the PAFLG register with bit 1 set. Pulse Accumulator Input edge Flag -- Set when the selected edge is detected at the IOC7 input pin.In event mode the event edge triggers PAIF and in gated time accumulation mode the trailing edge of the gate signal at the IOC7 input pin triggers PAIF. This bit is cleared by a write to the PAFLG register with bit 0 set. Any access to the PACNT register will clear all the flags in this register when TFFCA bit in register TSCR(0x0006) is set.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 433
Chapter 13 Timer Module (TIM16B4CV1)
13.3.2.17 Pulse Accumulators Count Registers (PACNT)
15 14 13 12 11 10 9 0
R PACNT15 W Reset 0 0 0 0 0 0 0 0 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8
Figure 13-24. Pulse Accumulator Count Register High (PACNTH)
7 6 5 4 3 2 1 0
R PACNT7 W Reset 0 0 0 0 0 0 0 0 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0
Figure 13-25. Pulse Accumulator Count Register Low (PACNTL)
Read: Anytime Write: Anytime These registers contain the number of active input edges on its input pin since the last reset. When PACNT overflows from 0xFFFF to 0x0000, the Interrupt flag PAOVF in PAFLG (0x0021) is set. Full count register access should take place in one clock cycle. A separate read/write for high byte and low byte will give a different result than accessing them as a word. NOTE Reading the pulse accumulator counter registers immediately after an active edge on the pulse accumulator input pin may miss the last count because the input has to be synchronized with the bus clock first.
MC9S12E128 Data Sheet, Rev. 1.07 434 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
13.4
Functional Description
This section provides a complete functional description of the timer TIM16B4CV1 block. Please refer to the detailed timer block diagram in Figure 13-26 as necessary.
Bus Clock
CLK[1:0] PR[2:1:0] PACLK PACLK/256 PACLK/65536
channel 7 output compare
MUX TCRE CxI CxF
PRESCALER
TCNT(hi):TCNT(lo) CLEAR COUNTER 16-BIT COUNTER TE CHANNEL 4 16-BIT COMPARATOR TC4 EDG4A EDG4B EDGE DETECT C4F OM:OL4 TOV4
TOF TOI
INTERRUPT LOGIC
TOF
C4F
CH. 4 CAPTURE
IOC4 PIN LOGIC CH. 4 COMPARE
IOC4 PIN
IOC4
CHANNEL7 16-BIT COMPARATOR TC7 EDG7A EDG7B EDGE DETECT C7F OM:OL7 TOV7
C7F
CH.7 CAPTURE IOC7 PIN PA INPUT LOGIC CH. 7 COMPARE IOC7 PIN
IOC7
PAOVF
PACNT(hi):PACNT(lo)
PEDGE PAE
EDGE DETECT
PACLK/65536 PACLK/256 INTERRUPT REQUEST PAOVI PAOVF
16-BIT COUNTER PACLK PAMOD INTERRUPT LOGIC DIVIDE-BY-64 PAI PAIF PAIF
Bus Clock
PAOVF PAOVI
Figure 13-26. Detailed Timer Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 435
Chapter 13 Timer Module (TIM16B4CV1)
13.4.1
Prescaler
The prescaler divides the bus clock by 1,2,4,8,16,32,64 or 128. The prescaler select bits, PR[2:0], select the prescaler divisor. PR[2:0] are in timer system control register 2 (TSCR2).
13.4.2
Input Capture
Clearing the I/O (input/output) select bit, IOSx, configures channel x as an input capture channel. The input capture function captures the time at which an external event occurs. When an active edge occurs on the pin of an input capture channel, the timer transfers the value in the timer counter into the timer channel registers, TCx. The minimum pulse width for the input capture input is greater than two bus clocks. An input capture on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt requests.
13.4.3
Output Compare
Setting the I/O select bit, IOSx, configures channel x as an output compare channel. The output compare function can generate a periodic pulse with a programmable polarity, duration, and frequency. When the timer counter reaches the value in the channel registers of an output compare channel, the timer can set, clear, or toggle the channel pin. An output compare on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt requests. The output mode and level bits, OMx and OLx, select set, clear, toggle on output compare. Clearing both OMx and OLx disconnects the pin from the output logic. Setting a force output compare bit, FOCx, causes an output compare on channel x. A forced output compare does not set the channel flag. A successful output compare on channel 7 overrides output compares on all other output compare channels. The output compare 7 mask register masks the bits in the output compare 7 data register. The timer counter reset enable bit, TCRE, enables channel 7 output compares to reset the timer counter. A channel 7 output compare can reset the timer counter even if the IOC7 pin is being used as the pulse accumulator input. Writing to the timer port bit of an output compare pin does not affect the pin state. The value written is stored in an internal latch. When the pin becomes available for general-purpose output, the last value written to the bit appears at the pin.
13.4.4
Pulse Accumulator
The pulse accumulator (PACNT) is a 16-bit counter that can operate in two modes: Event counter mode -- Counting edges of selected polarity on the pulse accumulator input pin, PAI. Gated time accumulation mode -- Counting pulses from a divide-by-64 clock. The PAMOD bit selects the mode of operation.
MC9S12E128 Data Sheet, Rev. 1.07 436 Freescale Semiconductor
Chapter 13 Timer Module (TIM16B4CV1)
The minimum pulse width for the PAI input is greater than two bus clocks.
13.4.5
Event Counter Mode
Clearing the PAMOD bit configures the PACNT for event counter operation. An active edge on the IOC7 pin increments the pulse accumulator counter. The PEDGE bit selects falling edges or rising edges to increment the count. NOTE The PACNT input and timer channel 7 use the same pin IOC7. To use the IOC7, disconnect it from the output logic by clearing the channel 7 output mode and output level bits, OM7 and OL7. Also clear the channel 7 output compare 7 mask bit, OC7M7. The Pulse Accumulator counter register reflect the number of active input edges on the PACNT input pin since the last reset. The PAOVF bit is set when the accumulator rolls over from 0xFFFF to 0x0000. The pulse accumulator overflow interrupt enable bit, PAOVI, enables the PAOVF flag to generate interrupt requests. NOTE The pulse accumulator counter can operate in event counter mode even when the timer enable bit, TEN, is clear.
13.4.6
Gated Time Accumulation Mode
Setting the PAMOD bit configures the pulse accumulator for gated time accumulation operation. An active level on the PACNT input pin enables a divided-by-64 clock to drive the pulse accumulator. The PEDGE bit selects low levels or high levels to enable the divided-by-64 clock. The trailing edge of the active level at the IOC7 pin sets the PAIF. The PAI bit enables the PAIF flag to generate interrupt requests. The pulse accumulator counter register reflect the number of pulses from the divided-by-64 clock since the last reset. NOTE The timer prescaler generates the divided-by-64 clock. If the timer is not active, there is no divided-by-64 clock.
13.5
Resets
The reset state of each individual bit is listed within Section 13.3, "Memory Map and Register Definition" which details the registers and their bit fields.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 437
Chapter 13 Timer Module (TIM16B4CV1)
13.6
Interrupts
This section describes interrupts originated by the TIM16B4CV1 block. Table 13-21 lists the interrupts generated by the TIM16B4CV1 to communicate with the MCU.
Table 13-21. TIM16B8CV1 Interrupts
Interrupt C[7:4]F PAOVI PAOVF TOF
1
Offset1 -- -- -- --
Vector1 -- -- -- --
Priority1 -- -- -- --
Source Timer Channel 7-4 Pulse Accumulator Input Pulse Accumulator Overflow Timer Overflow
Description Active high timer channel interrupts 7-4 Active high pulse accumulator input interrupt Pulse accumulator overflow interrupt Timer Overflow interrupt
Chip Dependent.
The TIM16B4CV1 uses a total of 7 interrupt vectors. The interrupt vector offsets and interrupt numbers are chip dependent.
13.6.1
Channel [7:4] Interrupt (C[7:4]F)
This active high outputs will be asserted by the module to request a timer channel 7 - 4 interrupt to be serviced by the system controller.
13.6.2
Pulse Accumulator Input Interrupt (PAOVI)
This active high output will be asserted by the module to request a timer pulse accumulator input interrupt to be serviced by the system controller.
13.6.3
Pulse Accumulator Overflow Interrupt (PAOVF)
This active high output will be asserted by the module to request a timer pulse accumulator overflow interrupt to be serviced by the system controller.
13.6.4
Timer Overflow Interrupt (TOF)
This active high output will be asserted by the module to request a timer overflow interrupt to be serviced by the system controller.
MC9S12E128 Data Sheet, Rev. 1.07 438 Freescale Semiconductor
Chapter 14 Dual Output Voltage Regulator (VREG3V3V2)
14.1 Introduction
The VREG3V3V2 is a dual output voltage regulator providing two separate 2.5 V (typical) supplies differing in the amount of current that can be sourced. The regulator input voltage range is from 3.3 V up to 5 V (typical).
14.1.1
Features
The block VREG3V3V2 includes these distinctive features: * Two parallel, linear voltage regulators -- Bandgap reference * Low-voltage detect (LVD) with low-voltage interrupt (LVI) * Power-on reset (POR) * Low-voltage reset (LVR)
14.1.2
Modes of Operation
There are three modes VREG3V3V2 can operate in: * Full-performance mode (FPM) (MCU is not in stop mode) The regulator is active, providing the nominal supply voltage of 2.5 V with full current sourcing capability at both outputs. Features LVD (low-voltage detect), LVR (low-voltage reset), and POR (power-on reset) are available. * Reduced-power mode (RPM) (MCU is in stop mode) The purpose is to reduce power consumption of the device. The output voltage may degrade to a lower value than in full-performance mode, additionally the current sourcing capability is substantially reduced. Only the POR is available in this mode, LVD and LVR are disabled. * Shutdown mode Controlled by VREGEN (see device overview chapter for connectivity of VREGEN). This mode is characterized by minimum power consumption. The regulator outputs are in a high impedance state, only the POR feature is available, LVD and LVR are disabled. This mode must be used to disable the chip internal regulator VREG3V3V2, i.e., to bypass the VREG3V3V2 to use external supplies.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 439
Chapter 14 Dual Output Voltage Regulator (VREG3V3V2)
14.1.3
Block Diagram
Figure 14-1 shows the function principle of VREG3V3V2 by means of a block diagram. The regulator core REG consists of two parallel sub-blocks, REG1 and REG2, providing two independent output voltages.
REG2 VDDR VDDA REG
VDDPLL VSSPLL
REG1
VDD
LVD
LVR
LVR
POR
POR
VSSA
VSS
VREGEN
CTRL LVI
REG: Regulator Core LVD: Low Voltage Detect CTRL: Regulator Control LVR: Low Voltage Reset POR: Power-on Reset PIN
Figure 14-1. VREG3V3 Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 440 Freescale Semiconductor
Chapter 14 Dual Output Voltage Regulator (VREG3V3V2)
14.2
External Signal Description
Due to the nature of VREG3V3V2 being a voltage regulator providing the chip internal power supply voltages most signals are power supply signals connected to pads. Table 14-1 shows all signals of VREG3V3V2 associated with pins.
Table 14-1. VREG3V3V2 -- Signal Properties
Name VDDR VDDA VSSA VDD VSS VDDPLL VSSPLL VREGEN (optional) Port -- -- -- -- -- -- -- -- Function VREG3V3V2 power input (positive supply) VREG3V3V2 quiet input (positive supply) VREG3V3V2 quiet input (ground) VREG3V3V2 primary output (positive supply) VREG3V3V2 primary output (ground) VREG3V3V2 secondary output (positive supply) VREG3V3V2 secondary output (ground) VREG3V3V2 (Optional) Regulator Enable Reset State -- -- -- -- -- -- -- -- Pull Up -- -- -- -- -- -- -- --
NOTE Check device overview chapter for connectivity of the signals.
14.2.1
VDDR -- Regulator Power Input
Signal VDDR is the power input of VREG3V3V2. All currents sourced into the regulator loads flow through this pin. A chip external decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDR and VSSR can smoothen ripple on VDDR. For entering shutdown mode, pin VDDR should also be tied to ground on devices without a VREGEN pin.
14.2.2
VDDA, VSSA -- Regulator Reference Supply
Signals VDDA/VSSA which are supposed to be relatively quiet are used to supply the analog parts of the regulator. Internal precision reference circuits are supplied from these signals. A chip external decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDA and VSSA can further improve the quality of this supply.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 441
Chapter 14 Dual Output Voltage Regulator (VREG3V3V2)
14.2.3
VDD, VSS -- Regulator Output1 (Core Logic)
Signals VDD/VSS are the primary outputs of VREG3V3V2 that provide the power supply for the core logic. These signals are connected to device pins to allow external decoupling capacitors (100 nF...220 nF, X7R ceramic). In shutdown mode an external supply at VDD/VSS can replace the voltage regulator.
14.2.4
VDDPLL, VSSPLL -- Regulator Output2 (PLL)
Signals VDDPLL/VSSPLL are the secondary outputs of VREG3V3V2 that provide the power supply for the PLL and oscillator. These signals are connected to device pins to allow external decoupling capacitors (100 nF...220 nF, X7R ceramic). In shutdown mode an external supply at VDDPLL/VSSPLL can replace the voltage regulator.
14.2.5
VREGEN -- Optional Regulator Enable
This optional signal is used to shutdown VREG3V3V2. In that case VDD/VSS and VDDPLL/VSSPLL must be provided externally. shutdown mode is entered with VREGEN being low. If VREGEN is high, the VREG3V3V2 is either in full-performance mode or in reduced-power mode. For the connectivity of VREGEN see device overview chapter. NOTE Switching from FPM or RPM to shutdown of VREG3V3V2 and vice versa is not supported while the MCU is powered.
14.3
Memory Map and Register Definition
This subsection provides a detailed description of all registers accessible in VREG3V3V2.
14.3.1
Module Memory Map
Figure 14-2 provides an overview of all used registers.
Table 14-2. VREG3V3V2 Memory Map
Address Offset 0x0000 Use VREG3V3V2 Control Register (VREGCTRL) Access R/W
MC9S12E128 Data Sheet, Rev. 1.07 442 Freescale Semiconductor
Chapter 14 Dual Output Voltage Regulator (VREG3V3V2)
14.3.2
Register Descriptions
The following paragraphs describe, in address order, all the VREG3V3V2 registers and their individual bits.
14.3.2.1
VREG3V3V2 -- Control Register (VREGCTRL)
The VREGCTRL register allows to separately enable features of VREG3V3V2.
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
LVDS LVIE LVIF 0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-2. VREG3V3 -- Control Register (VREGCTRL) Table 14-3. MCCTL1 Field Descriptions
Field 2 LVDS 1 LVIE 0 LVIF Description Low-Voltage Detect Status Bit -- This read-only status bit reflects the input voltage. Writes have no effect. 0 Input voltage VDDA is above level VLVID or RPM or shutdown mode. 1 Input voltage VDDA is below level VLVIA and FPM. Low-Voltage Interrupt Enable Bit 0 Interrupt request is disabled. 1 Interrupt will be requested whenever LVIF is set. Low-Voltage Interrupt Flag -- LVIF is set to 1 when LVDS status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (LVIE = 1), LVIF causes an interrupt request. 0 No change in LVDS bit. 1 LVDS bit has changed.
NOTE On entering the reduced-power mode the LVIF is not cleared by the VREG3V3V2.
14.4
Functional Description
Block VREG3V3V2 is a voltage regulator as depicted in Figure 14-1. The regulator functional elements are the regulator core (REG), a low-voltage detect module (LVD), a power-on reset module (POR) and a low-voltage reset module (LVR). There is also the regulator control block (CTRL) which represents the interface to the digital core logic but also manages the operating modes of VREG3V3V2.
14.4.1
REG -- Regulator Core
VREG3V3V2, respectively its regulator core has two parallel, independent regulation loops (REG1 and REG2) that differ only in the amount of current that can be sourced to the connected loads. Therefore, only REG1 providing the supply at VDD/VSS is explained. The principle is also valid for REG2.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 443
Chapter 14 Dual Output Voltage Regulator (VREG3V3V2)
The regulator is a linear series regulator with a bandgap reference in its full-performance mode and a voltage clamp in reduced-power mode. All load currents flow from input VDDR to VSS or VSSPLL, the reference circuits are connected to VDDA and VSSA.
14.4.2
Full-Performance Mode
In full-performance mode, a fraction of the output voltage (VDD) and the bandgap reference voltage are fed to an operational amplifier. The amplified input voltage difference controls the gate of an output driver which basically is a large NMOS transistor connected to the output.
14.4.3
Reduced-Power Mode
In reduced-power mode, the driver gate is connected to a buffered fraction of the input voltage (VDDR). The operational amplifier and the bandgap are disabled to reduce power consumption.
14.4.4
LVD -- Low-Voltage Detect
sub-block LVD is responsible for generating the low-voltage interrupt (LVI). LVD monitors the input voltage (VDDA-VSSA) and continuously updates the status flag LVDS. Interrupt flag LVIF is set whenever status flag LVDS changes its value. The LVD is available in FPM and is inactive in reduced-power mode and shutdown mode.
14.4.5
POR -- Power-On Reset
This functional block monitors output VDD. If VDD is below VPORD, signal POR is high, if it exceeds VPORD, the signal goes low. The transition to low forces the CPU in the power-on sequence. Due to its role during chip power-up this module must be active in all operating modes of VREG3V3V2.
14.4.6
LVR -- Low-Voltage Reset
Block LVR monitors the primary output voltage VDD. If it drops below the assertion level (VLVRA) signal LVR asserts and when rising above the deassertion level (VLVRD) signal LVR negates again. The LVR function is available only in full-performance mode.
14.4.7
CTRL -- Regulator Control
This part contains the register block of VREG3V3V2 and further digital functionality needed to control the operating modes. CTRL also represents the interface to the digital core logic.
MC9S12E128 Data Sheet, Rev. 1.07 444 Freescale Semiconductor
Chapter 14 Dual Output Voltage Regulator (VREG3V3V2)
14.5
Resets
This subsection describes how VREG3V3V2 controls the reset of the MCU.The reset values of registers and signals are provided in Section 14.3, "Memory Map and Register Definition". Possible reset sources are listed in Table 14-4.
Table 14-4. VREG3V3V2 -- Reset Sources
Reset Source Power-on reset Low-voltage reset Always active Available only in full-performance mode Local Enable
14.5.1
Power-On Reset
During chip power-up the digital core may not work if its supply voltage VDD is below the POR deassertion level (VPORD). Therefore, signal POR which forces the other blocks of the device into reset is kept high until VDD exceeds VPORD. Then POR becomes low and the reset generator of the device continues the start-up sequence. The power-on reset is active in all operation modes of VREG3V3V2.
14.5.2
Low-Voltage Reset
For details on low-voltage reset see Section 14.4.6, "LVR -- Low-Voltage Reset".
14.6
Interrupts
This subsection describes all interrupts originated by VREG3V3V2. The interrupt vectors requested by VREG3V3V2 are listed in Table 14-5. Vector addresses and interrupt priorities are defined at MCU level.
Table 14-5. VREG3V3V2 -- Interrupt Vectors
Interrupt Source Low Voltage Interrupt (LVI) Local Enable LVIE = 1; Available only in full-performance mode
14.6.1
LVI -- Low-Voltage Interrupt
In FPM VREG3V3V2 monitors the input voltage VDDA. Whenever VDDA drops below level VLVIA the status bit LVDS is set to 1. Vice versa, LVDS is reset to 0 when VDDA rises above level VLVID. An interrupt, indicated by flag LVIF = 1, is triggered by any change of the status bit LVDS if interrupt enable bit LVIE = 1. NOTE On entering the reduced-power mode, the LVIF is not cleared by the VREG3V3V2.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 445
Chapter 14 Dual Output Voltage Regulator (VREG3V3V2)
MC9S12E128 Data Sheet, Rev. 1.07 446 Freescale Semiconductor
Chapter 15 Background Debug Module (BDMV4)
15.1 Introduction
This section describes the functionality of the background debug module (BDM) sub-block of the HCS12 core platform. A block diagram of the BDM is shown in Figure 15-1.
HOST SYSTEM BKGD 16-BIT SHIFT REGISTER
ADDRESS ENTAG BDMACT TRACE INSTRUCTION DECODE AND EXECUTION BUS INTERFACE AND CONTROL LOGIC DATA CLOCKS
SDV ENBDM
STANDARD BDM FIRMWARE LOOKUP TABLE
CLKSW
Figure 15-1. BDM Block Diagram
The background debug module (BDM) sub-block is a single-wire, background debug system implemented in on-chip hardware for minimal CPU intervention. All interfacing with the BDM is done via the BKGD pin. BDMV4 has enhanced capability for maintaining synchronization between the target and host while allowing more flexibility in clock rates. This includes a sync signal to show the clock rate and a handshake signal to indicate when an operation is complete. The system is backwards compatible with older external interfaces.
15.1.1
* * * * * *
Features
Single-wire communication with host development system BDMV4 (and BDM2): Enhanced capability for allowing more flexibility in clock rates BDMV4: SYNC command to determine communication rate BDMV4: GO_UNTIL command BDMV4: Hardware handshake protocol to increase the performance of the serial communication Active out of reset in special single-chip mode
MC9S12E128 Data Sheet, Rev. 1.07
Freescale Semiconductor
447
Chapter 15 Background Debug Module (BDMV4)
* * * * * * *
Nine hardware commands using free cycles, if available, for minimal CPU intervention Hardware commands not requiring active BDM 15 firmware commands execute from the standard BDM firmware lookup table Instruction tagging capability Software control of BDM operation during wait mode Software selectable clocks When secured, hardware commands are allowed to access the register space in special single-chip mode, if the FLASH and EEPROM erase tests fail.
15.1.2
Modes of Operation
BDM is available in all operating modes but must be enabled before firmware commands are executed. Some system peripherals may have a control bit which allows suspending the peripheral function during background debug mode.
15.1.2.1
Regular Run Modes
All of these operations refer to the part in run mode. The BDM does not provide controls to conserve power during run mode. * Normal operation General operation of the BDM is available and operates the same in all normal modes. * Special single-chip mode In special single-chip mode, background operation is enabled and active out of reset. This allows programming a system with blank memory. * Special peripheral mode BDM is enabled and active immediately out of reset. BDM can be disabled by clearing the BDMACT bit in the BDM status (BDMSTS) register. The BDM serial system should not be used in special peripheral mode. * Emulation modes General operation of the BDM is available and operates the same as in normal modes.
15.1.2.2
Secure Mode Operation
If the part is in secure mode, the operation of the BDM is reduced to a small subset of its regular run mode operation. Secure operation prevents access to FLASH or EEPROM other than allowing erasure.
15.2
External Signal Description
A single-wire interface pin is used to communicate with the BDM system. Two additional pins are used for instruction tagging. These pins are part of the multiplexed external bus interface (MEBI) sub-block and all interfacing between the MEBI and BDM is done within the core interface boundary. Functional descriptions of the pins are provided below for completeness.
MC9S12E128 Data Sheet, Rev. 1.07 448 Freescale Semiconductor
Chapter 15 Background Debug Module (BDMV4)
* * * * *
BKGD -- Background interface pin TAGHI -- High byte instruction tagging pin TAGLO -- Low byte instruction tagging pin BKGD and TAGHI share the same pin. TAGLO and LSTRB share the same pin. NOTE Generally these pins are shared as described, but it is best to check the device overview chapter to make certain. All MCUs at the time of this writing have followed this pin sharing scheme.
15.2.1
BKGD -- Background Interface Pin
Debugging control logic communicates with external devices serially via the single-wire background interface pin (BKGD). During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the background debug mode.
15.2.2
TAGHI -- High Byte Instruction Tagging Pin
This pin is used to tag the high byte of an instruction. When instruction tagging is on, a logic 0 at the falling edge of the external clock (ECLK) tags the high half of the instruction word being read into the instruction queue.
15.2.3
TAGLO -- Low Byte Instruction Tagging Pin
This pin is used to tag the low byte of an instruction. When instruction tagging is on and low strobe is enabled, a logic 0 at the falling edge of the external clock (ECLK) tags the low half of the instruction word being read into the instruction queue.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 449
Chapter 15 Background Debug Module (BDMV4)
15.3
Memory Map and Register Definition
A summary of the registers associated with the BDM is shown in Figure 15-2. Registers are accessed by host-driven communications to the BDM hardware using READ_BD and WRITE_BD commands. Detailed descriptions of the registers and associated bits are given in the subsections that follow.
15.3.1
Module Memory Map
Table 15-1. INT Memory Map
Register Address Reserved BDM Status Register (BDMSTS) Reserved BDM CCR Holding Register (BDMCCR) 7 8- BDM Internal Register Position (BDMINR) Reserved Use Access -- R/W -- R/W R --
MC9S12E128 Data Sheet, Rev. 1.07 450 Freescale Semiconductor
Chapter 15 Background Debug Module (BDMV4)
15.3.2
Register Name Reserved
Register Descriptions
Bit 7 R W R W R W R W R W R W R W R W R W R W R W R W X 6 X 5 X 4 X 3 X 2 X 1 0 Bit 0 0
BDMSTS
ENBDM X
BDMACT
ENTAG X
SDV
TRACE
CLKSW X
UNSEC
0
Reserved
X
X
X
X
X
Reserved
X
X
X
X
X
X
X
X
Reserved
X
X
X
X
X
X
X
X
Reserved
X
X
X
X
X
X
X
X
BDMCCR
CCR7 0
CCR6 REG14
CCR5 REG13
CCR4 REG12
CCR3 REG11
CCR2 0
CCR1 0
CCR0 0
BDMINR
Reserved
0
0
0
0
0
0
0
0
Reserved
0
0
0
0
0
0
0
0
Reserved
X
X
X
X
X
X
X
X
Reserved
X
X
X
X
X
X
X
X
= Unimplemented, Reserved X = Indeterminate 0
= Implemented (do not alter) = Always read zero
Figure 15-2. BDM Register Summary
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 451
Chapter 15 Background Debug Module (BDMV4)
15.3.2.1
BDM Status Register (BDMSTS)
7 6 5 4 3 2 1 0
R ENBDM W Reset: Special single-chip mode: Special peripheral mode: All other modes: 11 0 0 0
BDMACT ENTAG
SDV
TRACE CLKSW
UNSEC
0
1 1 1 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
02 0 0 0
0 0 0 0
= Unimplemented or Reserved
= Implemented (do not alter)
Figure 15-3. BDM Status Register (BDMSTS)
Note:
1
ENBDM is read as "1" by a debugging environment in Special single-chip mode when the device is not secured or secured but fully erased (Flash and EEPROM).This is because the ENBDM bit is set by the standard firmware before a BDM command can be fully transmitted and executed. UNSEC is read as "1" by a debugging environment in Special single-chip mode when the device is secured and fully erased, else it is "0" and can only be read if not secure (see also bit description).
2
Read: All modes through BDM operation Write: All modes but subject to the following: * BDMACT can only be set by BDM hardware upon entry into BDM. It can only be cleared by the standard BDM firmware lookup table upon exit from BDM active mode. * CLKSW can only be written via BDM hardware or standard BDM firmware write commands. * All other bits, while writable via BDM hardware or standard BDM firmware write commands, should only be altered by the BDM hardware or standard firmware lookup table as part of BDM command execution. * ENBDM should only be set via a BDM hardware command if the BDM firmware commands are needed. (This does not apply in special single-chip mode).
Table 15-2. BDMSTS Field Descriptions
Field 7 ENBDM Description Enable BDM -- This bit controls whether the BDM is enabled or disabled. When enabled, BDM can be made active to allow firmware commands to be executed. When disabled, BDM cannot be made active but BDM hardware commands are allowed. 0 BDM disabled 1 BDM enabled Note: ENBDM is set by the firmware immediately out of reset in special single-chip mode. In secure mode, this bit will not be set by the firmware until after the EEPROM and FLASH erase verify tests are complete. BDM Active Status -- This bit becomes set upon entering BDM. The standard BDM firmware lookup table is then enabled and put into the memory map. BDMACT is cleared by a carefully timed store instruction in the standard BDM firmware as part of the exit sequence to return to user code and remove the BDM memory from the map. 0 BDM not active 1 BDM active
6 BDMACT
MC9S12E128 Data Sheet, Rev. 1.07 452 Freescale Semiconductor
Chapter 15 Background Debug Module (BDMV4)
Table 15-2. BDMSTS Field Descriptions (continued)
Field 5 ENTAG Description Tagging Enable -- This bit indicates whether instruction tagging in enabled or disabled. It is set when the TAGGO command is executed and cleared when BDM is entered. The serial system is disabled and the tag function enabled 16 cycles after this bit is written. BDM cannot process serial commands while tagging is active. 0 Tagging not enabled or BDM active 1 Tagging enabled Shift Data Valid -- This bit is set and cleared by the BDM hardware. It is set after data has been transmitted as part of a firmware read command or after data has been received as part of a firmware write command. It is cleared when the next BDM command has been received or BDM is exited. SDV is used by the standard BDM firmware to control program flow execution. 0 Data phase of command not complete 1 Data phase of command is complete TRACE1 BDM Firmware Command is Being Executed -- This bit gets set when a BDM TRACE1 firmware command is first recognized. It will stay set as long as continuous back-to-back TRACE1 commands are executed. This bit will get cleared when the next command that is not a TRACE1 command is recognized. 0 TRACE1 command is not being executed 1 TRACE1 command is being executed Clock Switch -- The CLKSW bit controls which clock the BDM operates with. It is only writable from a hardware BDM command. A 150 cycle delay at the clock speed that is active during the data portion of the command will occur before the new clock source is guaranteed to be active. The start of the next BDM command uses the new clock for timing subsequent BDM communications. Table 15-3 shows the resulting BDM clock source based on the CLKSW and the PLLSEL (Pll select from the clock and reset generator) bits. Note: The BDM alternate clock source can only be selected when CLKSW = 0 and PLLSEL = 1. The BDM serial interface is now fully synchronized to the alternate clock source, when enabled. This eliminates frequency restriction on the alternate clock which was required on previous versions. Refer to the device overview section to determine which clock connects to the alternate clock source input. Note: If the acknowledge function is turned on, changing the CLKSW bit will cause the ACK to be at the new rate for the write command which changes it. Unsecure -- This bit is only writable in special single-chip mode from the BDM secure firmware and always gets reset to zero. It is in a zero state as secure mode is entered so that the secure BDM firmware lookup table is enabled and put into the memory map along with the standard BDM firmware lookup table. The secure BDM firmware lookup table verifies that the on-chip EEPROM and FLASH EEPROM are erased. This being the case, the UNSEC bit is set and the BDM program jumps to the start of the standard BDM firmware lookup table and the secure BDM firmware lookup table is turned off. If the erase test fails, the UNSEC bit will not be asserted. 0 System is in a secured mode 1 System is in a unsecured mode Note: When UNSEC is set, security is off and the user can change the state of the secure bits in the on-chip FLASH EEPROM. Note that if the user does not change the state of the bits to "unsecured" mode, the system will be secured again when it is next taken out of reset.
4 SDV
3 TRACE
2 CLKSW
1 UNSEC
Table 15-3. BDM Clock Sources
PLLSEL 0 0 CLKSW 0 1 Bus clock Bus clock BDMCLK
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 453
Chapter 15 Background Debug Module (BDMV4)
Table 15-3. BDM Clock Sources
PLLSEL 1 1 CLKSW 0 1 BDMCLK Alternate clock (refer to the device overview chapter to determine the alternate clock source) Bus clock dependent on the PLL
MC9S12E128 Data Sheet, Rev. 1.07 454 Freescale Semiconductor
Chapter 15 Background Debug Module (BDMV4)
15.3.2.2
BDM CCR Holding Register (BDMCCR)
7 6 5 4 3 2 1 0
R CCR7 W Reset 0 0 0 0 0 0 0 0 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0
Figure 15-4. BDM CCR Holding Register (BDMCCR)
Read: All modes Write: All modes NOTE When BDM is made active, the CPU stores the value of the CCR register in the BDMCCR register. However, out of special single-chip reset, the BDMCCR is set to 0xD8 and not 0xD0 which is the reset value of the CCR register. When entering background debug mode, the BDM CCR holding register is used to save the contents of the condition code register of the user's program. It is also used for temporary storage in the standard BDM firmware mode. The BDM CCR holding register can be written to modify the CCR value.
15.3.2.3
BDM Internal Register Position Register (BDMINR)
7 6 5 4 3 2 1 0
R W Reset
0
REG14
REG13
REG12
REG11
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-5. BDM Internal Register Position (BDMINR)
Read: All modes Write: Never
Table 15-4. BDMINR Field Descriptions
Field Description
6:3 Internal Register Map Position -- These four bits show the state of the upper five bits of the base address for REG[14:11] the system's relocatable register block. BDMINR is a shadow of the INITRG register which maps the register block to any 2K byte space within the first 32K bytes of the 64K byte address space.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 455
Chapter 15 Background Debug Module (BDMV4)
15.4
Functional Description
The BDM receives and executes commands from a host via a single wire serial interface. There are two types of BDM commands, namely, hardware commands and firmware commands. Hardware commands are used to read and write target system memory locations and to enter active background debug mode, see Section 15.4.3, "BDM Hardware Commands." Target system memory includes all memory that is accessible by the CPU. Firmware commands are used to read and write CPU resources and to exit from active background debug mode, see Section 15.4.4, "Standard BDM Firmware Commands." The CPU resources referred to are the accumulator (D), X index register (X), Y index register (Y), stack pointer (SP), and program counter (PC). Hardware commands can be executed at any time and in any mode excluding a few exceptions as highlighted, see Section 15.4.3, "BDM Hardware Commands." Firmware commands can only be executed when the system is in active background debug mode (BDM).
15.4.1
Security
If the user resets into special single-chip mode with the system secured, a secured mode BDM firmware lookup table is brought into the map overlapping a portion of the standard BDM firmware lookup table. The secure BDM firmware verifies that the on-chip EEPROM and FLASH EEPROM are erased. This being the case, the UNSEC bit will get set. The BDM program jumps to the start of the standard BDM firmware and the secured mode BDM firmware is turned off and all BDM commands are allowed. If the EEPROM or FLASH do not verify as erased, the BDM firmware sets the ENBDM bit, without asserting UNSEC, and the firmware enters a loop. This causes the BDM hardware commands to become enabled, but does not enable the firmware commands. This allows the BDM hardware to be used to erase the EEPROM and FLASH. After execution of the secure firmware, regardless of the results of the erase tests, the CPU registers, INITEE and PPAGE, will no longer be in their reset state.
15.4.2
Enabling and Activating BDM
The system must be in active BDM to execute standard BDM firmware commands. BDM can be activated only after being enabled. BDM is enabled by setting the ENBDM bit in the BDM status (BDMSTS) register. The ENBDM bit is set by writing to the BDM status (BDMSTS) register, via the single-wire interface, using a hardware command such as WRITE_BD_BYTE. After being enabled, BDM is activated by one of the following1: * Hardware BACKGROUND command * BDM external instruction tagging mechanism * CPU BGND instruction * Breakpoint sub-block's force or tag mechanism2 When BDM is activated, the CPU finishes executing the current instruction and then begins executing the firmware in the standard BDM firmware lookup table. When BDM is activated by the breakpoint
1. BDM is enabled and active immediately out of special single-chip reset. 2. This method is only available on systems that have a a breakpoint or a debug sub-block. MC9S12E128 Data Sheet, Rev. 1.07 456 Freescale Semiconductor
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sub-block, the type of breakpoint used determines if BDM becomes active before or after execution of the next instruction. NOTE If an attempt is made to activate BDM before being enabled, the CPU resumes normal instruction execution after a brief delay. If BDM is not enabled, any hardware BACKGROUND commands issued are ignored by the BDM and the CPU is not delayed. In active BDM, the BDM registers and standard BDM firmware lookup table are mapped to addresses 0xFF00 to 0xFFFF. BDM registers are mapped to addresses 0xFF00 to 0xFF07. The BDM uses these registers which are readable anytime by the BDM. However, these registers are not readable by user programs.
15.4.3
BDM Hardware Commands
Hardware commands are used to read and write target system memory locations and to enter active background debug mode. Target system memory includes all memory that is accessible by the CPU such as on-chip RAM, EEPROM, FLASH EEPROM, I/O and control registers, and all external memory. Hardware commands are executed with minimal or no CPU intervention and do not require the system to be in active BDM for execution, although they can continue to be executed in this mode. When executing a hardware command, the BDM sub-block waits for a free CPU bus cycle so that the background access does not disturb the running application program. If a free cycle is not found within 128 clock cycles, the CPU is momentarily frozen so that the BDM can steal a cycle. When the BDM finds a free cycle, the operation does not intrude on normal CPU operation provided that it can be completed in a single cycle. However, if an operation requires multiple cycles the CPU is frozen until the operation is complete, even though the BDM found a free cycle.
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The BDM hardware commands are listed in Table 15-5.
Table 15-5. Hardware Commands
Command BACKGROUND ACK_ENABLE ACK_DISABLE READ_BD_BYTE READ_BD_WORD READ_BYTE READ_WORD WRITE_BD_BYTE WRITE_BD_WORD WRITE_BYTE WRITE_WORD Opcode (hex) 90 D5 D6 E4 EC E0 E8 C4 CC C0 C8 Data None None None 16-bit address 16-bit data out 16-bit address 16-bit data out 16-bit address 16-bit data out 16-bit address 16-bit data out 16-bit address 16-bit data in 16-bit address 16-bit data in 16-bit address 16-bit data in 16-bit address 16-bit data in Description Enter background mode if firmware is enabled. If enabled, an ACK will be issued when the part enters active background mode. Enable handshake. Issues an ACK pulse after the command is executed. Disable handshake. This command does not issue an ACK pulse. Read from memory with standard BDM firmware lookup table in map. Odd address data on low byte; even address data on high byte. Read from memory with standard BDM firmware lookup table in map. Must be aligned access. Read from memory with standard BDM firmware lookup table out of map. Odd address data on low byte; even address data on high byte. Read from memory with standard BDM firmware lookup table out of map. Must be aligned access. Write to memory with standard BDM firmware lookup table in map. Odd address data on low byte; even address data on high byte. Write to memory with standard BDM firmware lookup table in map. Must be aligned access. Write to memory with standard BDM firmware lookup table out of map. Odd address data on low byte; even address data on high byte. Write to memory with standard BDM firmware lookup table out of map. Must be aligned access.
NOTE: If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is complete for all BDM WRITE commands.
The READ_BD and WRITE_BD commands allow access to the BDM register locations. These locations are not normally in the system memory map but share addresses with the application in memory. To distinguish between physical memory locations that share the same address, BDM memory resources are enabled just for the READ_BD and WRITE_BD access cycle. This allows the BDM to access BDM locations unobtrusively, even if the addresses conflict with the application memory map.
15.4.4
Standard BDM Firmware Commands
Firmware commands are used to access and manipulate CPU resources. The system must be in active BDM to execute standard BDM firmware commands, see Section 15.4.2, "Enabling and Activating BDM." Normal instruction execution is suspended while the CPU executes the firmware located in the standard BDM firmware lookup table. The hardware command BACKGROUND is the usual way to activate BDM. As the system enters active BDM, the standard BDM firmware lookup table and BDM registers become visible in the on-chip memory map at 0xFF00-0xFFFF, and the CPU begins executing the standard BDM
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firmware. The standard BDM firmware watches for serial commands and executes them as they are received. The firmware commands are shown in Table 15-6.
Table 15-6. Firmware Commands
Command1 READ_NEXT READ_PC READ_D READ_X READ_Y READ_SP WRITE_NEXT WRITE_PC WRITE_D WRITE_X WRITE_Y WRITE_SP GO GO_UNTIL2 TRACE1 TAGGO
1
Opcode (hex) 62 63 64 65 66 67 42 43 44 45 46 47 08 0C 10 18
Data 16-bit data out 16-bit data out 16-bit data out 16-bit data out 16-bit data out 16-bit data out 16-bit data in 16-bit data in 16-bit data in 16-bit data in 16-bit data in 16-bit data in None None None None
Description Increment X by 2 (X = X + 2), then read word X points to. Read program counter. Read D accumulator. Read X index register. Read Y index register. Read stack pointer. Increment X by 2 (X = X + 2), then write word to location pointed to by X. Write program counter. Write D accumulator. Write X index register. Write Y index register. Write stack pointer. Go to user program. If enabled, ACK will occur when leaving active background mode. Go to user program. If enabled, ACK will occur upon returning to active background mode. Execute one user instruction then return to active BDM. If enabled, ACK will occur upon returning to active background mode. Enable tagging and go to user program. There is no ACK pulse related to this command.
If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is complete for all BDM WRITE commands. 2 Both WAIT (with clocks to the S12 CPU core disabled) and STOP disable the ACK function. The GO_UNTIL command will not get an Acknowledge if one of these two CPU instructions occurs before the "UNTIL" instruction. This can be a problem for any instruction that uses ACK, but GO_UNTIL is a lot more difficult for the development tool to time-out.
15.4.5
BDM Command Structure
Hardware and firmware BDM commands start with an 8-bit opcode followed by a 16-bit address and/or a 16-bit data word depending on the command. All the read commands return 16 bits of data despite the byte or word implication in the command name. NOTE 8-bit reads return 16-bits of data, of which, only one byte will contain valid data. If reading an even address, the valid data will appear in the MSB. If reading an odd address, the valid data will appear in the LSB.
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NOTE 16-bit misaligned reads and writes are not allowed. If attempted, the BDM will ignore the least significant bit of the address and will assume an even address from the remaining bits. For hardware data read commands, the external host must wait 150 bus clock cycles after sending the address before attempting to obtain the read data. This is to be certain that valid data is available in the BDM shift register, ready to be shifted out. For hardware write commands, the external host must wait 150 bus clock cycles after sending the data to be written before attempting to send a new command. This is to avoid disturbing the BDM shift register before the write has been completed. The 150 bus clock cycle delay in both cases includes the maximum 128 cycle delay that can be incurred as the BDM waits for a free cycle before stealing a cycle. For firmware read commands, the external host should wait 44 bus clock cycles after sending the command opcode and before attempting to obtain the read data. This includes the potential of an extra 7 cycles when the access is external with a narrow bus access (+1 cycle) and / or a stretch (+1, 2, or 3 cycles), (7 cycles could be needed if both occur). The 44 cycle wait allows enough time for the requested data to be made available in the BDM shift register, ready to be shifted out. NOTE This timing has increased from previous BDM modules due to the new capability in which the BDM serial interface can potentially run faster than the bus. On previous BDM modules this extra time could be hidden within the serial time. For firmware write commands, the external host must wait 32 bus clock cycles after sending the data to be written before attempting to send a new command. This is to avoid disturbing the BDM shift register before the write has been completed. The external host should wait 64 bus clock cycles after a TRACE1 or GO command before starting any new serial command. This is to allow the CPU to exit gracefully from the standard BDM firmware lookup table and resume execution of the user code. Disturbing the BDM shift register prematurely may adversely affect the exit from the standard BDM firmware lookup table. NOTE If the bus rate of the target processor is unknown or could be changing, it is recommended that the ACK (acknowledge function) be used to indicate when an operation is complete. When using ACK, the delay times are automated. Figure 15-6 represents the BDM command structure. The command blocks illustrate a series of eight bit times starting with a falling edge. The bar across the top of the blocks indicates that the BKGD line idles in the high state. The time for an 8-bit command is 8 x 16 target clock cycles.1
1. Target clock cycles are cycles measured using the target MCU's serial clock rate. See Section 15.4.6, "BDM Serial Interface," and Section 15.3.2.1, "BDM Status Register (BDMSTS)," for information on how serial clock rate is selected. MC9S12E128 Data Sheet, Rev. 1.07 460 Freescale Semiconductor
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8 BITS AT 16 TC/BIT HARDWARE READ COMMAND
16 BITS AT 16 TC/BIT ADDRESS
150-BC DELAY
16 BITS AT 16 TC/BIT DATA 150-BC DELAY NEXT COMMAND
HARDWARE WRITE
COMMAND 44-BC DELAY
ADDRESS
DATA
NEXT COMMAND
FIRMWARE READ
COMMAND
DATA 32-BC DELAY
NEXT COMMAND
FIRMWARE WRITE
COMMAND 64-BC DELAY
DATA
NEXT COMMAND
GO, TRACE
COMMAND
NEXT COMMAND
BC = BUS CLOCK CYCLES TC = TARGET CLOCK CYCLES
Figure 15-6. BDM Command Structure
15.4.6
BDM Serial Interface
The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the BDM. The BDM serial interface is timed using the clock selected by the CLKSW bit in the status register see Section 15.3.2.1, "BDM Status Register (BDMSTS)." This clock will be referred to as the target clock in the following explanation. The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is transmitted or received. Data is transferred most significant bit (MSB) first at 16 target clock cycles per bit. The interface times out if 512 clock cycles occur between falling edges from the host. The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all times. It is assumed that there is an external pull-up and that drivers connected to BKGD do not typically drive the high level. Because R-C rise time could be unacceptably long, the target system and host provide brief driven-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host for transmit cases and the target for receive cases. The timing for host-to-target is shown in Figure 15-7 and that of target-to-host in Figure 15-8 and Figure 15-9. All four cases begin when the host drives the BKGD pin low to generate a falling edge. Because the host and target are operating from separate clocks, it can take the target system up to one full clock cycle to recognize this edge. The target measures delays from this perceived start of the bit time while the host measures delays from the point it actually drove BKGD low to start the bit up to one target
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clock cycle earlier. Synchronization between the host and target is established in this manner at the start of every bit time. Figure 15-7 shows an external host transmitting a logic 1 and transmitting a logic 0 to the BKGD pin of a target system. The host is asynchronous to the target, so there is up to a one clock-cycle delay from the host-generated falling edge to where the target recognizes this edge as the beginning of the bit time. Ten target clock cycles later, the target senses the bit level on the BKGD pin. Internal glitch detect logic requires the pin be driven high no later that eight target clock cycles after the falling edge for a logic 1 transmission. Because the host drives the high speedup pulses in these two cases, the rising edges look like digitally driven signals.
CLOCK TARGET SYSTEM
HOST TRANSMIT 1
HOST TRANSMIT 0 PERCEIVED START OF BIT TIME 10 CYCLES SYNCHRONIZATION UNCERTAINTY TARGET SENSES BIT EARLIEST START OF NEXT BIT
Figure 15-7. BDM Host-to-Target Serial Bit Timing
The receive cases are more complicated. Figure 15-8 shows the host receiving a logic 1 from the target system. Because the host is asynchronous to the target, there is up to one clock-cycle delay from the host-generated falling edge on BKGD to the perceived start of the bit time in the target. The host holds the BKGD pin low long enough for the target to recognize it (at least two target clock cycles). The host must release the low drive before the target drives a brief high speedup pulse seven target clock cycles after the perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it started the bit time.
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CLOCK TARGET SYSTEM
HOST DRIVE TO BKGD PIN TARGET SYSTEM SPEEDUP PULSE PERCEIVED START OF BIT TIME R-C RISE BKGD PIN
HIGH-IMPEDANCE
HIGH-IMPEDANCE
HIGH-IMPEDANCE
10 CYCLES 10 CYCLES EARLIEST START OF NEXT BIT
HOST SAMPLES BKGD PIN
Figure 15-8. BDM Target-to-Host Serial Bit Timing (Logic 1)
Figure 15-9 shows the host receiving a logic 0 from the target. Because the host is asynchronous to the target, there is up to a one clock-cycle delay from the host-generated falling edge on BKGD to the start of the bit time as perceived by the target. The host initiates the bit time but the target finishes it. Because the target wants the host to receive a logic 0, it drives the BKGD pin low for 13 target clock cycles then briefly drives it high to speed up the rising edge. The host samples the bit level about 10 target clock cycles after starting the bit time.
CLOCK TARGET SYS.
HOST DRIVE TO BKGD PIN TARGET SYS. DRIVE AND SPEEDUP PULSE PERCEIVED START OF BIT TIME BKGD PIN
HIGH-IMPEDANCE SPEEDUP PULSE
10 CYCLES 10 CYCLES EARLIEST START OF NEXT BIT
HOST SAMPLES BKGD PIN
Figure 15-9. BDM Target-to-Host Serial Bit Timing (Logic 0)
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15.4.7
Serial Interface Hardware Handshake Protocol
BDM commands that require CPU execution are ultimately treated at the MCU bus rate. Because the BDM clock source can be asynchronously related to the bus frequency, when CLKSW = 0, it is very helpful to provide a handshake protocol in which the host could determine when an issued command is executed by the CPU. The alternative is to always wait the amount of time equal to the appropriate number of cycles at the slowest possible rate the clock could be running. This sub-section will describe the hardware handshake protocol. The hardware handshake protocol signals to the host controller when an issued command was successfully executed by the target. This protocol is implemented by a 16 serial clock cycle low pulse followed by a brief speedup pulse in the BKGD pin. This pulse is generated by the target MCU when a command, issued by the host, has been successfully executed (see Figure 15-10). This pulse is referred to as the ACK pulse. After the ACK pulse has finished: the host can start the bit retrieval if the last issued command was a read command, or start a new command if the last command was a write command or a control command (BACKGROUND, GO, GO_UNTIL, or TRACE1). The ACK pulse is not issued earlier than 32 serial clock cycles after the BDM command was issued. The end of the BDM command is assumed to be the 16th tick of the last bit. This minimum delay assures enough time for the host to perceive the ACK pulse. Note also that, there is no upper limit for the delay between the command and the related ACK pulse, because the command execution depends upon the CPU bus frequency, which in some cases could be very slow compared to the serial communication rate. This protocol allows a great flexibility for the POD designers, because it does not rely on any accurate time measurement or short response time to any event in the serial communication.
BDM CLOCK (TARGET MCU)
16 CYCLES TARGET TRANSMITS ACK PULSE HIGH-IMPEDANCE 32 CYCLES SPEEDUP PULSE MINIMUM DELAY FROM THE BDM COMMAND BKGD PIN EARLIEST START OF NEXT BIT HIGH-IMPEDANCE
16th TICK OF THE LAST COMMAD BIT
Figure 15-10. Target Acknowledge Pulse (ACK)
NOTE If the ACK pulse was issued by the target, the host assumes the previous command was executed. If the CPU enters WAIT or STOP prior to executing a hardware command, the ACK pulse will not be issued meaning that the BDM command was not executed. After entering wait or stop mode, the BDM command is no longer pending.
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Figure 15-11 shows the ACK handshake protocol in a command level timing diagram. The READ_BYTE instruction is used as an example. First, the 8-bit instruction opcode is sent by the host, followed by the address of the memory location to be read. The target BDM decodes the instruction. A bus cycle is grabbed (free or stolen) by the BDM and it executes the READ_BYTE operation. Having retrieved the data, the BDM issues an ACK pulse to the host controller, indicating that the addressed byte is ready to be retrieved. After detecting the ACK pulse, the host initiates the byte retrieval process. Note that data is sent in the form of a word and the host needs to determine which is the appropriate byte based on whether the address was odd or even.
TARGET HOST NEW BDM COMMAND HOST BDM ISSUES THE ACK PULSE (OUT OF SCALE) BDM EXECUTES THE READ_BYTE COMMAND TARGET
BKGD PIN
READ_BYTE HOST
BYTE ADDRESS TARGET
(2) BYTES ARE RETRIEVED
BDM DECODES THE COMMAND
Figure 15-11. Handshake Protocol at Command Level
Differently from the normal bit transfer (where the host initiates the transmission), the serial interface ACK handshake pulse is initiated by the target MCU by issuing a falling edge in the BKGD pin. The hardware handshake protocol in Figure 15-10 specifies the timing when the BKGD pin is being driven, so the host should follow this timing constraint in order to avoid the risk of an electrical conflict in the BKGD pin. NOTE The only place the BKGD pin can have an electrical conflict is when one side is driving low and the other side is issuing a speedup pulse (high). Other "highs" are pulled rather than driven. However, at low rates the time of the speedup pulse can become lengthy and so the potential conflict time becomes longer as well. The ACK handshake protocol does not support nested ACK pulses. If a BDM command is not acknowledge by an ACK pulse, the host needs to abort the pending command first in order to be able to issue a new BDM command. When the CPU enters WAIT or STOP while the host issues a command that requires CPU execution (e.g., WRITE_BYTE), the target discards the incoming command due to the WAIT or STOP being detected. Therefore, the command is not acknowledged by the target, which means that the ACK pulse will not be issued in this case. After a certain time the host should decide to abort the ACK sequence in order to be free to issue a new command. Therefore, the protocol should provide a mechanism in which a command, and therefore a pending ACK, could be aborted. NOTE Differently from a regular BDM command, the ACK pulse does not provide a time out. This means that in the case of a WAIT or STOP instruction being executed, the ACK would be prevented from being issued. If not aborted, the ACK would remain pending indefinitely. See the handshake abort procedure described in Section 15.4.8, "Hardware Handshake Abort Procedure."
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15.4.8
Hardware Handshake Abort Procedure
The abort procedure is based on the SYNC command. In order to abort a command, which had not issued the corresponding ACK pulse, the host controller should generate a low pulse in the BKGD pin by driving it low for at least 128 serial clock cycles and then driving it high for one serial clock cycle, providing a speedup pulse. By detecting this long low pulse in the BKGD pin, the target executes the SYNC protocol, see Section 15.4.9, "SYNC -- Request Timed Reference Pulse," and assumes that the pending command and therefore the related ACK pulse, are being aborted. Therefore, after the SYNC protocol has been completed the host is free to issue new BDM commands. Although it is not recommended, the host could abort a pending BDM command by issuing a low pulse in the BKGD pin shorter than 128 serial clock cycles, which will not be interpreted as the SYNC command. The ACK is actually aborted when a falling edge is perceived by the target in the BKGD pin. The short abort pulse should have at least 4 clock cycles keeping the BKGD pin low, in order to allow the falling edge to be detected by the target. In this case, the target will not execute the SYNC protocol but the pending command will be aborted along with the ACK pulse. The potential problem with this abort procedure is when there is a conflict between the ACK pulse and the short abort pulse. In this case, the target may not perceive the abort pulse. The worst case is when the pending command is a read command (i.e., READ_BYTE). If the abort pulse is not perceived by the target the host will attempt to send a new command after the abort pulse was issued, while the target expects the host to retrieve the accessed memory byte. In this case, host and target will run out of synchronism. However, if the command to be aborted is not a read command the short abort pulse could be used. After a command is aborted the target assumes the next falling edge, after the abort pulse, is the first bit of a new BDM command. NOTE The details about the short abort pulse are being provided only as a reference for the reader to better understand the BDM internal behavior. It is not recommended that this procedure be used in a real application. Because the host knows the target serial clock frequency, the SYNC command (used to abort a command) does not need to consider the lower possible target frequency. In this case, the host could issue a SYNC very close to the 128 serial clock cycles length. Providing a small overhead on the pulse length in order to assure the SYNC pulse will not be misinterpreted by the target. See Section 15.4.9, "SYNC -- Request Timed Reference Pulse." Figure 15-12 shows a SYNC command being issued after a READ_BYTE, which aborts the READ_BYTE command. Note that, after the command is aborted a new command could be issued by the host computer. NOTE Figure 15-12 does not represent the signals in a true timing scale
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READ_BYTE CMD IS ABORTED BY THE SYNC REQUEST (OUT OF SCALE)
SYNC RESPONSE FROM THE TARGET (OUT OF SCALE)
BKGD PIN
READ_BYTE HOST
MEMORY ADDRESS TARGET
READ_STATUS HOST TARGET
NEW BDM COMMAND HOST TARGET
BDM DECODE AND STARTS TO EXECUTES THE READ_BYTE CMD
NEW BDM COMMAND
Figure 15-12. ACK Abort Procedure at the Command Level
Figure 15-13 shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could occur if a POD device is connected to the target BKGD pin and the target is already in debug active mode. Consider that the target CPU is executing a pending BDM command at the exact moment the POD is being connected to the BKGD pin. In this case, an ACK pulse is issued along with the SYNC command. In this case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. Because this is not a probable situation, the protocol does not prevent this conflict from happening.
AT LEAST 128 CYCLES BDM CLOCK (TARGET MCU) ACK PULSE TARGET MCU DRIVES TO BKGD PIN HOST DRIVES SYNC TO BKGD PIN HOST AND TARGET DRIVE TO BKGD PIN HOST SYNC REQUEST PULSE BKGD PIN HIGH-IMPEDANCE ELECTRICAL CONFLICT
SPEEDUP PULSE
16 CYCLES
Figure 15-13. ACK Pulse and SYNC Request Conflict
NOTE This information is being provided so that the MCU integrator will be aware that such a conflict could eventually occur. The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE BDM commands. This provides backwards compatibility with the existing POD devices which are not able to execute the hardware handshake protocol. It also allows for new POD devices, that support the hardware handshake protocol, to freely communicate with the target device. If desired, without the need for waiting for the ACK pulse.
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The commands are described as follows: * ACK_ENABLE -- enables the hardware handshake protocol. The target will issue the ACK pulse when a CPU command is executed by the CPU. The ACK_ENABLE command itself also has the ACK pulse as a response. * ACK_DISABLE -- disables the ACK pulse protocol. In this case, the host needs to use the worst case delay time at the appropriate places in the protocol. The default state of the BDM after reset is hardware handshake protocol disabled. All the read commands will ACK (if enabled) when the data bus cycle has completed and the data is then ready for reading out by the BKGD serial pin. All the write commands will ACK (if enabled) after the data has been received by the BDM through the BKGD serial pin and when the data bus cycle is complete. See Section 15.4.3, "BDM Hardware Commands," and Section 15.4.4, "Standard BDM Firmware Commands," for more information on the BDM commands. The ACK_ENABLE sends an ACK pulse when the command has been completed. This feature could be used by the host to evaluate if the target supports the hardware handshake protocol. If an ACK pulse is issued in response to this command, the host knows that the target supports the hardware handshake protocol. If the target does not support the hardware handshake protocol the ACK pulse is not issued. In this case, the ACK_ENABLE command is ignored by the target because it is not recognized as a valid command. The BACKGROUND command will issue an ACK pulse when the CPU changes from normal to background mode. The ACK pulse related to this command could be aborted using the SYNC command. The GO command will issue an ACK pulse when the CPU exits from background mode. The ACK pulse related to this command could be aborted using the SYNC command. The GO_UNTIL command is equivalent to a GO command with exception that the ACK pulse, in this case, is issued when the CPU enters into background mode. This command is an alternative to the GO command and should be used when the host wants to trace if a breakpoint match occurs and causes the CPU to enter active background mode. Note that the ACK is issued whenever the CPU enters BDM, which could be caused by a breakpoint match or by a BGND instruction being executed. The ACK pulse related to this command could be aborted using the SYNC command. The TRACE1 command has the related ACK pulse issued when the CPU enters background active mode after one instruction of the application program is executed. The ACK pulse related to this command could be aborted using the SYNC command. The TAGGO command will not issue an ACK pulse because this would interfere with the tagging function shared on the same pin.
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15.4.9
SYNC -- Request Timed Reference Pulse
The SYNC command is unlike other BDM commands because the host does not necessarily know the correct communication speed to use for BDM communications until after it has analyzed the response to the SYNC command. To issue a SYNC command, the host should perform the following steps: 1. Drive the BKGD pin low for at least 128 cycles at the lowest possible BDM serial communication frequency (the lowest serial communication frequency is determined by the crystal oscillator or the clock chosen by CLKSW.) 2. Drive BKGD high for a brief speedup pulse to get a fast rise time (this speedup pulse is typically one cycle of the host clock.) 3. Remove all drive to the BKGD pin so it reverts to high impedance. 4. Listen to the BKGD pin for the sync response pulse. Upon detecting the SYNC request from the host, the target performs the following steps: 1. Discards any incomplete command received or bit retrieved. 2. Waits for BKGD to return to a logic 1. 3. Delays 16 cycles to allow the host to stop driving the high speedup pulse. 4. Drives BKGD low for 128 cycles at the current BDM serial communication frequency. 5. Drives a one-cycle high speedup pulse to force a fast rise time on BKGD. 6. Removes all drive to the BKGD pin so it reverts to high impedance. The host measures the low time of this 128 cycle SYNC response pulse and determines the correct speed for subsequent BDM communications. Typically, the host can determine the correct communication speed within a few percent of the actual target speed and the communication protocol can easily tolerate speed errors of several percent. As soon as the SYNC request is detected by the target, any partially received command or bit retrieved is discarded. This is referred to as a soft-reset, equivalent to a time-out in the serial communication. After the SYNC response, the target will consider the next falling edge (issued by the host) as the start of a new BDM command or the start of new SYNC request. Another use of the SYNC command pulse is to abort a pending ACK pulse. The behavior is exactly the same as in a regular SYNC command. Note that one of the possible causes for a command to not be acknowledged by the target is a host-target synchronization problem. In this case, the command may not have been understood by the target and so an ACK response pulse will not be issued.
15.4.10 Instruction Tracing
When a TRACE1 command is issued to the BDM in active BDM, the CPU exits the standard BDM firmware and executes a single instruction in the user code. As soon as this has occurred, the CPU is forced to return to the standard BDM firmware and the BDM is active and ready to receive a new command. If the TRACE1 command is issued again, the next user instruction will be executed. This facilitates stepping or tracing through the user code one instruction at a time.
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If an interrupt is pending when a TRACE1 command is issued, the interrupt stacking operation occurs but no user instruction is executed. Upon return to standard BDM firmware execution, the program counter points to the first instruction in the interrupt service routine.
15.4.11 Instruction Tagging
The instruction queue and cycle-by-cycle CPU activity are reconstructible in real time or from trace history that is captured by a logic analyzer. However, the reconstructed queue cannot be used to stop the CPU at a specific instruction. This is because execution already has begun by the time an operation is visible outside the system. A separate instruction tagging mechanism is provided for this purpose. The tag follows program information as it advances through the instruction queue. When a tagged instruction reaches the head of the queue, the CPU enters active BDM rather than executing the instruction. NOTE Tagging is disabled when BDM becomes active and BDM serial commands are not processed while tagging is active. Executing the BDM TAGGO command configures two system pins for tagging. The TAGLO signal shares a pin with the LSTRB signal, and the TAGHI signal shares a pin with the BKGD signal. Table 15-7 shows the functions of the two tagging pins. The pins operate independently, that is the state of one pin does not affect the function of the other. The presence of logic level 0 on either pin at the fall of the external clock (ECLK) performs the indicated function. High tagging is allowed in all modes. Low tagging is allowed only when low strobe is enabled (LSTRB is allowed only in wide expanded modes and emulation expanded narrow mode).
Table 15-7. Tag Pin Function
TAGHI 1 1 0 0 TAGLO 1 0 1 0 Tag No tag Low byte High byte Both bytes
15.4.12 Serial Communication Time-Out
The host initiates a host-to-target serial transmission by generating a falling edge on the BKGD pin. If BKGD is kept low for more than 128 target clock cycles, the target understands that a SYNC command was issued. In this case, the target will keep waiting for a rising edge on BKGD in order to answer the SYNC request pulse. If the rising edge is not detected, the target will keep waiting forever without any time-out limit. Consider now the case where the host returns BKGD to logic one before 128 cycles. This is interpreted as a valid bit transmission, and not as a SYNC request. The target will keep waiting for another falling edge marking the start of a new bit. If, however, a new falling edge is not detected by the target within 512 clock cycles since the last falling edge, a time-out occurs and the current command is discarded without affecting memory or the operating mode of the MCU. This is referred to as a soft-reset.
MC9S12E128 Data Sheet, Rev. 1.07 470 Freescale Semiconductor
Chapter 15 Background Debug Module (BDMV4)
If a read command is issued but the data is not retrieved within 512 serial clock cycles, a soft-reset will occur causing the command to be disregarded. The data is not available for retrieval after the time-out has occurred. This is the expected behavior if the handshake protocol is not enabled. However, consider the behavior where the BDC is running in a frequency much greater than the CPU frequency. In this case, the command could time out before the data is ready to be retrieved. In order to allow the data to be retrieved even with a large clock frequency mismatch (between BDC and CPU) when the hardware handshake protocol is enabled, the time out between a read command and the data retrieval is disabled. Therefore, the host could wait for more then 512 serial clock cycles and continue to be able to retrieve the data from an issued read command. However, as soon as the handshake pulse (ACK pulse) is issued, the time-out feature is re-activated, meaning that the target will time out after 512 clock cycles. Therefore, the host needs to retrieve the data within a 512 serial clock cycles time frame after the ACK pulse had been issued. After that period, the read command is discarded and the data is no longer available for retrieval. Any falling edge of the BKGD pin after the time-out period is considered to be a new command or a SYNC request. Note that whenever a partially issued command, or partially retrieved data, has occurred the time out in the serial communication is active. This means that if a time frame higher than 512 serial clock cycles is observed between two consecutive negative edges and the command being issued or data being retrieved is not complete, a soft-reset will occur causing the partially received command or data retrieved to be disregarded. The next falling edge of the BKGD pin, after a soft-reset has occurred, is considered by the target as the start of a new BDM command, or the start of a SYNC request pulse.
15.4.13 Operation in Wait Mode
The BDM cannot be used in wait mode if the system disables the clocks to the BDM. There is a clearing mechanism associated with the WAIT instruction when the clocks to the BDM (CPU core platform) are disabled. As the clocks restart from wait mode, the BDM receives a soft reset (clearing any command in progress) and the ACK function will be disabled. This is a change from previous BDM modules.
15.4.14 Operation in Stop Mode
The BDM is completely shutdown in stop mode. There is a clearing mechanism associated with the STOP instruction. STOP must be enabled and the part must go into stop mode for this to occur. As the clocks restart from stop mode, the BDM receives a soft reset (clearing any command in progress) and the ACK function will be disabled. This is a change from previous BDM modules.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 471
Chapter 15 Background Debug Module (BDMV4)
MC9S12E128 Data Sheet, Rev. 1.07 472 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
16.1 Introduction
This section describes the functionality of the debug (DBG) sub-block of the HCS12 core platform. The DBG module is designed to be fully compatible with the existing BKP_HCS12_A module (BKP mode) and furthermore provides an on-chip trace buffer with flexible triggering capability (DBG mode). The DBG module provides for non-intrusive debug of application software. The DBG module is optimized for the HCS12 16-bit architecture.
16.1.1
Features
The DBG module in BKP mode includes these distinctive features: * Full or dual breakpoint mode -- Compare on address and data (full) -- Compare on either of two addresses (dual) * BDM or SWI breakpoint -- Enter BDM on breakpoint (BDM) -- Execute SWI on breakpoint (SWI) * Tagged or forced breakpoint -- Break just before a specific instruction will begin execution (TAG) -- Break on the first instruction boundary after a match occurs (Force) * Single, range, or page address compares -- Compare on address (single) -- Compare on address 256 byte (range) -- Compare on any 16K page (page) * At forced breakpoints compare address on read or write * High and/or low byte data compares * Comparator C can provide an additional tag or force breakpoint (enhancement for BKP mode)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 473
Chapter 16 Debug Module (DBGV1)
The DBG in DBG mode includes these distinctive features: * Three comparators (A, B, and C) -- Dual mode, comparators A and B used to compare addresses -- Full mode, comparator A compares address and comparator B compares data -- Can be used as trigger and/or breakpoint -- Comparator C used in LOOP1 capture mode or as additional breakpoint * Four capture modes -- Normal mode, change-of-flow information is captured based on trigger specification -- Loop1 mode, comparator C is dynamically updated to prevent redundant change-of-flow storage. -- Detail mode, address and data for all cycles except program fetch (P) and free (f) cycles are stored in trace buffer -- Profile mode, last instruction address executed by CPU is returned when trace buffer address is read * Two types of breakpoint or debug triggers -- Break just before a specific instruction will begin execution (tag) -- Break on the first instruction boundary after a match occurs (force) * BDM or SWI breakpoint -- Enter BDM on breakpoint (BDM) -- Execute SWI on breakpoint (SWI) * Nine trigger modes for comparators A and B --A -- A or B -- A then B -- A and B, where B is data (full mode) -- A and not B, where B is data (full mode) -- Event only B, store data -- A then event only B, store data -- Inside range, A address B -- Outside range, address < or address > B * Comparator C provides an additional tag or force breakpoint when capture mode is not configured in LOOP1 mode. * Sixty-four word (16 bits wide) trace buffer for storing change-of-flow information, event only data and other bus information. -- Source address of taken conditional branches (long, short, bit-conditional, and loop constructs) -- Destination address of indexed JMP, JSR, and CALL instruction. -- Destination address of RTI, RTS, and RTC instructions -- Vector address of interrupts, except for SWI and BDM vectors
MC9S12E128 Data Sheet, Rev. 1.07 474 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
-- -- -- --
Data associated with event B trigger modes Detail report mode stores address and data for all cycles except program (P) and free (f) cycles Current instruction address when in profiling mode BGND is not considered a change-of-flow (cof) by the debugger
16.1.2
Modes of Operation
There are two main modes of operation: breakpoint mode and debug mode. Each one is mutually exclusive of the other and selected via a software programmable control bit. In the breakpoint mode there are two sub-modes of operation: * Dual address mode, where a match on either of two addresses will cause the system to enter background debug mode (BDM) or initiate a software interrupt (SWI). * Full breakpoint mode, where a match on address and data will cause the system to enter background debug mode (BDM) or initiate a software interrupt (SWI). In debug mode, there are several sub-modes of operation. * Trigger modes There are many ways to create a logical trigger. The trigger can be used to capture bus information either starting from the trigger or ending at the trigger. Types of triggers (A and B are registers): -- A only -- A or B -- A then B -- Event only B (data capture) -- A then event only B (data capture) -- A and B, full mode -- A and not B, full mode -- Inside range -- Outside range * Capture modes There are several capture modes. These determine which bus information is saved and which is ignored. -- Normal: save change-of-flow program fetches -- Loop1: save change-of-flow program fetches, ignoring duplicates -- Detail: save all bus operations except program and free cycles -- Profile: poll target from external device
16.1.3
Block Diagram
Figure 16-1 is a block diagram of this module in breakpoint mode. Figure 16-2 is a block diagram of this module in debug mode.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 475
Chapter 16 Debug Module (DBGV1) CLOCKS AND CONTROL SIGNALS CONTROL BLOCK BREAKPOINT MODES AND GENERATION OF SWI, FORCE BDM, AND TAGS CONTROL SIGNALS RESULTS SIGNALS CONTROL BITS READ/WRITE CONTROL BKP CONTROL SIGNALS
......
......
EXPANSION ADDRESS ADDRESS WRITE DATA READ DATA
REGISTER BLOCK BKPCT0
BKPCT1 COMPARE BLOCK BKP READ DATA BUS WRITE DATA BUS BKP0X COMPARATOR EXPANSION ADDRESSES
BKP0H
COMPARATOR
ADDRESS HIGH
ADDRESS LOW BKP0L COMPARATOR EXPANSION ADDRESSES BKP1X COMPARATOR DATA HIGH BKP1H COMPARATOR DATA/ADDRESS HIGH MUX DATA/ADDRESS LOW MUX READ DATA HIGH COMPARATOR READ DATA LOW COMPARATOR ADDRESS HIGH DATA LOW ADDRESS LOW
BKP1L
COMPARATOR
Figure 16-1. DBG Block Diagram in BKP Mode
MC9S12E128 Data Sheet, Rev. 1.07 476 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
DBG READ DATA BUS ADDRESS BUS CONTROL WRITE DATA BUS READ DATA BUS READ/WRITE DBG MODE ENABLE CHANGE-OF-FLOW INDICATORS MCU IN BDM DETAIL EVENT ONLY CPU PROGRAM COUNTER STORE POINTER INSTRUCTION LAST CYCLE REGISTER BUS CLOCK M U X 64 x 16 BIT WORD TRACE BUFFER PROFILE CAPTURE MODE TRACE BUFFER OR PROFILING DATA ADDRESS/DATA/CONTROL REGISTERS COMPARATOR A COMPARATOR B COMPARATOR C CONTROL MATCH_A MATCH_B MATCH_C LOOP1 TRACER BUFFER CONTROL LOGIC
TAG FORCE
M U X
WRITE DATA BUS READ DATA BUS
M U X
M U X
LAST INSTRUCTION ADDRESS
PROFILE CAPTURE REGISTER
READ/WRITE
Figure 16-2. DBG Block Diagram in DBG Mode
16.2
External Signal Description
The DBG sub-module relies on the external bus interface (generally the MEBI) when the DBG is matching on the external bus. The tag pins in Table 16-1 (part of the MEBI) may also be a part of the breakpoint operation.
Table 16-1. External System Pins Associated with DBG and MEBI
Pin Name BKGD/MODC/ TAGHI PE3/LSTRB/ TAGLO Pin Functions TAGHI TAGLO Description When instruction tagging is on, a 0 at the falling edge of E tags the high half of the instruction word being read into the instruction queue. In expanded wide mode or emulation narrow modes, when instruction tagging is on and low strobe is enabled, a 0 at the falling edge of E tags the low half of the instruction word being read into the instruction queue.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 477
Chapter 16 Debug Module (DBGV1)
16.3
Memory Map and Register Definition
A summary of the registers associated with the DBG sub-block is shown in Figure 16-3. Detailed descriptions of the registers and bits are given in the subsections that follow.
16.3.1
Module Memory Map
Table 16-2. DBGV1 Memory Map
Address Offset Debug Control Register (DBGC1) Debug Status and Control Register (DBGSC) Debug Trace Buffer Register High (DBGTBH) Debug Trace Buffer Register Low (DBGTBL) 4 5 6 8 9 A B Debug Count Register (DBGCNT) Debug Comparator C Extended Register (DBGCCX) Debug Comparator C Register High (DBGCCH) Debug Comparator C Register Low (DBGCCL) Debug Control Register 2 (DBGC2) / (BKPCT0) Debug Control Register 3 (DBGC3) / (BKPCT1) Debug Comparator A Extended Register (DBGCAX) / (/BKP0X) Debug Comparator A Register High (DBGCAH) / (BKP0H) Debug Comparator A Register Low (DBGCAL) / (BKP0L) Debug Comparator B Extended Register (DBGCBX) / (BKP1X) E F Debug Comparator B Register High (DBGCBH) / (BKP1H) Debug Comparator B Register Low (DBGCBL) / (BKP1L) Use Access R/W R/W R R R R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
16.3.2
Register Descriptions
This section consists of the DBG register descriptions in address order. Most of the register bits can be written to in either BKP or DBG mode, although they may not have any effect in one of the modes. However, the only bits in the DBG module that can be written while the debugger is armed (ARM = 1) are DBGEN and ARM
Name1 DBGC1 R W R W = Unimplemented or Reserved Bit 7 DBGEN AF 6 ARM BF 5 TRGSEL CF 4 BEGIN 0 3 DBGBRK 2 0 1 Bit 0 CAPMOD
DBGSC
TRG
Figure 16-3. DBG Register Summary
MC9S12E128 Data Sheet, Rev. 1.07 478 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
Name1 DBGTBH R W R W R W R W R W R W R W R W R W R W R W R W R W R W
Bit 7 Bit 15
6 Bit 14
5 Bit 13
4 Bit 12
3 Bit 11
2 Bit 10
1 Bit 9
Bit 0 Bit 8
DBGTBL
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DBGCNT
TBF
0
CNT
DBGCCX(2)
PAGSEL
EXTCMP
DBGCCH(2)
Bit 15
14
13
12
11
10
9
Bit 8
DBGCCL(2)
Bit 7
6
5
4
3
2
1
Bit 0
DBGC2 BKPCT0 DBGC3 BKPCT1 DBGCAX BKP0X DBGCAH BKP0H DBGCAL BKP0L DBGCBX BKP1X DBGCBH BKP1H DBGCBL BKP1L
BKABEN
FULL
BDM
TAGAB
BKCEN
TAGC
RWCEN
RWC
BKAMBH
BKAMBL
BKBMBH
BKBMBL
RWAEN
RWA
RWBEN
RWB
PAGSEL
EXTCMP
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
PAGSEL
EXTCMP
Bit 15
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
= Unimplemented or Reserved
Figure 16-3. DBG Register Summary (continued)
1
The DBG module is designed for backwards compatibility to existing BKP modules. Register and bit names have changed from the BKP module. This column shows the DBG register name, as well as the BKP register name for reference. 2 Comparator C can be used to enhance the BKP mode by providing a third breakpoint.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 479
Chapter 16 Debug Module (DBGV1)
16.3.2.1
Debug Control Register 1 (DBGC1)
NOTE All bits are used in DBG mode only.
7 6 5 4 3 2 1 0
R DBGEN W Reset 0 0 0 0 0 ARM TRGSEL BEGIN DBGBRK
0 CAPMOD 0 0 0
= Unimplemented or Reserved
Figure 16-4. Debug Control Register (DBGC1)
NOTE This register cannot be written if BKP mode is enabled (BKABEN in DBGC2 is set).
Table 16-3. DBGC1 Field Descriptions
Field 7 DBGEN Description DBG Mode Enable Bit -- The DBGEN bit enables the DBG module for use in DBG mode. This bit cannot be set if the MCU is in secure mode. 0 DBG mode disabled 1 DBG mode enabled Arm Bit -- The ARM bit controls whether the debugger is comparing and storing data in the trace buffer. See Section 16.4.2.4, "Arming the DBG Module," for more information. 0 Debugger unarmed 1 Debugger armed Note: This bit cannot be set if the DBGEN bit is not also being set at the same time. For example, a write of 01 to DBGEN[7:6] will be interpreted as a write of 00. Trigger Selection Bit -- The TRGSEL bit controls the triggering condition for comparators A and B in DBG mode. It serves essentially the same function as the TAGAB bit in the DBGC2 register does in BKP mode. See Section 16.4.2.1.2, "Trigger Selection," for more information. TRGSEL may also determine the type of breakpoint based on comparator A and B if enabled in DBG mode (DBGBRK = 1). Please refer to Section 16.4.3.1, "Breakpoint Based on Comparator A and B." 0 Trigger on any compare address match 1 Trigger before opcode at compare address gets executed (tagged-type) Begin/End Trigger Bit -- The BEGIN bit controls whether the trigger begins or ends storing of data in the trace buffer. See Section 16.4.2.8.1, "Storing with Begin-Trigger," and Section 16.4.2.8.2, "Storing with End-Trigger," for more details. 0 Trigger at end of stored data 1 Trigger before storing data
6 ARM
5 TRGSEL
4 BEGIN
MC9S12E128 Data Sheet, Rev. 1.07 480 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
Table 16-3. DBGC1 Field Descriptions (continued)
Field 3 DBGBRK Description DBG Breakpoint Enable Bit -- The DBGBRK bit controls whether the debugger will request a breakpoint based on comparator A and B to the CPU upon completion of a tracing session. Please refer to Section 16.4.3, "Breakpoints," for further details. 0 CPU break request not enabled 1 CPU break request enabled Capture Mode Field -- See Table 16-4 for capture mode field definitions. In LOOP1 mode, the debugger will automatically inhibit redundant entries into capture memory. In detail mode, the debugger is storing address and data for all cycles except program fetch (P) and free (f) cycles. In profile mode, the debugger is returning the address of the last instruction executed by the CPU on each access of trace buffer address. Refer to Section 16.4.2.6, "Capture Modes," for more information.
1:0 CAPMOD
Table 16-4. CAPMOD Encoding
CAPMOD 00 01 10 11 Description Normal LOOP1 DETAIL PROFILE
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 481
Chapter 16 Debug Module (DBGV1)
16.3.2.2
Debug Status and Control Register (DBGSC)
7 6 5 4 3 2 1 0
R W Reset
AF
BF
CF
0 TRG
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 16-5. Debug Status and Control Register (DBGSC) Table 16-5. DBGSC Field Descriptions
Field 7 AF Description Trigger A Match Flag -- The AF bit indicates if trigger A match condition was met since arming. This bit is cleared when ARM in DBGC1 is written to a 1 or on any write to this register. 0 Trigger A did not match 1 Trigger A match Trigger B Match Flag -- The BF bit indicates if trigger B match condition was met since arming.This bit is cleared when ARM in DBGC1 is written to a 1 or on any write to this register. 0 Trigger B did not match 1 Trigger B match Comparator C Match Flag -- The CF bit indicates if comparator C match condition was met since arming.This bit is cleared when ARM in DBGC1 is written to a 1 or on any write to this register. 0 Comparator C did not match 1 Comparator C match Trigger Mode Bits -- The TRG bits select the trigger mode of the DBG module as shown Table 16-6. See Section 16.4.2.5, "Trigger Modes," for more detail.
6 BF
5 CF
3:0 TRG
Table 16-6. Trigger Mode Encoding
TRG Value 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1111 Meaning A only A or B A then B Event only B A then event only B A and B (full mode) A and Not B (full mode) Inside range Outside range Reserved (Defaults to A only)
MC9S12E128 Data Sheet, Rev. 1.07 482 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
16.3.2.3
Debug Trace Buffer Register (DBGTB)
15 14 13 12 11 10 9 8
R W Reset
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
u
u
u
u
u
u
u
u
= Unimplemented or Reserved
Figure 16-6. Debug Trace Buffer Register High (DBGTBH)
7 6 5 4 3 2 1 0
R W Reset
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
u
u
u
u
u
u
u
u
= Unimplemented or Reserved
Figure 16-7. Debug Trace Buffer Register Low (DBGTBL) Table 16-7. DBGTB Field Descriptions
Field 15:0 Description Trace Buffer Data Bits -- The trace buffer data bits contain the data of the trace buffer. This register can be read only as a word read. Any byte reads or misaligned access of these registers will return 0 and will not cause the trace buffer pointer to increment to the next trace buffer address. The same is true for word reads while the debugger is armed. In addition, this register may appear to contain incorrect data if it is not read with the same capture mode bit settings as when the trace buffer data was recorded (See Section 16.4.2.9, "Reading Data from Trace Buffer"). Because reads will reflect the contents of the trace buffer RAM, the reset state is undefined.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 483
Chapter 16 Debug Module (DBGV1)
16.3.2.4
Debug Count Register (DBGCNT)
7 6 5 4 3 2 1 0
R W Reset
TBF
0
CNT
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 16-8. Debug Count Register (DBGCNT) Table 16-8. DBGCNT Field Descriptions
Field 7 TBF 5:0 CNT Description Trace Buffer Full -- The TBF bit indicates that the trace buffer has stored 64 or more words of data since it was last armed. If this bit is set, then all 64 words will be valid data, regardless of the value in CNT[5:0]. The TBF bit is cleared when ARM in DBGC1 is written to a 1. Count Value -- The CNT bits indicate the number of valid data words stored in the trace buffer. Table 16-9 shows the correlation between the CNT bits and the number of valid data words in the trace buffer. When the CNT rolls over to 0, the TBF bit will be set and incrementing of CNT will continue if DBG is in end-trigger mode. The DBGCNT register is cleared when ARM in DBGC1 is written to a 1.
Table 16-9. CNT Decoding Table
TBF 0 0 0 CNT 000000 000001 000010 .. .. 111110 111111 000000 Description No data valid 1 word valid 2 words valid .. .. 62 words valid 63 words valid 64 words valid; if BEGIN = 1, the ARM bit will be cleared. A breakpoint will be generated if DBGBRK = 1 64 words valid, oldest data has been overwritten by most recent data
0 1
1
000001 .. .. 111111
MC9S12E128 Data Sheet, Rev. 1.07 484 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
16.3.2.5
Debug Comparator C Extended Register (DBGCCX)
7 6 5 4 3 2 1 0
R PAGSEL W Reset 0 0 0 0 0 0 0 0 EXTCMP
Figure 16-9. Debug Comparator C Extended Register (DBGCCX) Table 16-10. DBGCCX Field Descriptions
Field 7:6 PAGSEL Description Page Selector Field -- In both BKP and DBG mode, PAGSEL selects the type of paging as shown in Table 16-11. DPAGE and EPAGE are not yet implemented so the value in bit 7 will be ignored (i.e., PAGSEL values of 10 and 11 will be interpreted as values of 00 and 01, respectively). Comparator C Extended Compare Bits -- The EXTCMP bits are used as comparison address bits as shown in Table 16-11 along with the appropriate PPAGE, DPAGE, or EPAGE signal from the core. Note: Comparator C can be used when the DBG module is configured for BKP mode. Extended addressing comparisons for comparator C use PAGSEL and will operate differently to the way that comparator A and B operate in BKP mode.
5:0 EXTCMP
Table 16-11. PAGSEL Decoding1
PAGSEL 00 01 103 112
1 2
Description Normal (64k) PPAGE (256 -- 16K pages) DPAGE (reserved) (256 -- 4K pages) EPAGE (reserved) (256 -- 1K pages)
EXTCMP Not used EXTCMP[5:0] is compared to address bits [21:16]2 EXTCMP[3:0] is compared to address bits [19:16] EXTCMP[1:0] is compared to address bits [17:16]
Comment No paged memory PPAGE[7:0] / XAB[21:14] becomes address bits [21:14]1 DPAGE / XAB[21:14] becomes address bits [19:12] EPAGE / XAB[21:14] becomes address bits [17:10]
See Figure 16-10. Current HCS12 implementations have PPAGE limited to 6 bits. Therefore, EXTCMP[5:4] should be set to 00. 3 Data page (DPAGE) and Extra page (EPAGE) are reserved for implementation on devices that support paged data and extra space.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 485
Chapter 16 Debug Module (DBGV1)
DBGCXX PAGSEL 7 6 0 5 0 4 3 EXTCMP 2 1 BIT 0 BIT 15
DBGCXH[15:12] BIT 14 BIT 13 BIT 12 BKP/DBG MODE
9 8
SEE NOTE 1 PORTK/XAB XAB21 XAB20 XAB19 XAB18 XAB17 XAB16 XAB15 XAB14
PPAGE
PIX7
PIX6
PIX5
PIX4
PIX3
PIX2
PIX1
PIX0
SEE NOTE 2 NOTES: 1. In BKP and DBG mode, PAGSEL selects the type of paging as shown in Table 16-11. 2. Current HCS12 implementations are limited to six PPAGE bits, PIX[5:0]. Therefore, EXTCMP[5:4] = 00.
Figure 16-10. Comparator C Extended Comparison in BKP/DBG Mode
16.3.2.6
Debug Comparator C Register (DBGCC)
15 14 13 12 11 10
R W Reset
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 16-11. Debug Comparator C Register High (DBGCCH)
7 6 5 4 3 2 1 0
R W Reset
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 16-12. Debug Comparator C Register Low (DBGCCL) Table 16-12. DBGCC Field Descriptions
Field 15:0 Description Comparator C Compare Bits -- The comparator C compare bits control whether comparator C will compare the address bus bits [15:0] to a logic 1 or logic 0. See Table 16-13. 0 Compare corresponding address bit to a logic 0 1 Compare corresponding address bit to a logic 1 Note: This register will be cleared automatically when the DBG module is armed in LOOP1 mode.
MC9S12E128 Data Sheet, Rev. 1.07 486 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
Table 16-13. Comparator C Compares
PAGSEL x0 x1 EXTCMP Compare No compare EXTCMP[5:0] = XAB[21:16] High-Byte Compare DBGCCH[7:0] = AB[15:8] DBGCCH[7:0] = XAB[15:14],AB[13:8]
16.3.2.7
Debug Control Register 2 (DBGC2)
7 6 5 4 3 2 1 0
R W Reset
1
BKABEN1 0
FULL 0
BDM 0
TAGAB 0
BKCEN2 0
TAGC2 0
RWCEN2 0
RWC2 0
When BKABEN is set (BKP mode), all bits in DBGC2 are available. When BKABEN is cleared and DBG is used in DBG mode, bits FULL and TAGAB have no meaning. 2 These bits can be used in BKP mode and DBG mode (when capture mode is not set in LOOP1) to provide a third breakpoint.
Figure 16-13. Debug Control Register 2 (DBGC2) Table 16-14. DBGC2 Field Descriptions
Field 7 BKABEN Description Breakpoint Using Comparator A and B Enable -- This bit enables the breakpoint capability using comparator A and B, when set (BKP mode) the DBGEN bit in DBGC1 cannot be set. 0 Breakpoint module off 1 Breakpoint module on Full Breakpoint Mode Enable -- This bit controls whether the breakpoint module is in dual mode or full mode. In full mode, comparator A is used to match address and comparator B is used to match data. See Section 16.4.1.2, "Full Breakpoint Mode," for more details. 0 Dual address mode enabled 1 Full breakpoint mode enabled Background Debug Mode Enable -- This bit determines if the breakpoint causes the system to enter background debug mode (BDM) or initiate a software interrupt (SWI). 0 Go to software interrupt on a break request 1 Go to BDM on a break request Comparator A/B Tag Select -- This bit controls whether the breakpoint will cause a break on the next instruction boundary (force) or on a match that will be an executable opcode (tagged). Non-executed opcodes cannot cause a tagged breakpoint. 0 On match, break at the next instruction boundary (force) 1 On match, break if/when the instruction is about to be executed (tagged) Breakpoint Comparator C Enable Bit -- This bit enables the breakpoint capability using comparator C. 0 Comparator C disabled for breakpoint 1 Comparator C enabled for breakpoint Note: This bit will be cleared automatically when the DBG module is armed in loop1 mode. Comparator C Tag Select -- This bit controls whether the breakpoint will cause a break on the next instruction boundary (force) or on a match that will be an executable opcode (tagged). Non-executed opcodes cannot cause a tagged breakpoint. 0 On match, break at the next instruction boundary (force) 1 On match, break if/when the instruction is about to be executed (tagged)
6 FULL
5 BDM
4 TAGAB
3 BKCEN
2 TAGC
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Chapter 16 Debug Module (DBGV1)
Table 16-14. DBGC2 Field Descriptions (continued)
Field 1 RWCEN Description Read/Write Comparator C Enable Bit -- The RWCEN bit controls whether read or write comparison is enabled for comparator C. RWCEN is not useful for tagged breakpoints. 0 Read/Write is not used in comparison 1 Read/Write is used in comparison Read/Write Comparator C Value Bit -- The RWC bit controls whether read or write is used in compare for comparator C. The RWC bit is not used if RWCEN = 0. 0 Write cycle will be matched 1 Read cycle will be matched
0 RWC
16.3.2.8
Debug Control Register 3 (DBGC3)
7 6 5 4 3 2 1 0
R W Reset
1 2
BKAMBH1 0
BKAMBL1 0
BKBMBH2 0
BKBMBL2 0
RWAEN 0
RWA 0
RWBEN 0
RWB 0
In DBG mode, BKAMBH:BKAMBL has no meaning and are forced to 0's. In DBG mode, BKBMBH:BKBMBL are used in full mode to qualify data.
Figure 16-14. Debug Control Register 3 (DBGC3) Table 16-15. DBGC3 Field Descriptions
Field Description
7:6 Breakpoint Mask High Byte for First Address -- In dual or full mode, these bits may be used to mask (disable) BKAMB[H:L] the comparison of the high and/or low bytes of the first address breakpoint. The functionality is as given in Table 16-16. The x:0 case is for a full address compare. When a program page is selected, the full address compare will be based on bits for a 20-bit compare. The registers used for the compare are {DBGCAX[5:0], DBGCAH[5:0], DBGCAL[7:0]}, where DBGAX[5:0] corresponds to PPAGE[5:0] or extended address bits [19:14] and CPU address [13:0]. When a program page is not selected, the full address compare will be based on bits for a 16-bit compare. The registers used for the compare are {DBGCAH[7:0], DBGCAL[7:0]} which corresponds to CPU address [15:0]. Note: This extended address compare scheme causes an aliasing problem in BKP mode in which several physical addresses may match with a single logical address. This problem may be avoided by using DBG mode to generate breakpoints. The 1:0 case is not sensible because it would ignore the high order address and compare the low order and expansion addresses. Logic forces this case to compare all address lines (effectively ignoring the BKAMBH control bit). The 1:1 case is useful for triggering a breakpoint on any access to a particular expansion page. This only makes sense if a program page is being accessed so that the breakpoint trigger will occur only if DBGCAX compares.
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Chapter 16 Debug Module (DBGV1)
Table 16-15. DBGC3 Field Descriptions (continued)
Field Description
5:4 Breakpoint Mask High Byte and Low Byte of Data (Second Address) -- In dual mode, these bits may be BKBMB[H:L] used to mask (disable) the comparison of the high and/or low bytes of the second address breakpoint. The functionality is as given in Table 16-17. The x:0 case is for a full address compare. When a program page is selected, the full address compare will be based on bits for a 20-bit compare. The registers used for the compare are {DBGCBX[5:0], DBGCBH[5:0], DBGCBL[7:0]} where DBGCBX[5:0] corresponds to PPAGE[5:0] or extended address bits [19:14] and CPU address [13:0]. When a program page is not selected, the full address compare will be based on bits for a 16-bit compare. The registers used for the compare are {DBGCBH[7:0], DBGCBL[7:0]} which corresponds to CPU address [15:0]. Note: This extended address compare scheme causes an aliasing problem in BKP mode in which several physical addresses may match with a single logical address. This problem may be avoided by using DBG mode to generate breakpoints. The 1:0 case is not sensible because it would ignore the high order address and compare the low order and expansion addresses. Logic forces this case to compare all address lines (effectively ignoring the BKBMBH control bit). The 1:1 case is useful for triggering a breakpoint on any access to a particular expansion page. This only makes sense if a program page is being accessed so that the breakpoint trigger will occur only if DBGCBX compares. In full mode, these bits may be used to mask (disable) the comparison of the high and/or low bytes of the data breakpoint. The functionality is as given in Table 16-18. 3 RWAEN Read/Write Comparator A Enable Bit -- The RWAEN bit controls whether read or write comparison is enabled for comparator A. See Section 16.4.2.1.1, "Read or Write Comparison," for more information. This bit is not useful for tagged operations. 0 Read/Write is not used in comparison 1 Read/Write is used in comparison Read/Write Comparator A Value Bit -- The RWA bit controls whether read or write is used in compare for comparator A. The RWA bit is not used if RWAEN = 0. 0 Write cycle will be matched 1 Read cycle will be matched Read/Write Comparator B Enable Bit -- The RWBEN bit controls whether read or write comparison is enabled for comparator B. See Section 16.4.2.1.1, "Read or Write Comparison," for more information. This bit is not useful for tagged operations. 0 Read/Write is not used in comparison 1 Read/Write is used in comparison Read/Write Comparator B Value Bit -- The RWB bit controls whether read or write is used in compare for comparator B. The RWB bit is not used if RWBEN = 0. 0 Write cycle will be matched 1 Read cycle will be matched Note: RWB and RWBEN are not used in full mode.
2 RWA
1 RWBEN
0 RWB
Table 16-16. Breakpoint Mask Bits for First Address
BKAMBH:BKAMBL x:0 0:1 1:1
1
Address Compare Full address compare 256 byte address range 16K byte address range
DBGCAX Yes1 Yes1 Yes
1
DBGCAH Yes Yes No
DBGCAL Yes No No
If PPAGE is selected.
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Chapter 16 Debug Module (DBGV1)
Table 16-17. Breakpoint Mask Bits for Second Address (Dual Mode)
BKBMBH:BKBMBL x:0 0:1 1:1
1
Address Compare Full address compare 256 byte address range 16K byte address range
DBGCBX Yes
1
DBGCBH Yes Yes No
DBGCBL Yes No No
Yes1 Yes1
If PPAGE is selected.
Table 16-18. Breakpoint Mask Bits for Data Breakpoints (Full Mode)
BKBMBH:BKBMBL 0:0 0:1 1:0 1:1
1
Data Compare High and low byte compare High byte Low byte No compare
DBGCBX No No
1 1
DBGCBH Yes Yes No No
DBGCBL Yes No Yes No
No1 No1
Expansion addresses for breakpoint B are not applicable in this mode.
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Chapter 16 Debug Module (DBGV1)
16.3.2.9
Debug Comparator A Extended Register (DBGCAX)
7 6 5 4 3 2 1 0
R PAGSEL W Reset 0 0 0 0 0 0 0 0 EXTCMP
Figure 16-15. Debug Comparator A Extended Register (DBGCAX) Table 16-19. DBGCAX Field Descriptions
Field 7:6 PAGSEL Description Page Selector Field -- If DBGEN is set in DBGC1, then PAGSEL selects the type of paging as shown in Table 16-20. DPAGE and EPAGE are not yet implemented so the value in bit 7 will be ignored (i.e., PAGSEL values of 10 and 11 will be interpreted as values of 00 and 01, respectively). In BKP mode, PAGSEL has no meaning and EXTCMP[5:0] are compared to address bits [19:14] if the address is in the FLASH/ROM memory space. 5:0 EXTCMP Comparator A Extended Compare Bits -- The EXTCMP bits are used as comparison address bits as shown in Table 16-20 along with the appropriate PPAGE, DPAGE, or EPAGE signal from the core.
Table 16-20. Comparator A or B Compares
Mode BKP
1
EXTCMP Compare No compare EXTCMP[5:0] = XAB[19:14] No compare EXTCMP[5:0] = XAB[21:16]
High-Byte Compare DBGCxH[7:0] = AB[15:8] DBGCxH[5:0] = AB[13:8] DBGCxH[7:0] = AB[15:8] DBGCxH[7:0] = XAB[15:14], AB[13:8]
Not FLASH/ROM access FLASH/ROM access PAGSEL = 00 PAGSEL = 01
DBG2
1 2
See Figure 16-16. See Figure 16-10 (note that while this figure provides extended comparisons for comparator C, the figure also pertains to comparators A and B in DBG mode only).
PAGSEL DBGCXX 0 0 5 4 EXTCMP 3 2 1 BIT 0
PORTK/XAB
XAB21
XAB20
XAB19
XAB18
XAB17
XAB16
XAB15
XAB14
PPAGE
PIX7
PIX6
PIX5
PIX4
PIX3
PIX2
PIX1
PIX0
SEE NOTE 2 NOTES: 1. In BKP mode, PAGSEL has no functionality. Therefore, set PAGSEL to 00 (reset state). 2. Current HCS12 implementations are limited to six PPAGE bits, PIX[5:0].
Figure 16-16. Comparators A and B Extended Comparison in BKP Mode
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BKP MODE
SEE NOTE 1
Chapter 16 Debug Module (DBGV1)
16.3.2.10 Debug Comparator A Register (DBGCA)
15 14 13 12 11 10 9 8
R Bit 15 W Reset 0 0 0 0 0 0 0 0 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
Figure 16-17. Debug Comparator A Register High (DBGCAH)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Figure 16-18. Debug Comparator A Register Low (DBGCAL) Table 16-21. DBGCA Field Descriptions
Field 15:0 15:0 Description Comparator A Compare Bits -- The comparator A compare bits control whether comparator A compares the address bus bits [15:0] to a logic 1 or logic 0. See Table 16-20. 0 Compare corresponding address bit to a logic 0 1 Compare corresponding address bit to a logic 1
16.3.2.11 Debug Comparator B Extended Register (DBGCBX)
7 6 5 4 3 2 1 0
R PAGSEL W Reset 0 0 0 0 0 0 0 0 EXTCMP
Figure 16-19. Debug Comparator B Extended Register (DBGCBX) Table 16-22. DBGCBX Field Descriptions
Field 7:6 PAGSEL Description Page Selector Field -- If DBGEN is set in DBGC1, then PAGSEL selects the type of paging as shown in Table 16-11. DPAGE and EPAGE are not yet implemented so the value in bit 7 will be ignored (i.e., PAGSEL values of 10 and 11 will be interpreted as values of 00 and 01, respectively.) In BKP mode, PAGSEL has no meaning and EXTCMP[5:0] are compared to address bits [19:14] if the address is in the FLASH/ROM memory space. 5:0 EXTCMP Comparator B Extended Compare Bits -- The EXTCMP bits are used as comparison address bits as shown in Table 16-11 along with the appropriate PPAGE, DPAGE, or EPAGE signal from the core. Also see Table 16-20.
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Chapter 16 Debug Module (DBGV1)
16.3.2.12 Debug Comparator B Register (DBGCB)
15 14 13 12 11 10 9 8
R Bit 15 W Reset 0 0 0 0 0 0 0 0 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
Figure 16-20. Debug Comparator B Register High (DBGCBH)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Figure 16-21. Debug Comparator B Register Low (DBGCBL) Table 16-23. DBGCB Field Descriptions
Field 15:0 15:0 Description Comparator B Compare Bits -- The comparator B compare bits control whether comparator B compares the address bus bits [15:0] or data bus bits [15:0] to a logic 1 or logic 0. See Table 16-20. 0 Compare corresponding address bit to a logic 0, compares to data if in Full mode 1 Compare corresponding address bit to a logic 1, compares to data if in Full mode
16.4
Functional Description
This section provides a complete functional description of the DBG module. The DBG module can be configured to run in either of two modes, BKP or DBG. BKP mode is enabled by setting BKABEN in DBGC2. DBG mode is enabled by setting DBGEN in DBGC1. Setting BKABEN in DBGC2 overrides the DBGEN in DBGC1 and prevents DBG mode. If the part is in secure mode, DBG mode cannot be enabled.
16.4.1
DBG Operating in BKP Mode
In BKP mode, the DBG will be fully backwards compatible with the existing BKP_ST12_A module. The DBGC2 register has four additional bits that were not available on existing BKP_ST12_A modules. As long as these bits are written to either all 1s or all 0s, they should be transparent to the user. All 1s would enable comparator C to be used as a breakpoint, but tagging would be enabled. The match address register would be all 0s if not modified by the user. Therefore, code executing at address 0x0000 would have to occur before a breakpoint based on comparator C would happen. The DBG module in BKP mode supports two modes of operation: dual address mode and full breakpoint mode. Within each of these modes, forced or tagged breakpoint types can be used. Forced breakpoints occur at the next instruction boundary if a match occurs and tagged breakpoints allow for breaking just before the tagged instruction executes. The action taken upon a successful match can be to either place the CPU in background debug mode or to initiate a software interrupt.
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Chapter 16 Debug Module (DBGV1)
The breakpoint can operate in dual address mode or full breakpoint mode. Each of these modes is discussed in the subsections below.
16.4.1.1
Dual Address Mode
When dual address mode is enabled, two address breakpoints can be set. Each breakpoint can cause the system to enter background debug mode or to initiate a software interrupt based upon the state of BDM in DBGC2 being logic 1 or logic 0, respectively. BDM requests have a higher priority than SWI requests. No data breakpoints are allowed in this mode. TAGAB in DBGC2 selects whether the breakpoint mode is forced or tagged. The BKxMBH:L bits in DBGC3 select whether or not the breakpoint is matched exactly or is a range breakpoint. They also select whether the address is matched on the high byte, low byte, both bytes, and/or memory expansion. The RWx and RWxEN bits in DBGC3 select whether the type of bus cycle to match is a read, write, or read/write when performing forced breakpoints.
16.4.1.2
Full Breakpoint Mode
Full breakpoint mode requires a match on address and data for a breakpoint to occur. Upon a successful match, the system will enter background debug mode or initiate a software interrupt based upon the state of BDM in DBGC2 being logic 1 or logic 0, respectively. BDM requests have a higher priority than SWI requests. R/W matches are also allowed in this mode. TAGAB in DBGC2 selects whether the breakpoint mode is forced or tagged. When TAGAB is set in DBGC2, only addresses are compared and data is ignored. The BKAMBH:L bits in DBGC3 select whether or not the breakpoint is matched exactly, is a range breakpoint, or is in page space. The BKBMBH:L bits in DBGC3 select whether the data is matched on the high byte, low byte, or both bytes. RWA and RWAEN bits in DBGC2 select whether the type of bus cycle to match is a read or a write when performing forced breakpoints. RWB and RWBEN bits in DBGC2 are not used in full breakpoint mode. NOTE The full trigger mode is designed to be used for either a word access or a byte access, but not both at the same time. Confusing trigger operation (seemingly false triggers or no trigger) can occur if the trigger address occurs in the user program as both byte and word accesses.
16.4.1.3
Breakpoint Priority
Breakpoint operation is first determined by the state of the BDM module. If the BDM module is already active, meaning the CPU is executing out of BDM firmware, breakpoints are not allowed. In addition, while executing a BDM TRACE command, tagging into BDM is not allowed. If BDM is not active, the breakpoint will give priority to BDM requests over SWI requests. This condition applies to both forced and tagged breakpoints. In all cases, BDM related breakpoints will have priority over those generated by the Breakpoint sub-block. This priority includes breakpoints enabled by the TAGLO and TAGHI external pins of the system that interface with the BDM directly and whose signal information passes through and is used by the breakpoint sub-block.
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Chapter 16 Debug Module (DBGV1)
NOTE BDM should not be entered from a breakpoint unless the ENABLE bit is set in the BDM. Even if the ENABLE bit in the BDM is cleared, the CPU actually executes the BDM firmware code. It checks the ENABLE and returns if ENABLE is not set. If the BDM is not serviced by the monitor then the breakpoint would be re-asserted when the BDM returns to normal CPU flow. There is no hardware to enforce restriction of breakpoint operation if the BDM is not enabled. When program control returns from a tagged breakpoint through an RTI or a BDM GO command, it will return to the instruction whose tag generated the breakpoint. Unless breakpoints are disabled or modified in the service routine or active BDM session, the instruction will be tagged again and the breakpoint will be repeated. In the case of BDM breakpoints, this situation can also be avoided by executing a TRACE1 command before the GO to increment the program flow past the tagged instruction.
16.4.1.4
Using Comparator C in BKP Mode
The original BKP_ST12_A module supports two breakpoints. The DBG_ST12_A module can be used in BKP mode and allow a third breakpoint using comparator C. Four additional bits, BKCEN, TAGC, RWCEN, and RWC in DBGC2 in conjunction with additional comparator C address registers, DBGCCX, DBGCCH, and DBGCCL allow the user to set up a third breakpoint. Using PAGSEL in DBGCCX for expanded memory will work differently than the way paged memory is done using comparator A and B in BKP mode. See Section 16.3.2.5, "Debug Comparator C Extended Register (DBGCCX)," for more information on using comparator C.
16.4.2
DBG Operating in DBG Mode
Enabling the DBG module in DBG mode, allows the arming, triggering, and storing of data in the trace buffer and can be used to cause CPU breakpoints. The DBG module is made up of three main blocks, the comparators, trace buffer control logic, and the trace buffer. NOTE In general, there is a latency between the triggering event appearing on the bus and being detected by the DBG circuitry. In general, tagged triggers will be more predictable than forced triggers.
16.4.2.1
Comparators
The DBG contains three comparators, A, B, and C. Comparator A compares the core address bus with the address stored in DBGCAH and DBGCAL. Comparator B compares the core address bus with the address stored in DBGCBH and DBGCBL except in full mode, where it compares the data buses to the data stored in DBGCBH and DBGCBL. Comparator C can be used as a breakpoint generator or as the address comparison unit in the loop1 mode. Matches on comparator A, B, and C are signaled to the trace buffer
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Chapter 16 Debug Module (DBGV1)
control (TBC) block. When PAGSEL = 01, registers DBGCAX, DBGCBX, and DBGCCX are used to match the upper addresses as shown in Table 16-11. NOTE If a tagged-type C breakpoint is set at the same address as an A/B tagged-type trigger (including the initial entry in an inside or outside range trigger), the C breakpoint will have priority and the trigger will not be recognized. 16.4.2.1.1 Read or Write Comparison
Read or write comparisons are useful only with TRGSEL = 0, because only opcodes should be tagged as they are "read" from memory. RWAEN and RWBEN are ignored when TRGSEL = 1. In full modes ("A and B" and "A and not B") RWAEN and RWA are used to select read or write comparisons for both comparators A and B. Table 16-24 shows the effect for RWAEN, RWA, and RW on the DBGCB comparison conditions. The RWBEN and RWB bits are not used and are ignored in full modes.
Table 16-24. Read or Write Comparison Logic Table
RWAEN bit 0 0 1 1 1 1 RWA bit x x 0 0 1 1 RW signal 0 1 0 1 0 1 Comment Write data bus Read data bus Write data bus No data bus compare since RW=1 No data bus compare since RW=0 Read data bus
16.4.2.1.2
Trigger Selection
The TRGSEL bit in DBGC1 is used to determine the triggering condition in DBG mode. TRGSEL applies to both trigger A and B except in the event only trigger modes. By setting TRGSEL, the comparators A and B will qualify a match with the output of opcode tracking logic and a trigger occurs before the tagged instruction executes (tagged-type trigger). With the TRGSEL bit cleared, a comparator match forces a trigger when the matching condition occurs (force-type trigger). NOTE If the TRGSEL is set, the address stored in the comparator match address registers must be an opcode address for the trigger to occur.
16.4.2.2
Trace Buffer Control (TBC)
The TBC is the main controller for the DBG module. Its function is to decide whether data should be stored in the trace buffer based on the trigger mode and the match signals from the comparator. The TBC also determines whether a request to break the CPU should occur.
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Chapter 16 Debug Module (DBGV1)
16.4.2.3
Begin- and End-Trigger
The definitions of begin- and end-trigger as used in the DBG module are as follows: * Begin-trigger: Storage in trace buffer occurs after the trigger and continues until 64 locations are filled. * End-trigger: Storage in trace buffer occurs until the trigger, with the least recent data falling out of the trace buffer if more than 64 words are collected.
16.4.2.4
Arming the DBG Module
In DBG mode, arming occurs by setting DBGEN and ARM in DBGC1. The ARM bit in DBGC1 is cleared when the trigger condition is met in end-trigger mode or when the Trace Buffer is filled in begin-trigger mode. The TBC logic determines whether a trigger condition has been met based on the trigger mode and the trigger selection.
16.4.2.5
Trigger Modes
The DBG module supports nine trigger modes. The trigger modes are encoded as shown in Table 16-6. The trigger mode is used as a qualifier for either starting or ending the storing of data in the trace buffer. When the match condition is met, the appropriate flag A or B is set in DBGSC. Arming the DBG module clears the A, B, and C flags in DBGSC. In all trigger modes except for the event-only modes and DETAIL capture mode, change-of-flow addresses are stored in the trace buffer. In the event-only modes only the value on the data bus at the trigger event B will be stored. In DETAIL capture mode address and data for all cycles except program fetch (P) and free (f) cycles are stored in trace buffer. 16.4.2.5.1 A Only
In the A only trigger mode, if the match condition for A is met, the A flag in DBGSC is set and a trigger occurs. 16.4.2.5.2 A or B
In the A or B trigger mode, if the match condition for A or B is met, the corresponding flag in DBGSC is set and a trigger occurs. 16.4.2.5.3 A then B
In the A then B trigger mode, the match condition for A must be met before the match condition for B is compared. When the match condition for A or B is met, the corresponding flag in DBGSC is set. The trigger occurs only after A then B have matched. NOTE When tagging and using A then B, if addresses A and B are close together, then B may not complete the trigger sequence. This occurs when A and B are in the instruction queue at the same time. Basically the A trigger has not yet occurred, so the B instruction is not tagged. Generally, if address B is at
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least six addresses higher than address A (or B is lower than A) and there are not changes of flow to put these in the queue at the same time, then this operation should trigger properly. 16.4.2.5.4 Event-Only B (Store Data)
In the event-only B trigger mode, if the match condition for B is met, the B flag in DBGSC is set and a trigger occurs. The event-only B trigger mode is considered a begin-trigger type and the BEGIN bit in DBGC1 is ignored. Event-only B is incompatible with instruction tagging (TRGSEL = 1), and thus the value of TRGSEL is ignored. Please refer to Section 16.4.2.7, "Storage Memory," for more information. This trigger mode is incompatible with the detail capture mode so the detail capture mode will have priority. TRGSEL and BEGIN will not be ignored and this trigger mode will behave as if it were "B only". 16.4.2.5.5 A then Event-Only B (Store Data)
In the A then event-only B trigger mode, the match condition for A must be met before the match condition for B is compared, after the A match has occurred, a trigger occurs each time B matches. When the match condition for A or B is met, the corresponding flag in DBGSC is set. The A then event-only B trigger mode is considered a begin-trigger type and BEGIN in DBGC1 is ignored. TRGSEL in DBGC1 applies only to the match condition for A. Please refer to Section 16.4.2.7, "Storage Memory," for more information. This trigger mode is incompatible with the detail capture mode so the detail capture mode will have priority. TRGSEL and BEGIN will not be ignored and this trigger mode will be the same as A then B. 16.4.2.5.6 A and B (Full Mode)
In the A and B trigger mode, comparator A compares to the address bus and comparator B compares to the data bus. In the A and B trigger mode, if the match condition for A and B happen on the same bus cycle, both the A and B flags in the DBGSC register are set and a trigger occurs. If TRGSEL = 1, only matches from comparator A are used to determine if the trigger condition is met and comparator B matches are ignored. If TRGSEL = 0, full-word data matches on an odd address boundary (misaligned access) do not work unless the access is to a RAM that manages misaligned accesses in a single clock cycle (which is typical of RAM modules used in HCS12 MCUs). 16.4.2.5.7 A and Not B (Full Mode)
In the A and not B trigger mode, comparator A compares to the address bus and comparator B compares to the data bus. In the A and not B trigger mode, if the match condition for A and not B happen on the same bus cycle, both the A and B flags in DBGSC are set and a trigger occurs. If TRGSEL = 1, only matches from comparator A are used to determine if the trigger condition is met and comparator B matches are ignored. As described in Section 16.4.2.5.6, "A and B (Full Mode)," full-word data compares on misaligned accesses will not match expected data (and thus will cause a trigger in this mode) unless the access is to a RAM that manages misaligned accesses in a single clock cycle.
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16.4.2.5.8
Inside Range (A address B)
In the inside range trigger mode, if the match condition for A and B happen on the same bus cycle, both the A and B flags in DBGSC are set and a trigger occurs. If a match condition on only A or only B occurs no flags are set. If TRGSEL = 1, the inside range is accurate only to word boundaries. If TRGSEL = 0, an aligned word access which straddles the range boundary will cause a trigger only if the aligned address is within the range. 16.4.2.5.9 Outside Range (address < A or address > B)
In the outside range trigger mode, if the match condition for A or B is met, the corresponding flag in DBGSC is set and a trigger occurs. If TRGSEL = 1, the outside range is accurate only to word boundaries. If TRGSEL = 0, an aligned word access which straddles the range boundary will cause a trigger only if the aligned address is outside the range. 16.4.2.5.10 Control Bit Priorities The definitions of some of the control bits are incompatible with each other. Table 16-25 and the notes associated with it summarize how these incompatibilities are managed: * Read/write comparisons are not compatible with TRGSEL = 1. Therefore, RWAEN and RWBEN are ignored. * Event-only trigger modes are always considered a begin-type trigger. See Section 16.4.2.8.1, "Storing with Begin-Trigger," and Section 16.4.2.8.2, "Storing with End-Trigger." * Detail capture mode has priority over the event-only trigger/capture modes. Therefore, event-only modes have no meaning in detail mode and their functions default to similar trigger modes.
Table 16-25. Resolution of Mode Conflicts
Normal / Loop1 Mode Tag A only A or B A then B Event-only B A then event-only B A and B (full mode) A and not B (full mode) Inside range Outside range 1 2 5 5 6 6 1, 3 4 5 5 6 6 3 4 Force Tag Force Detail
1 -- Ignored -- same as force 2 -- Ignored for comparator B 3 -- Reduces to effectively "B only" 4 -- Works same as A then B 5 -- Reduces to effectively "A only" -- B not compared 6 -- Only accurate to word boundaries
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 499
Chapter 16 Debug Module (DBGV1)
16.4.2.6
Capture Modes
The DBG in DBG mode can operate in four capture modes. These modes are described in the following subsections. 16.4.2.6.1 Normal Mode
In normal mode, the DBG module uses comparator A and B as triggering devices. Change-of-flow information or data will be stored depending on TRG in DBGSC. 16.4.2.6.2 Loop1 Mode
The intent of loop1 mode is to prevent the trace buffer from being filled entirely with duplicate information from a looping construct such as delays using the DBNE instruction or polling loops using BRSET/BRCLR instructions. Immediately after address information is placed in the trace buffer, the DBG module writes this value into the C comparator and the C comparator is placed in ignore address mode. This will prevent duplicate address entries in the trace buffer resulting from repeated bit-conditional branches. Comparator C will be cleared when the ARM bit is set in loop1 mode to prevent the previous contents of the register from interfering with loop1 mode operation. Breakpoints based on comparator C are disabled. Loop1 mode only inhibits duplicate source address entries that would typically be stored in most tight looping constructs. It will not inhibit repeated entries of destination addresses or vector addresses, because repeated entries of these would most likely indicate a bug in the user's code that the DBG module is designed to help find. NOTE In certain very tight loops, the source address will have already been fetched again before the C comparator is updated. This results in the source address being stored twice before further duplicate entries are suppressed. This condition occurs with branch-on-bit instructions when the branch is fetched by the first P-cycle of the branch or with loop-construct instructions in which the branch is fetched with the first or second P cycle. See examples below:
LOOP INCX ; 1-byte instruction fetched by 1st P-cycle of BRCLR BRCLR CMPTMP,#$0c,LOOP ; the BRCLR instruction also will be fetched by 1st P-cycle of BRCLR * A,LOOP2 ; 2-byte instruction fetched by 1st P-cycle of DBNE ; 1-byte instruction fetched by 2nd P-cycle of DBNE ; this instruction also fetched by 2nd P-cycle of DBNE
LOOP2 BRN NOP DBNE
NOTE Loop1 mode does not support paged memory, and inhibits duplicate entries in the trace buffer based solely on the CPU address. There is a remote possibility of an erroneous address match if program flow alternates between paged and unpaged memory space.
MC9S12E128 Data Sheet, Rev. 1.07 500 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
16.4.2.6.3
Detail Mode
In the detail mode, address and data for all cycles except program fetch (P) and free (f) cycles are stored in trace buffer. This mode is intended to supply additional information on indexed, indirect addressing modes where storing only the destination address would not provide all information required for a user to determine where his code was in error. 16.4.2.6.4 Profile Mode
This mode is intended to allow a host computer to poll a running target and provide a histogram of program execution. Each read of the trace buffer address will return the address of the last instruction executed. The DBGCNT register is not incremented and the trace buffer does not get filled. The ARM bit is not used and all breakpoints and all other debug functions will be disabled.
16.4.2.7
Storage Memory
The storage memory is a 64 words deep by 16-bits wide dual port RAM array. The CPU accesses the RAM array through a single memory location window (DBGTBH:DBGTBL). The DBG module stores trace information in the RAM array in a circular buffer format. As data is read via the CPU, a pointer into the RAM will increment so that the next CPU read will receive fresh information. In all trigger modes except for event-only and detail capture mode, the data stored in the trace buffer will be change-of-flow addresses. change-of-flow addresses are defined as follows: * Source address of conditional branches (long, short, BRSET, and loop constructs) taken * Destination address of indexed JMP, JSR, and CALL instruction * Destination address of RTI, RTS, and RTC instructions * Vector address of interrupts except for SWI and BDM vectors In the event-only trigger modes only the 16-bit data bus value corresponding to the event is stored. In the detail capture mode, address and then data are stored for all cycles except program fetch (P) and free (f) cycles.
16.4.2.8
16.4.2.8.1
Storing Data in Memory Storage Buffer
Storing with Begin-Trigger
Storing with begin-trigger can be used in all trigger modes. When DBG mode is enabled and armed in the begin-trigger mode, data is not stored in the trace buffer until the trigger condition is met. As soon as the trigger condition is met, the DBG module will remain armed until 64 words are stored in the trace buffer. If the trigger is at the address of the change-of-flow instruction the change-of-flow associated with the trigger event will be stored in the trace buffer. 16.4.2.8.2 Storing with End-Trigger
Storing with end-trigger cannot be used in event-only trigger modes. When DBG mode is enabled and armed in the end-trigger mode, data is stored in the trace buffer until the trigger condition is met. When the trigger condition is met, the DBG module will become de-armed and no more data will be stored. If
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 501
Chapter 16 Debug Module (DBGV1)
the trigger is at the address of a change-of-flow address the trigger event will not be stored in the trace buffer.
16.4.2.9
Reading Data from Trace Buffer
The data stored in the trace buffer can be read using either the background debug module (BDM) module or the CPU provided the DBG module is enabled and not armed. The trace buffer data is read out first-in first-out. By reading CNT in DBGCNT the number of valid words can be determined. CNT will not decrement as data is read from DBGTBH:DBGTBL. The trace buffer data is read by reading DBGTBH:DBGTBL with a 16-bit read. Each time DBGTBH:DBGTBL is read, a pointer in the DBG will be incremented to allow reading of the next word. Reading the trace buffer while the DBG module is armed will return invalid data and no shifting of the RAM pointer will occur. NOTE The trace buffer should be read with the DBG module enabled and in the same capture mode that the data was recorded. The contents of the trace buffer counter register (DBGCNT) are resolved differently in detail mode verses the other modes and may lead to incorrect interpretation of the trace buffer data.
16.4.3
Breakpoints
There are two ways of getting a breakpoint in DBG mode. One is based on the trigger condition of the trigger mode using comparator A and/or B, and the other is using comparator C. External breakpoints generated using the TAGHI and TAGLO external pins are disabled in DBG mode.
16.4.3.1
Breakpoint Based on Comparator A and B
A breakpoint request to the CPU can be enabled by setting DBGBRK in DBGC1. The value of BEGIN in DBGC1 determines when the breakpoint request to the CPU will occur. When BEGIN in DBGC1 is set, begin-trigger is selected and the breakpoint request will not occur until the trace buffer is filled with 64 words. When BEGIN in DBGC1 is cleared, end-trigger is selected and the breakpoint request will occur immediately at the trigger cycle. There are two types of breakpoint requests supported by the DBG module, tagged and forced. Tagged breakpoints are associated with opcode addresses and allow breaking just before a specific instruction executes. Forced breakpoints are not associated with opcode addresses and allow breaking at the next instruction boundary. The type of breakpoint based on comparators A and B is determined by TRGSEL in the DBGC1 register (TRGSEL = 1 for tagged breakpoint, TRGSEL = 0 for forced breakpoint). Table 16-26 illustrates the type of breakpoint that will occur based on the debug run.
MC9S12E128 Data Sheet, Rev. 1.07 502 Freescale Semiconductor
Chapter 16 Debug Module (DBGV1)
Table 16-26. Breakpoint Setup
BEGIN 0 0 0 0 1 1 1 1 TRGSEL 0 0 1 1 0 0 1 1 DBGBRK 0 1 0 1 0 1 0 1 Type of Debug Run Fill trace buffer until trigger address (no CPU breakpoint -- keep running) Fill trace buffer until trigger address, then a forced breakpoint request occurs Fill trace buffer until trigger opcode is about to execute (no CPU breakpoint -- keep running) Fill trace buffer until trigger opcode about to execute, then a tagged breakpoint request occurs Start trace buffer at trigger address (no CPU breakpoint -- keep running) Start trace buffer at trigger address, a forced breakpoint request occurs when trace buffer is full Start trace buffer at trigger opcode (no CPU breakpoint -- keep running) Start trace buffer at trigger opcode, a forced breakpoint request occurs when trace buffer is full
16.4.3.2
Breakpoint Based on Comparator C
A breakpoint request to the CPU can be created if BKCEN in DBGC2 is set. Breakpoints based on a successful comparator C match can be accomplished regardless of the mode of operation for comparator A or B, and do not affect the status of the ARM bit. TAGC in DBGC2 is used to select either tagged or forced breakpoint requests for comparator C. Breakpoints based on comparator C are disabled in LOOP1 mode. NOTE Because breakpoints cannot be disabled when the DBG is armed, one must be careful to avoid an "infinite breakpoint loop" when using tagged-type C breakpoints while the DBG is armed. If BDM breakpoints are selected, executing a TRACE1 instruction before the GO instruction is the recommended way to avoid re-triggering a breakpoint if one does not wish to de-arm the DBG. If SWI breakpoints are selected, disarming the DBG in the SWI interrupt service routine is the recommended way to avoid re-triggering a breakpoint.
16.5
Resets
The DBG module is disabled after reset. The DBG module cannot cause a MCU reset.
16.6
Interrupts
The DBG contains one interrupt source. If a breakpoint is requested and BDM in DBGC2 is cleared, an SWI interrupt will be generated.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 503
Chapter 16 Debug Module (DBGV1)
MC9S12E128 Data Sheet, Rev. 1.07 504 Freescale Semiconductor
Chapter 17 Interrupt (INTV1)
17.1 Introduction
This section describes the functionality of the interrupt (INT) sub-block of the S12 core platform. A block diagram of the interrupt sub-block is shown in Figure 17-1.
INT
WRITE DATA BUS
HPRIO (OPTIONAL)
HIGHEST PRIORITY I-INTERRUPT
INTERRUPTS XMASK IMASK INTERRUPT INPUT REGISTERS AND CONTROL REGISTERS READ DATA BUS
WAKEUP HPRIO VECTOR
QUALIFIED INTERRUPTS
INTERRUPT PENDING RESET FLAGS VECTOR REQUEST PRIORITY DECODER VECTOR ADDRESS
Figure 17-1. INTV1 Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 505
Chapter 17 Interrupt (INTV1)
The interrupt sub-block decodes the priority of all system exception requests and provides the applicable vector for processing the exception. The INT supports I-bit maskable and X-bit maskable interrupts, a non-maskable unimplemented opcode trap, a non-maskable software interrupt (SWI) or background debug mode request, and three system reset vector requests. All interrupt related exception requests are managed by the interrupt sub-block (INT).
17.1.1
Features
The INT includes these features: * Provides two to 122 I-bit maskable interrupt vectors (0xFF00-0xFFF2) * Provides one X-bit maskable interrupt vector (0xFFF4) * Provides a non-maskable software interrupt (SWI) or background debug mode request vector (0xFFF6) * Provides a non-maskable unimplemented opcode trap (TRAP) vector (0xFFF8) * Provides three system reset vectors (0xFFFA-0xFFFE) (reset, CMR, and COP) * Determines the appropriate vector and drives it onto the address bus at the appropriate time * Signals the CPU that interrupts are pending * Provides control registers which allow testing of interrupts * Provides additional input signals which prevents requests for servicing I and X interrupts * Wakes the system from stop or wait mode when an appropriate interrupt occurs or whenever XIRQ is active, even if XIRQ is masked * Provides asynchronous path for all I and X interrupts, (0xFF00-0xFFF4) * (Optional) selects and stores the highest priority I interrupt based on the value written into the HPRIO register
17.1.2
Modes of Operation
The functionality of the INT sub-block in various modes of operation is discussed in the subsections that follow. * Normal operation The INT operates the same in all normal modes of operation. * Special operation Interrupts may be tested in special modes through the use of the interrupt test registers. * Emulation modes The INT operates the same in emulation modes as in normal modes. * Low power modes See Section 17.4.1, "Low-Power Modes," for details
MC9S12E128 Data Sheet, Rev. 1.07 506 Freescale Semiconductor
Chapter 17 Interrupt (INTV1)
17.2
External Signal Description
Most interfacing with the interrupt sub-block is done within the core. However, the interrupt does receive direct input from the multiplexed external bus interface (MEBI) sub-block of the core for the IRQ and XIRQ pin data.
17.3
Memory Map and Register Definition
Detailed descriptions of the registers and associated bits are given in the subsections that follow.
17.3.1
Module Memory Map
Table 17-1. INT Memory Map
Address Offset 0x0015 0x0016 0x001F Use Interrupt Test Control Register (ITCR) Interrupt Test Registers (ITEST) Highest Priority Interrupt (Optional) (HPRIO) Access R/W R/W R/W
17.3.2
17.3.2.1
Register Descriptions
Interrupt Test Control Register
7 6 5 4 3 2 1 0
R W Reset
0
0
0 WRTINT ADR3 1 ADR2 1 ADR1 1 ADR0 1
0
0
0
0
= Unimplemented or Reserved
Figure 17-2. Interrupt Test Control Register (ITCR)
Read: See individual bit descriptions Write: See individual bit descriptions
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 507
Chapter 17 Interrupt (INTV1)
Table 17-2. ITCR Field Descriptions
Field 4 WRTINT Description Write to the Interrupt Test Registers Read: anytime Write: only in special modes and with I-bit mask and X-bit mask set. 0 Disables writes to the test registers; reads of the test registers will return the state of the interrupt inputs. 1 Disconnect the interrupt inputs from the priority decoder and use the values written into the ITEST registers instead. Note: Any interrupts which are pending at the time that WRTINT is set will remain until they are overwritten. Test Register Select Bits Read: anytime Write: anytime These bits determine which test register is selected on a read or write. The hexadecimal value written here will be the same as the upper nibble of the lower byte of the vector selects. That is, an "F" written into ADR[3:0] will select vectors 0xFFFE-0xFFF0 while a "7" written to ADR[3:0] will select vectors 0xFF7E-0xFF70.
3:0 ADR[3:0]
17.3.2.2
Interrupt Test Registers
7 6 5 4 3 2 1 0
R INTE W Reset 0 0 0 0 0 0 0 0 INTC INTA INT8 INT6 INT4 INT2 INT0
= Unimplemented or Reserved
Figure 17-3. Interrupt TEST Registers (ITEST)
Read: Only in special modes. Reads will return either the state of the interrupt inputs of the interrupt sub-block (WRTINT = 0) or the values written into the TEST registers (WRTINT = 1). Reads will always return 0s in normal modes. Write: Only in special modes and with WRTINT = 1 and CCR I mask = 1.
Table 17-3. ITEST Field Descriptions
Field 7:0 INT[E:0] Description Interrupt TEST Bits -- These registers are used in special modes for testing the interrupt logic and priority independent of the system configuration. Each bit is used to force a specific interrupt vector by writing it to a logic 1 state. Bits are named INTE through INT0 to indicate vectors 0xFFxE through 0xFFx0. These bits can be written only in special modes and only with the WRTINT bit set (logic 1) in the interrupt test control register (ITCR). In addition, I interrupts must be masked using the I bit in the CCR. In this state, the interrupt input lines to the interrupt sub-block will be disconnected and interrupt requests will be generated only by this register. These bits can also be read in special modes to view that an interrupt requested by a system block (such as a peripheral block) has reached the INT module. There is a test register implemented for every eight interrupts in the overall system. All of the test registers share the same address and are individually selected using the value stored in the ADR[3:0] bits of the interrupt test control register (ITCR). Note: When ADR[3:0] have the value of 0x000F, only bits 2:0 in the ITEST register will be accessible. That is, vectors higher than 0xFFF4 cannot be tested using the test registers and bits 7:3 will always read as a logic 0. If ADR[3:0] point to an unimplemented test register, writes will have no effect and reads will always return a logic 0 value.
MC9S12E128 Data Sheet, Rev. 1.07 508 Freescale Semiconductor
Chapter 17 Interrupt (INTV1)
17.3.2.3
Highest Priority I Interrupt (Optional)
7 6 5 4 3 2 1 0
R PSEL7 W Reset 1 1 1 1 0 0 1 PSEL6 PSEL5 PSEL4 PSEL3 PSEL2 PSEL1
0
0
= Unimplemented or Reserved
Figure 17-4. Highest Priority I Interrupt Register (HPRIO)
Read: Anytime Write: Only if I mask in CCR = 1
Table 17-4. HPRIO Field Descriptions
Field 7:1 PSEL[7:1] Description Highest Priority I Interrupt Select Bits -- The state of these bits determines which I-bit maskable interrupt will be promoted to highest priority (of the I-bit maskable interrupts). To promote an interrupt, the user writes the least significant byte of the associated interrupt vector address to this register. If an unimplemented vector address or a non I-bit masked vector address (value higher than 0x00F2) is written, IRQ (0xFFF2) will be the default highest priority interrupt.
17.4
Functional Description
The interrupt sub-block processes all exception requests made by the CPU. These exceptions include interrupt vector requests and reset vector requests. Each of these exception types and their overall priority level is discussed in the subsections below.
17.4.1
Low-Power Modes
The INT does not contain any user-controlled options for reducing power consumption. The operation of the INT in low-power modes is discussed in the following subsections.
17.4.1.1
Operation in Run Mode
The INT does not contain any options for reducing power in run mode.
17.4.1.2
Operation in Wait Mode
Clocks to the INT can be shut off during system wait mode and the asynchronous interrupt path will be used to generate the wake-up signal upon recognition of a valid interrupt or any XIRQ request.
17.4.1.3
Operation in Stop Mode
Clocks to the INT can be shut off during system stop mode and the asynchronous interrupt path will be used to generate the wake-up signal upon recognition of a valid interrupt or any XIRQ request.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 509
Chapter 17 Interrupt (INTV1)
17.5
Resets
The INT supports three system reset exception request types: normal system reset or power-on-reset request, crystal monitor reset request, and COP watchdog reset request. The type of reset exception request must be decoded by the system and the proper request made to the core. The INT will then provide the service routine address for the type of reset requested.
17.6
Interrupts
As shown in the block diagram in Figure 17-1, the INT contains a register block to provide interrupt status and control, an optional highest priority I interrupt (HPRIO) block, and a priority decoder to evaluate whether pending interrupts are valid and assess their priority.
17.6.1
Interrupt Registers
The INT registers are accessible only in special modes of operation and function as described in Section 17.3.2.1, "Interrupt Test Control Register," and Section 17.3.2.2, "Interrupt Test Registers," previously.
17.6.2
Highest Priority I-Bit Maskable Interrupt
When the optional HPRIO block is implemented, the user is allowed to promote a single I-bit maskable interrupt to be the highest priority I interrupt. The HPRIO evaluates all interrupt exception requests and passes the HPRIO vector to the priority decoder if the highest priority I interrupt is active. RTI replaces the promoted interrupt source.
17.6.3
Interrupt Priority Decoder
The priority decoder evaluates all interrupts pending and determines their validity and priority. When the CPU requests an interrupt vector, the decoder will provide the vector for the highest priority interrupt request. Because the vector is not supplied until the CPU requests it, it is possible that a higher priority interrupt request could override the original exception that caused the CPU to request the vector. In this case, the CPU will receive the highest priority vector and the system will process this exception instead of the original request. NOTE Care must be taken to ensure that all exception requests remain active until the system begins execution of the applicable service routine; otherwise, the exception request may not be processed. If for any reason the interrupt source is unknown (e.g., an interrupt request becomes inactive after the interrupt has been recognized but prior to the vector request), the vector address will default to that of the last valid interrupt that existed during the particular interrupt sequence. If the CPU requests an interrupt vector when there has never been a pending interrupt request, the INT will provide the software interrupt (SWI) vector address.
MC9S12E128 Data Sheet, Rev. 1.07 510 Freescale Semiconductor
Chapter 17 Interrupt (INTV1)
17.7
Exception Priority
The priority (from highest to lowest) and address of all exception vectors issued by the INT upon request by the CPU is shown in Table 17-5.
Table 17-5. Exception Vector Map and Priority
Vector Address 0xFFFE-0xFFFF 0xFFFC-0xFFFD 0xFFFA-0xFFFB 0xFFF8-0xFFF9 0xFFF6-0xFFF7 0xFFF4-0xFFF5 0xFFF2-0xFFF3 0xFFF0-0xFF00 System reset Crystal monitor reset COP reset Unimplemented opcode trap Software interrupt instruction (SWI) or BDM vector request XIRQ signal IRQ signal Device-specific I-bit maskable interrupt sources (priority in descending order) Source
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 511
Chapter 17 Interrupt (INTV1)
MC9S12E128 Data Sheet, Rev. 1.07 512 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.1 Introduction
This section describes the functionality of the multiplexed external bus interface (MEBI) sub-block of the S12 core platform. The functionality of the module is closely coupled with the S12 CPU and the memory map controller (MMC) sub-blocks. Figure 18-1 is a block diagram of the MEBI. In Figure 18-1, the signals on the right hand side represent pins that are accessible externally. On some chips, these may not all be bonded out. The MEBI sub-block of the core serves to provide access and/or visibility to internal core data manipulation operations including timing reference information at the external boundary of the core and/or system. Depending upon the system operating mode and the state of bits within the control registers of the MEBI, the internal 16-bit read and write data operations will be represented in 8-bit or 16-bit accesses externally. Using control information from other blocks within the system, the MEBI will determine the appropriate type of data access to be generated.
18.1.1
Features
The block name includes these distinctive features: * External bus controller with four 8-bit ports A,B, E, and K * Data and data direction registers for ports A, B, E, and K when used as general-purpose I/O * Control register to enable/disable alternate functions on ports E and K * Mode control register * Control register to enable/disable pull resistors on ports A, B, E, and K * Control register to enable/disable reduced output drive on ports A, B, E, and K * Control register to configure external clock behavior * Control register to configure IRQ pin operation * Logic to capture and synchronize external interrupt pin inputs
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 513
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
REGS
Port K
ADDR
PK[7:0]/ECS/XCS/X[19:14]
Internal Bus
Data[15:0]
EXT BUS I/F CTL
ADDR DATA
Port A
Addr[19:0]
PA[7:0]/A[15:8]/ D[15:8]/D[7:0]
(Control)
Port B
ADDR
PB[7:0]/A[7:0]/ D[7:0]
DATA
PE[7:2]/NOACC/ IPIPE1/MODB/CLKTO IPIPE0/MODA/ ECLK/ LSTRB/TAGLO R/W PE1/IRQ PE0/XIRQ
ECLK CTL
CPU pipe info IRQ interrupt XIRQ interrupt
PIPE CTL IRQ CTL TAG CTL
mode
BDM tag info
Port E
BKGD
BKGD/MODC/TAGHI
Control signal(s) Data signal (unidirectional) Data signal (bidirectional) Data bus (unidirectional) Data bus (bidirectional)
Figure 18-1. MEBI Block Diagram
MC9S12E128 Data Sheet, Rev. 1.07 514 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.1.2
*
Modes of Operation
*
*
*
*
*
*
*
Normal expanded wide mode Ports A and B are configured as a 16-bit multiplexed address and data bus and port E provides bus control and status signals. This mode allows 16-bit external memory and peripheral devices to be interfaced to the system. Normal expanded narrow mode Ports A and B are configured as a 16-bit address bus and port A is multiplexed with 8-bit data. Port E provides bus control and status signals. This mode allows 8-bit external memory and peripheral devices to be interfaced to the system. Normal single-chip mode There is no external expansion bus in this mode. The processor program is executed from internal memory. Ports A, B, K, and most of E are available as general-purpose I/O. Special single-chip mode This mode is generally used for debugging single-chip operation, boot-strapping, or security related operations. The active background mode is in control of CPU execution and BDM firmware is waiting for additional serial commands through the BKGD pin. There is no external expansion bus after reset in this mode. Emulation expanded wide mode Developers use this mode for emulation systems in which the users target application is normal expanded wide mode. Emulation expanded narrow mode Developers use this mode for emulation systems in which the users target application is normal expanded narrow mode. Special test mode Ports A and B are configured as a 16-bit multiplexed address and data bus and port E provides bus control and status signals. In special test mode, the write protection of many control bits is lifted so that they can be thoroughly tested without needing to go through reset. Special peripheral mode This mode is intended for Freescale Semiconductor factory testing of the system. The CPU is inactive and an external (tester) bus master drives address, data, and bus control signals.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 515
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.2
External Signal Description
In typical implementations, the MEBI sub-block of the core interfaces directly with external system pins. Some pins may not be bonded out in all implementations. Table 18-1 outlines the pin names and functions and gives a brief description of their operation reset state of these pins and associated pull-ups or pull-downs is dependent on the mode of operation and on the integration of this block at the chip level (chip dependent).
.
Table 18-1. External System Pins Associated With MEBI
Pin Name Pin Functions MODC BKGD TAGHI Description At the rising edge on RESET, the state of this pin is registered into the MODC bit to set the mode. (This pin always has an internal pullup.) Pseudo open-drain communication pin for the single-wire background debug mode. There is an internal pull-up resistor on this pin. When instruction tagging is on, a 0 at the falling edge of E tags the high half of the instruction word being read into the instruction queue. General-purpose I/O pins, see PORTA and DDRA registers. High-order address lines multiplexed during ECLK low. Outputs except in special peripheral mode where they are inputs from an external tester system. High-order bidirectional data lines multiplexed during ECLK high in expanded wide modes, special peripheral mode, and visible internal accesses (IVIS = 1) in emulation expanded narrow mode. Direction of data transfer is generally indicated by R/W. Alternate high-order and low-order bytes of the bidirectional data lines multiplexed during ECLK high in expanded narrow modes and narrow accesses in wide modes. Direction of data transfer is generally indicated by R/W. General-purpose I/O pins, see PORTB and DDRB registers. Low-order address lines multiplexed during ECLK low. Outputs except in special peripheral mode where they are inputs from an external tester system. Low-order bidirectional data lines multiplexed during ECLK high in expanded wide modes, special peripheral mode, and visible internal accesses (with IVIS = 1) in emulation expanded narrow mode. Direction of data transfer is generally indicated by R/W. General-purpose I/O pin, see PORTE and DDRE registers. CPU No Access output. Indicates whether the current cycle is a free cycle. Only available in expanded modes. At the rising edge of RESET, the state of this pin is registered into the MODB bit to set the mode. General-purpose I/O pin, see PORTE and DDRE registers. Instruction pipe status bit 1, enabled by PIPOE bit in PEAR. System clock test output. Only available in special modes. PIPOE = 1 overrides this function. The enable for this function is in the clock module.
BKGD/MODC/ TAGHI
PA7/A15/D15/D7 thru PA0/A8/D8/D0
PA7-PA0 A15-A8 D15-D8
D15/D7 thru D8/D0 PB7/A7/D7 thru PB0/A0/D0 PB7-PB0 A7-A0 D7-D0
PE7/NOACC
PE7 NOACC
PE6/IPIPE1/ MODB/CLKTO
MODB PE6 IPIPE1 CLKTO
MC9S12E128 Data Sheet, Rev. 1.07 516 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
Table 18-1. External System Pins Associated With MEBI (continued)
Pin Name PE5/IPIPE0/MODA Pin Functions MODA PE5 IPIPE0 PE4/ECLK PE4 ECLK Description At the rising edge on RESET, the state of this pin is registered into the MODA bit to set the mode. General-purpose I/O pin, see PORTE and DDRE registers. Instruction pipe status bit 0, enabled by PIPOE bit in PEAR. General-purpose I/O pin, see PORTE and DDRE registers. Bus timing reference clock, can operate as a free-running clock at the system clock rate or to produce one low-high clock per visible access, with the high period stretched for slow accesses. ECLK is controlled by the NECLK bit in PEAR, the IVIS bit in MODE, and the ESTR bit in EBICTL. General-purpose I/O pin, see PORTE and DDRE registers. Low strobe bar, 0 indicates valid data on D7-D0. In special peripheral mode, this pin is an input indicating the size of the data transfer (0 = 16-bit; 1 = 8-bit). In expanded wide mode or emulation narrow modes, when instruction tagging is on and low strobe is enabled, a 0 at the falling edge of E tags the low half of the instruction word being read into the instruction queue. General-purpose I/O pin, see PORTE and DDRE registers. Read/write, indicates the direction of internal data transfers. This is an output except in special peripheral mode where it is an input. General-purpose input-only pin, can be read even if IRQ enabled. Maskable interrupt request, can be level sensitive or edge sensitive. General-purpose input-only pin. Non-maskable interrupt input. General-purpose I/O pin, see PORTK and DDRK registers. Emulation chip select General-purpose I/O pin, see PORTK and DDRK registers. External data chip select General-purpose I/O pins, see PORTK and DDRK registers. Memory expansion addresses
PE3/LSTRB/ TAGLO
PE3 LSTRB SZ8 TAGLO
PE2/R/W
PE2 R/W
PE1/IRQ
PE1 IRQ
PE0/XIRQ
PE0 XIRQ
PK7/ECS
PK7 ECS
PK6/XCS
PK6 XCS
PK5/X19 thru PK0/X14
PK5-PK0 X19-X14
Detailed descriptions of these pins can be found in the device overview chapter.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 517
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3
Memory Map and Register Definition
A summary of the registers associated with the MEBI sub-block is shown in Table 18-2. Detailed descriptions of the registers and bits are given in the subsections that follow. On most chips the registers are mappable. Therefore, the upper bits may not be all 0s as shown in the table and descriptions.
18.3.1
Module Memory Map
Table 18-2. MEBI Memory Map
Address Offset 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 0x000A 0x000B 0x000C 0x000D 0x000E 0x000F 0x001E 0x00032 0x00033 Port A Data Register (PORTA) Port B Data Register (PORTB) Data Direction Register A (DDRA) Data Direction Register B (DDRB) Reserved Reserved Reserved Reserved Port E Data Register (PORTE) Data Direction Register E (DDRE) Port E Assignment Register (PEAR) Mode Register (MODE) Pull Control Register (PUCR) Reduced Drive Register (RDRIV) External Bus Interface Control Register (EBICTL) Reserved IRQ Control Register (IRQCR) Port K Data Register (PORTK) Data Direction Register K (DDRK) Use Access R/W R/W R/W R/W R R R R R/W R/W R/W R/W R/W R/W R/W R R/W R/W R/W
MC9S12E128 Data Sheet, Rev. 1.07 518 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2
18.3.2.1
Register Descriptions
Port A Data Register (PORTA)
7 6 5 4 3 2 1 0
R Bit 7 W Reset Single Chip 0 PA7 0 PA6 AB/DB14 0 PA5 AB/DB13 0 PA4 AB/DB12 0 PA3 AB/DB11 0 PA2 AB/DB10 0 PA1 AB/DB9 AB9 and DB9/DB1 0 PA0 AB/DB8 AB8 and DB8/DB0 6 5 4 3 2 1 Bit 0
Expanded Wide, Emulation Narrow with AB/DB15 IVIS, and Peripheral
Expanded Narrow AB15 and AB14 and AB13 and AB12 and AB11 and AB10 and DB15/DB7 DB14/DB6 DB13/DB5 DB12/DB4 DB11/DB3 DB10/DB2
Figure 18-2. Port A Data Register (PORTA)
Read: Anytime when register is in the map Write: Anytime when register is in the map Port A bits 7 through 0 are associated with address lines A15 through A8 respectively and data lines D15/D7 through D8/D0 respectively. When this port is not used for external addresses such as in single-chip mode, these pins can be used as general-purpose I/O. Data direction register A (DDRA) determines the primary direction of each pin. DDRA also determines the source of data for a read of PORTA. This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally. NOTE To ensure that you read the value present on the PORTA pins, always wait at least one cycle after writing to the DDRA register before reading from the PORTA register.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 519
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.2
Port B Data Register (PORTB)
7 6 5 4 3 2 1 0
R Bit 7 W Reset Single Chip Expanded Wide, Emulation Narrow with IVIS, and Peripheral Expanded Narrow 0 PB7 AB/DB7 AB7 0 PB6 AB/DB6 AB6 0 PB5 AB/DB5 AB5 0 PB4 AB/DB4 AB4 0 PB3 AB/DB3 AB3 0 PB2 AB/DB2 AB2 0 PB1 AB/DB1 AB1 0 PB0 AB/DB0 AB0 6 5 4 3 2 1 Bit 0
Figure 18-3. Port A Data Register (PORTB)
Read: Anytime when register is in the map Write: Anytime when register is in the map Port B bits 7 through 0 are associated with address lines A7 through A0 respectively and data lines D7 through D0 respectively. When this port is not used for external addresses, such as in single-chip mode, these pins can be used as general-purpose I/O. Data direction register B (DDRB) determines the primary direction of each pin. DDRB also determines the source of data for a read of PORTB. This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally. NOTE To ensure that you read the value present on the PORTB pins, always wait at least one cycle after writing to the DDRB register before reading from the PORTB register.
MC9S12E128 Data Sheet, Rev. 1.07 520 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.3
Data Direction Register A (DDRA)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 18-4. Data Direction Register A (DDRA)
Read: Anytime when register is in the map Write: Anytime when register is in the map This register controls the data direction for port A. When port A is operating as a general-purpose I/O port, DDRA determines the primary direction for each port A pin. A 1 causes the associated port pin to be an output and a 0 causes the associated pin to be a high-impedance input. The value in a DDR bit also affects the source of data for reads of the corresponding PORTA register. If the DDR bit is 0 (input) the buffered pin input state is read. If the DDR bit is 1 (output) the associated port data register bit state is read. This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally. It is reset to 0x00 so the DDR does not override the three-state control signals.
Table 18-3. DDRA Field Descriptions
Field 7:0 DDRA Description Data Direction Port A 0 Configure the corresponding I/O pin as an input 1 Configure the corresponding I/O pin as an output
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 521
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.4
Data Direction Register B (DDRB)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 18-5. Data Direction Register B (DDRB)
Read: Anytime when register is in the map Write: Anytime when register is in the map This register controls the data direction for port B. When port B is operating as a general-purpose I/O port, DDRB determines the primary direction for each port B pin. A 1 causes the associated port pin to be an output and a 0 causes the associated pin to be a high-impedance input. The value in a DDR bit also affects the source of data for reads of the corresponding PORTB register. If the DDR bit is 0 (input) the buffered pin input state is read. If the DDR bit is 1 (output) the associated port data register bit state is read. This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally. It is reset to 0x00 so the DDR does not override the three-state control signals.
Table 18-4. DDRB Field Descriptions
Field 7:0 DDRB Description Data Direction Port B 0 Configure the corresponding I/O pin as an input 1 Configure the corresponding I/O pin as an output
MC9S12E128 Data Sheet, Rev. 1.07 522 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.5
Reserved Registers
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-6. Reserved Register
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-7. Reserved Register
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-8. Reserved Register
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-9. Reserved Register
These register locations are not used (reserved). All unused registers and bits in this block return logic 0s when read. Writes to these registers have no effect. These registers are not in the on-chip map in special peripheral mode.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 523
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.6
Port E Data Register (PORTE)
7 6 5 4 3 2 1 0
R Bit 7 W Reset Alternate Pin Function 0 NOACC 0 MODB or IPIPE1 or CLKTO 0 MODA or IPIPE0 0 ECLK 0 LSTRB or TAGLO 0 R/W 6 5 4 3 2
Bit 1
Bit 0
u IRQ
u XIRQ
= Unimplemented or Reserved
u = Unaffected by reset
Figure 18-10. Port E Data Register (PORTE)
Read: Anytime when register is in the map Write: Anytime when register is in the map Port E is associated with external bus control signals and interrupt inputs. These include mode select (MODB/IPIPE1, MODA/IPIPE0), E clock, size (LSTRB/TAGLO), read/write (R/W), IRQ, and XIRQ. When not used for one of these specific functions, port E pins 7:2 can be used as general-purpose I/O and pins 1:0 can be used as general-purpose input. The port E assignment register (PEAR) selects the function of each pin and DDRE determines whether each pin is an input or output when it is configured to be general-purpose I/O. DDRE also determines the source of data for a read of PORTE. Some of these pins have software selectable pull resistors. IRQ and XIRQ can only be pulled up whereas the polarity of the PE7, PE4, PE3, and PE2 pull resistors are determined by chip integration. Please refer to the device overview chapter (Signal Property Summary) to determine the polarity of these resistors. A single control bit enables the pull devices for all of these pins when they are configured as inputs. This register is not in the on-chip map in special peripheral mode or in expanded modes when the EME bit is set. Therefore, these accesses will be echoed externally. NOTE It is unwise to write PORTE and DDRE as a word access. If you are changing port E pins from being inputs to outputs, the data may have extra transitions during the write. It is best to initialize PORTE before enabling as outputs. NOTE To ensure that you read the value present on the PORTE pins, always wait at least one cycle after writing to the DDRE register before reading from the PORTE register.
MC9S12E128 Data Sheet, Rev. 1.07 524 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.7
Data Direction Register E (DDRE)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 6 5 4 3 Bit 2
0
0
0
0
= Unimplemented or Reserved
Figure 18-11. Data Direction Register E (DDRE)
Read: Anytime when register is in the map Write: Anytime when register is in the map Data direction register E is associated with port E. For bits in port E that are configured as general-purpose I/O lines, DDRE determines the primary direction of each of these pins. A 1 causes the associated bit to be an output and a 0 causes the associated bit to be an input. Port E bit 1 (associated with IRQ) and bit 0 (associated with XIRQ) cannot be configured as outputs. Port E, bits 1 and 0, can be read regardless of whether the alternate interrupt function is enabled. The value in a DDR bit also affects the source of data for reads of the corresponding PORTE register. If the DDR bit is 0 (input) the buffered pin input state is read. If the DDR bit is 1 (output) the associated port data register bit state is read. This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally. Also, it is not in the map in expanded modes while the EME control bit is set.
Table 18-5. DDRE Field Descriptions
Field 7:2 DDRE Description Data Direction Port E 0 Configure the corresponding I/O pin as an input 1 Configure the corresponding I/O pin as an output Note: It is unwise to write PORTE and DDRE as a word access. If you are changing port E pins from inputs to outputs, the data may have extra transitions during the write. It is best to initialize PORTE before enabling as outputs.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 525
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.8
Port E Assignment Register (PEAR)
7 6 5 4 3 2 1 0
R NOACCE W Reset Special Single Chip Special Test Peripheral Emulation Expanded Narrow Emulation Expanded Wide Normal Single Chip Normal Expanded Narrow Normal Expanded Wide 0 0 0 1 1 0 0 0
0 PIPOE NECLK LSTRE RDWE
0
0
0 0 0 0 0 0 0 0
0 1 0 1 1 0 0 0
0 0 0 0 0 1 0 0
0 1 0 1 1 0 0 0
0 1 0 1 1 0 0 0
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
= Unimplemented or Reserved
Figure 18-12. Port E Assignment Register (PEAR)
Read: Anytime (provided this register is in the map). Write: Each bit has specific write conditions. Please refer to the descriptions of each bit on the following pages. Port E serves as general-purpose I/O or as system and bus control signals. The PEAR register is used to choose between the general-purpose I/O function and the alternate control functions. When an alternate control function is selected, the associated DDRE bits are overridden. The reset condition of this register depends on the mode of operation because bus control signals are needed immediately after reset in some modes. In normal single-chip mode, no external bus control signals are needed so all of port E is configured for general-purpose I/O. In normal expanded modes, only the E clock is configured for its alternate bus control function and the other bits of port E are configured for general-purpose I/O. As the reset vector is located in external memory, the E clock is required for this access. R/W is only needed by the system when there are external writable resources. If the normal expanded system needs any other bus control signals, PEAR would need to be written before any access that needed the additional signals. In special test and emulation modes, IPIPE1, IPIPE0, E, LSTRB, and R/W are configured out of reset as bus control signals. This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally.
MC9S12E128 Data Sheet, Rev. 1.07 526 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
Table 18-6. PEAR Field Descriptions
Field 7 NOACCE Description CPU No Access Output Enable Normal: write once Emulation: write never Special: write anytime 1 The associated pin (port E, bit 7) is general-purpose I/O. 0 The associated pin (port E, bit 7) is output and indicates whether the cycle is a CPU free cycle. This bit has no effect in single-chip or special peripheral modes. Pipe Status Signal Output Enable Normal: write once Emulation: write never Special: write anytime. 0 The associated pins (port E, bits 6:5) are general-purpose I/O. 1 The associated pins (port E, bits 6:5) are outputs and indicate the state of the instruction queue This bit has no effect in single-chip or special peripheral modes. No External E Clock Normal and special: write anytime Emulation: write never 0 The associated pin (port E, bit 4) is the external E clock pin. External E clock is free-running if ESTR = 0 1 The associated pin (port E, bit 4) is a general-purpose I/O pin. External E clock is available as an output in all modes. Low Strobe (LSTRB) Enable Normal: write once Emulation: write never Special: write anytime. 0 The associated pin (port E, bit 3) is a general-purpose I/O pin. 1 The associated pin (port E, bit 3) is configured as the LSTRB bus control output. If BDM tagging is enabled, TAGLO is multiplexed in on the rising edge of ECLK and LSTRB is driven out on the falling edge of ECLK. This bit has no effect in single-chip, peripheral, or normal expanded narrow modes. Note: LSTRB is used during external writes. After reset in normal expanded mode, LSTRB is disabled to provide an extra I/O pin. If LSTRB is needed, it should be enabled before any external writes. External reads do not normally need LSTRB because all 16 data bits can be driven even if the system only needs 8 bits of data. Read/Write Enable Normal: write once Emulation: write never Special: write anytime 0 The associated pin (port E, bit 2) is a general-purpose I/O pin. 1 The associated pin (port E, bit 2) is configured as the R/W pin This bit has no effect in single-chip or special peripheral modes. Note: R/W is used for external writes. After reset in normal expanded mode, R/W is disabled to provide an extra I/O pin. If R/W is needed it should be enabled before any external writes.
5 PIPOE
4 NECLK
3 LSTRE
2 RDWE
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 527
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.9
Mode Register (MODE)
7 6 5 4 3 2 1 0
R MODC W Reset Special Single Chip Emulation Expanded Narrow Special Test Emulation Expanded Wide Normal Single Chip Normal Expanded Narrow Peripheral Normal Expanded Wide 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 MODB MODA
0 IVIS
0 EMK EME
0 0 0 0 0 0 0 0
0 1 1 1 0 0 0 0
0 0 0 0 0 0 0 0
0 1 0 1 0 0 0 0
0 1 0 1 0 0 0 0
= Unimplemented or Reserved
Figure 18-13. Mode Register (MODE)
Read: Anytime (provided this register is in the map). Write: Each bit has specific write conditions. Please refer to the descriptions of each bit on the following pages. The MODE register is used to establish the operating mode and other miscellaneous functions (i.e., internal visibility and emulation of port E and K). In special peripheral mode, this register is not accessible but it is reset as shown to system configuration features. Changes to bits in the MODE register are delayed one cycle after the write. This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally.
MC9S12E128 Data Sheet, Rev. 1.07 528 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
Table 18-7. MODE Field Descriptions
Field 7:5 MOD[C:A] Description Mode Select Bits -- These bits indicate the current operating mode. If MODA = 1, then MODC, MODB, and MODA are write never. If MODC = MODA = 0, then MODC, MODB, and MODA are writable with the exception that you cannot change to or from special peripheral mode If MODC = 1, MODB = 0, and MODA = 0, then MODC is write never. MODB and MODA are write once, except that you cannot change to special peripheral mode. From normal single-chip, only normal expanded narrow and normal expanded wide modes are available. See Table 18-8 and Table 18-16. 3 IVIS Internal Visibility (for both read and write accesses) -- This bit determines whether internal accesses generate a bus cycle that is visible on the external bus. Normal: write once Emulation: write never Special: write anytime 0 No visibility of internal bus operations on external bus. 1 Internal bus operations are visible on external bus. Emulate Port K Normal: write once Emulation: write never Special: write anytime 0 PORTK and DDRK are in the memory map so port K can be used for general-purpose I/O. 1 If in any expanded mode, PORTK and DDRK are removed from the memory map. In single-chip modes, PORTK and DDRK are always in the map regardless of the state of this bit. In special peripheral mode, PORTK and DDRK are never in the map regardless of the state of this bit. Emulate Port E Normal and Emulation: write never Special: write anytime 0 PORTE and DDRE are in the memory map so port E can be used for general-purpose I/O. 1 If in any expanded mode or special peripheral mode, PORTE and DDRE are removed from the memory map. Removing the registers from the map allows the user to emulate the function of these registers externally. In single-chip modes, PORTE and DDRE are always in the map regardless of the state of this bit.
1 EMK
0 EME
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 529
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
Table 18-8. MODC, MODB, and MODA Write Capabilitya
MODC 0 0 0 0 1 MODB 0 0 1 1 0 MODA 0 1 0 1 0 Mode Special single chip Emulation narrow Special test Emulation wide Normal single chip MODx Write Capability MODC, MODB, and MODA write anytime but not to 110b No write MODC, MODB, and MODA write anytime but not to 110(2) No write MODC write never, MODB and MODA write once but not to 110 No write No write No write
1 1 1
a b
0 1 1
1 0 1
Normal expanded narrow Special peripheral Normal expanded wide
No writes to the MOD bits are allowed while operating in a secure mode. For more details, refer to the device overview chapter. If you are in a special single-chip or special test mode and you write to this register, changing to normal single-chip mode, then one allowed write to this register remains. If you write to normal expanded or emulation mode, then no writes remain.
18.3.2.10 Pull Control Register (PUCR)
7 6 5 4 3 2 1 0
R PUPKE W Reset1 1
0
0 PUPEE
0
0 PUPBE PUPAE 0
0
0
1
0
0
0
NOTES: 1. The default value of this parameter is shown. Please refer to the device overview chapter to determine the actual reset state of this register.
= Unimplemented or Reserved
Figure 18-14. Pull Control Register (PUCR)
Read: Anytime (provided this register is in the map). Write: Anytime (provided this register is in the map). This register is used to select pull resistors for the pins associated with the core ports. Pull resistors are assigned on a per-port basis and apply to any pin in the corresponding port that is currently configured as an input. The polarity of these pull resistors is determined by chip integration. Please refer to the device overview chapter to determine the polarity of these resistors.
MC9S12E128 Data Sheet, Rev. 1.07 530 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally. NOTE These bits have no effect when the associated pin(s) are outputs. (The pull resistors are inactive.)
Table 18-9. PUCR Field Descriptions
Field 7 PUPKE 4 PUPEE Pull resistors Port K Enable 0 Port K pull resistors are disabled. 1 Enable pull resistors for port K input pins. Pull resistors Port E Enable 0 Port E pull resistors on bits 7, 4:0 are disabled. 1 Enable pull resistors for port E input pins bits 7, 4:0. Note: Pins 5 and 6 of port E have pull resistors which are only enabled during reset. This bit has no effect on these pins. Pull resistors Port B Enable 0 Port B pull resistors are disabled. 1 Enable pull resistors for all port B input pins. Pull resistors Port A Enable 0 Port A pull resistors are disabled. 1 Enable pull resistors for all port A input pins. Description
1 PUPBE 0 PUPAE
18.3.2.11 Reduced Drive Register (RDRIV)
7 6 5 4 3 2 1 0
R RDRK W Reset 0
0
0 RDPE
0
0 RDPB RDPA 0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-15. Reduced Drive Register (RDRIV)
Read: Anytime (provided this register is in the map) Write: Anytime (provided this register is in the map) This register is used to select reduced drive for the pins associated with the core ports. This gives reduced power consumption and reduced RFI with a slight increase in transition time (depending on loading). This feature would be used on ports which have a light loading. The reduced drive function is independent of which function is being used on a particular port. This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 531
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
Table 18-10. RDRIV Field Descriptions
Field 7 RDRK 4 RDPE 1 RDPB 0 RDPA Description Reduced Drive of Port K 0 All port K output pins have full drive enabled. 1 All port K output pins have reduced drive enabled. Reduced Drive of Port E 0 All port E output pins have full drive enabled. 1 All port E output pins have reduced drive enabled. Reduced Drive of Port B 0 All port B output pins have full drive enabled. 1 All port B output pins have reduced drive enabled. Reduced Drive of Ports A 0 All port A output pins have full drive enabled. 1 All port A output pins have reduced drive enabled.
18.3.2.12 External Bus Interface Control Register (EBICTL)
7 6 5 4 3 2 1 0
R W Reset: Peripheral All other modes
0
0
0
0
0
0
0 ESTR
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 1
= Unimplemented or Reserved
Figure 18-16. External Bus Interface Control Register (EBICTL)
Read: Anytime (provided this register is in the map) Write: Refer to individual bit descriptions below The EBICTL register is used to control miscellaneous functions (i.e., stretching of external E clock). This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally.
Table 18-11. EBICTL Field Descriptions
Field 0 ESTR Description E Clock Stretches -- This control bit determines whether the E clock behaves as a simple free-running clock or as a bus control signal that is active only for external bus cycles. Normal and Emulation: write once Special: write anytime 0 E never stretches (always free running). 1 E stretches high during stretched external accesses and remains low during non-visible internal accesses. This bit has no effect in single-chip modes.
MC9S12E128 Data Sheet, Rev. 1.07 532 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.13 Reserved Register
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-17. Reserved Register
This register location is not used (reserved). All bits in this register return logic 0s when read. Writes to this register have no effect. This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these accesses will be echoed externally.
18.3.2.14 IRQ Control Register (IRQCR)
7 6 5 4 3 2 1 0
R IRQE W Reset 0 1 IRQEN
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-18. IRQ Control Register (IRQCR)
Read: See individual bit descriptions below Write: See individual bit descriptions below
Table 18-12. IRQCR Field Descriptions
Field 7 IRQE Description IRQ Select Edge Sensitive Only Special modes: read or write anytime Normal and Emulation modes: read anytime, write once 0 IRQ configured for low level recognition. 1 IRQ configured to respond only to falling edges. Falling edges on the IRQ pin will be detected anytime IRQE = 1 and will be cleared only upon a reset or the servicing of the IRQ interrupt. External IRQ Enable Normal, emulation, and special modes: read or write anytime 0 External IRQ pin is disconnected from interrupt logic. 1 External IRQ pin is connected to interrupt logic. Note: When IRQEN = 0, the edge detect latch is disabled.
6 IRQEN
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 533
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.15 Port K Data Register (PORTK)
7 6 5 4 3 2 1 0
R Bit 7 W Reset Alternate Pin Function 0 ECS 0 XCS 0 XAB19 0 XAB18 0 XAB17 0 XAB16 0 XAB15 0 XAB14 6 5 4 3 2 1 Bit 0
Figure 18-19. Port K Data Register (PORTK)
Read: Anytime Write: Anytime This port is associated with the internal memory expansion emulation pins. When the port is not enabled to emulate the internal memory expansion, the port pins are used as general-purpose I/O. When port K is operating as a general-purpose I/O port, DDRK determines the primary direction for each port K pin. A 1 causes the associated port pin to be an output and a 0 causes the associated pin to be a high-impedance input. The value in a DDR bit also affects the source of data for reads of the corresponding PORTK register. If the DDR bit is 0 (input) the buffered pin input is read. If the DDR bit is 1 (output) the output of the port data register is read. This register is not in the map in peripheral or expanded modes while the EMK control bit in MODE register is set. Therefore, these accesses will be echoed externally. When inputs, these pins can be selected to be high impedance or pulled up, based upon the state of the PUPKE bit in the PUCR register.
Table 18-13. PORTK Field Descriptions
Field 7 Port K, Bit 7 Description Port K, Bit 7 -- This bit is used as an emulation chip select signal for the emulation of the internal memory expansion, or as general-purpose I/O, depending upon the state of the EMK bit in the MODE register. While this bit is used as a chip select, the external bit will return to its de-asserted state (VDD) for approximately 1/4 cycle just after the negative edge of ECLK, unless the external access is stretched and ECLK is free-running (ESTR bit in EBICTL = 0). See the MMC block description chapter for additional details on when this signal will be active. Port K, Bit 6 -- This bit is used as an external chip select signal for most external accesses that are not selected by ECS (see the MMC block description chapter for more details), depending upon the state the of the EMK bit in the MODE register. While this bit is used as a chip select, the external pin will return to its deasserted state (VDD) for approximately 1/4 cycle just after the negative edge of ECLK, unless the external access is stretched and ECLK is free-running (ESTR bit in EBICTL = 0).
6 Port K, Bit 6
5:0 Port K, Bits 5:0 -- These six bits are used to determine which FLASH/ROM or external memory array page Port K, Bits 5:0 is being accessed. They can be viewed as expanded addresses XAB19-XAB14 of the 20-bit address used to access up to1M byte internal FLASH/ROM or external memory array. Alternatively, these bits can be used for general-purpose I/O depending upon the state of the EMK bit in the MODE register.
MC9S12E128 Data Sheet, Rev. 1.07 534 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.3.2.16 Port K Data Direction Register (DDRK)
7 6 5 4 3 2 1 0
R Bit 7 W Reset 0 0 0 0 0 0 0 0 6 5 4 3 2 1 Bit 0
Figure 18-20. Port K Data Direction Register (DDRK)
Read: Anytime Write: Anytime This register determines the primary direction for each port K pin configured as general-purpose I/O. This register is not in the map in peripheral or expanded modes while the EMK control bit in MODE register is set. Therefore, these accesses will be echoed externally.
Table 18-14. EBICTL Field Descriptions
Field 7:0 DDRK Description Data Direction Port K Bits 0 Associated pin is a high-impedance input 1 Associated pin is an output Note: It is unwise to write PORTK and DDRK as a word access. If you are changing port K pins from inputs to outputs, the data may have extra transitions during the write. It is best to initialize PORTK before enabling as outputs. Note: To ensure that you read the correct value from the PORTK pins, always wait at least one cycle after writing to the DDRK register before reading from the PORTK register.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 535
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.4
18.4.1
Functional Description
Detecting Access Type from External Signals
The external signals LSTRB, R/W, and AB0 indicate the type of bus access that is taking place. Accesses to the internal RAM module are the only type of access that would produce LSTRB = AB0 = 1, because the internal RAM is specifically designed to allow misaligned 16-bit accesses in a single cycle. In these cases the data for the address that was accessed is on the low half of the data bus and the data for address + 1 is on the high half of the data bus. This is summarized in Table 18-15.
Table 18-15. Access Type vs. Bus Control Pins
LSTRB 1 0 1 0 0 1 0 1 AB0 0 1 0 1 0 1 0 1 R/W 1 1 0 0 1 1 0 0 Type of Access 8-bit read of an even address 8-bit read of an odd address 8-bit write of an even address 8-bit write of an odd address 16-bit read of an even address 16-bit read of an odd address (low/high data swapped) 16-bit write to an even address 16-bit write to an odd address (low/high data swapped)
18.4.2
Stretched Bus Cycles
In order to allow fast internal bus cycles to coexist in a system with slower external memory resources, the HCS12 supports the concept of stretched bus cycles (module timing reference clocks for timers and baud rate generators are not affected by this stretching). Control bits in the MISC register in the MMC sub-block of the core specify the amount of stretch (0, 1, 2, or 3 periods of the internal bus-rate clock). While stretching, the CPU state machines are all held in their current state. At this point in the CPU bus cycle, write data would already be driven onto the data bus so the length of time write data is valid is extended in the case of a stretched bus cycle. Read data would not be captured by the system until the E clock falling edge. In the case of a stretched bus cycle, read data is not required until the specified setup time before the falling edge of the stretched E clock. The chip selects, and R/W signals remain valid during the period of stretching (throughout the stretched E high time). NOTE The address portion of the bus cycle is not stretched.
MC9S12E128 Data Sheet, Rev. 1.07 536 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.4.3
Modes of Operation
The operating mode out of reset is determined by the states of the MODC, MODB, and MODA pins during reset (Table 18-16). The MODC, MODB, and MODA bits in the MODE register show the current operating mode and provide limited mode switching during operation. The states of the MODC, MODB, and MODA pins are latched into these bits on the rising edge of the reset signal.
Table 18-16. Mode Selection
MODC 0 0 0 0 1 1 1 1 MODB 0 0 1 1 0 0 1 1 MODA 0 1 0 1 0 1 0 1 Mode Description Special Single Chip, BDM allowed and ACTIVE. BDM is allowed in all other modes but a serial command is required to make BDM active. Emulation Expanded Narrow, BDM allowed Special Test (Expanded Wide), BDM allowed Emulation Expanded Wide, BDM allowed Normal Single Chip, BDM allowed Normal Expanded Narrow, BDM allowed Peripheral; BDM allowed but bus operations would cause bus conflicts (must not be used) Normal Expanded Wide, BDM allowed
There are two basic types of operating modes: 1. Normal modes: Some registers and bits are protected against accidental changes. 2. Special modes: Allow greater access to protected control registers and bits for special purposes such as testing. A system development and debug feature, background debug mode (BDM), is available in all modes. In special single-chip mode, BDM is active immediately after reset. Some aspects of Port E are not mode dependent. Bit 1 of Port E is a general purpose input or the IRQ interrupt input. IRQ can be enabled by bits in the CPU's condition codes register but it is inhibited at reset so this pin is initially configured as a simple input with a pull-up. Bit 0 of Port E is a general purpose input or the XIRQ interrupt input. XIRQ can be enabled by bits in the CPU's condition codes register but it is inhibited at reset so this pin is initially configured as a simple input with a pull-up. The ESTR bit in the EBICTL register is set to one by reset in any user mode. This assures that the reset vector can be fetched even if it is located in an external slow memory device. The PE6/MODB/IPIPE1 and PE5/MODA/IPIPE0 pins act as high-impedance mode select inputs during reset. The following paragraphs discuss the default bus setup and describe which aspects of the bus can be changed after reset on a per mode basis.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 537
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.4.3.1
Normal Operating Modes
These modes provide three operating configurations. Background debug is available in all three modes, but must first be enabled for some operations by means of a BDM background command, then activated. 18.4.3.1.1 Normal Single-Chip Mode
There is no external expansion bus in this mode. All pins of Ports A, B and E are configured as general purpose I/O pins Port E bits 1 and 0 are available as general purpose input only pins with internal pull resistors enabled. All other pins of Port E are bidirectional I/O pins that are initially configured as high-impedance inputs with internal pull resistors enabled. Ports A and B are configured as high-impedance inputs with their internal pull resistors disabled. The pins associated with Port E bits 6, 5, 3, and 2 cannot be configured for their alternate functions IPIPE1, IPIPE0, LSTRB, and R/W while the MCU is in single chip modes. In single chip modes, the associated control bits PIPOE, LSTRE, and RDWE are reset to zero. Writing the opposite state into them in single chip mode does not change the operation of the associated Port E pins. In normal single chip mode, the MODE register is writable one time. This allows a user program to change the bus mode to narrow or wide expanded mode and/or turn on visibility of internal accesses. Port E, bit 4 can be configured for a free-running E clock output by clearing NECLK=0. Typically the only use for an E clock output while the MCU is in single chip modes would be to get a constant speed clock for use in the external application system. 18.4.3.1.2 Normal Expanded Wide Mode
In expanded wide modes, Ports A and B are configured as a 16-bit multiplexed address and data bus and Port E bit 4 is configured as the E clock output signal. These signals allow external memory and peripheral devices to be interfaced to the MCU. Port E pins other than PE4/ECLK are configured as general purpose I/O pins (initially high-impedance inputs with internal pull resistors enabled). Control bits PIPOE, NECLK, LSTRE, and RDWE in the PEAR register can be used to configure Port E pins to act as bus control outputs instead of general purpose I/O pins. It is possible to enable the pipe status signals on Port E bits 6 and 5 by setting the PIPOE bit in PEAR, but it would be unusual to do so in this mode. Development systems where pipe status signals are monitored would typically use the special variation of this mode. The Port E bit 2 pin can be reconfigured as the R/W bus control signal by writing "1" to the RDWE bit in PEAR. If the expanded system includes external devices that can be written, such as RAM, the RDWE bit would need to be set before any attempt to write to an external location. If there are no writable resources in the external system, PE2 can be left as a general purpose I/O pin. The Port E bit 3 pin can be reconfigured as the LSTRB bus control signal by writing "1" to the LSTRE bit in PEAR. The default condition of this pin is a general purpose input because the LSTRB function is not needed in all expanded wide applications.
MC9S12E128 Data Sheet, Rev. 1.07 538 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
The Port E bit 4 pin is initially configured as ECLK output with stretch. The E clock output function depends upon the settings of the NECLK bit in the PEAR register, the IVIS bit in the MODE register and the ESTR bit in the EBICTL register. The E clock is available for use in external select decode logic or as a constant speed clock for use in the external application system. 18.4.3.1.3 Normal Expanded Narrow Mode
This mode is used for lower cost production systems that use 8-bit wide external EPROMs or RAMs. Such systems take extra bus cycles to access 16-bit locations but this may be preferred over the extra cost of additional external memory devices. Ports A and B are configured as a 16-bit address bus and Port A is multiplexed with data. Internal visibility is not available in this mode because the internal cycles would need to be split into two 8-bit cycles. Since the PEAR register can only be written one time in this mode, use care to set all bits to the desired states during the single allowed write. The PE3/LSTRB pin is always a general purpose I/O pin in normal expanded narrow mode. Although it is possible to write the LSTRE bit in PEAR to "1" in this mode, the state of LSTRE is overridden and Port E bit 3 cannot be reconfigured as the LSTRB output. It is possible to enable the pipe status signals on Port E bits 6 and 5 by setting the PIPOE bit in PEAR, but it would be unusual to do so in this mode. LSTRB would also be needed to fully understand system activity. Development systems where pipe status signals are monitored would typically use special expanded wide mode or occasionally special expanded narrow mode. The PE4/ECLK pin is initially configured as ECLK output with stretch. The E clock output function depends upon the settings of the NECLK bit in the PEAR register, the IVIS bit in the MODE register and the ESTR bit in the EBICTL register. In normal expanded narrow mode, the E clock is available for use in external select decode logic or as a constant speed clock for use in the external application system. The PE2/R/W pin is initially configured as a general purpose input with an internal pull resistor enabled but this pin can be reconfigured as the R/W bus control signal by writing "1" to the RDWE bit in PEAR. If the expanded narrow system includes external devices that can be written such as RAM, the RDWE bit would need to be set before any attempt to write to an external location. If there are no writable resources in the external system, PE2 can be left as a general purpose I/O pin. 18.4.3.1.4 Emulation Expanded Wide Mode
In expanded wide modes, Ports A and B are configured as a 16-bit multiplexed address and data bus and Port E provides bus control and status signals. These signals allow external memory and peripheral devices to be interfaced to the MCU. These signals can also be used by a logic analyzer to monitor the progress of application programs. The bus control related pins in Port E (PE7/NOACC, PE6/MODB/IPIPE1, PE5/MODA/IPIPE0, PE4/ECLK, PE3/LSTRB/TAGLO, and PE2/R/W) are all configured to serve their bus control output functions rather than general purpose I/O. Notice that writes to the bus control enable bits in the PEAR register in emulation mode are restricted.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 539
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
18.4.3.1.5
Emulation Expanded Narrow Mode
Expanded narrow modes are intended to allow connection of single 8-bit external memory devices for lower cost systems that do not need the performance of a full 16-bit external data bus. Accesses to internal resources that have been mapped external (i.e. PORTA, PORTB, DDRA, DDRB, PORTE, DDRE, PEAR, PUCR, RDRIV) will be accessed with a 16-bit data bus on Ports A and B. Accesses of 16-bit external words to addresses which are normally mapped external will be broken into two separate 8-bit accesses using Port A as an 8-bit data bus. Internal operations continue to use full 16-bit data paths. They are only visible externally as 16-bit information if IVIS=1. Ports A and B are configured as multiplexed address and data output ports. During external accesses, address A15, data D15 and D7 are associated with PA7, address A0 is associated with PB0 and data D8 and D0 are associated with PA0. During internal visible accesses and accesses to internal resources that have been mapped external, address A15 and data D15 is associated with PA7 and address A0 and data D0 is associated with PB0. The bus control related pins in Port E (PE7/NOACC, PE6/MODB/IPIPE1, PE5/MODA/IPIPE0, PE4/ECLK, PE3/LSTRB/TAGLO, and PE2/R/W) are all configured to serve their bus control output functions rather than general purpose I/O. Notice that writes to the bus control enable bits in the PEAR register in emulation mode are restricted. The main difference between special modes and normal modes is that some of the bus control and system control signals cannot be written in emulation modes.
18.4.3.2
Special Operating Modes
There are two special operating modes that correspond to normal operating modes. These operating modes are commonly used in factory testing and system development. 18.4.3.2.1 Special Single-Chip Mode
When the MCU is reset in this mode, the background debug mode is enabled and active. The MCU does not fetch the reset vector and execute application code as it would in other modes. Instead the active background mode is in control of CPU execution and BDM firmware is waiting for additional serial commands through the BKGD pin. When a serial command instructs the MCU to return to normal execution, the system will be configured as described below unless the reset states of internal control registers have been changed through background commands after the MCU was reset. There is no external expansion bus after reset in this mode. Ports A and B are initially simple bidirectional I/O pins that are configured as high-impedance inputs with internal pull resistors disabled; however, writing to the mode select bits in the MODE register (which is allowed in special modes) can change this after reset. All of the Port E pins (except PE4/ECLK) are initially configured as general purpose high-impedance inputs with internal pull resistors enabled. PE4/ECLK is configured as the E clock output in this mode. The pins associated with Port E bits 6, 5, 3, and 2 cannot be configured for their alternate functions IPIPE1, IPIPE0, LSTRB, and R/W while the MCU is in single chip modes. In single chip modes, the associated
MC9S12E128 Data Sheet, Rev. 1.07 540 Freescale Semiconductor
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
control bits PIPOE, LSTRE and RDWE are reset to zero. Writing the opposite value into these bits in single chip mode does not change the operation of the associated Port E pins. Port E, bit 4 can be configured for a free-running E clock output by clearing NECLK=0. Typically the only use for an E clock output while the MCU is in single chip modes would be to get a constant speed clock for use in the external application system. 18.4.3.2.2 Special Test Mode
In expanded wide modes, Ports A and B are configured as a 16-bit multiplexed address and data bus and Port E provides bus control and status signals. In special test mode, the write protection of many control bits is lifted so that they can be thoroughly tested without needing to go through reset.
18.4.3.3
Test Operating Mode
There is a test operating mode in which an external master, such as an I.C. tester, can control the on-chip peripherals. 18.4.3.3.1 Peripheral Mode
This mode is intended for factory testing of the MCU. In this mode, the CPU is inactive and an external (tester) bus master drives address, data and bus control signals in through Ports A, B and E. In effect, the whole MCU acts as if it was a peripheral under control of an external CPU. This allows faster testing of on-chip memory and peripherals than previous testing methods. Since the mode control register is not accessible in peripheral mode, the only way to change to another mode is to reset the MCU into a different mode. Background debugging should not be used while the MCU is in special peripheral mode as internal bus conflicts between BDM and the external master can cause improper operation of both functions.
18.4.4
Internal Visibility
Internal visibility is available when the MCU is operating in expanded wide modes or emulation narrow mode. It is not available in single-chip, peripheral or normal expanded narrow modes. Internal visibility is enabled by setting the IVIS bit in the MODE register. If an internal access is made while E, R/W, and LSTRB are configured as bus control outputs and internal visibility is off (IVIS=0), E will remain low for the cycle, R/W will remain high, and address, data and the LSTRB pins will remain at their previous state. When internal visibility is enabled (IVIS=1), certain internal cycles will be blocked from going external. During cycles when the BDM is selected, R/W will remain high, data will maintain its previous state, and address and LSTRB pins will be updated with the internal value. During CPU no access cycles when the BDM is not driving, R/W will remain high, and address, data and the LSTRB pins will remain at their previous state.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 541
Chapter 18 Multiplexed External Bus Interface (MEBIV3)
NOTE When the system is operating in a secure mode, internal visibility is not available (i.e., IVIS = 1 has no effect). Also, the IPIPE signals will not be visible, regardless of operating mode. IPIPE1-IPIPE0 will display 0es if they are enabled. In addition, the MOD bits in the MODE control register cannot be written.
18.4.5
Low-Power Options
The MEBI does not contain any user-controlled options for reducing power consumption. The operation of the MEBI in low-power modes is discussed in the following subsections.
18.4.5.1
Operation in Run Mode
The MEBI does not contain any options for reducing power in run mode; however, the external addresses are conditioned to reduce power in single-chip modes. Expanded bus modes will increase power consumption.
18.4.5.2
Operation in Wait Mode
The MEBI does not contain any options for reducing power in wait mode.
18.4.5.3
Operation in Stop Mode
The MEBI will cease to function after execution of a CPU STOP instruction.
MC9S12E128 Data Sheet, Rev. 1.07 542 Freescale Semiconductor
Chapter 19 Module Mapping Control (MMCV4)
19.1 Introduction
This section describes the functionality of the module mapping control (MMC) sub-block of the S12 core platform. The block diagram of the MMC is shown in Figure 19-1.
MMC SECURE BDM_UNSECURE STOP, WAIT SECURITY MMC_SECURE
ADDRESS DECODE READ & WRITE ENABLES CLOCKS, RESET MODE INFORMATION INTERNAL MEMORY EXPANSION REGISTERS PORT K INTERFACE MEMORY SPACE SELECT(S) PERIPHERAL SELECT EBI ALTERNATE ADDRESS BUS EBI ALTERNATE WRITE DATA BUS EBI ALTERNATE READ DATA BUS ALTERNATE ADDRESS BUS (BDM) CPU ADDRESS BUS CPU READ DATA BUS CPU WRITE DATA BUS CPU CONTROL BUS CONTROL ALTERNATE WRITE DATA BUS (BDM) ALTERNATE READ DATA BUS (BDM) CORE SELECT (S)
Figure 19-1. MMC Block Diagram
The MMC is the sub-module which controls memory map assignment and selection of internal resources and external space. Internal buses between the core and memories and between the core and peripherals is controlled in this module. The memory expansion is generated in this module.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 543
Chapter 19 Module Mapping Control (MMCV4)
19.1.1
* * * * * * * * * * *
Features
Registers for mapping of address space for on-chip RAM, EEPROM, and FLASH (or ROM) memory blocks and associated registers Memory mapping control and selection based upon address decode and system operating mode Core address bus control Core data bus control and multiplexing Core security state decoding Emulation chip select signal generation (ECS) External chip select signal generation (XCS) Internal memory expansion External stretch and ROM mapping control functions via the MISC register Reserved registers for test purposes Configurable system memory options defined at integration of core into the system-on-a-chip (SoC).
19.1.2
Modes of Operation
Some of the registers operate differently depending on the mode of operation (i.e., normal expanded wide, special single chip, etc.). This is best understood from the register descriptions.
19.2
External Signal Description
All interfacing with the MMC sub-block is done within the core, it has no external signals.
19.3
Memory Map and Register Definition
A summary of the registers associated with the MMC sub-block is shown in Figure 19-2. Detailed descriptions of the registers and bits are given in the subsections that follow.
19.3.1
Module Memory Map
Table 19-1. MMC Memory Map
Address Offset Register Initialization of Internal RAM Position Register (INITRM) Initialization of Internal Registers Position Register (INITRG) Initialization of Internal EEPROM Position Register (INITEE) Miscellaneous System Control Register (MISC) Reserved . . . . Access R/W R/W R/W R/W -- --
MC9S12E128 Data Sheet, Rev. 1.07 544 Freescale Semiconductor
Chapter 19 Module Mapping Control (MMCV4)
Table 19-1. MMC Memory Map (continued)
Address Offset Reserved . . Memory Size Register 0 (MEMSIZ0) Memory Size Register 1 (MEMSIZ1) . . . . Program Page Index Register (PPAGE) Reserved R/W -- . . Register Access -- -- R R
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 545
Chapter 19 Module Mapping Control (MMCV4)
19.3.2
Name INITRM
Register Descriptions
Bit 7 R W RAM15 0 6 RAM14 5 RAM13 4 RAM12 3 RAM11 2 0 1 0 Bit 0 RAMHAL 0
INITRG
R W
REG14
REG13
REG12
REG11
0
0
INITEE
R W
EE15 0
EE14 0
EE13 0
EE12 0
EE11
0
0
EEON
MISC
R W
EXSTR1 3
EXSTR0 2
ROMHM 1
ROMON Bit 0
MTSTO
R W
Bit 7
6
5
4
MTST1
R W
Bit 7
6
5
4
3
2
1
Bit 0
MEMSIZ0
R REG_SW0 W
0
EEP_SW1 EEP_SW0
0
RAM_SW2 RAM_SW1 RAM_SW0
MEMSIZ1
R ROM_SW1 ROM_SW0 W
0
0
0
0
PAG_SW1 PAG_SW0
PPAGE
R W
0
0
PIX5 0
PIX4 0
PIX3 0
PIX2 0
PIX1 0
PIX0 0
Reserved
R W
0
0
= Unimplemented
Figure 19-2. MMC Register Summary
19.3.2.1
Initialization of Internal RAM Position Register (INITRM)
7 6 5 4 3 2 1 0
R RAM15 W Reset 0 0 0 0 1 RAM14 RAM13 RAM12 RAM11
0
0 RAMHAL
0
0
1
= Unimplemented or Reserved
Figure 19-3. Initialization of Internal RAM Position Register (INITRM)
Read: Anytime
MC9S12E128 Data Sheet, Rev. 1.07 546 Freescale Semiconductor
Chapter 19 Module Mapping Control (MMCV4)
Write: Once in normal and emulation modes, anytime in special modes NOTE Writes to this register take one cycle to go into effect. This register initializes the position of the internal RAM within the on-chip system memory map.
Table 19-2. INITRM Field Descriptions
Field Description
7:3 Internal RAM Map Position -- These bits determine the upper five bits of the base address for the system's RAM[15:11] internal RAM array. 0 RAMHAL RAM High-Align -- RAMHAL specifies the alignment of the internal RAM array. 0 Aligns the RAM to the lowest address (0x0000) of the mappable space 1 Aligns the RAM to the higher address (0xFFFF) of the mappable space
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 547
Chapter 19 Module Mapping Control (MMCV4)
19.3.2.2
Initialization of Internal Registers Position Register (INITRG)
7 6 5 4 3 2 1 0
R W Reset
0 REG14 0 0 REG13 0 REG12 0 REG11 0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-4. Initialization of Internal Registers Position Register (INITRG)
Read: Anytime Write: Once in normal and emulation modes and anytime in special modes This register initializes the position of the internal registers within the on-chip system memory map. The registers occupy either a 1K byte or 2K byte space and can be mapped to any 2K byte space within the first 32K bytes of the system's address space.
Table 19-3. INITRG Field Descriptions
Field Description
6:3 Internal Register Map Position -- These four bits in combination with the leading zero supplied by bit 7 of REG[14:11] INITRG determine the upper five bits of the base address for the system's internal registers (i.e., the minimum base address is 0x0000 and the maximum is 0x7FFF).
MC9S12E128 Data Sheet, Rev. 1.07 548 Freescale Semiconductor
Chapter 19 Module Mapping Control (MMCV4)
19.3.2.3
Initialization of Internal EEPROM Position Register (INITEE)
7 6 5 4 3 2 1 0
R EE15 W Reset1 -- -- -- -- -- EE14 EE13 EE12 EE11
0
0 EEON
--
--
--
1. The reset state of this register is controlled at chip integration. Please refer to the device overview section to determine the actual reset state of this register. = Unimplemented or Reserved
Figure 19-5. Initialization of Internal EEPROM Position Register (INITEE)
Read: Anytime Write: The EEON bit can be written to any time on all devices. Bits E[11:15] are "write anytime in all modes" on most devices. On some devices, bits E[11:15] are "write once in normal and emulation modes and write anytime in special modes". See device overview chapter to determine the actual write access rights. NOTE Writes to this register take one cycle to go into effect. This register initializes the position of the internal EEPROM within the on-chip system memory map.
Table 19-4. INITEE Field Descriptions
Field 7:3 EE[15:11] 0 EEON Description Internal EEPROM Map Position -- These bits determine the upper five bits of the base address for the system's internal EEPROM array. Enable EEPROM -- This bit is used to enable the EEPROM memory in the memory map. 0 Disables the EEPROM from the memory map. 1 Enables the EEPROM in the memory map at the address selected by EE[15:11].
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 549
Chapter 19 Module Mapping Control (MMCV4)
19.3.2.4
Miscellaneous System Control Register (MISC)
7 6 5 4 3 2 1 0
R W Reset: Expanded or Emulation Reset: Peripheral or Single Chip Reset: Special Test
0
0
0
0 EXSTR1 EXSTR0 ROMHM ROMON --1 1 0
0 0 0
0 0 0
0 0 0
0 0 0
1 1 1
1 1 1
0 0 0
1. The reset state of this bit is determined at the chip integration level. = Unimplemented or Reserved
Figure 19-6. Miscellaneous System Control Register (MISC)
Read: Anytime Write: As stated in each bit description NOTE Writes to this register take one cycle to go into effect. This register initializes miscellaneous control functions.
Table 19-5. INITEE Field Descriptions
Field Description
3:2 External Access Stretch Bits 1 and 0 EXSTR[1:0] Write: once in normal and emulation modes and anytime in special modes This two-bit field determines the amount of clock stretch on accesses to the external address space as shown in Table 19-6. In single chip and peripheral modes these bits have no meaning or effect. 1 ROMHM FLASH EEPROM or ROM Only in Second Half of Memory Map Write: once in normal and emulation modes and anytime in special modes 0 The fixed page(s) of FLASH EEPROM or ROM in the lower half of the memory map can be accessed. 1 Disables direct access to the FLASH EEPROM or ROM in the lower half of the memory map. These physical locations of the FLASH EEPROM or ROM remain accessible through the program page window. ROMON -- Enable FLASH EEPROM or ROM Write: once in normal and emulation modes and anytime in special modes This bit is used to enable the FLASH EEPROM or ROM memory in the memory map. 0 Disables the FLASH EEPROM or ROM from the memory map. 1 Enables the FLASH EEPROM or ROM in the memory map.
0 ROMON
Table 19-6. External Stretch Bit Definition
Stretch Bit EXSTR1 0 0 1 1 Stretch Bit EXSTR0 0 1 0 1 MC9S12E128 Data Sheet, Rev. 1.07 550 Freescale Semiconductor Number of E Clocks Stretched 0 1 2 3
Chapter 19 Module Mapping Control (MMCV4)
19.3.2.5
Reserved Test Register 0 (MTST0)
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-7. Reserved Test Register 0 (MTST0)
Read: Anytime Write: No effect -- this register location is used for internal test purposes.
19.3.2.6
Reserved Test Register 1 (MTST1)
7 6 5 4 3 2 1 0
R W Reset
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
= Unimplemented or Reserved
Figure 19-8. Reserved Test Register 1 (MTST1)
Read: Anytime Write: No effect -- this register location is used for internal test purposes.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 551
Chapter 19 Module Mapping Control (MMCV4)
19.3.2.7
Memory Size Register 0 (MEMSIZ0)
7 6 5 4 3 2 1 0
R REG_SW0 W Reset --
0
EEP_SW1
EEP_SW0
0
RAM_SW2
RAM_SW1
RAM_SW0
--
--
--
--
--
--
--
= Unimplemented or Reserved
Figure 19-9. Memory Size Register 0 (MEMSIZ0)
Read: Anytime Write: Writes have no effect Reset: Defined at chip integration, see device overview section. The MEMSIZ0 register reflects the state of the register, EEPROM and RAM memory space configuration switches at the core boundary which are configured at system integration. This register allows read visibility to the state of these switches.
Table 19-7. MEMSIZ0 Field Descriptions
Field 7 REG_SW0 Description Allocated System Register Space 0 Allocated system register space size is 1K byte 1 Allocated system register space size is 2K byte
5:4 Allocated System EEPROM Memory Space -- The allocated system EEPROM memory space size is as EEP_SW[1:0] given in Table 19-8. 2 Allocated System RAM Memory Space -- The allocated system RAM memory space size is as given in RAM_SW[2:0] Table 19-9.
Table 19-8. Allocated EEPROM Memory Space
eep_sw1:eep_sw0 00 01 10 11 Allocated EEPROM Space 0K byte 2K bytes 4K bytes 8K bytes
Table 19-9. Allocated RAM Memory Space
ram_sw2:ram_sw0 000 001 010 011 100 Allocated RAM Space 2K bytes 4K bytes 6K bytes 8K bytes 10K bytes RAM Mappable Region 2K bytes 4K bytes 8K bytes
2
INITRM Bits Used RAM[15:11] RAM[15:12] RAM[15:13] RAM[15:13] RAM[15:14]
RAM Reset Base Address1 0x0800 0x0000 0x0800 0x0000 0x1800
8K bytes 16K bytes
2
MC9S12E128 Data Sheet, Rev. 1.07 552 Freescale Semiconductor
Chapter 19 Module Mapping Control (MMCV4)
Table 19-9. Allocated RAM Memory Space (continued)
ram_sw2:ram_sw0 101 110 111
1 2
Allocated RAM Space 12K bytes 14K bytes 16K bytes
RAM Mappable Region 16K bytes 2 16K bytes
2
INITRM Bits Used RAM[15:14] RAM[15:14] RAM[15:14]
RAM Reset Base Address1 0x1000 0x0800 0x0000
16K bytes
The RAM Reset BASE Address is based on the reset value of the INITRM register, 0x0009. Alignment of the Allocated RAM space within the RAM mappable region is dependent on the value of RAMHAL.
NOTE As stated, the bits in this register provide read visibility to the system physical memory space allocations defined at system integration. The actual array size for any given type of memory block may differ from the allocated size. Please refer to the device overview chapter for actual sizes.
19.3.2.8
Memory Size Register 1 (MEMSIZ1)
7 6 5 4 3 2 1 0
R ROM_SW1 W Reset --
ROM_SW0
0
0
0
0
PAG_SW1
PAG_SW0
--
--
--
--
--
--
--
= Unimplemented or Reserved
Figure 19-10. Memory Size Register 1 (MEMSIZ1)
Read: Anytime Write: Writes have no effect Reset: Defined at chip integration, see device overview section. The MEMSIZ1 register reflects the state of the FLASH or ROM physical memory space and paging switches at the core boundary which are configured at system integration. This register allows read visibility to the state of these switches.
Table 19-10. MEMSIZ0 Field Descriptions
Field Description
7:6 Allocated System FLASH or ROM Physical Memory Space -- The allocated system FLASH or ROM ROM_SW[1:0] physical memory space is as given in Table 19-11. 1:0 Allocated Off-Chip FLASH or ROM Memory Space -- The allocated off-chip FLASH or ROM memory space PAG_SW[1:0] size is as given in Table 19-12.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 553
Chapter 19 Module Mapping Control (MMCV4)
Table 19-11. Allocated FLASH/ROM Physical Memory Space
rom_sw1:rom_sw0 00 01 10 11 Allocated FLASH or ROM Space 0K byte 16K bytes 48K bytes(1) 64K bytes(1)
NOTES: 1. The ROMHM software bit in the MISC register determines the accessibility of the FLASH/ROM memory space. Please refer to Section 19.3.2.8, "Memory Size Register 1 (MEMSIZ1)," for a detailed functional description of the ROMHM bit.
Table 19-12. Allocated Off-Chip Memory Options
pag_sw1:pag_sw0 00 01 10 11 Off-Chip Space 876K bytes 768K bytes 512K bytes 0K byte On-Chip Space 128K bytes 256K bytes 512K bytes 1M byte
NOTE As stated, the bits in this register provide read visibility to the system memory space and on-chip/off-chip partitioning allocations defined at system integration. The actual array size for any given type of memory block may differ from the allocated size. Please refer to the device overview chapter for actual sizes.
19.3.2.9
Program Page Index Register (PPAGE)
7 6 5 4 3 2 1 0
R W Reset1
0
0 PIX5 PIX4 -- PIX3 -- PIX2 -- PIX1 -- PIX0 --
--
--
--
1. The reset state of this register is controlled at chip integration. Please refer to the device overview section to determine the actual reset state of this register. = Unimplemented or Reserved
Figure 19-11. Program Page Index Register (PPAGE)
Read: Anytime Write: Determined at chip integration. Generally it's: "write anytime in all modes;" on some devices it will be: "write only in special modes." Check specific device documentation to determine which applies. Reset: Defined at chip integration as either 0x00 (paired with write in any mode) or 0x3C (paired with write only in special modes), see device overview chapter.
MC9S12E128 Data Sheet, Rev. 1.07 554 Freescale Semiconductor
Chapter 19 Module Mapping Control (MMCV4)
The HCS12 core architecture limits the physical address space available to 64K bytes. The program page index register allows for integrating up to 1M byte of FLASH or ROM into the system by using the six page index bits to page 16K byte blocks into the program page window located from 0x8000 to 0xBFFF as defined in Table 19-14. CALL and RTC instructions have special access to read and write this register without using the address bus. NOTE Normal writes to this register take one cycle to go into effect. Writes to this register using the special access of the CALL and RTC instructions will be complete before the end of the associated instruction.
Table 19-13. MEMSIZ0 Field Descriptions
Field 5:0 PIX[5:0] Description Program Page Index Bits 5:0 -- These page index bits are used to select which of the 64 FLASH or ROM array pages is to be accessed in the program page window as shown in Table 19-14.
Table 19-14. Program Page Index Register Bits
PIX5 0 0 0 0 . . . . . 1 1 1 1 PIX4 0 0 0 0 . . . . . 1 1 1 1 PIX3 0 0 0 0 . . . . 1 1 1 1 PIX2 0 0 0 0 . . . . . 1 1 1 1 PIX1 0 0 1 1 . . . . . 0 0 1 1 PIX0 0 1 0 1 . . . . . 0 1 0 1 Program Space Selected 16K page 0 16K page 1 16K page 2 16K page 3 . . . . . 16K page 60 16K page 61 16K page 62 16K page 63
19.4
Functional Description
The MMC sub-block performs four basic functions of the core operation: bus control, address decoding and select signal generation, memory expansion, and security decoding for the system. Each aspect is described in the following subsections.
19.4.1
Bus Control
The MMC controls the address bus and data buses that interface the core with the rest of the system. This includes the multiplexing of the input data buses to the core onto the main CPU read data bus and control
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 555
Chapter 19 Module Mapping Control (MMCV4)
of data flow from the CPU to the output address and data buses of the core. In addition, the MMC manages all CPU read data bus swapping operations.
19.4.2
Address Decoding
As data flows on the core address bus, the MMC decodes the address information, determines whether the internal core register or firmware space, the peripheral space or a memory register or array space is being addressed and generates the correct select signal. This decoding operation also interprets the mode of operation of the system and the state of the mapping control registers in order to generate the proper select. The MMC also generates two external chip select signals, emulation chip select (ECS) and external chip select (XCS).
19.4.2.1
Select Priority and Mode Considerations
Although internal resources such as control registers and on-chip memory have default addresses, each can be relocated by changing the default values in control registers. Normally, I/O addresses, control registers, vector spaces, expansion windows, and on-chip memory are mapped so that their address ranges do not overlap. The MMC will make only one select signal active at any given time. This activation is based upon the priority outlined in Table 19-15. If two or more blocks share the same address space, only the select signal for the block with the highest priority will become active. An example of this is if the registers and the RAM are mapped to the same space, the registers will have priority over the RAM and the portion of RAM mapped in this shared space will not be accessible. The expansion windows have the lowest priority. This means that registers, vectors, and on-chip memory are always visible to a program regardless of the values in the page select registers.
Table 19-15. Select Signal Priority
Priority Highest ... ... ... ... Lowest Address Space BDM (internal to core) firmware or register space Internal register space RAM memory block EEPROM memory block On-chip FLASH or ROM Remaining external space
In expanded modes, all address space not used by internal resources is by default external memory space. The data registers and data direction registers for ports A and B are removed from the on-chip memory map and become external accesses. If the EME bit in the MODE register (see MEBI block description chapter) is set, the data and data direction registers for port E are also removed from the on-chip memory map and become external accesses. In special peripheral mode, the first 16 registers associated with bus expansion are removed from the on-chip memory map (PORTA, PORTB, DDRA, DDRB, PORTE, DDRE, PEAR, MODE, PUCR, RDRIV, and the EBI reserved registers).
MC9S12E128 Data Sheet, Rev. 1.07 556 Freescale Semiconductor
Chapter 19 Module Mapping Control (MMCV4)
In emulation modes, if the EMK bit in the MODE register (see MEBI block description chapter) is set, the data and data direction registers for port K are removed from the on-chip memory map and become external accesses.
19.4.2.2
Emulation Chip Select Signal
When the EMK bit in the MODE register (see MEBI block description chapter) is set, port K bit 7 is used as an active-low emulation chip select signal, ECS. This signal is active when the system is in emulation mode, the EMK bit is set and the FLASH or ROM space is being addressed subject to the conditions outlined in Section 19.4.3.2, "Extended Address (XAB19:14) and ECS Signal Functionality." When the EMK bit is clear, this pin is used for general purpose I/O.
19.4.2.3
External Chip Select Signal
When the EMK bit in the MODE register (see MEBI block description chapter) is set, port K bit 6 is used as an active-low external chip select signal, XCS. This signal is active only when the ECS signal described above is not active and when the system is addressing the external address space. Accesses to unimplemented locations within the register space or to locations that are removed from the map (i.e., ports A and B in expanded modes) will not cause this signal to become active. When the EMK bit is clear, this pin is used for general purpose I/O.
19.4.3
Memory Expansion
The HCS12 core architecture limits the physical address space available to 64K bytes. The program page index register allows for integrating up to 1M byte of FLASH or ROM into the system by using the six page index bits to page 16K byte blocks into the program page window located from 0x8000 to 0xBFFF in the physical memory space. The paged memory space can consist of solely on-chip memory or a combination of on-chip and off-chip memory. This partitioning is configured at system integration through the use of the paging configuration switches (pag_sw1:pag_sw0) at the core boundary. The options available to the integrator are as given in Table 19-16 (this table matches Table 19-12 but is repeated here for easy reference).
Table 19-16. Allocated Off-Chip Memory Options
pag_sw1:pag_sw0 00 01 10 11 Off-Chip Space 876K bytes 768K bytes 512K bytes 0K byte On-Chip Space 128K bytes 256K bytes 512K bytes 1M byte
Based upon the system configuration, the program page window will consider its access to be either internal or external as defined in Table 19-17.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 557
Chapter 19 Module Mapping Control (MMCV4)
Table 19-17. External/Internal Page Window Access
pag_sw1:pag_sw0 00 Partitioning 876K off-Chip, 128K on-Chip 768K off-chip, 256K on-chip 512K off-chip, 512K on-chip 0K off-chip, 1M on-chip PIX5:0 Value 0x0000-0x0037 0x0038-0x003F 0x0000-0x002F 0x0030-0x003F 0x0000-0x001F 0x0020-0x003F N/A 0x0000-0x003F Page Window Access External Internal External Internal External Internal External Internal
01
10
11
NOTE The partitioning as defined in Table 19-17 applies only to the allocated memory space and the actual on-chip memory sizes implemented in the system may differ. Please refer to the device overview chapter for actual sizes. The PPAGE register holds the page select value for the program page window. The value of the PPAGE register can be manipulated by normal read and write (some devices don't allow writes in some modes) instructions as well as the CALL and RTC instructions. Control registers, vector spaces, and a portion of on-chip memory are located in unpaged portions of the 64K byte physical address space. The stack and I/O addresses should also be in unpaged memory to make them accessible from any page. The starting address of a service routine must be located in unpaged memory because the 16-bit exception vectors cannot point to addresses in paged memory. However, a service routine can call other routines that are in paged memory. The upper 16K byte block of memory space (0xC000-0xFFFF) is unpaged. It is recommended that all reset and interrupt vectors point to locations in this area.
19.4.3.1
CALL and Return from Call Instructions
CALL and RTC are uninterruptable instructions that automate page switching in the program expansion window. CALL is similar to a JSR instruction, but the subroutine that is called can be located anywhere in the normal 64K byte address space or on any page of program expansion memory. CALL calculates and stacks a return address, stacks the current PPAGE value, and writes a new instruction-supplied value to PPAGE. The PPAGE value controls which of the 64 possible pages is visible through the 16K byte expansion window in the 64K byte memory map. Execution then begins at the address of the called subroutine. During the execution of a CALL instruction, the CPU: * Writes the old PPAGE value into an internal temporary register and writes the new instruction-supplied PPAGE value into the PPAGE register.
MC9S12E128 Data Sheet, Rev. 1.07 558 Freescale Semiconductor
Chapter 19 Module Mapping Control (MMCV4)
* * *
Calculates the address of the next instruction after the CALL instruction (the return address), and pushes this 16-bit value onto the stack. Pushes the old PPAGE value onto the stack. Calculates the effective address of the subroutine, refills the queue, and begins execution at the new address on the selected page of the expansion window.
This sequence is uninterruptable; there is no need to inhibit interrupts during CALL execution. A CALL can be performed from any address in memory to any other address. The PPAGE value supplied by the instruction is part of the effective address. For all addressing mode variations except indexed-indirect modes, the new page value is provided by an immediate operand in the instruction. In indexed-indirect variations of CALL, a pointer specifies memory locations where the new page value and the address of the called subroutine are stored. Using indirect addressing for both the new page value and the address within the page allows values calculated at run time rather than immediate values that must be known at the time of assembly. The RTC instruction terminates subroutines invoked by a CALL instruction. RTC unstacks the PPAGE value and the return address and refills the queue. Execution resumes with the next instruction after the CALL. During the execution of an RTC instruction, the CPU: * Pulls the old PPAGE value from the stack * Pulls the 16-bit return address from the stack and loads it into the PC * Writes the old PPAGE value into the PPAGE register * Refills the queue and resumes execution at the return address This sequence is uninterruptable; an RTC can be executed from anywhere in memory, even from a different page of extended memory in the expansion window. The CALL and RTC instructions behave like JSR and RTS, except they use more execution cycles. Therefore, routinely substituting CALL/RTC for JSR/RTS is not recommended. JSR and RTS can be used to access subroutines that are on the same page in expanded memory. However, a subroutine in expanded memory that can be called from other pages must be terminated with an RTC. And the RTC unstacks a PPAGE value. So any access to the subroutine, even from the same page, must use a CALL instruction so that the correct PPAGE value is in the stack.
19.4.3.2
Extended Address (XAB19:14) and ECS Signal Functionality
If the EMK bit in the MODE register is set (see MEBI block description chapter) the PIX5:0 values will be output on XAB19:14 respectively (port K bits 5:0) when the system is addressing within the physical program page window address space (0x8000-0xBFFF) and is in an expanded mode. When addressing anywhere else within the physical address space (outside of the paging space), the XAB19:14 signals will be assigned a constant value based upon the physical address space selected. In addition, the active-low emulation chip select signal, ECS, will likewise function based upon the assigned memory allocation. In the cases of 48K byte and 64K byte allocated physical FLASH/ROM space, the operation of the ECS signal will additionally depend upon the state of the ROMHM bit (see Section 19.3.2.4, "Miscellaneous System Control Register (MISC)") in the MISC register. Table 19-18, Table 19-19, Table 19-20, and
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 559
Chapter 19 Module Mapping Control (MMCV4)
Table 19-21 summarize the functionality of these signals based upon the allocated memory configuration. Again, this signal information is only available externally when the EMK bit is set and the system is in an expanded mode.
Table 19-18. 0K Byte Physical FLASH/ROM Allocated
Address Space 0x0000-0x3FFF 0x4000-0x7FFF 0x8000-0xBFFF 0xC000-0xFFFF Page Window Access N/A N/A N/A N/A ROMHM N/A N/A N/A N/A ECS 1 1 0 0 XAB19:14 0x3D 0x3E PIX[5:0] 0x3F
Table 19-19. 16K Byte Physical FLASH/ROM Allocated
Address Space 0x0000-0x3FFF 0x4000-0x7FFF 0x8000-0xBFFF 0xC000-0xFFFF Page Window Access N/A N/A N/A N/A ROMHM N/A N/A N/A N/A ECS 1 1 1 0 XAB19:14 0x3D 0x3E PIX[5:0] 0x3F
Table 19-20. 48K Byte Physical FLASH/ROM Allocated
Address Space 0x0000-0x3FFF 0x4000-0x7FFF 0x8000-0xBFFF 0xC000-0xFFFF Page Window Access N/A N/A N/A External Internal N/A ROMHM N/A 0 1 N/A N/A N/A ECS 1 0 1 1 0 0 0x3F PIX[5:0] XAB19:14 0x3D 0x3E
Table 19-21. 64K Byte Physical FLASH/ROM Allocated
Address Space 0x0000-0x3FFF 0x4000-0x7FFF 0x8000-0xBFFF 0xC000-0xFFFF Page Window Access N/A N/A N/A N/A External Internal N/A ROMHM 0 1 0 1 N/A N/A N/A ECS 0 1 0 1 1 0 0 0x3F PIX[5:0] 0x3E XAB19:14 0x3D
MC9S12E128 Data Sheet, Rev. 1.07 560 Freescale Semiconductor
Chapter 19 Module Mapping Control (MMCV4)
A graphical example of a memory paging for a system configured as 1M byte on-chip FLASH/ROM with 64K allocated physical space is given in Figure 19-12.
0x0000 61
16K FLASH (UNPAGED)
0x4000
62
16K FLASH (UNPAGED) ONE 16K FLASH/ROM PAGE ACCESSIBLE AT A TIME (SELECTED BY PPAGE = 0 TO 63) 0x8000 0 1 2 3 59 60 61 62 63
16K FLASH (PAGED)
0xC000 63 These 16K FLASH/ROM pages accessible from 0x0000 to 0x7FFF if selected by the ROMHM bit in the MISC register. 16K FLASH (UNPAGED)
0xFF00 0xFFFF VECTORS NORMAL SINGLE CHIP
Figure 19-12. Memory Paging Example: 1M Byte On-Chip FLASH/ROM, 64K Allocation
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 561
Chapter 19 Module Mapping Control (MMCV4)
MC9S12E128 Data Sheet, Rev. 1.07 562 Freescale Semiconductor
Appendix A Electrical Characteristics
Appendix A Electrical Characteristics
A.1 General
NOTE The electrical characteristics given in this section are preliminary and should be used as a guide only. Values cannot be guaranteed by Freescale and are subject to change without notice. The part is specified and tested over the 5V and 3.3V ranges. For the intermediate range, generally the electrical specifications for the 3.3V range apply, but the part is not tested in production test in the intermediate range. This supplement contains the most accurate electrical information for the MC9S12E128 microcontroller available at the time of publication. The information should be considered PRELIMINARY and is subject to change. This introduction is intended to give an overview on several common topics like power supply, current injection etc.
A.1.1
Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding the following classification is used and the parameters are tagged accordingly in the tables where appropriate. NOTE This classification will be added at a later release of the specification P: Those parameters are guaranteed during production testing on each individual device. C: Those parameters are achieved by the design characterization by measuring a statistically relevant sample size across process variations. They are regularly verified by production monitors. T: Those parameters are achieved by design characterization on a small sample size from typical devices. All values shown in the typical column are within this category. D: Those parameters are derived mainly from simulations.
A.1.2
Power Supply
The MC9S12E-Family utilizes several pins to supply power to the I/O ports, A/D converter, oscillator, PLL and internal logic. The VDDA, VSSA pair supplies the A/D converter and D/A converter. The VDDX, VSSX pair supplies the I/O pins The VDDR, VSSR pair supplies the internal voltage regulator.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 563
Appendix A Electrical Characteristics
VDD1, VSS1, VDD2 and VSS2 are the supply pins for the internal logic. VDDPLL, VSSPLL supply the oscillator and the PLL. VSS1 and VSS2 are internally connected by metal. VDD1 and VDD2 are internally connected by metal. VDDA, VDDX, VDDR as well as VSSA, VSSX, VSSR are connected by anti-parallel diodes for ESD protection. NOTE In the following context VDD5 is used for either VDDA, VDDR and VDDX; VSS5 is used for either VSSA, VSSR and VSSX unless otherwise noted. IDD5 denotes the sum of the currents flowing into the VDDA, VDDX and VDDR pins. VDD is used for VDD1, VDD2 and VDDPLL, VSS is used for VSS1, VSS2 and VSSPLL. IDD is used for the sum of the currents flowing into VDD1 and VDD2.
A.1.3
Pins
There are four groups of functional pins.
A.1.3.1
3.3V/5V I/O Pins
Those I/O pins have a nominal level of 3.3V or 5V depending on the application operating point. This group of pins is comprised of all port I/O pins, the analog inputs, BKGD pin and the RESET inputs.The internal structure of all those pins is identical, however some of the functionality may be disabled.
A.1.3.2
Analog Reference
This group of pins is comprised of the VRH and VRL pins.
A.1.3.3
Oscillator
The pins XFC, EXTAL, XTAL dedicated to the oscillator have a nominal 2.5V level. They are supplied by VDDPLL.
A.1.3.4
TEST
This pin is used for production testing only.
A.1.4
Current Injection
Power supply must maintain regulation within operating VDD5 or VDD range during instantaneous and operating maximum current conditions. If positive injection current (Vin > VDD5) is greater than IDD5, the
MC9S12E128 Data Sheet, Rev. 1.07 564 Freescale Semiconductor
Appendix A Electrical Characteristics
injection current may flow out of VDD5 and could result in external power supply going out of regulation. Insure external VDD5 load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power; e.g. if no system clock is present, or if clock rate is very low which would reduce overall power consumption.
A.1.5
Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the device. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either VSS5 or VDD5).
Table A-1. Absolute Maximum Ratings
Num 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
1
Rating I/O, Regulator and Analog Supply Voltage Internal Logic Supply Voltage1 PLL Supply Voltage 1 Voltage difference VDDX to VDDR and VDDA Voltage difference VSSX to VSSR and VSSA Digital I/O Input Voltage Analog Reference XFC, EXTAL, XTAL inputs TEST input Instantaneous Maximum Current Single pin limit for all digital I/O pins 2 Instantaneous Maximum Current Single pin limit for XFC, EXTAL, XTAL3 Instantaneous Maximum Current Single pin limit for TEST4 Operating Temperature Range (packaged) Operating Temperature Range (junction) Storage Temperature Range
Symbol VDD5 VDD VDDPLL VDDX VSSX VIN VRH, VRL VILV VTEST ID IDL I
DT
Min -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -25 -25 -0.25 - 40 - 40 - 65
Max 6.5 3.0 3.0 0.3 0.3 6.5 6.5 3.0 10.0 +25 +25 0 125 140 155
Unit V V V V V V V V V mA mA mA C C C
T
A
TJ Tstg
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The absolute maximum ratings apply when the device is powered from an external source. 2 All digital I/O pins are internally clamped to VSSX and VDDX, VSSR and VDDR or VSSA and VDDA. 3 These pins are internally clamped to V SSPLL and VDDPLL 4 This pin is clamped low to VSSR, but not clamped high. This pin must be tied low in applications.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 565
Appendix A Electrical Characteristics
A.1.6
ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 Stress test qualification for Automotive Grade Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body Model (HBM), the Machine Model (MM) and the Charge Device Model. A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification.
Table A-2. ESD and Latch-up Test Conditions
Model Human Body Series Resistance Storage Capacitance Number of Pulse per pin positive negative Machine Series Resistance Storage Capacitance Number of Pulse per pin positive negative Latch-up Minimum input voltage limit Maximum input voltage limit Description Symbol R1 C -- -- R1 C -- -- -- -- Value 1500 100 - 3 3 0 200 3 3 -2.5 7.5 V V Ohm pF Unit Ohm pF
Table A-3. ESD and Latch-Up Protection Characteristics
Num 1 2 3 4 C C C C C Rating Human Body Model (HBM) Machine Model (MM) Charge Device Model (CDM) Latch-up Current at 125C positive negative Latch-up Current at 27C positive negative Symbol VHBM VMM VCDM ILAT +100 -100 ILAT +200 -200 -- -- -- -- mA Min 2000 200 500 Max -- -- -- Unit V V V mA
5
C
MC9S12E128 Data Sheet, Rev. 1.07 566 Freescale Semiconductor
Appendix A Electrical Characteristics
A.1.7
Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions apply to all the following data. NOTE Instead of specifying ambient temperature all parameters are specified for the more meaningful silicon junction temperature. For power dissipation calculations refer to Section A.1.8, "Power Dissipation and Thermal Characteristics".
Table A-4. Operating Conditions
Rating I/O, Regulator and Analog Supply Voltage Internal Logic Supply Voltage1 PLL Supply Voltage 1 Voltage Difference VDDX to VDDA Voltage Difference VSSX to VSSR and VSSA Oscillator Bus Frequency2 Operating Junction Temperature Range
1
Symbol VDD5 VDD VDDPLL VDDX VSSX fosc fbus TJ
Min 2.97 2.35 2.35 -0.1 -0.1 0.5 0.25 -40
Typ 3.3/5 2.5 2.5 0 0 -- -- --
Max 5.5 2.75 2.75 0.1 0.1 16 25 140
Unit V V V V V MHz MHz C
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The given operating range applies when this regulator is disabled and the device is powered from an external source. 2 Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper operation.
A.1.8
Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum operating junction temperature is not exceeded. The average chip-junction temperature (TJ) in C can be obtained from:
T T T J J = T + (P * ) A D JA = Junction Temperature, [C ]
= Ambient Temperature, [C ] A P = Total Chip Power Dissipation, [W] D = Package Thermal Resistance, [C/W] JA
The total power dissipation can be calculated from:
P P D =P +P INT IO = Chip Internal Power Dissipation, [W]
INT
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 567
Appendix A Electrical Characteristics
Two cases with internal voltage regulator enabled and disabled must be considered: 1. Internal Voltage Regulator disabled
P P INT IO = =I DD V DD +I DDPLL V DDPLL +I DDA V DDA
RDSON IIOi2 i
Which is the sum of all output currents on I/O ports associated with VDDX and VDDM. For RDSON is valid:
R V OL = ----------- ;for outputs driven low DSON I OL
respectively
R V -V DD5 OH = ----------------------------------- ;for outputs driven high DSON I OH
2. Internal voltage regulator enabled
P INT =I DDR V DDR +I DDA V DDA
IDDR is the current shown in Table A-8 and not the overall current flowing into VDDR, which additionally contains the current flowing into the external loads with output high.
P IO =
RDSON IIOi2 i
Table A-5. Thermal Package Characteristics1
Rating Symbol JA JA JB JC JT JA JA JB JC JT Min -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- -- -- -- -- Max 54 41 31 11 2 51 41 27 14 3 Unit
oC/W oC/W o
Which is the sum of all output currents on I/O ports associated with VDDX and VDDR.
Num 1 2 3 4 5 6 7 8 9 10
1 2
C T T T T T T T T T T
Thermal Resistance LQFP112, single sided PCB2 Thermal Resistance LQFP112, double sided PCB with 2 internal planes3 Junction to Board LQFP112 Junction to Case LQFP112 Junction to Package Top LQFP112 Thermal Resistance QFP 80, single sided PCB Thermal Resistance QFP 80, double sided PCB with 2 internal planes Junction to Board QFP80 Junction to Case QFP80 Junction to Package Top QFP80
C/W
oC/W oC/W oC/W oC/W oC/W oC/W oC/W
The values for thermal resistance are achieved by package simulations PC Board according to EIA/JEDEC Standard 51-3 3 PC Board according to EIA/JEDEC Standard 51-7
MC9S12E128 Data Sheet, Rev. 1.07 568 Freescale Semiconductor
Appendix A Electrical Characteristics
A.1.9
I/O Characteristics
This section describes the characteristics of all 3.3V/5V I/O pins. All parameters are not always applicable, e.g., not all pins feature pull up/down resistances.
Table A-6. 5V I/O Characteristics
Conditions are shown in Table A-4 unless otherwise noted Num 1 C P T 2 P T 3 4 C P Input High Voltage Input High Voltage Input Low Voltage Input Low Voltage Input Hysteresis Input Leakage Current (pins in high ohmic input mode)1 Vin = VDD5 or VSS5 Output High Voltage (pins in output mode) Partial Drive IOH = -2mA Output High Voltage (pins in output mode) Full Drive IOH = -10mA Output Low Voltage (pins in output mode) Partial Drive IOL = +2mA Output Low Voltage (pins in output mode) Full Drive IOL = +10mA Internal Pull Up Device Current, tested at VIL Max. Internal Pull Up Device Current, tested at VIH Min. Internal Pull Down Device Current, tested at VIH Min. Internal Pull Down Device Current, tested at VIL Max. Input Capacitance Injection current2 Single Pin limit Total Device Limit. Sum of all injected currents Port AD Interrupt Input Pulse filtered3 Port AD Interrupt Input Pulse passed3 Rating Symbol VIH VIH VIL VIL VHYS I
in
Min 0.65*VDD5 -- -- VSS5 - 0.3 -- -1.0
Typ -- -- -- -- 250 --
Max -- VDD5 + 0.3 0.35*VDD5 -- -- 1.0
Unit V V V V mV A
5 6 7 8 9 10 11 12 13 14
C P C P P C P C D T
VOH VOH VOL VOL IPUL IPUH IPDH IPDL Cin IICS IICP tPIGN tPVAL
VDD5 - 0.8 VDD5 - 0.8 -- -- -- -10 -- 10 -- -2.5 -25 -- 10
-- -- -- -- -- -- -- -- 6 -- -- -- --
-- -- 0.8 0.8 -130 -- 130 -- -- 2.5 25 3 --
V V V V A A A A pF mA
15 16
1
P P
s s
Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each 8 C to 12 C in the temper ature range from 50 C to 125 C . 2 Refer to Section A.1.4, "Current Injection" for more details 3 Parameter only applies in STOP or Pseudo STOP mode.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 569
Appendix A Electrical Characteristics
Table A-7. Preliminary 3.3V I/O Characteristics
Conditions are shown in Table A-4 unless otherwise noted Num 1 C P T 2 P T 3 4 C P Input High Voltage Input High Voltage Input Low Voltage Input Low Voltage Input Hysteresis Input Leakage Current (pins in high ohmic input mode)1 Vin = VDD5 or VSS5 Output High Voltage (pins in output mode) Partial Drive IOH = -0.75mA Output High Voltage (pins in output mode) Full Drive IOH = -4mA Output Low Voltage (pins in output mode) Partial Drive IOL = +0.9mA Output Low Voltage (pins in output mode) Full Drive IOL = +4.75mA Internal Pull Up Device Current, tested at VIL Max. Internal Pull Up Device Current, tested at VIH Min. Internal Pull Down Device Current, tested at VIH Min. Internal Pull Down Device Current, tested at VIL Max. Input Capacitance Injection current2 Single Pin limit Total Device Limit. Sum of all injected currents Port AD Interrupt Input Pulse filtered3 Port AD Interrupt Input Pulse passed3 Rating Symbol VIH VIH VIL VIL V
HYS
Min 0.65*VDD5 -- -- VSS5 - 0.3
Typ -- -- -- -- 250
Max -- VDD5 + 0.3 0.35*VDD5 --
Unit V V V V mV
I
in
-1.0
--
1.0
A
5 6 7 8 9 10 11 12 13 14
C P C P P C P C D T
VOH VOH VOL VOL IPUL IPUH IPDH IPDL Cin IICS IICP tPIGN tPVAL
VDD5 - 0.4 VDD5 - 0.4 -- -- -- -6 -- 6 -- -2.5 -25 -- 10
-- -- -- -- -- -- -- -- 6 -- -- -- --
-- -- 0.4 0.4 -60 -- 60 -- -- 2.5 25 3 --
V V V V A A A A pF mA
15 16
1
P P
s s
Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each 8 C to 12 C in the temper ature range from 50 C to 125 C . 2 Refer to Section A.1.4, "Current Injection", for more details 3 Parameter only applies in STOP or Pseudo STOP mode.
A.1.10
Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for the measurements.
MC9S12E128 Data Sheet, Rev. 1.07 570 Freescale Semiconductor
Appendix A Electrical Characteristics
A.1.10.1
Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in single chip mode, internal voltage regulator enabled and at 25MHz bus frequency using a 4MHz oscillator.
A.1.10.2
Additional Remarks
In expanded modes the currents flowing in the system are highly dependent on the load at the address, data and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be given. A very good estimate is to take the single chip currents and add the currents due to the external loads.
Table A-8. Supply Current Characteristics
Conditions are shown in Table A-4 unless otherwise noted Num 1 2 P P 3 C C C C C C C 4 C P C C P C P C P 5 C P C C P C P C P
1 2
C P
Rating Run supply currents Single Chip, Internal regulator enabled Wait Supply current All modules enabled only RTI enabled Pseudo Stop Current (RTI and COP enabled) 1, 2 -40C 27C 70C 85C 105C 125C 140C Pseudo Stop Current (RTI and COP disabled) 1,2 -40C 27C 70C 85C "C" Temp Option 100C 105C "V" Temp Option 120C 125C "M" Temp Option 140C Stop Current 2 -40C 27C 70C 85C "C" Temp Option 100C 105C "V" Temp Option 120C 125C "M" Temp Option 140C
Symbol IDD5 IDDW
Min -- -- --
Typ -- -- -- 570 600 650 750 850 1200 1500 370 400 450 550 600 650 800 850 1200 12 30 100 130 160 200 350 400 600
Max 65
Unit mA mA
40 5 A -- -- -- -- -- -- -- A -- 500 -- -- 1600 -- 2100 -- 5000 A -- 100 -- -- 1200 -- 1700 -- 5000
IDDPS -- -- -- -- -- -- -- IDDPS -- -- -- -- -- -- -- -- -- IDDS -- -- -- -- -- -- -- -- --
PLL off At those low power dissipation levels TJ = TA can be assumed
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 571
Appendix A Electrical Characteristics
A.2
Voltage Regulator
This section describes the characteristics of the on chip voltage regulator.
Table A-9. Voltage Regulator Electrical Parameters
Num 1 3 C P P Characteristic Input Voltages Output Voltage Core Full Performance Mode Output Voltage PLL Full Performance Mode Low Voltage Interrupt1 Assert Level Deassert Level Low Voltage Reset2 Assert Level Deassert Level Power-on Reset3 Assert Level Deassert Level Symbol VVDDR,A VDD Min 2.97 2.35 Typical -- 2.5 Max 5.5 2.75 Unit V V
4
P
VDDPLL
2.35
2.5
2.75
V
5
P
VLVIA VLVID VLVRA VLVRD VPORA VPORD
4.1 4.25 2.25 -- 0.97 --
4.37 4.52 -- -- -----
4.66 4.77 -- 2.55 -- 2.05
V V V V V V
6
P
7
C
1 2
Monitors VDDA, active only in Full Performance Mode. Indicates I/O & ADC performance degradation due to low supply voltage. Monitors VDD, active only in Full Performance Mode. VLVRA and VPORD must overlap 3 Monitors V . Active in all modes. DD
The electrical characteristics given in this section are preliminary and should be used as a guide only. Values in this section cannot be guaranteed by Freescale and are subject to change without notice.
MC9S12E128 Data Sheet, Rev. 1.07 572 Freescale Semiconductor
Appendix A Electrical Characteristics
A.2.1
Chip Power-up and LVI/LVR Graphical Explanation
Voltage regulator sub modules LVI (low voltage interrupt), POR (power-on reset) and LVR (low voltage reset) handle chip power-up or drops of the supply voltage. Their function is described in Figure A-1. V
VLVID VLVIA VDD VDDA
VLVRD VLVRA VPORD
t
LVI
LVI enabled
POR
LVI disabled due to LVR
LVR
Figure A-1. Voltage Regulator -- Chip Power-up and Voltage Drops (not scaled)
A.2.2
A.2.2.1
Output Loads
Resistive Loads
The on-chip voltage regulator is intended to supply the internal logic and oscillator circuits allows no external DC loads.
A.2.2.2
Capacitive Loads
Table A-10. Voltage Regulator -- Capacitive Loads
The capacitive loads are specified in Table A-10. Ceramic capacitors with X7R dielectricum are required.
Num 1 2
Characteristic VDD external capacitive load VDDPLL external capacitive load
Symbol CDDext CDDPLLext
Min 200 90
Typical 440 220
Max 12000 5000
Unit nF nF
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 573
Appendix A Electrical Characteristics
A.3
A.3.1
Startup, Oscillator and PLL
Startup
Table A-11 summarizes several startup characteristics explained in this section.
Table A-11. Startup Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
1 2 3 4 5 6 7 8
C
T T D D D D P P POR release level POR assert level
Rating
Symbol
VPORR VPORA PWRSTL nRST PWIRQ tWRS VLVRR VLVRA
Min
Typ
Max
2.07
Unit
V V tosc
0.97 2 192 20 14 2.25 2.55 196
Reset input pulse width, minimum input time Startup from Reset Interrupt pulse width, IRQ edge-sensitive mode Wait recovery startup time LVR release level LVR assert level
nosc ns tcyc V V
A.3.1.1
POR
The release level VPORR and the assert level VPORA are derived from the VDD Supply. They are also valid if the device is powered externally. After releasing the POR reset the oscillator and the clock quality check are started. If after a time tCQOUT no valid oscillation is detected, the MCU will start using the internal self clock. The fastest startup time possible is given by nuposc.
A.3.1.2
LVR
The release level VLVRR and the assert level VLVRA are derived from the VDD Supply. They are also valid if the device is powered externally. After releasing the LVR reset the oscillator and the clock quality check are started. If after a time tCQOUT no valid oscillation is detected, the MCU will start using the internal self clock. The fastest startup time possible is given by nuposc.
A.3.1.3
SRAM Data Retention
Provided an appropriate external reset signal is applied to the MCU, preventing the CPU from executing code when VDD5 is out of specification limits, the SRAM contents integrity is guaranteed if after the reset the PORF bit in the CRG Flags Register has not been set.
MC9S12E128 Data Sheet, Rev. 1.07 574 Freescale Semiconductor
Appendix A Electrical Characteristics
A.3.1.4
External Reset
When external reset is asserted for a time greater than PWRSTL the CRG module generates an internal reset, and the CPU starts fetching the reset vector without doing a clock quality check, if there was an oscillation before reset.
A.3.1.5
Stop Recovery
Out of STOP the controller can be woken up by an external interrupt. A clock quality check as after POR is performed before releasing the clocks to the system.
A.3.1.6
Pseudo Stop and Wait Recovery
The recovery from Pseudo STOP and Wait are essentially the same since the oscillator was not stopped in both modes. The controller can be woken up by internal or external interrupts. After twrs the CPU starts fetching the interrupt vector.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 575
Appendix A Electrical Characteristics
A.3.2
Oscillator
The device features an internal Colpitts and Pierce oscillator. The selection of Colpitts oscillator or Pierce oscillator/external clock depends on the XCLKS signal which is sampled during reset. Pierce oscillator/external clock mode allows the input of a square wave. Before asserting the oscillator to the internal system clocks the quality of the oscillation is checked for each start from either power-on, STOP or oscillator fail. tCQOUT specifies the maximum time before switching to the internal self clock mode after POR or STOP if a proper oscillation is not detected. The quality check also determines the minimum oscillator start-up time tUPOSC. The device also features a clock monitor. A Clock Monitor Failure is asserted if the frequency of the incoming clock signal is below the Assert Frequency fCMFA.
Table A-12. Oscillator Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num C
1a 1b 2 3 4 5 6 7 8 9 10 11 12 13
Rating
Symbol
fOSC fOSC iOSC tUPOSC tCQOUT fCMFA fEXT tEXTL tEXTH tEXTR tEXTF CIN VDCBIAS VIH,EXTAL VIH,EXTAL VIL,EXTAL VIL,EXTAL VHYS,EXTAL
Min
0.5 0.5 100
Typ
Max
16 40
Unit
MHz MHz A
C Crystal oscillator range (Colpitts) C Crystal oscillator range (Pierce) 1 P Startup Current C Oscillator start-up time (Colpitts) D Clock Quality check time-out P Clock Monitor Failure Assert Frequency P External square wave input frequency 4 D External square wave pulse width low4 D External square wave pulse width high4 D External square wave rise time4 D External square wave fall time4 D Input Capacitance (EXTAL, XTAL pins) C DC Operating Bias in Colpitts Configuration on EXTAL Pin
82 0.45 50 0.5 9.5 9.5 100
1003 2.5 200 50
ms s KHz MHz ns ns
1 1 7 1.1 0.75*VDDPLL VDDPLL + 0.3 0.25*VDDPLL VSSPLL - 0.3 250
ns ns pF V V V V V mV
P EXTAL Pin Input High Voltage4 T EXTAL Pin Input High Voltage4
14
P EXTAL Pin Input Low Voltage4 T EXTAL Pin Input Low Voltage4
15
C EXTAL Pin Input Hysteresis4
1Depending on the crystal a damping series resistor might be necessary 2 fosc = 4MHz, C = 22pF. 3 Maximum value is for extreme cases using high Q, low frequency crystals 4Only valid if Pierce oscillator/external clock mode is selected
MC9S12E128 Data Sheet, Rev. 1.07 576 Freescale Semiconductor
Appendix A Electrical Characteristics
A.3.3
Phase Locked Loop
The oscillator provides the reference clock for the PLL. The PLLs Voltage Controlled Oscillator (VCO) is also the system clock source in self clock mode.
A.3.3.1
XFC Component Selection
This section describes the selection of the XFC components to achieve a good filter characteristics.
Cp VDDPLL Cs fosc 1 refdv+1 fref fcmp R Phase K Detector Loop Divider 1 synr+1
XFC Pin
VCO KV fvco
1 2
Figure A-2. Basic PLL functional diagram
The following procedure can be used to calculate the resistance and capacitance values using typical values for K1, f1 and ich from Table A-13. The grey boxes show the calculation for fVCO = 50MHz and fref = 1MHz. E.g., these frequencies are used for fOSC = 4MHz and a 25MHz bus clock. The VCO Gain at the desired VCO frequency is approximated by: ( f 1 - f vco ) ( 60 - 50 ) -------------------------------------------K 1 1V - 100 KV = K1 e = -90.48MHz/V = - 100 e The phase detector relationship is given by:
K = - i ch K V
= 316.7Hz/
ich is the current in tracking mode.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 577
Appendix A Electrical Characteristics
The loop bandwidth fC should be chosen to fulfill the Gardner's stability criteria by at least a factor of 10, typical values are 50. = 0.9 ensures a good transient response.
2 f ref f ref 1 f C < ------------------------------------------ ----- f C < ------------ ;( = 0.9 ) 4 10 10 2 + 1 + fC < 25kHz
And finally the frequency relationship is defined as
f VCO n = ------------- = 2 ( synr + 1 ) f ref
= 50
With the above values the resistance can be calculated. The example is shown for a loop bandwidth fC=10kHz:
2 n fC R = ---------------------------- = 2**50*10kHz/(316.7Hz/)=9.9k=~10k K
The capacitance Cs can now be calculated as:
0.516 2 C s = --------------------- -------------- ;( = 0.9 ) = 5.19nF =~ 4.7nF fC R fC R
The capacitance Cp should be chosen in the range of:
2
C s 20 C p C s 10
Cp = 470pF
A.3.3.2
Jitter Information
The basic functionality of the PLL is shown in Figure A-2. With each transition of the clock fcmp, the deviation from the reference clock fref is measured and input voltage to the VCO is adjusted accordingly.The adjustment is done continuously with no abrupt changes in the clock output frequency. Noise, voltage, temperature and other factors cause slight variations in the control loop resulting in a clock jitter. This jitter affects the real minimum and maximum clock periods as illustrated in Figure A-3.
MC9S12E128 Data Sheet, Rev. 1.07 578 Freescale Semiconductor
Appendix A Electrical Characteristics
0
1
2
3
N-1
N
tmin1 tnom tmax1 tminN tmaxN
Figure A-3. Jitter Definitions
The relative deviation of tnom is at its maximum for one clock period, and decreases towards zero for larger number of clock periods (N). Defining the jitter as:
t max ( N ) t min ( N ) J ( N ) = max 1 - -------------------- , 1 - -------------------- N t nom N t nom
For N < 100, the following equation is a good fit for the maximum jitter:
j1 J ( N ) = ------- + j 2 N
J(N)
1
5
10
20
N
This is very important to notice with respect to timers, serial modules where a pre-scaler will eliminate the effect of the jitter to a large extent.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 579
Appendix A Electrical Characteristics
Table A-13. PLL Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
C
P D D D D D C D D D D D D C C
Rating
Self Clock Mode frequency VCO locking range Lock Detector transition from Acquisition to Tracking mode Lock Detection Un-Lock Detection Lock Detector transition from Tracking to Acquisition mode PLLON Total Stabilization delay (Auto Mode) 2 PLLON Acquisition mode stabilization delay 2 PLLON Tracking mode stabilization delay 2 Fitting parameter VCO loop gain Fitting parameter VCO loop frequency Charge pump current acquisition mode Charge pump current tracking mode Jitter fit parameter 12 Jitter fit parameter 22
Symbol
fSCM fVCO |trk| |Lock| |unl| |unt| tstab tacq tal K1 f1 | ich | | ich | j1 j2
Min
1 8 3 0 0.5 6
Typ
Max
5.5 50 4 1.5 2.5 8
Unit
MHz MHz %1 %1 %1 %1 ms ms ms MHz/V MHz A A
0.5 0.3 0.2 -100 60 38.5 3.5 1.1 0.13
% %
1% deviation from target frequency 2 fOSC = 4MHz, fBUS = 25MHz equivalent fVCO
= 50MHz: REFDV = #$03, SYNR = #$018, Cs = 4.7nF, Cp = 470pF, Rs =
10K.
MC9S12E128 Data Sheet, Rev. 1.07 580 Freescale Semiconductor
Appendix A Electrical Characteristics
A.4
A.4.1
Flash NVM
NVM Timing
The time base for all NVM program or erase operations is derived from the oscillator. A minimum oscillator frequency fNVMOSC is required for performing program or erase operations. The NVM modules do not have any means to monitor the frequency and will not prevent program or erase operation at frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at a lower frequency a full program or erase transition is not assured. The Flash program and erase operations are timed using a clock derived from the oscillator using the FCLKDIV register. The frequency of this clock must be set within the limits specified as fNVMOP. The minimum program and erase times shown in Table A-14 are calculated for maximum fNVMOP and maximum fbus. The maximum times are calculated for minimum fNVMOP and a fbus of 2MHz.
A.4.1.1
Single Word Programming
The programming time for single word programming is dependent on the bus frequency as a well as on the frequency fNVMOP and can be calculated according to the following formula.
t swpgm 1 1 = 9 ------------------------ + 25 ----------f f NVMOP bus
A.4.1.2
Row Programming
Flash programming where up to 64 words in a row can be programmed consecutively by keeping the command pipeline filled. The time to program a consecutive word can be calculated as:
t bwpgm 1 1 = 4 ------------------------ + 9 ----------f f NVMOP bus
The time to program a whole row is:
t brpgm =t swpgm + 63 t bwpgm
Row programming is more than 2 times faster than single word programming.
A.4.1.3
Sector Erase
1 4000 -----------------------f NVMOP
Erasing a 1024 byte Flash sector takes:
t era
The setup times can be ignored for this operation.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 581
Appendix A Electrical Characteristics
A.4.1.4
Mass Erase
1 20000 -----------------------f NVMOP
Erasing a NVM block takes:
t mass
The setup times can be ignored for this operation.
A.4.1.5
Blank Check
The time it takes to perform a blank check on the Flash is dependant on the location of the first non-blank word starting at relative address zero. It takes one bus cycle per word to verify plus a setup of the command.
t check location t cyc + 10 t cyc
Table A-14. NVM Timing Characteristics
Conditions are shown in Table A-4 unless otherwise noted Num 1 2 3 4 5 6 7 8 9
1 2 3 4 5 6 7
C D D D P D D P P D
Rating External Oscillator Clock Bus frequency for Programming or Erase Operations Operating Frequency Single Word Programming Time Flash Burst Programming consecutive word Flash Burst Programming Time for 64 Word row Sector Erase Time Mass Erase Time Blank Check Time Flash per block
Symbol fNVMOSC fNVMBUS fNVMOP tswpgm tbwpgm tbrpgm tera tmass t check
Min 0.5 1 150 462 20.42 1331.22 204 1004 115
Typ -- -- -- -- -- -- -- -- --
Max 501
Unit MHz MHz
200 74.5
3
kHz s s s ms ms
7t cyc
313 2027.53 26.73 1333 655466
Restrictions for oscillator in crystal mode apply! Minimum Programming times are achieved under maximum NVM operating frequency f NVMOP and maximum bus frequency fbus. Maximum Erase and Programming times are achieved under particular combinations of f NVMOP and bus frequency f bus. Refer to formulae in Sections A.3.1.1 - A.3.1.4 for guidance. Minimum Erase times are achieved under maximum NVM operating frequency f NVMOP. Minimum time, if first word in the array is not blank Maximum time to complete check on an erased block Where tcyc is the system bus clock period.
MC9S12E128 Data Sheet, Rev. 1.07 582 Freescale Semiconductor
Appendix A Electrical Characteristics
A.4.2
NVM Reliability
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process monitors and burn-in to screen early life failures. The program/erase cycle count on the sector is incremented every time a sector or mass erase event is executed.
Table A-15. NVM Reliability Characteristics1
Conditions are shown in Table A-4 unless otherwise noted Num C Rating Symbol Flash Reliability Characteristics 1 2 3 4
1
Min
Typ
Max
Unit
C Data retention after 10,000 program/erase cycles at an average junction temperature of TJavg 85C C Data retention with <100 program/erase cycles at an average junction temperature TJavg 85C C Number of program/erase cycles (-40C TJ 0C) C Number of program/erase cycles (0C TJ 140C)
tFLRET
15 20
1002 1002 -- 100,0003
-- -- -- --
Years
nFL
10,000 10,000
Cycles
TJavg will not exeed 85C considering a typical temperature profile over the lifetime of a consumer, industrial or automotive application. 2 Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25C using the Arrhenius equation. For additional information on how Freescale defines Typical Data Retention, please refer to Engineering Bulletin EB618. 3 Spec table quotes typical endurance evaluated at 25C for this product family, typical endurance at various temperature can be estimated using the graph below. For additional information on how Freescale defines Typical Endurance, please refer to Engineering Bulletin EB619.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 583
Appendix A Electrical Characteristics
Typical Endurance 500 450
Typical Endurance [103 Cycles]
400 350 300 250 200 150 100 50 0 -40 -20 0 20 40
60 80
100
120
140
Operating Temperature TJ [C]
------ Flash
MC9S12E128 Data Sheet, Rev. 1.07 584 Freescale Semiconductor
Appendix A Electrical Characteristics
A.5
SPI Characteristics
This section provides electrical parametrics and ratings for the SPI. In Table A-16 the measurement conditions are listed.
Table A-16. Measurement Conditions
Description Drive mode Load capacitance CLOAD, on all outputs Thresholds for delay measurement points Value full drive mode 50 (20% / 80%) VDDX Unit -- pF V
A.5.1
Master Mode
In Figure A-4 the timing diagram for master mode with transmission format CPHA=0 is depicted.
SS1 (OUTPUT) 2 SCK (CPOL = 0) (OUTPUT) SCK (CPOL = 1) (OUTPUT) 5 MISO (INPUT) 10 MOSI (OUTPUT) MSB OUT2 6 MSB IN2 BIT 6 . . . 1 9 BIT 6 . . . 1 LSB OUT LSB IN 11 1 4 4 12 13 12 13 3
1.If configured as an output. 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-4. SPI Master Timing (CPHA = 0)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 585
Appendix A Electrical Characteristics
In Figure A-5 the timing diagram for master mode with transmission format CPHA=1 is depicted.
SS1 (OUTPUT) 1 2 SCK (CPOL = 0) (OUTPUT) 4 SCK (CPOL = 1) (OUTPUT) 5 MISO (INPUT) 9 MOSI (OUTPUT) PORT DATA MASTER MSB OUT2 6 MSB IN2 BIT 6 . . . 1 11 BIT 6 . . . 1 MASTER LSB OUT PORT DATA LSB IN 4 12 13 12 13 3
1.If configured as output 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-5. SPI Master Timing (CPHA=1)
In Table A-17 the timing characteristics for master mode are listed.
Table A-17. SPI Master Mode Timing Characteristics
Num 1 1 2 3 4 5 6 9 10 11 12 13 C P P D D D D D D D D D D Characteristic SCK Frequency SCK Period Enable Lead Time Enable Lag Time Clock (SCK) High or Low Time Data Setup Time (Inputs) Data Hold Time (Inputs) Data Valid after SCK Edge Data Valid after SS fall (CPHA = 0) Data Hold Time (Outputs) Rise and Fall Time Inputs Rise and Fall Time Outputs Symbol fsck tsck tlead tlag twsck tsu thi tvsck tvss tho trfi trfo Min 1/2048 2 -- -- -- 8 8 -- -- 20 -- -- Typ -- -- 1/2 1/2 1/2 -- -- -- -- -- -- -- Max 1/2 2048 -- -- -- -- -- 30 15 -- 8 8 Unit fbus tbus tsck tsck tsck ns ns ns ns ns ns ns
MC9S12E128 Data Sheet, Rev. 1.07 586 Freescale Semiconductor
Appendix A Electrical Characteristics
A.5.2
Slave Mode
In Figure A-6 the timing diagram for slave mode with transmission format CPHA = 0 is depicted.
SS (INPUT) 1 SCK (CPOL = 0) (INPUT) 2 SCK (CPOL = 1) (INPUT) 10 7 MISO (OUTPUT) see note 5 MOSI (INPUT) NOTE: Not defined! SLAVE MSB 6 MSB IN BIT 6 . . . 1 LSB IN 9 BIT 6 . . . 1 4 4 12 13 8 11 11 SEE NOTE 12 13 3
SLAVE LSB OUT
Figure A-6. SPI Slave Timing (CPHA = 0)
In Figure A-7 the timing diagram for slave mode with transmission format CPHA = 1 is depicted.
SS (INPUT) 1 2 SCK (CPOL = 0) (INPUT) 4 SCK (CPOL = 1) (INPUT) 9 MISO (OUTPUT) see note 7 MOSI (INPUT) NOTE: Not defined! SLAVE 5 MSB IN MSB OUT 6 BIT 6 . . . 1 LSB IN 4 12 13 12 13 3
11 BIT 6 . . . 1 SLAVE LSB OUT
8
Figure A-7. SPI Slave Timing (CPHA = 1)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 587
Appendix A Electrical Characteristics
In Table A-18 the timing characteristics for slave mode are listed.
Table A-18. SPI Slave Mode Timing Characteristics
Num 1 1 2 3 4 5 6 7 8 9 10 11 12 13
1
C P P D D D D D D D D D D D D SCK Period
Characteristic SCK Frequency Enable Lead Time Enable Lag Time Clock (SCK) High or Low Time Data Setup Time (Inputs) Data Hold Time (Inputs) Slave Access Time (time to data active) Slave MISO Disable Time Data Valid after SCK Edge Data Valid after SS fall Data Hold Time (Outputs) Rise and Fall Time Inputs Rise and Fall Time Outputs
Symbol fsck tsck tlead tlag twsck tsu thi ta tdis tvsck tvss tho trfi trfo
Min DC 4 4 4 4 8 8 -- -- -- -- 20 -- --
Typ -- -- -- -- -- -- -- -- -- -- -- -- -- --
Max 1/4 -- -- -- -- -- 20 22 30 + 30 + tbus1 tbus1
Unit fbus tbus tbus tbus tbus ns ns ns ns ns ns ns ns ns
-- 8 8
tbus added due to internal synchronization delay
MC9S12E128 Data Sheet, Rev. 1.07 588 Freescale Semiconductor
Appendix A Electrical Characteristics
A.6
ATD Characteristics
This section describes the characteristics of the analog to digital converter. The ATD is specified and tested for both the 3.3V and 5V range. For ranges between 3.3V and 5V the ATD accuracy is generally the same as in the 3.3V range but is not tested in this range in production test.
A.6.1
ATD Operating Characteristics -- 5V Range
The Table A-19 shows conditions under which the ATD operates. The following constraints exist to obtain full-scale, full range results: VSSA VRL VIN VRH VDDA. This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that it ties to. If the input level goes outside of this range it will effectively be clipped.
Table A-19. 5V ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted. Supply Voltage 5V-10% <= VDDA <=5V+10% Num C 1 D Reference Potential Low High 2 3 4 C Differential Reference Voltage1 D ATD Clock Frequency D ATD 10-Bit Conversion Period Clock Cycles2 Conv, Time at 2.0MHz ATD Clock fATDCLK Conv, Time at 4.0MHz3 ATD Clock fATDCLK 5 D ATD 8-Bit Conversion Period Clock Cycles1 Conv, Time at 2.0MHz ATD Clock fATDCLK 6 7
1 2
Rating
Symbol VRL VRH VRH-VRL fATDCLK NCONV10 TCONV10 TCONV10 NCONV8 TCONV8 tSR IREF
Min VSSA VDDA/2 4.75 0.5 14 7 3.5 12 6 -- --
Typ -- -- 5.0 -- -- -- -- -- -- -- --
Max VDDA/2 VDDA 5.25 2.0 28 14 7 26 13 20 0.375
Unit V V V MHz Cycles s s Cycles s s mA
D Stop Recovery Time (VDDA = 5.0 Volts) P Reference Supply current
Full accuracy is not guaranteed when differential voltage is less than 4.75V The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample period of 16 ATD clocks. 3 Reduced accuracy see Table A-22 and Table A-23.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 589
Appendix A Electrical Characteristics
A.6.2
ATD Operating Characteristics -- 3.3V Range
The Table A-20 shows conditions under which the ATD operates. The following constraints exist to obtain full-scale, full range results: VSSA VRL VIN VRH VDDA. This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that it ties to. If the input level goes outside of this range it will effectively be clipped.
Table A-20. 3.3V ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted; Supply Voltage 3.3V-10% <= VDDA <= 3.3V+10% Num C 1 D Reference Potential Low High 2 3 4 C Differential Reference Voltage D ATD Clock Frequency D ATD 10-Bit Conversion Period Clock Cycles1 Conv, Time at 2.0MHz ATD Clock fATDCLK Conv, Time at 4.0MHz2 ATD Clock fATDCLK 5 D ATD 8-Bit Conversion Period Clock Cycles1 Conv, Time at 2.0MHz ATD Clock fATDCLK 6 7
1
Rating
Symbol VRL VRH VRH-VRL fATDCLK NCONV10 TCONV10 TCONV10 NCONV8 TCONV8 tREC IREF
Min VSSA VDDA/2 3.0 0.5 14 7 3.5 12 6 -- --
Typ -- -- 3.3 -- -- -- -- -- -- -- --
Max VDDA/2 VDDA 3.6 2.0 28 14 7 26 13 20 0.250
Unit V V V MHz Cycles s s Cycles s s mA
D Recovery Time (VDDA=3.3 Volts) P Reference Supply current
The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample period of 16 ATD clocks. 2 Reduced accuracy see Table A-22 and Table A-23.
A.6.3
Factors Influencing Accuracy
Three factors -- source resistance, source capacitance and current injection -- have an influence on the accuracy of the ATD.
A.6.3.1
Source Resistance
Due to the input pin leakage current as specified in Table A-6 and Table A-7 in conjunction with the source resistance there will be a voltage drop from the signal source to the ATD input. The maximum source resistance RS specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage current. If device or operating conditions are less than worst case or leakage-induced error is acceptable, larger values of source resistance are allowed.
MC9S12E128 Data Sheet, Rev. 1.07 590 Freescale Semiconductor
Appendix A Electrical Characteristics
A.6.3.2
Source Capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input voltage 1LSB, then the external filter capacitor, Cf 1024 * (CINS- CINN).
A.6.3.3
Current Injection
There are two cases to consider. 1. A current is injected into the channel being converted. The channel being stressed has conversion values of 0x3FF (0xFF in 8-bit mode) for analog inputs greater than VRH and 0x000 for values less than VRL unless the current is higher than specified as disruptive conditions. 2. Current is injected into pins in the neighborhood of the channel being converted. A portion of this current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy of the conversion depending on the source resistance. The additional input voltage error on the converted channel can be calculated as VERR = K * RS * IINJ, with IINJ being the sum of the currents injected into the two pins adjacent to the converted channel.
Table A-21. ATD Electrical Characteristics
Conditions are shown in Table A-4 unless otherwise noted Num 1 2 C C T Rating Max input Source Resistance Total Input Capacitance Non Sampling Sampling Disruptive Analog Input Current Coupling Ratio positive current injection Coupling Ratio negative current injection Symbol RS CINN CINS INA Kp Kn Min -- -- -- -2.5 -- -- Typ -- -- -- -- -- -- Max 1 10 15 2.5 10-4 10-2 mA A/A A/A Unit K pF
3 4 5
C C C
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 591
Appendix A Electrical Characteristics
A.6.4
ATD Accuracy -- 5V Range
Table A-22 specifies the ATD conversion performance excluding any errors due to current injection, input capacitance and source resistance.
Table A-22. 5V ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted VREF = VRH - VRL = 5.12V. Resulting to one 8 bit count = 20mV and one 10 bit count = 5mV fATDCLK = 2.0MHz Num 1 2 3 4 5 6 7 8 9
1
C P 10-Bit Resolution
Rating
Symbol LSB DNL INL AE AE LSB DNL INL AE
Min -- -1 -2.0 -2.5 -- -- -0.5 -1.0 -1.5
Typ 5 -- -- -- 7.0 20 -- 0.5 1.0
Max -- 1 2.0 2.5 -- -- 0.5 1.0 1.5
Unit mV Counts Counts Counts Counts mV Counts Counts Counts
P 10-Bit Differential Nonlinearity P 10-Bit Integral Nonlinearity P 10-Bit Absolute Error
1
C 10-Bit Absolute Error at fATDCLK= 4MHz P 8-Bit Resolution P 8-Bit Differential Nonlinearity P 8-Bit Integral Nonlinearity P 8-Bit Absolute Error
1
These values include quantization error which is inherently 1/2 count for any A/D converter.
A.6.5
ATD Accuracy -- 3.3V Range
Table A-23 specifies the ATD conversion performance excluding any errors due to current injection, input capacitance and source resistance.
Table A-23. 3.3V ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted VREF = VRH - VRL = 3.328V. Resulting to one 8 bit count = 13mV and one 10 bit count = 3.25mV fATDCLK = 2.0MHz Num C 1 2 3 4 5 6 7 8 9
1
Rating
Symbol LSB DNL INL AE AE LSB DNL INL AE
Min -- -1.5 -3.5 -5 -- -- -0.5 -1.5 -2.0
Typ 3.25
Max -- 1.5
Unit mV Counts Counts Counts Counts mV Counts Counts Counts
P 10-Bit Resolution P 10-Bit Differential Nonlinearity P 10-Bit Integral Nonlinearity P 10-Bit Absolute Error
1
1.5 2.5 7.0 13 -- 1.0 1.5
3.5 5 -- -- 0.5 1.5 2.0
C 10-Bit Absolute Error at fATDCLK= 4MHz P 8-Bit Resolution P 8-Bit Differential Nonlinearity P 8-Bit Integral Nonlinearity P 8-Bit Absolute Error1
These values include the quantization error which is inherently 1/2 count for any A/D converter.
MC9S12E128 Data Sheet, Rev. 1.07 592 Freescale Semiconductor
Appendix A Electrical Characteristics
For the following definitions see also Figure A-8. Differential Non-Linearity (DNL) is defined as the difference between two adjacent switching steps.
V -V i i-1 DNL ( i ) = -------------------------- - 1 1LSB
The Integral Non-Linearity (INL) is defined as the sum of all DNLs:
INL ( n ) = n DNL(i) = --------------------0- - n 1LSB V -V n
i=1
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 593
Appendix A Electrical Characteristics
DNL
Vi-1
LSB
10-Bit Absolute Error Boundary Vi
0x3FF 0x3FE 0x3FD 0x3FC 0x3FB 0x3FA 0x3F9 0x3F8 0x3F7 0x3F6 0x3F5 0x3F4 0x3F3 10-Bit Resolution
8-Bit Absolute Error Boundary
0xFF
0xFE
0xFD 8-Bit Resolution Vin mV
9 8 7 6 5 4 3 2 1 0
5 10 15 20 25 30 35 40 50
Ideal Transfer Curve 2
10-Bit Transfer Curve
1
8-Bit Transfer Curve
5055 5060 5065 5070 5075 5080 5085 5090 5095 5100 5105 5110 5115 5120
Figure A-8. ATD Accuracy Definitions
NOTE Figure A-8 shows only definitions, for specification values refer to Table A-22 and Table A-23.
MC9S12E128 Data Sheet, Rev. 1.07 594 Freescale Semiconductor
Appendix A Electrical Characteristics
A.7
DAC Characteristics
This section describes the characteristics of the digital to analog converter.
A.7.1
Num 1 2 C D D D 3 D D 4 5 6 D D D
DAC Operating Characteristics
Table A-24. DAC Electrical Characteristics (Operating)
Characteristic DAC Supply DAC Supply Current Running Stop (low power) Reference Potential Low High Reference Supply Current Input Current, Channel Off1 Operating Temperature Range VREF to VSSA Condition Symbol VDDA IDDArun IDDstop VSSA VREF IREF IOFF T Min 3.135 -- -- VSSA VDDA/2 -- -200 -40 Typ -- -- -- -- -- -- -- -- Max 5.5 3.5 1.0 VSSA VDDA 400 1 125 Unit V mA mA V V mA A
C
Table A-25. DAC Timing/Performance Characteristics
Num 1 2 3 4 5 6 7 C D D D D D P D Parameters DAC Operating Frequency Integral Non-Linearity Differential Non-Linearity Resolution Settling Time Absolute Accuracy Offset Error Symbol fBUS INL DNL RES TS ABSACC ERR Min -- -- -- -- 5 -1 -- Typ -- 0.25 0.10 -- -- -- +/-2.5 Max 25 -- -- 8 10 1 -- Unit MHz Count Count Bit s Count mV
A.8
External Bus Timing
A timing diagram of the external multiplexed-bus is illustrated in Figure A-9 with the actual timing values shown on table Table A-26 and Table A-27. All major bus signals are included in the diagram. While both a data write and data read cycle are shown, only one or the other would occur on a particular bus cycle. The expanded bus timings are highly dependent on the load conditions. The timing parameters shown assume a balanced load across all outputs.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 595
Appendix A Electrical Characteristics
1, 2 3 ECLK PE4 5 9 Addr/Data (read) PA, PB data 6 15 addr 7 12 Addr/Data (write) PA, PB data addr 8 14 data 13 16 10 data 11 4
17 Non-Multiplexed Addresses PK5:0 20 ECS PK7
18
19
21
22
23
24 R/W PE2
25
26
27 LSTRB PE3
28
29
30 NOACC PE7
31
32
33 IPIPO0 IPIPO1, PE6,5
34
35
36
Figure A-9. General External Bus Timing
MC9S12E128 Data Sheet, Rev. 1.07 596 Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-26. Expanded Bus Timing Characteristics (5V Range)
Conditions are 4.75V < VDDX < 5.25V, Junction Temperature -40C to +140C, CLOAD = 50pF Num 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
1
C P P D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D
Rating Frequency of operation (E-clock) Cycle time Pulse width, E low Pulse width, E high1 Address delay time Address valid time to E rise (PWEL-tAD) Muxed address hold time Address hold to data valid Data hold to address Read data setup time Read data hold time Write data delay time Write data hold time Write data setup time1 (PWEH-tDDW) Address access E high access
cyc-tAD-tDSR) 1 (PW -t time EH DSR)
Symbol fo tcyc PWEL PWEH tAD tAV tMAH tAHDS tDHA tDSR tDHR tDDW tDHW tDSW tACCA tACCE tNAD tNAV tNAH tCSD tACCS tCSH tCSN tRWD tRWV tRWH tLSD tLSV tLSH tNOD tNOV tNOH tP0D tP0V tP1D tP1V
Min 0 40 19 19 -- 11 2 7 2 13 0 -- 2 12 19 6 -- 14 2 -- 11 2 8 -- 14 2 -- 14 2 -- 14 2 2 11 2 11
Typ -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
Max 25.0 -- -- -- 8 -- -- -- -- -- -- 7 -- -- -- -- 6 -- -- 16 -- -- -- 7 -- -- 7 -- -- 7 -- -- 7 -- 25 --
Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
time1 (t
Non-multiplexed address delay time Non-muxed address valid to E rise (PWEL-tNAD) Non-multiplexed address hold time Chip select delay time Chip select access time1 (tcyc-tCSD-tDSR) Chip select hold time Chip select negated time Read/write delay time Read/write valid time to E rise (PWEL-tRWD) Read/write hold time Low strobe delay time Low strobe valid time to E rise (PWEL-tLSD) Low strobe hold time NOACC strobe delay time NOACC valid time to E rise (PWEL-tNOD) NOACC hold time IPIPO[1:0] delay time IPIPO[1:0] valid time to E rise (PWEL-tP0D) IPIPO[1:0] delay time1 (PWEH-tP1V)
IPIPO[1:0] valid time to E fall
Affected by clock stretch: add N x tcyc where N=0,1,2 or 3, depending on the number of clock stretches.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 597
Appendix A Electrical Characteristics
Table A-27. Expanded Bus Timing Characteristics (3.3V Range)
Conditions are VDDX=3.3V+/-10%, Junction Temperature -40C to +140C, CLOAD = 50pF Num 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
1
C P P D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D
Rating Frequency of operation (E-clock) Cycle time Pulse width, E low Pulse width, E high1
Symbol fo tcyc PWEL PWEH tAD tAV tMAH tAHDS tDHA tDSR tDHR tDDW tDHW tDSW tACCA tACCE tNAD tNAV tNAH tCSD tACCS tCSH tCSN tRWD tRWV tRWH tLSD tLSV tLSH tNOD tNOV tNOH tP0D tP0V tP1D tP1V
Min 0 62.5 30 30 -- 16 2 7 2 15 0 -- 2 15 29 15 -- 16 2 -- 22.5 2 8 -- 16 2 -- 16 2 -- 16 2 2 16 2 11
Typ -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
Max 16.0 -- -- -- 16 -- -- -- -- -- -- 15 -- -- -- -- 14 -- -- 25 -- -- -- 14 -- -- 14 -- -- 14 -- -- 14 -- 25 --
Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Address delay time Address valid time to E rise (PWEL-tAD) Muxed address hold time Address hold to data valid Data hold to address Read data setup time Read data hold time Write data delay time Write data hold time Write data setup (PWEH-tDDW) 1 (t Address access time cyc-tAD-tDSR) E high access time1 (PWEH-tDSR) Non-multiplexed address delay time Non-muxed address valid to E rise (PWEL-tNAD) Non-multiplexed address hold time Chip select delay time Chip select access time1 (tcyc-tCSD-tDSR) Chip select hold time Chip select negated time Read/write delay time Read/write valid time to E rise (PWEL-tRWD) Read/write hold time Low strobe delay time Low strobe valid time to E rise (PWEL-tLSD) Low strobe hold time NOACC strobe delay time NOACC valid time to E rise (PWEL-tNOD) NOACC hold time IPIPO[1:0] delay time IPIPO[1:0] valid time to E rise (PWEL-tP0D) IPIPO[1:0] delay time1 (PW
EH-tP1V)
time1
IPIPO[1:0] valid time to E fall
Affected by clock stretch: add N x tcyc where N=0,1,2 or 3, depending on the number of clock stretches.
MC9S12E128 Data Sheet, Rev. 1.07 598 Freescale Semiconductor
Appendix B Package Information
Appendix B Package Information
B.1 64-Pin QFN Package
Figure B-1. 64-Pin QFN Mechanical Dimensions (Case no. TBD)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 599
Appendix B Package Information
B.2
80-Pin QFP Package
L
60 61 41 40
S
S
B B P
D
S
-AL
-BB
0.20 M H A-B
V 0.05 D
0.20 M C A-B
S
D
-A-,-B-,-DDETAIL A
DETAIL A
80 1 20
21
-DA 0.20 M H A-B 0.05 A-B S 0.20 M C A-B
S S
F
D
S
J D
S
N
E C -CSEATING PLANE
M DETAIL C -HDATUM PLANE
D 0.20 M C A-B SECTION B-B
S
D
S
H G
0.10 M
VIEW ROTATED 90
U T
DATUM -HPLANE
R
K W X DETAIL C
Q
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -C-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT.
DIM A B C D E F G H J K L M N P Q R S T U V W X
MILLIMETERS MIN MAX 13.90 14.10 13.90 14.10 2.15 2.45 0.22 0.38 2.00 2.40 0.22 0.33 0.65 BSC --0.25 0.13 0.23 0.65 0.95 12.35 REF 5 10 0.13 0.17 0.325 BSC 0 7 0.13 0.30 16.95 17.45 0.13 --0 --16.95 17.45 0.35 0.45 1.6 REF
Figure B-2. 80-Pin QFP Mechanical Dimensions (Case no. 841B)
MC9S12E128 Data Sheet, Rev. 1.07 600 Freescale Semiconductor
Appendix B Package Information
B.3
PIN 1 IDENT
112-Pin LQFP Package
4X 112 1
0.20 T L-M N
4X 28 TIPS 85 84
0.20 T L-M N
J1 J1 C L
4X
P
VIEW Y
108X
G
X X=L, M OR N
VIEW Y B L M B1 V1 V
J
AA
28
57
F D 0.13
M
BASE METAL
29
56
N A1 S1 A S
T L-M N
SECTION J1-J1 ROTATED 90 COUNTERCLOCKWISE
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DATUMS L, M AND N TO BE DETERMINED AT SEATING PLANE, DATUM T. 4. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE, DATUM T. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER SIDE. DIMENSIONS A AND B INCLUDE MOLD MISMATCH. 6. DIMENSION D DOES NOT INCLUDE DAMBAR MILLIMETERS MIN MAX 20.000 BSC 10.000 BSC 20.000 BSC 10.000 BSC --1.600 0.050 0.150 1.350 1.450 0.270 0.370 0.450 0.750 0.270 0.330 0.650 BSC 0.090 0.170 0.500 REF 0.325 BSC 0.100 0.200 0.100 0.200 22.000 BSC 11.000 BSC 22.000 BSC 11.000 BSC 0.250 REF 1.000 REF 0.090 0.160 8 0 7 3 11 13 11 13
C2 C 0.050 2
VIEW AB 0.10 T
112X
SEATING PLANE
3 T
R
R2 0.25
GAGE PLANE
R
R1
C1 (Y) (Z) VIEW AB
(K) E
1
DIM A A1 B B1 C C1 C2 D E F G J K P R1 R2 S S1 V V1 Y Z AA 1 2 3
Figure B-3. 112-Pin QFP Mechanical Dimensions (Case no. 987)
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 601
Appendix C Ordering Information
Appendix C Ordering Information
MC9S12 E128 C FU
Package Option Temperature Option Device Title Controller Family Package Options FC = 64QFN FU = 80QFP PV = 112LQFP Temperature Options C = -40C to 85C V = -40C to 105C M = -40C to 125C
Figure C-1. Order Part Number Coding
Table C-1 lists the part number coding based on the package and temperature.
Table C-1. Part Number Coding Part Number
MC9S12E128CFU MC9S12E128CPV MC9S12E128MFU MC9S12E128MPV MC9S12E64CFU MC9S12E64CPV MC9S12E64MFU MC9S12E64MPV MC9S12E32CFC MC9S12E32CFU MC9S12E32MFC MC9S12E32MFU
Temp.
-40C, 85C -40C, 85C -40C, 125C -40C, 125C -40C, 85C -40C, 85C -40C, 125C -40C, 125C -40C, 85C -40C, 85C -40C, 125C -40C, 125C
Package
80QFP 112LQFP 80QFP 112LQFP 80QFP 112LQFP 80QFP 112LQFP 64QFN 80QFP 64QFN 80QFP
MC9S12E128 Data Sheet, Rev. 1.07 602 Freescale Semiconductor
Appendix C Ordering Information
Table C-2 summarizes the package option and size configuration.
Table C-2. Package Option Summary Part Number
MC9S12E128 MC9S12E64 MC9S12E32
1C: 2
1 Package Temp. Flash RAM MEBI TIM SCI SPI IIC A/D D/A PWM PMF KWU I/O2 Options
112LQFP 80QFP 112LQFP 80QFP 80QFP 64QFN
M, C M, C M, C
128K 64K 32K
8K 4K 2K
1 0 1 0 0 0
12 12 12 8
3 3 3 2
1 1 1 1
1 1 1 1
16 16 16 8
2 2 2 2
6 6 6 6
6 6 6 6
16 16 16 8
92 60 92 60 60 44
TA = 85C, f = 25MHz. M: TA= 125C, f = 25MHz I/O is the sum of ports capable to act as digital input or output.
-- TIM is the number of channels. -- A/D is the number of A/D channels. -- D/A is the number of D/A channels. -- PWM is the number of channels. -- PMF is the number of channels. -- KWU is the number of key wake up interrupt pins. -- I/O is the sum of ports capable to act as digital input or output.
MC9S12E128 Data Sheet, Rev. 1.07 Freescale Semiconductor 603
Appendix C Ordering Information
MC9S12E128 Data Sheet, Rev. 1.07 604 Freescale Semiconductor
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